Method for a photon induced material deposition and a device therefor
11554541 · 2023-01-17
Assignee
Inventors
- Sen Yang (Shatin, HK)
- Kangwei Xia (Shanghai, CN)
- Siu Fai Hung (New Territories, HK)
- Yifan Chen (New Territories, HK)
Cpc classification
B33Y10/00
PERFORMING OPERATIONS; TRANSPORTING
B29C64/135
PERFORMING OPERATIONS; TRANSPORTING
B33Y70/00
PERFORMING OPERATIONS; TRANSPORTING
B33Y30/00
PERFORMING OPERATIONS; TRANSPORTING
G03F7/0044
PHYSICS
B33Y80/00
PERFORMING OPERATIONS; TRANSPORTING
G03F7/2051
PHYSICS
G03F7/0043
PHYSICS
International classification
B29C64/135
PERFORMING OPERATIONS; TRANSPORTING
B33Y10/00
PERFORMING OPERATIONS; TRANSPORTING
B33Y30/00
PERFORMING OPERATIONS; TRANSPORTING
B33Y80/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A method for photon induced material deposition includes providing a first solution, which contains metallate or metal ions, providing a second solution, which contains light sensitive reducing agent, such as semiconductor nanoparticles, mixing the first solution and the second solution to form a reagent on a substrate, and focusing a light source on the reagent to form a mechanically rigid deposition in the focus of the light source.
Claims
1. Method for a photon induced material deposition comprising the following steps: providing a first solution, which contains metallate or metal ions, selected from the group consisting of gold(III) chloride hydrochloride (HAuCl.sub.4), zinc chloride (ZnCl.sub.2), nickel chloride (NiCl.sub.2), chloroplatinic acid (H.sub.2PtCl.sub.6), silver nitrate (AgNO.sub.3), providing a second solution, which contains light sensitive reducing agent, selected from the group consisting of graphene oxide, quantum dots, and carbon ink particles, mixing the first solution and the second solution to form a reagent on a substrate, and focusing a light source on the reagent to form a mechanically rigid deposition in the focus of the light source.
2. Method for a photon induced material processing comprising the following steps: providing a first solution, which contains photoacid, metallate or metal ions, selected from the group consisting of gold(III) chloride hydrochloride (HAuCl.sub.4), zinc chloride (ZnCl.sub.2), nickel chloride (NiCl.sub.2), chloroplatinic acid (H.sub.2PtCl.sub.6), silver nitrate (AgNO.sub.3), providing a second suspension, which contains light sensitive reducing agent, selected from the group consisting of graphene oxide, quantum dots, and carbon ink particles, mixing the first solution and the second suspension to form a reagent on a substrate, and focusing a light source on the reagent to either form a mechanically rigid deposition in the focus of the light source or etch the materials.
3. Method according to claim 1, wherein the method comprises at least one of the following features: the light source is a continuous wave laser or a pulsed laser in the visible range, optionally with 532 nm wavelength; the focus of the light source is moved across the substrate and/or can be moved away from the substrate to form a two- or three-dimensional deposition; the light source is focused by a lens, optionally an air objective lens or an oil objective lens or a water immersion objective lens; and/or the light from the light source is guided to the reagent via free space, and/or via at least photonic waveguide and/or via at least one optical fiber and/or via evanescent coupling.
4. Method according to claim 2, wherein the first solution contains photoacid generators (PAGs) and photoacids (PAHs).
5. Method according to claim 1, wherein the substrate is glass, quartz, sapphire, indium tin oxide or polyimide tape.
6. Method according to claim 1, wherein the deposition is a solid and rigid composite made of semiconductor particles and inorganic material.
7. Method according to claim 1, wherein after forming a deposition the method can be repeated, wherein the first solution is replaced by a third solution, which contains metallate or metal ions, which are different from the metallate or metal ions of the first solution, and/or the second solution is replaced by a fourth solution, which contains light sensitive reducing agent comprising semiconductor nanoparticles, which are different from light sensitive reducing agent comprising semiconductor nanoparticles of the second solution.
8. Method according to claim 1, wherein the method comprises further the step: sintering or annealing the deposited material to improve its mechanical and/or electronic properties.
9. Method according to claim 2, wherein the reagent is applied by drop-casting, and/or by spin-coating, and/or by spraying, and/or by microfluidic channels, and/or by ink injections.
10. Method according to claim 2, wherein by inducing decomposition solution on the semiconductor particle after the deposition, a deposition with pure materials is created.
11. Method according to claim 1, wherein the method is used for making electronics, fabricating flexible devices and/or quantum devices, and/or photonic structures, and/or repairing broken pad and circuits, optionally with a printer.
12. Method according to claim 2, wherein the method comprises at least one of the following features: the light source is a continuous wave laser or a pulsed laser in the visible range, optionally with 532 nm wavelength; the focus of the light source is moved across the substrate and/or can be moved away from the substrate to form a two- or three-dimensional deposition; the light source is focused by a lens, optionally an air objective lens or an oil objective lens or a water immersion objective lens; and/or the light from the light source is guided to the reagent via free space, and/or via at least photonic waveguide and/or via at least one optical fiber and/or via evanescent coupling.
13. Method according to claim 2, wherein the substrate is glass, quartz, sapphire, indium tin oxide or polyimide tape.
14. Method according to claim 2, wherein the method comprises further the step: sintering or annealing the deposited material to improve its mechanical and/or electronic properties.
15. Method according to claim 2, wherein the method is used for making electronics, fabricating flexible devices and/or quantum devices, and/or photonic structures, and/or repairing broken pad and circuits, optionally with a printer.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) Further features, details and advantages of the disclosure result from the wording of the claims as well as from the following description of embodiments on the basis of the drawings.
(2)
(3)
(4)
(5)
(6)
(7)
(8)
DETAILED DESCRIPTION
(9) In the following description as well as in the figures corresponding components and elements bear the same reference numbers. For the sake of clarity, not all reference numbers are shown in all figures.
(10)
(11)
(12) Under the substrate 16 an objective lens 20 is arranged. A light source (not shown), in this case a cw laser, provide a laser beam (not shown), that is conducted through the objective lens 20. The objective lens 20 focus the laser beam on the reagent 14 on the surface 22 of the substrate 16.
(13)
(14)
(15)
(16)
(17) Here a panda with a bamboo branch was drawn. The dark body parts of the panda were drawn in platinum 28, and the rest, including the contour of the panda and the bamboo, were drawn in gold 26. This colouring is analogue to the colouring in
(18) The colour of the deposited material corresponds to the colour of metal whose metallate are dissolved in the first solution 10. For example, by using gold(III) chloride hydrochloride (HAuCl.sub.4) as metallate in the first solution 10 the colour of the deposited material will be yellow or golden, as described above. As a further example, by using chloroplatinic acid (H.sub.2PtCl.sub.6) as matallate in the first solution 10 the colour will be black, as illustrated in
(19) The colour of the semiconductor nanoparticles, it is black in the case of ink particles for example, does not matter. Because the metal ions attach themselves to the semiconductor nanoparticles and surround them, the semiconductor nanoparticles are at the end covered by the attached metal ions respectively metal atoms. Therefore, the colour of the covered nanoparticles is not seen in the deposited material.
(20)
(21)
(22) In the following, an example for the inventive method, the deposition of platinum on glass is described. A glass substrate 16 covered with an aqueous reagent 14 of the mixture of H2PtCl6 and carbon ink was subjected to the laser writing system. A cw laser beam was focused at the substrate 16 surface 22 respectively the liquid reagent 14 to introduce the reduction reaction between metallate and semiconductor nanoparticles as well as inducing optical trapping. The laser on/off status was controlled by an acousto-optic modulator (AOM), while the transmission, and luminescence/scattering at the laser focus were imaged by the same objective lens 20/microscope.
(23) The parameters for large structures were the following: The exposure laser power was 60.4 mW measured in front of the objective lens 20. The exposure time per pixel was 30 ms, and the pixel size was 1.17 μm. For microstructure deposition, the exposure parameter was 0.485 mW power and 1 s exposure time. After the exposure, the residue reagent 14 was taken out by a pipette. Further cleaning was performed by adding and taking out pure water solution 2 to 3 times. All the procedures had been done without taking out the sample from the set up system. When the deposition of a second type of material is needed, the steps, described above, can be repeated using a different first solution 10.
(24) In other experimental attempts of the inventive method, the exposure parameters were the following:
(25) Parameters for a thin iron (Fe) line: the first solution 10 with FeCl3 with the concentration of 25 mmol/L, and 200 times diluted hero ink (the second solution 12) were mixed by 1:1 volume ratio. The mixture/reagent 14 was sonicated for 15 s. Exposure parameters: 0.485 mW laser power, 100 magnification NA(Numerical aperture)=1.3 oil objective lens 20, exposure time 1 s per pixel, step size 0.35, pixel size 446 nm.
(26) Parameters for metal microstructure: The receipt for each metal was as following: 15 mmol/L H.sub.2PtCl.sub.6, 1.25 mmol/L HAuCl.sub.4, 50 mmol/L FeCl.sub.3, 7 mmol/L AgNO.sub.3. These metal solutions (the first solutions 10) were then mixed with 3000 times diluted from the off-the-shelf carbon ink (the second solution 12) by 1:1 volume ratio. 100 mmol/L NiCl.sub.2 was mixed with 3000 times diluted off-the-shelf carbon ink (second solution 12) by 1:1 volume ratio. All reagents 14 were sonicated for 15 s. Exposure parameter: 57.6 mW laser power, 20×NA=0.75 objective lens 20, exposure time 30 ms per pixel, step size 0.15, pixel size 1.17 μm.
(27) The inventive method can be used to deposit ferromagnetic materials as well. Take nickel as an example. In an experiment, four square shaped Ni layers with a permanent magnet polarizing them during the deposition process were wrote. The magnetic profile then was measured with nitrogen vacancy (NV) centers inside diamond nanoparticles spread on the sample. The splitting of electron spin resonance (ESR) lines from these NV centers are due to the Zeeman effect of the residue magnetic field from the Ni layers. The field is nearly 30 Gauss inside the Ni square while close to none outside. This implies the ferromagnetic property in the deposited layer. Thus, this method enables to in-situ fabricate micromagnets and complicated magnetic structures.
(28) The performance of the deposited materials can be further demonstrated in application devices. Flexible electronics and wearable technology are booming fields. Simplification in production and flexibility in design can be key factors for commercial developments. The direct laser writing nature of the present method provides a simple and cheap way for production and customization. As examples, two proof-of-principle devices were build: a resistive flex sensor and a resistive touch sensor. Resistive flex sensors are important parts for robotics. For this, a platinum line with length of 300 μm and width of 50 μm was written on a polyimide tape. The measured resistance of the wire shows a linear dependency with the curvature. The device reaches similar sensitivity, than current sensors, but is two orders of magnitude smaller in size.
(29) From this deformation-sensitive mechanism, resistive touch sensor devices can be further developed. As another example, two parallel platinum squares were written on a polyimide tape. Depending on the location where pressure was applied on, the measured resistances of both lines show different trend of change. Based on this dependence, a measurement of both resistances can determine the location of the touching.
(30) Beside applications in macroscopic scale, with the present method also devices for microscopic applications can be fabricated with submicron accuracy. One of the major road blocks for nanotechnology is manufacturing high performance devices with high precision with respect to tiny samples. The present method provides an easy solution as the deposition and imaging are in-situ. One key device in solid state based quantum information science is the microwave waveguide, which is used to enhance coupling of microwave radiation to solid state qubits. This waveguide has to be in close vicinity to the tiny qubits and it should be able to transmit high power microwave signals. In an experiment directly a microwave waveguide near a nanodiamond particle was wrote. This waveguide performs as good as structures made with conventional method. This was proven in an electron spin Rabi oscillation measurement. With a cross-section of only 27×2 μm.sup.2, this structure works well for a large power range. The measured linear dependency of the Rabi frequency to the square root of the applied microwave power up to 6.2 Watts. Furthermore, since the laser writing setup is compatible with other confocal microscope setups, it is possible to combine both the sample characterization measurements and the present method together. This would greatly benefit the research fields where a big variation of the sample properties are unavoidable, such as two-dimensional materials, nanoparticles and nanostructures.