DISTRIBUTION SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE

Abstract

The present disclosure relates to a distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, a device for chemical and/or electrolytic surface treatment of a substrate in a process fluid, a use of the distribution system, and a method for manufacturing the distribution system. The distribution system comprises: a first distribution body, a substitute body, and a framework. The first distribution body is configured to direct a flow of the process fluid and/or an electrical current to the substrate. The first distribution body and the substitute body are arranged to insert the substrate between them. The framework is configured to mount the first distribution body and the substitute body relative to each other. The framework is further configured to form, together with the first distribution body and the substitute body, a casing surrounding the substrate.

Claims

1. A distribution system for a process fluid for chemical and/or electrolytic surface treatment for a substrate, comprising: a first distribution body, a substitute body, and a framework, wherein the first distribution body is configured to direct a flow of the process fluid and/or an electrical current to the substrate, wherein the first distribution body and the substitute body are arranged to insert the substrate between them, wherein the framework is configured to mount the first distribution body and the substitute body relative to each other, wherein the framework is further configured to form, together with the first distribution body and the substitute body, a casing surrounding the substrate, and wherein the casing is insertable into the distribution system as an independent unit.

2. The distribution system according to claim 1, further comprising a tank configured to receive the casing and configured to receive an anode.

3. The distribution system according to claim 1, further comprising two chambers, each chamber mounted to one side face of the casing, wherein each chamber is configured to receive an anode.

4. The distribution system according to claim 1, wherein the substitute body is a second distribution body also configured to direct a flow of the process fluid and/or an electrical current to the substrate.

5. The distribution system according to claim 1, wherein the framework comprises a distribution frame element comprising at least a process fluid inlet and/or a process fluid outlet.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Exemplary embodiments of the disclosure will be described in the following with reference to the accompanying drawing:

[0035] FIG. 1 shows schematically and exemplarily an embodiment of a distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate according to the present disclosure.

[0036] FIG. 2 shows schematically and exemplarily an embodiment of a distribution system for a process fluid according to the present disclosure, when seen in a cross section.

[0037] FIG. 3 shows schematically and exemplarily an embodiment of a distribution system for a process fluid according to the present disclosure, when seen from below.

[0038] FIG. 4 shows schematically and exemplarily an embodiment of a device for chemical and/or electrolytic surface treatment of a substrate in a process fluid.

[0039] FIG. 5 shows schematically and exemplarily an embodiment of a device for chemical and/or electrolytic surface treatment of a substrate in a process fluid.

DETAILED DESCRIPTION OF EMBODIMENTS

[0040] FIG. 1 shows schematically and exemplarily an embodiment of a distribution system 10 for a process fluid for chemical and/or electrolytic surface treatment of a substrate according to the present disclosure. FIG. 2 shows schematically and exemplarily an embodiment of a distribution system 10 for a process fluid according to the present disclosure, when seen in a cross section. The distribution system 10 for a process fluid comprises a first distribution body 11, a second distribution body 12, and a framework 14.

[0041] The first distribution body 11 and the second distribution body 12 are configured to direct a flow of the process fluid and/or an electrical current to the substrate. The first distribution and the second distribution body 12 are arranged to insert the substrate between them.

[0042] The framework 14 mounts the first distribution body 11 and the second distribution body 12 relative to each other. The framework 14 forms, together with the first distribution body 11 and the second distribution body 12, a casing surrounding the substrate to be inserted. The framework 14 comprises several separate frame elements 1, 4, which are mounted relative to each other, the first distribution body 11 and the second distribution body 12. The framework 14 comprise four lateral elements and a bottom element. The separate elements may be screwed to each other. The framework 14 mounts the first distribution body 11 and the second distribution body 12 parallel to each other.

[0043] The top surface of the casing is open to allow a passage of the substrate. A substrate holder 21 (see FIG. 4) with one or two substrates can be inserted from the top surface through an opening into the casing. The top surface of the casing is thereby open to the surrounding environment.

[0044] FIG. 3 shows schematically and exemplarily an embodiment of a distribution system 10 for a process fluid according to the present disclosure, when seen from below. As can be seen in FIG. 3, the framework 14 comprises a distribution frame element 13 comprising several process fluid inlets 2 and several process fluid outlets 3. The distribution frame element 13 or fluid distribution plate is arranged at a lower part of the first or second distribution bodies.

[0045] In other words, the first distribution body 11, the second distribution body 12 and the framework 14 form together the casing for the substrate. The casing can be inserted as an independent unit into a tank 15 containing the process fluid. This can be seen in FIG. 4.

[0046] FIG. 4 shows schematically and exemplarily an embodiment of a device 20 and a system 10 for chemical and/or electrolytic surface treatment of a substrate in a process fluid. The device 20 comprises the distribution system 10 and a tank 15 to receive the casing and at least one anode. In FIG. 4, two anodes are arranged in the tank 15.

[0047] The distribution system 10 further comprises sealing units to seal an interface between the framework 14 and the first distribution body 11 as well as an interface between the framework 14 and the second distribution body 12 in a fluid or liquid tight and electrically insulated manner relative to the surrounding. The sealing units lead to an electrical isolation of the casing.

[0048] The framework 14 is more rigid than the first distribution body 11 and the second distribution body 12. As a result, the framework 14 forces also initially non-parallel first or second distribution bodies into a parallel condition.

[0049] FIG. 5 shows schematically and exemplarily an embodiment of a device 20 for chemical and/or electrolytic surface treatment of a substrate in a process fluid. The device 20 for chemical and/or electrolytic surface treatment comprises a distribution system 10 as described above and a substrate holder 21. The substrate holder 21 is configured to hold at least one substrate in the distribution system 10. The casing of the distribution system 10 and the substrate holder 21 are mounted in the same reference system A (see broken lines) above the process fluid. As the first distribution body 11 and thereby the casing as well as the substrate holder 21 are fixed at their upper ends, all thermal expansions apply in the same direction, namely in a direction to their lower ends.

[0050] It has to be noted that embodiments of the present disclosure are described with reference to different subject matters. In particular, some embodiments are described with reference to method type claims whereas other embodiments are described with reference to the device type claims. However, a person skilled in the art will gather from the above and the following description that, unless otherwise notified, in addition to any combination of features belonging to one type of subject matter also any combination between features relating to different subject matters is considered to be disclosed with this application. However, all features can be combined providing synergetic effects that are more than the simple summation of the features.

[0051] While the present disclosure has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive. The present disclosure is not limited to the disclosed embodiments. Other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing a claimed present disclosure, from a study of the drawings, the disclosure, and the dependent claims.

[0052] In the claims, the word “comprising” does not exclude other elements or steps, and the indefinite article “a” or “an” does not exclude a plurality. A single processor or other unit may fulfil the functions of several items re-cited in the claims. The mere fact that certain measures are re-cited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. Any reference signs in the claims should not be construed as limiting the scope.

EMBODIMENTS

[0053] 1. A distribution system (10) for a process fluid for chemical and/or electrolytic surface treatment of a substrate, comprising: [0054] a first distribution body (11), [0055] a substitute body, and [0056] a framework (14), [0057] wherein the first distribution body (11) is configured to direct a flow of the process fluid and/or an electrical current to the substrate, [0058] wherein the first distribution body (11) and the substitute body are arranged to insert the substrate between them, [0059] wherein the framework (14) is configured to mount the first distribution body (11) and the substitute body relative to each other, and [0060] wherein the framework (14) is further configured to form, together with the first distribution body (11) and the substitute body, a casing surrounding the substrate.

[0061] 2. Distribution system (10) according to embodiment 1, further comprising a tank (15) configured to receive the casing and an anode.

[0062] 3. Distribution system (10) according to embodiment 1, further comprising two chambers, each mounted to one side face of the casing, wherein each chamber is configured to receive an anode.

[0063] 4. Distribution system (10) according to one of the preceding embodiments, further comprising sealing units configured to seal an interface between the framework (14) and the first distribution body (11) as well as an interface between the framework (14) and the substitute body in an electrically insulated manner relative to the surrounding.

[0064] 5. Distribution system (10) according to one of the preceding embodiments, wherein a top surface of the casing is at least partially open to allow a passage of the substrate.

[0065] 6. Distribution system (10) according to one of the preceding embodiments, wherein the framework (14) is configured to mount the first distribution body (11) and the substitute body parallel to each other.

[0066] 7. Distribution system (10) according to one of the preceding embodiments, wherein the framework (14) comprises several separate frame elements (1, 4) to be mounted relative to each other, the first distribution body (11) and the substitute body.

[0067] 8. Distribution system (10) according to the preceding embodiment, wherein the separate frame elements (1, 4) are releasable mounted.

[0068] 9. Distribution system (10) according to one of the preceding embodiments, wherein the framework (14) is more rigid than the first distribution body (11) and the substitute body and thereby configured to force also initially non-parallel first distribution and substitute bodies into a parallel condition.

[0069] 10. Distribution system (10) according to one of the preceding embodiments, wherein the substitute body is a second distribution body (12) also configured to direct a flow of the process fluid and/or an electrical current to the substrate.

[0070] 11. Distribution system (10) according to one of the preceding embodiments, wherein the framework (14) comprises a distribution frame element (13) comprising at least a 25 process fluid inlet (2) and/or a process fluid outlet (3).

[0071] 12. A device (20) for chemical and/or electrolytic surface treatment of a substrate in a process fluid, comprising: [0072] a distribution system (10) according to one of the proceeding embodiments, and [0073] a substrate holder (21), [0074] wherein the substrate holder is configured to hold at least one substrate in the distribution system (10).

[0075] 13. Device (20) according to the preceding embodiment, wherein a first distribution body (11) of the distribution system (10) and the substrate holder (21) are mounted in the same reference system (A) above the process fluid to be inserted.

[0076] 14. A manufacturing method for a distribution system (10) for a process fluid for chemical and/or electrolytic surface treatment of a substrate, comprising the following steps: [0077] arranging a first distribution body (11) and a substitute body for the substrate to be inserted between them, and [0078] mounting the first distribution body (11) and the substitute body relative to each other by means of a framework (14), [0079] wherein the first distribution body (11) and the substitute body are configured to direct a flow of the process fluid and/or an electrical current to the substrate, and wherein the framework (14) is configured to form, together with the first distribution body (11) and the substitute body, a casing surrounding the substrate.

[0080] 15. A use of a system (10) or a device (20) according to one of the embodiments 1 to 13 for chemically processing a substrate and in particular a large substrate.