COOLING SYSTEM AND METHOD FOR COOLING AN ELECTRONICS CABINET

Abstract

A cooling system, in particular for electronics cabinets, is proposed, comprising a casing, wherein the casing comprises at least a cabinet side partitionment, wherein the cooling system comprises a first cooling circuit and a second cooling circuit, wherein the second cooling circuit is an active cooling circuit, wherein the first cooling circuit and the second cooling circuit are thermally coupled, wherein the second cooling circuit is not disposed in the cabinet side partitionment.

Claims

1. Cooling system, in particular for electronics cabinets, comprising a casing, wherein the casing comprises at least a cabinet side partitionment, wherein the cooling system comprises a first cooling circuit and a second cooling circuit, wherein the second cooling circuit is an active cooling circuit, wherein the first cooling circuit and the second cooling circuit are thermally coupled, wherein the second cooling circuit is not disposed in the cabinet side partitionment.

2. Cooling system according to claim 1, wherein the first cooling circuit is a passive cooling circuit or an active cooling circuit, and/or wherein the second cooling circuit comprises a refrigerant or coolant with a Global Warming Potential (GWP) of less than 1.000, preferably of less than 100, more preferably of less than 10, further preferably of less than 5, still further preferably of less than 3, and/or wherein the second cooling circuit comprises a combustible or harmful refrigerant or coolant, wherein preferably the refrigerant or the coolant is a hydrocarbon, preferably a polyolefin or an alkane, in particular propane, propene or isobutane, and/or wherein the second cooling circuit is a vapor compression cycle circuit or a chiller, and/or wherein the first cooling circuit is a fluid cooling circuit, in particular a water cooling circuit, or a heat pipe, a thermosiphon or a pulsating heat pipe.

3. Cooling system according to claim 1, wherein the second cooling circuit comprises a heat absorbing heat exchanger section, in particular an evaporator, and wherein the first cooling circuit comprises a heat releasing heat exchanger section, in particular a condenser, wherein the heat absorbing heat exchanger section of the second cooling circuit is thermally coupled to the heat releasing heat exchanger section of the first cooling circuit.

4. Cooling system according to claim 1, wherein the heat absorbing heat exchanger section of the second cooling circuit and the heat releasing heat exchanger section of the first cooling circuit form a heat exchanger arrangement, wherein the heat exchanger arrangement comprises a plurality of heat exchange structures which are arranged, preferably in parallel to each other, in a plane of extension, wherein the heat absorbing heat exchanger section of the second cooling circuit comprises a first plurality of fluid guiding means and wherein the heat releasing heat exchanger section of the first cooling circuit comprises a second plurality of fluid guiding means, wherein each heat exchange structure comprises at least one fluid guiding means of the first plurality and at least one fluid guiding means of the second plurality thermally coupled to each other, and preferably arranged in parallel to each other, wherein a clearance is disposed between two adjacent heat exchange structures to allow airflow between the adjacent heat exchange structures and/or wherein each heat exchange structure comprises a heat sink to thermally couple the at least one fluid guiding means of the first plurality and the at least one fluid guiding means of the second plurality.

5. Cooling system according to claim 1, wherein the first cooling circuit comprises a heat absorbing heat exchanger section, in particular an evaporator.

6. Cooling system according to claim 3, wherein the casing comprises an external side partitionment separated by a, preferably gas tight, internal partition wall from the cabinet side partitionment, wherein the heat absorbing heat exchanger section of the second cooling circuit is disposed only in the external side partitionment.

7. Cooling system according to claim 5, wherein the heat releasing heat exchanger section, in particular the condenser, of the first cooling circuit is disposed in the external side partitionment, and wherein the heat absorbing heat exchanger section, in particular the evaporator, of the first cooling circuit is arranged in the cabinet side partitionment.

8. Cooling system according to claim 1, wherein the cabinet side partitionment comprises one inlet opening for inflow of air from an interior of an electronics cabinet and an outlet opening for outflow of air into the electronics cabinet, and/or wherein the external side partitionment comprises at least one inlet opening for inflow of air from an external side and at least one outlet opening for outflow of air to the external side of the electronics cabinet.

9. Cooling system according to claim 6, wherein the external side partitionment comprises a separation wall, separating the external side partitionment into a first volume and a second volume, or a shutter flap, which in a closed position, separates the external side partitionment into a first volume and a second volume, wherein preferably the heat absorbing heat exchanger section of the second cooling circuit and/or the heat releasing heat exchanger section of the first cooling circuit is/are arranged in the first volume and wherein the heat releasing heat exchanger section of the second cooling circuit is arranged in the second volume, wherein preferably the first volume and/or the second volume each have a respective outlet opening and a respective inlet opening wherein further preferably the shutter flap in the open position closes the inlet opening of the second volume, and/or wherein the external side partitionment, in particular the first volume and/or the second volume, comprises a fan, and/or wherein the cabinet side partitionment comprises a fan.

10. Cooling system according to claim 1, comprising a third cooling circuit, wherein the third cooling circuit is preferably configured as a heat pipe, a thermosiphon or a pulsating heat pipe, wherein further preferably a heat absorbing heat exchanger section of the third cooling circuit is arranged in the cabinet side partitionment in flow direction of the airflow in front of the heat absorbing heat exchanger section of the first cooling circuit and/or wherein a heat releasing heat exchanger section of the third cooling circuit is arranged in the external side partitionment in flow direction of the airflow behind the heat releasing heat exchanger section of the first cooling circuit and/or behind the heat absorbing heat exchanger section of the second cooling circuit.

11. Method for cooling an electronics cabinet carried out with a cooling system, in particular for electronics cabinets, comprising a casing, wherein the casing comprises at least a cabinet side partitionment, wherein the cooling system comprises a first cooling circuit and a second cooling circuit, wherein the second cooling circuit is an active cooling circuit, wherein the first cooling circuit and the second cooling circuit are thermally coupled, wherein the second cooling circuit is not disposed in the cabinet side partitionment, wherein the cooling system is selectively operated in at least one of a first mode, in particular in a passive mode, a second mode, in particular in a hybrid mode, or a third mode, in particular in an active mode.

12. Method for cooling an electronics cabinet according to claim 11, wherein an internal temperature T.sub.in is measured in the electronics cabinet and/or in the cabinet side partitionment, and wherein an external temperature T.sub.ex is measured on the external side and/or in the external side partitionment, and wherein the first mode is activated when the internal temperature T.sub.in is higher than the external temperature T.sub.ex, and/or wherein the second mode is activated when the internal temperature T.sub.in is higher than the external temperature T.sub.ex and the external temperature T.sub.ex is higher or preferably lower than an evaporation temperature T.sub.evap of the refrigerant in the second cooling circuit, and/or wherein the third mode is activated when the internal temperature T.sub.in is lower than the external temperature T.sub.ex.

13. Method for cooling an electronics cabinet according to claim 11, wherein in the first mode only the first cooling circuit and/or the third cooling circuit is/are operated, wherein in the second mode and/or in the third mode the first cooling circuit and the second cooling circuit, and preferably the third cooling circuit is operated.

14. Method for cooling an electronics cabinet according to claim 11, wherein in the first mode the shutter flap is in an open position, and/or wherein an airflow regulation flap is in an open position, and/or wherein at least one fan in the external side partitionment, in particular in the first volume and/or the second volume, and/or in the cabinet side partitionment is operated, and/or wherein in the second mode the shutter flap is in an open position, and/or wherein the airflow regulation flap is in an open position or in a closed position, and/or wherein at least one fan in the external side partitionment, in particular in the first volume and/or the second volume, and/or in the cabinet side partitionment is operated, and/or wherein in the third mode the shutter flap is in a closed position, and/or wherein the airflow regulation flap is in a closed position, and/or wherein at least one fan in the external side partitionment, in particular in the first volume and/or the second volume, and/or in the cabinet side partitionment is operated.

15. Electronics cabinet with a cooling system, in particular for electronics cabinets, comprising a casing, wherein the casing comprises at least a cabinet side partitionment, wherein the cooling system comprises a first cooling circuit and a second cooling circuit, wherein the second cooling circuit is an active cooling circuit, wherein the first cooling circuit and the second cooling circuit are thermally coupled, wherein the second cooling circuit is not disposed in the cabinet side partitionment.

Description

BRIEF DESCRIPTION OF THE FIGURES

[0069] The present invention is described in more detail in reference to the accompanying figures.

[0070] FIG. 1 shows a first configuration of a cooling system,

[0071] FIG. 2 shows a first configuration of a heat exchanger arrangement for a cooling system,

[0072] FIG. 3 shows a second configuration of a heat exchanger arrangement for a cooling system,

[0073] FIG. 4 shows the first configuration of the cooling system operated in a passive, a hybrid and an active mode,

[0074] FIG. 5 shows a first configuration of the cooling system comprising an airflow regulation flap

[0075] FIG. 6 shows a second configuration of the cooling system operated in a hybrid mode,

[0076] FIG. 7 shows the second configuration of the cooling system operated in a passive mode,

[0077] FIG. 8 shows the second configuration of the cooling system operated in an active mode,

[0078] FIG. 9 shows a third configuration of the cooling system operated in a passive and in a hybrid mode,

[0079] FIG. 10 shows the third configuration of the cooling system operated in an active mode,

[0080] FIG. 11 shows a fourth configuration of the cooling system comprising a thermosiphon and an airflow regulation flap,

[0081] FIG. 12 shows a fifth configuration of the cooling system comprising a thermosiphon,

[0082] FIG. 13 shows a sixth configuration of the cooling system comprising a water cooling circuit, and

[0083] FIG. 14 shows a seventh configuration of the cooling system comprising a third cooling circuit.

DETAILED DESCRIPTION OF THE FIGURES

[0084] FIG. 1 shows a cooling system 100 for an electronics cabinet 10. The cooling system 100 comprises a casing 11. The casing 11 is divided into a cabinet side partitionment 12 and an external side partitionment 13 by an internal and preferably substantially gas tight partition wall 14. The cooling system 100 comprises a first cooling circuit 15 configured as a pulsating heat pipe 16 and a second cooling circuit 17 configured as a vapor compression cycle circuit 18. The second cooling circuit 17, in particular the vapor compression cycle circuit 18, comprises evaporator 19 as a heat absorbing heat exchanger section 20, compressor 21, condenser 22 as a heat releasing heat exchanger section 23, expansion valve 24 and fluid lines 25. The pulsating heat pipe 16 of the first cooling circuit 15 comprises an evaporator 26 as a heat absorbing heat exchanger section 27 and a condenser 28 as a heat releasing heat exchanger section 29. The condenser 28 of the pulsating heat pipe 16 is thermally coupled to the evaporator 19 of the vapor compression cycle circuit 18. All components of second cooling circuit 17, i.e. the vapor compression cycle circuit 18, are disposed in the external side partitionment 13 so that the second cooling circuit 17 is not disposed in the cabinet side partitionment 12. Evaporator 26 of the pulsating heat pipe 16 is only disposed in the cabinet side partitionment 12, while condenser 28 of the pulsating heat pipe 16 is only disposed in the external side partitionment 13.

[0085] The cabinet side partitionment 12 includes an inlet opening 30 and an outlet opening 31 for air from the interior 32 of the electronics cabinet 10 to enter and exit the cabinet side partitionment 12. To circulate the air through the cabinet side partitionment 12 a first fan 33 is disposed inside the cabinet side partitionment 12.

[0086] The external side partitionment 13 also comprises an inlet opening 34 and an outlet opening 35. Ambient air from outside of the electronics cabinet 10 circulates through the external side partitionment 13 via inlet opening 34 and outlet opening 35. To circulate the ambient air through the external side partitionment 13 a second fan 36 is disposed inside the external side partitionment 13.

[0087] The partition wall 14 is configured gas tight so that the airflows inside the external side partitionment 13 and the cabinet side partitionment 12 are fluidically separated from each other. The vapor compression cycle circuit 18 of the second cooling circuit 17 comprises a refrigerant with a low Global Warming Potential (GWP), which may be flammable, for example propane. The refrigerant in the pulsating heat pipe 16 is a non-flammable or incombustible refrigerant such as R134a.

[0088] FIG. 2 shows a heat exchanger arrangement 37 suitable for the cooling system 100 of FIG. 1. The heat exchanger arrangement 37 comprises a pulsating heat pipe 16 with a heat absorbing heat exchanger section 27 configured as an evaporator 26 and a heat releasing heat exchanger section 29 configured as a condenser 28. Condenser 28 of the pulsating heat pipe 16 is thermally coupled to evaporator 19 of second cooling circuit 17. For the thermal coupling the evaporator 19 of the second cooling circuit 17 comprises a first plurality of stripe-like fluid guiding means 38. The condenser 28 of the first cooling circuit 15 comprises a second plurality of stripe-like fluid guiding means 39. The fluid guiding means 38 of the first plurality and the fluid guiding means 39 of the second plurality are in face-to-face thermal contact with each other. One fluid guiding means 38 of the first plurality and one fluid guiding means 39 of the second plurality form a respective heat exchange structure 40. The heat exchange structures are arranged parallel to each other in an imagined plane of extension 41. Between adjacent heat exchange structures 40 clearances 42 are provided in which pleated cooling fins 43 are arranged for interconnecting the heat exchange structures 40. Heat absorbed in the evaporator 26 of the pulsating heat pipe 16 is transferred to the condenser 28 of the pulsating heat pipe 16 and transferred via the thermal coupling to the evaporator 19 of the second cooling circuit 17. In addition, heat can be transferred to an airflow through the clearances 42 from the fluid guiding means 38 of the second plurality of the condenser 28 of pulsating heat pipe 16.

[0089] A more detailed description of the heat exchanger arrangement 37 according to FIG. 2 is provided in European patent application no. 19168012.3 of the applicant.

[0090] FIG. 3 shows another configuration of a heat exchanger arrangement 44 suitable for the cooling system 100 of FIG. 1. In the heat exchanger arrangement 44 according to FIG. 3, the pulsating heat pipe 16 comprises an evaporator 26 and a condenser 28. In contrast to the configuration of FIG. 2 the evaporator 19 of the second cooling circuit 17 is arranged in an imagined plane of extension 41, while the condenser 28 of the pulsating heat pipe 16 is disposed in an imagined second plane 45 parallel to the plane of extension 41. For the thermal coupling between the evaporator 19 of the second cooling circuit 17 and the condenser 28 of the pulsating heat pipe 16 heat sinks 46 are provided, which are configured as solid aluminum blocks 47. A more detailed description of the heat exchanger arrangement 44 according to FIG. 3 is provided in European patent application no. 19168012.3 of the applicant.

[0091] The cooling system 100 according to FIG. 1 can be operated in at least one of three cooling modii, which are explained in more detail with reference to FIG. 4.

[0092] The cooling system 100 can be operated in a first mode, the so called passive mode, which is chosen when an exterior temperature T.sub.ex is lower than an interior temperature T.sub.in of the electronics cabinet 10. In the passive mode only the pulsating heat pipe 16 is operated to transfer heat from the cabinet side compartment 12 to the exterior side compartment 13, i.e. the second cooling circuit 17 is not operated. In the passive mode the fans 33, 36 can be operated to circulate air through the cabinet side compartment 12 and through the external side compartment 13. However, it is also possible that the fans are not operated in the passive mode. Heat of airflow 48 circulating through the cabinet side partitionment is transferred to airflow 49 circulating through the external side partitionment 13 only via pulsating heat pipe 16. In the passive mode it is particularly advantageous when the first cooling circuit 15 and the second cooling circuit 17 are configured according to the heat exchanger arrangement 37 of FIG. 2, in which an airflow through the clearances 42 between the heat exchange structures 40 is possible.

[0093] The second cooling mode, the so-called hybrid mode, is chosen, when the exterior temperature T.sub.ex is lower than the interior temperature T.sub.in of the electronics cabinet 10, while at the same time the evaporation temperature T.sub.evap of the refrigerant in the second cooling circuit 17 is higher than the exterior temperature T.sub.ex. In the hybrid mode both the passive cooling system of the pulsating heat pipe 16 and the active second cooling system 17 of the vapor compression cycle circuit 18 are operated and, preferably, both fans 33, 36 are running. The evaporation temperature T.sub.evap can be preferably adjusted to be higher than the exterior temperature T.sub.ex by setting the operating parameters of the compressor 21 of the second cooling circuit 17, thereby providing the conditions for the hybrid mode. In the hybrid mode, the evaporator 19 of the second cooling circuit 17 does not absorb heat from the airflow 49 in the external side partitionment 13, because the evaporation temperature T.sub.evap of the refrigerant in evaporator 19 is higher than the external temperature T.sub.ex. However, evaporator 19 cools condenser 28 of heat pipe 16, thereby increasing the cooling effectivity of heat pipe 16 and the cooling system 100.

[0094] In FIG. 5 a modification of the cooling system 100 of FIGS. 1 and 4 is shown. Cooling system 100 of FIG. 5 comprises an airflow regulation flap 50 connected swivelably to thermally coupled evaporator 19 and condenser 28. The thermal coupling between evaporator 19 and condenser 28 does not extend over the full length of condenser 28. In FIG. 5 the flow regulation flap 50 is in a closed position preventing airflow through evaporator 19 and thereby effectively thermally insulating evaporator 19 of the second cooling circuit 17 from airflow 49 in external side partitionment 13. Because of the thermal insulation, cooling system 100 can be operated in the hybrid mode, even if the evaporation temperature T.sub.evap of the refrigerant in evaporator 19 is lower than the exterior temperature T.sub.ex, because heat from airflow 49 is not absorbed by evaporator 19.

[0095] Returning to FIG. 4 the third cooling mode, the so-called active mode, is described. The active mode is chosen, when the external temperature T.sub.ex is higher than the internal temperature T.sub.in. In the active mode both the first cooling circuit 15, i.e. the pulsating heat pipe 16, and the second cooling circuit 17, i.e. the vapor compression cycle circuit 18, are operated. Since the external temperature T.sub.ex is higher than the internal temperature T.sub.in, the passive cooling system 15 of the pulsating heat pipe 16 cannot transfer heat from the cabinet side partitionment 12 to the external side partitionment 13. In order to force heat transfer from the cabinet side partitionment 12 to the external side partitionment 13, the evaporator 19 of the second active cooling circuit 17 is used to cool the condenser 28 of pulsating heat pipe 16 in the external side partitionment 13 below the internal temperature T.sub.in in the cabinet side partitionment 12. The absorbed heat is released via condenser 22 of the second cooling circuit 17.

[0096] FIG. 6 shows a third configuration of the cooling system 100. The configuration shown in FIG. 6 differs from the configuration of FIG. 1 by an internal separation wall 51 in the external side partitionment 13. The separation wall 51 divides the external side partitionment 13 into a first volume 52 and a second volume 53. In the first volume 52 the evaporator 19, the expansion valve 24 and the compressor 21 of the second cooling circuit 17 as well as the condenser 28 of the first cooling circuit 15 are arranged. Furthermore, the first volume 52 holds third fan 54. The first volume 52 comprises an inlet opening 55 and an outlet opening 56 to allow airflow 57 circulation through the first volume 52. The second volume 53 comprises the condenser 22 of the second cooling circuit 17 as well as the second fan 36 to circulate airflow 58 through the second volume 53 via inlet opening 59 and outlet opening 60. FIG. 6 shows the hybrid mode operation of cooling system 100. In the hybrid mode both the first cooling circuit 15 and the second cooling circuit 17 are operated. To effectively remove heat from the first volume 52 and the second volume 53 both fans 36 and 54 are operated. In an alternative configuration, the evaporator 19 and condenser 28 may be configured as in FIG. 5 with the thermal coupling not extending over the full length of condenser 28 and further comprising an airflow regulation flap 50 to thermally insulate evaporator 19 from the air inside the first volume 52.

[0097] FIG. 7 shows the system 100 in the passive mode. In the passive mode the second cooling circuit 17 is not operated. Heat is only released via the condenser 28 of the first cooling circuit 15 disposed in the first volume 52. In the passive mode, second fan 36 is not necessarily running, because heat is not released from condenser 22 of second cooling circuit 17.

[0098] FIG. 8 shows the system of FIGS. 6 and 7 in the active mode. In the active mode the fan 54 in the first volume 52 is not operated. Heat is only released via the condenser 22 of the second cooling circuit 17. Additionally, the inlet opening 55 and outlet opening 56 of the first volume 52 may be closed in the active mode with suitable flaps.

[0099] FIG. 9 shows a third configuration of the cooling system 100. In contrast to the cooling system of FIGS. 1 and 4 to 8 a shutter flap 61 is provided, which in the shown open positioning preferably closes the inlet opening 59 of the second volume 53, and which in the closed position separates the external side partitionment 13 into a first volume 52 and a second volume 53 as shown in FIG. 10. Furthermore, the first volume 52 does not comprise a dedicated outlet opening.

[0100] In the passive and in the hybrid mode shutter flap 61 is in the open position as shown in FIG. 9 and the first fan 33 and the second fan 36 are operated to circulate airflows 48, 49 through the cabinet side partitionment 12 and the external side partitionment 13, respectively. The passive mode is operated when the external temperature T.sub.ex is lower than the internal temperature T.sub.in and the hybrid mode is chosen when in addition the evaporation temperature T.sub.evap of the refrigerant in evaporator 19 of the second cooling circuit 17 is preferably higher than the external temperature T.sub.ex.

[0101] FIG. 10 shows the configuration of cooling system 100 of FIG. 9 in the active mode. In the active mode the shutter flap 61 is in the closed position so that the external side partitionment 13 is separated into the first volume 52 and the second volume 53. In the active mode, the first fan 33 and the second fan 36 are operated. Because of the closed shutter flap 61 airflow 58 circulates only through the second volume 53 to transfer heat released from condenser 22 of the second cooling circuit 17 to the outside of casing 11.

[0102] In the configuration of FIGS. 9 and 10, the thermal coupling between evaporator 19 of second cooling circuit 17 and condenser 28 of first cooling circuit 15 can be configured as in the configuration of FIG. 5, where the thermal coupling does not extend over the full length of condenser 28. An airflow regulation flap 50 might be provided as well.

[0103] FIGS. 11 to 13 show variations of the configurations of first cooling circuit 15 and second cooling circuit 17, which can be applied to each of the configurations of FIGS. 1 and 4 to 10 in any suitable combination.

[0104] In FIG. 11 the first cooling circuit 15 is configured as a thermosiphon 62. Evaporator 63 of thermosiphon 62 in cabinet side partitionment 12 is connected to condenser 64 of thermosiphon 62 in the external side partitionment 13 via fluid lines 65. Evaporator 63 of thermosiphon 62 and condenser 64 are physically separated from each other. Similarly to the configuration of FIG. 5, cooling system 100 of FIG. 11 comprises an airflow regulation flap 50 connected swivellably to thermally coupled evaporator 19 and condenser 64. The airflow regulation flap 50 is shown in an open position allowing airflow through evaporator 19 and condenser 64. The thermal coupling between evaporator 19 and condenser 64 does not extend over the full length of condenser 64.

[0105] FIG. 12 shows a configuration similar to FIG. 11. However, the thermal coupling of evaporator 19 and condenser 64 does extend over the full length of condenser 64 and no airflow regulation flap 50 is provided.

[0106] In the configuration of FIG. 13, first cooling circuit 15 is a water cooling circuit 66 comprising a pump 67. Instead of water the first cooling circuit 15 may comprise a different coolant or refrigerant.

[0107] FIG. 14 shows another configuration of the cooling system 100. Cooling system 100 of FIG. 14 comprises a third cooling circuit 68, which is configured as a pulsating heat pipe 69. The cooling system 100 furthermore comprises the heat exchanger arrangement 44 of FIG. 3, in which the evaporator 19 of the second cooling circuit 17 is arranged in parallel to the condenser 28 of the first cooling circuit 15 and thermally connected to the condenser 28 of the first cooling circuit 15 via heat sinks 46. Heat sinks 46 prevent air from flowing through the evaporator 19 and condenser 28. To improve the effectivity of the passive cooling mode the third cooling circuit 68 is provided. First fan 33 creates airflow 48 in cabinet side partitionment 12 and second Fan 36 creates airflow 49 in external side partitionment 13. A heat absorbing heat exchanger section 70 of the third cooling circuit 68 is arranged in the cabinet side partitionment 12 in flow direction of the airflow 48 in front of the heat absorbing heat exchanger section 27 of the first cooling circuit 15 and a heat releasing heat exchanger section 71 of the third cooling circuit 68 is arranged in the external side partitionment 13 in flow direction of the airflow 49 behind the heat releasing heat exchanger section 29 of the first cooling circuit 15 and behind the heat absorbing heat exchanger section 20 of the second cooling circuit 17.