PERPENDICULAR MTJ ELEMENT HAVING A CUBE-TEXTURED REFERENCE LAYER AND METHODS OF MAKING THE SAME

Abstract

The invention comprises a method of forming a novel magnetic pinning structure having a (100) textured or cube-textured reference layer through a non-epitaxial texturing approach so that an excellent coherent tunneling effect is achieved in a pMTJ element due to its texture structure of CoFe BCC (100)/MgO rocksalt (100)/CoFe BCC (100). Correspondingly, a high MR ratio and a high pinning strength on the reference layer can be achieved for perpendicular spin-transfer-torque magnetic-random-access memory (pSTT-MRAM) using perpendicular magnetoresistive elements as basic memory cells which potentially replace the conventional semiconductor memory used in electronic chips, especially mobile chips for power saving and non-volatility.

Claims

1. A perpendicular magnentic tunnel junction (pMTJ) element comprising: a magnetic pinning structure, wherein the magnetic pinning structure comprises: a perpendicular synthetic antiferromagnetic (pSAF) stack, an oxide buffer (013) layer on top of the pSAF stack, and a cube-textured reference layer comprising a texture starting (TS) layer on top of the oxide buffer layer and a spin polarization (SP) layer on top of the texture starting layer; a tunnel barrier layer on top of the magnetic pinning structure; a magnnetic free layer on top of the tunnel barrier layer and having a magnetic anisotropy perpendicular to a film surface and having a variable magnetization direction; and a cap layer on top of the magnetic free layer, wherein said TS layer comprises a magnetic material having a BCC or L10 superlattice structure and a (100) crystal texture, and said SP layer has a BCC structure and a (100) crystal texture.

2. The element of claim 1, wherein said pSAF stack has a seed-layer and at least two magnetic Co-containing multilayer structures having perpendicular magnetic anisotropy (PMA) interleaved with at least one anti-ferromagnetic coupling (AFC) layer comprising Ru, Rh or Ir, preferred to be seed-layer/(Co/X).sub.m/Y/(Ru, Rh, or Ir)/Y/(X/Co).sub.n, where X represents Pt, Pd or Ni metals, in and n are non-negative integers (normally m>n), Y represents Co or CoFe.

3. The element of claim 1, wherein said OB layer is made of an oxide having a thickness of no more than 1.0 nm, preferably no more than 0.5 nm.

4. The element of claim 1, wherein said OB layer is preferred to be an rocksalt crystalline metal oxide selected from NiO, CoO, FeO, FeCoO.sub.2, NiFeO.sub.2, CoNiO.sub.2, MnO, CrO, VO, TiO, MgO, Mg.sub.xZn.sub.(1—x)O, ZnO and CdO, wherein x is between 0 and 1.

5. The element of claim 1, wherein said TS layer comprises at least one of an iron (Fe) layer, a cobalt (Co) layer, an alloy layer of cobalt iron (CoFe), an alloy layer of iron plantinum (FePt), an alloy layer of iron palladium (FePd), a laminated layer of (Fe/Co).sub.n, a laminated layer of (Fe/CoFe).sub.n, a laminated layer of (Fe/Pt).sub.n, a laminated layer of (Fe/Pd).sub.n and a boron absorbing layer, wherein n is a lamination number, and the boron absorbing layer is a thin layer of metal or alloy containing W, Mo, Mg or Ta.

6. The element of claim 1, wherein said SP layer comprises at least one of an iron (Fe) layer, a cobalt (Co) layer, an alloy layer of cobalt iron (CoFe), an alloy layer of cobalt iron boron (CoFeB), an alloy layer of cobalt boron (CoB), an alloy layer of iron boron (FeB), a laminated layer of (Co/Fe).sub.n, a laminated layer of (Fe/CoFe).sub.n, a laminated layer of (Co/CoFe).sub.n, a laminated layer of (Fe/Pt).sub.n and a laminated layer of (Fe/Pd).sub.n, wherein n is a lamination number.

7. The element of claim 1, wherein said tunnel barrier layer comprises any one of MgO, MgAl.sub.2O.sub.4, Mg.sub.xZno.sub.(1—x)O or ZnO, where x is between 0 and 1.

8. A method of manufacturing a perpendicular magnetic tunnel junction (pMTJ) element for being used in a magnetic memory device comprising the steps of: forming a perpendicular synthetic anti-ferromagnetic (pSAF) stack; forming an oxide buffer (OB) layer atop the pSAF stack; forming a cube-textured reference layer atop the pSAF stack, wherein forming the cube-textured layer sequentially comprises: forming a texture starting (TS) layer and forming a spin polarization (SP) layer having a BCC structure and a (100) crystal texture; forming a tunnel barrier layer atop the cube-textured reference layer and having a rocksalt (100) crystalline texture; forming a magnetic free layer atop the tunnel barrier layer; forming a cap layer atop the magnetic free layer, wherein forming the TS layer comprises the steps of: depositing a magnetic material atop the OB layer and performing a rapid thermal annealing (RTA) process or a fast quenching (FQ) process to obtain a BCC structure or an L10 superlattice structure, and a (100) crystal texture for the magnetic material.

9. The element of claim 8, wherein said OB layer is made of an oxide having a thickness of no more than 1.0 nm, preferably no more than 0.5 nm.

10. The element of claim 8, wherein said OB layer is preferred to be an rocksalt crystalline metal oxide selected from NiO, CoO, FeO, FeCoO.sub.2, NiFeO.sub.2, CoNiO.sub.2, MnO, CrO, VO, TiO, MgO, Mg.sub.xZn.sub.(1−x)O, ZnO and CdO, wherein x is between 0 and 1.

11. The element of claim 8, wherein said TS layer comprises at least one of an iron (Fe) layer, a cobalt (Co) layer, an alloy layer of cobalt iron (CoFe), an alloy layer of iron plantinum (FePt), an alloy layer of iron palladium (FePd), a laminated layer of (Fe/Co).sub.n, a laminated layer of (Fe/CoFe).sub.n, a laminated layer of (Fe/Pt).sub.n, a laminated layer of (Fe/Pd).sub.n and a boron absorbing layer, wherein n is a lamination number, and the boron absorbing layer is a thin layer of metal or alloy containing W, Mo, Mg or Ta.

12. The element of claim 8, wherein said SP layer comprises at least one of an iron (Fe) layer, a cobalt (Co) layer, an alloy layer of cobalt iron (CoFe), an alloy layer of cobalt iron boron (CoFeB), an alloy layer of cobalt boron (CoB), an alloy layer of iron boron (FeB), a laminated layer of (Co/Fe).sub.n, a laminated layer of (Fe/CoFe).sub.n, a laminated layer of (Co/CoFe).sub.n, a laminated layer of (Fe/Pt).sub.n and a laminated layer of (Fe/Pd).sub.n, wherein n is a lamination number.

13. The element of claim 8, wherein said tunnel barrier layer comprises any one of MgO, MgAl.sub.2O.sub.4, Mg.sub.xZn.sub.(1−x)O or ZnO, where x is between 0 and 1.

14. The element of claim 8, wherein forming the magnetic free layer subsequently comprises forming a first free sub-layer and forming a second free sub-layer, wherein the first free sub-layer is formed by PVD or CVD deposition having a deposition rate no more than 0.5 angstrom per second, preferably no more than 0.1 angstrom per second.

15. The element of claim 8, wherein said OB layer is formed by a direct deposition, or a two-step sequential process comprising: depositing a metal layer and oxidizing the metal layer.

16. The element of claim 8, wherein said OB layer is formed by directly oxidizing the top surface of the pSAF stack.

17. The element of claim 8, wherein said rapid thermal annealing (RTA) process has a heating rate of at least 20 degree Kelvin per second.

18. The element of claim 8, wherein said fast quenching (FQ) process has a heating rate of at least 20 degree Kelvin per second, and said fast quenching (FQ) process is preferred to be a laser quenching process.

19. The element of claim 8, wherein said TS layer is formed by PVD or CVD deposition having a deposition rate no more than 0.5 angstrom per second, preferably no more than 0.1 angstrom per second.

20. A method of manufacturing a perpendicular magnetic tunnel junction (pMTJ) element for being used in a magnetic memory device comprising: forming a perpendicular synthetic anti-ferromagnetic (pSAF) stack; forming an oxide buffer (OB) layer atop the pSAF stack; forming a cube-textured reference layer atop the pSAF stack; forming a tunnel barrier layer atop the cube-textured reference layer and having a rocksalt (100) crystalline texture; forming a magnetic free layer atop the tunnel barrier layer; forming a cap layer atop the magnetic free layer, wherein forming the cube-textured reference layer comprises the steps of: depositing a texture starting (TS) layer of a magnetic material atop the OB layer and performing a tensile strain quenching (TSQ) process, to obtain a BCC structure or an L10 superlattice structure, and a (100) crystal texture for the magnetic material, wherein said TSQ process is performed after forming the tunnel barrier layer or any processing stage which is later than forming the tunnel barrier layer, and includes a rapid thermal annealing (RTA) process, a laser quenching process, a pressure quenching process or any other quenching process, said TS layer comprises at least one of an iron (Fe) layer, a cobalt (Co) layer, an alloy layer of cobalt iron (CoFe), an alloy layer of iron platinum (FePt), an alloy layer of iron palladium (FePd), a laminated layer of (Fe/Co).sub.n, a laminated layer of (Fe/CoFe).sub.n, a laminated layer of (Fe/Pt).sub.n and a laminated layer of (Fe/Pd).sub.n, wherein n is a lamination number.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0021] FIG. 1 shows a schematic representation of a typical pMTJ element 10 in the prior art.

[0022] FIG. 2 shows a schematic drawing of layer configuration of a pMTJ element 20 comprising an oxide buffer layer sandwiched between a pSAF stack and a cube-textured reference layer according to an embodiment of the invention.

[0023] FIG. 3 is a cross-sectional view showing a configuration of a pMTJ element 100 after forming the pSAF stack.

[0024] FIG. 4A is a cross-sectional view showing a configuration of a pMTJ element 201 after depositing the oxide buffer layer on top of the pSAF stack, according to the first embodiment.

[0025] FIG. 4B is a cross-sectional view showing a configuration of a pMTJ element 201 after depositing the texture starting layer with an ultra-low deposition rate on top of the oxide buffer layer, according to the first embodiment.

[0026] FIG. 5A is a cross-sectional view showing a configuration of a pMTJ element 202 after depositing an intermediate metal layer on top of the pSAF stack, according to the second embodiment.

[0027] FIG. 5B is a cross-sectional view showing a configuration of a pMTJ element 202 after forming the oxide buffer layer by oxidizing the intermediate metal layer, according to the second embodiment.

[0028] FIG. 5C is a cross-sectional view showing a configuration of a pMTJ element 202 after depositing the texture starting layer with an ultra-low deposition rate on top of the oxide buffer layer, according to the second embodiment.

[0029] FIG. 6A is a cross-sectional view showing a configuration of a pMTJ element 203 after forming the oxide buffer layer by oxidizing the top surface of the pSAF stack, according to the third embodiment.

[0030] FIG. 6B is a cross-sectional view showing a configuration of a pMTJ element 203 after depositing the texture starting layer on top of the oxide buffer layer, according to the third embodiment.

[0031] FIG. 7 is a cross-sectional view showing a configuration of a pMTJ element 300 after performing a rapid thermal annealing (RTA) process or a fast quenching (FQ) process on the texture starting layer.

[0032] FIG. 8 is a cross-sectional view showing a configuration of a pMTJ element 400 after depositing the spin polarization layer (SP-L) on the RTA-treated or FQ-treated texture starting layer.

[0033] FIG. 9 is a cross-sectional view showing a configuration of a pMTJ element 500 after depositing the tunnel barrier layer on the spin polarization layer.

[0034] FIG. 10 is a cross-sectional view showing a configuration of a pMTJ element 600 after depositing the free layer on the tunnel barrier layer.

DETAILED DESCRIPTION OF THE INVENTION

[0035] The present application will now be described in greater detail by referring to the following discussion and drawings that accompany the present application. It is noted that the drawings of the present application are provided for illustrative purposes only and, as such, the drawings are not drawn to scale. It is also noted that like and corresponding elements are referred to by like reference numerals.

[0036] In the following description, numerous specific details are set forth, such as particular structures, components, materials, dimensions, processing steps and techniques, in order to provide an understanding of the various embodiments of the present application. However, it will be appreciated by one of ordinary skill in the art that the various embodiments of the present application may be practiced without these specific details. In other instances, well-known structures or processing steps have not been described in detail in order to avoid obscuring the present application.

[0037] It will be understood that when an element as a layer, region or substrate is referred to as being “on” or “over” another element, it can be directly on the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly on” or “directly over” another element, there are no intervening elements present. It will also be understood that when an element is referred to as being “beneath” or “under” another element, it can be directly beneath or under the other element, or intervening elements may be present. In contrast, when an element is referred to as being “directly beneath” or “directly under” another element, there are no intervening elements present. Here, and thereafter throughout this application, each element written in the left side of “/” is stacked above an element written in the right side thereof.

[0038] In the invention, we propose a novel non-epitaxial growth method to fabricate a thin (100) textured starting (TS) layer over an oxide buffer (OB) layer, atop of a highly FCC (111) textured pSAF stack, which would later lead to epitaxial growth of a highly BCC (100) textured spin polarization layer.

[0039] In general, there is provided a pMTJ element comprising: a magnetically fixed pinning structure, a tunnel barrier layer and a magnetic free layer. The pinning structure consists of a perpendicular synthetic anti-ferromagnetic (pSAF) stack, an oxide buffer (OB) layer and a cube-textured reference layer. The pSAF stack includes a FCC (111) PMA material multilayer such as seed-layer/(Co/X).sub.m/Co/Y/Co/(X/Co).sub.n, where X represents Pt, Pd or Ni metals, m and n are integers (normally m>n), and Y represents a Ru (or Rh, Ir) metal spacer. The cube-textured reference layer comprises a texture starting (TS) layer and a spin polarization (SP) layer. The TS layer includes a crystalline material selected from the group consisting of ferromagnetic materials and ferrimagnetic materials, while the SP layer, as deposited, includes a crystalline material or an amorphous material selected from the group consisting of ferromagnetic materials and ferrimagnetic materials. The TS layer comprises a highly BCC (100) textured material or a L10 superlattice (100) textured material after applying a non-epitaxial texturing method. The SP layer comprises a highly BCC (100) textured material. The thickness of the OB layer sandwiched between the pSAF stack and the cube-textured reference layer is thin enough to produce a strong magnetic parallel-coupling between the reference layer and the pSAF stack, so that the magnetization of the reference layer is pinned in a predetermined perpendicular direction. The TS layer comprises at least one selected from the group consisting of Fe, FeCo, Co, FeX, (Fe/Co).sub.n, (Fe/X).sub.n, Fe/Y, FeCo/Y, (Fe/Co).sub.n/Y, (Fe/Co).sub.n/Fe/Y, (Fe/X).sub.n/Y and (Fe/X).sub.n/Fe/Y, where X represents Pt or Pd metals, Y represents W, Mo, Mg, Ta, or other Boron absorbing metals, and n is a positive integer, and is highly (100) textured by applying a non-epitaxial texturing method. The SP layer includes at least one element selected from Fe, Co and B, and preferably comprises at least one selected from the group consisting of Fe, Co, CoFe, (Fe/Co).sub.n, (Fe/CoFe).sub.n, (Co/Fe).sub.n, (Co/CoFe).sub.n, (CoFe/Fe).sub.n, (CoFe/Co).sub.n, (Fe/Co).sub.n/Fe, (Fe/Co).sub.n/CoFe, (Fe/CoFe).sub.n/Fe, (Fe/CoFe).sub.n/Co, (Co/Fe).sub.n/CoFe, (Co/Fe).sub.n/Co, (Co/CoFe).sub.n/Co, (Co/CoFe).sub.n/Fe, (CoFe/Fe).sub.n/Co, (CoFe/Fe).sub.n/CoFe, (CoFe/Co).sub.n/Fe, (CoFe/Co).sub.n/CoFe, CoFe/(Fe/Co).sub.n, Co/(Fe/CoFe).sub.n, CoFe/(Co/Fe).sub.n, Fe/(Co/CoFe).sub.n, Co/(CoFe/Fe).sub.n, Fe/(CoFe/Co).sub.n, FeB, CoB, FeB/Fe, CoB/Fe, FeB/Co, CoB/Co, FeB/CoFe, CoB/CoFe, CoFeB, CoFeB/Fe, CoFeB/Co and CoFeB/CoFe, where n is a positive integer.

[0040] The OB layer is formed by depositing an oxide layer, or by sequentially depositing a metal layer and oxidizing the metal layer. Alternatively, the OB layer may advantageously be formed by oxidizing the top surface of the pSAF immediately in an oxidization chamber after the formation of the pSAF stack. In general, it is preferred that the OB layer is a magnetic oxide, such as FeO, CoO and FeCoO2, and has a thickness no more than 10 angstroms. The OB layer may strongly exchange couple the two magnetic moments that sandwich the OB layer so that their magnetization directions are parallel. The TS layer is formed by direct deposition on the oxide buffer layer and subsequent rapid thermal annealing (RTA) or fast quenching (FQ). The RTA or FQ can be conducted in-situ in a special chamber attached to a deposition system. As an iron rich layer is deposited directly over an oxide, Fe atoms get oxidized or partially oxidized on the surface, and a strong tensile stress is induced in the film plane, which is caused by interaction between Fe mono-layers and FeO. A sufficiently strong tensile strain in Fe film plane favors a BCC (100) texture. A rapid thermal annealing (RTA), in which lamps are used to heat a substrate quickly to high temperatures, induces an extra tensile strain in the film plane of the iron rich layer. The tensile strains from Fe/FeO interface and the RTA are added together, as a non-epitaxial texturing mechanism, and freeze the Fe film in the (100) texture. For a TS layer made of Fe or CoFe thin film deposited directly on an OB layer, a BCC (100) texture is promoted with the tensile strain in the film plane by performing the RTA within a proper heating/cooling rate range. For a TS layer made of (Fe/Pt).sub.n, thin film deposited directly on an OB layer, an L10 superlattice (100) texture is promoted with the tensile strain in the film plane by performing the RTA within a proper heating/cooling rate range. Alternatively, the TS layer is formed by direct deposition on the OB layer with an ultra-low deposition rate of no more than 0.5 angstrom per second and subsequent thermal annealing in hydrogen atmosphere. The thermal annealing in hydrogen atmosphere can be conducted in-situ in a special thermal annealing chamber attached to a deposition system. In general, the TS layer is highly (100) textured, and the SP layer grows epitaxially on the TS layer and is highly BCC (100) textured.

[0041] Thin-film deposition methods offer the ability to control crystalline texture through epitaxial relationships with the substrate or a seed layer, and common deposition methods include molecular beam epitaxy (MBE), electron-beam (E-beam) evaporation, pulse-laser deposition (PLD) and plasma sputtering. Sputter deposition is the simplest method and widely used in labs and manufacturing industry, and normally sputtering rates are variable, ranging from slower than 1 Å/s to as fast as ˜1 μm/min.

[0042] The structure and morphology of a sputtered thin film can also change significantly during growth depending on substrate type and temperature, the available kinetic energy and the current state of the film. Theoretically, high adatom mobility and active surface diffusion allow a growing film to rearrange into energy minimizing configurations and achieve near-equilibrium structures. However, the ability to reconfigure is lost for fast deposition rates, and the film growth is said to be quenched if atomic mobility is too low or the deposition rate too high. Quenched growth modes or low substrate temperatures can kinetically inhibit energy-minimizing processes, yielding highly non-equilibrium as-deposited structures. Grain growth, coalescence, and defect elimination can induce in-plane tensile strain, relaxing any compressive strain and in some cases leading to a residual tensile strain state. Due to the non-equilibrium nature of magnetron sputtering it is often necessary to employ post-deposition processing to achieve a desired phase or microstructure. In another word, preferential grain growth occurs when there exists a larger driving force, such as additional in-plane strain, for the growth of one particular grain configuration of over any other. Such preferred configurations originate from large surface energy anisotropies or variable strain states of the growing crystallites. Besides, a close epitaxial relationship between the film and substrate or preceding layer can alter the strain in the growing film. Mismatched lattices lead to large strains as the film continues to grow. Both preferential and epitaxial growth can yield crystallographic texture. A rapid thermal anneal with high heating rates induces additional in-plane strain, activates diffusion, promotes grain growth and re-crystallization, and accelerates equilibration through enhanced kinetics. In fact, RTA is a class of techniques, including a spike annealing and a flash light annealing, that provide a way to rapidly anneal wafers to elevated temperatures for relatively short times, usually less than a minute. The heating is accomplished optically. An RTA system typically processes wafers singly and is capable of achieving process temperature of ˜200-1300° C. with a wide range of ramp rates ˜20-250° C. per second. Besides RTA, fast quenching processes include a laser quenching, an induction quenching, a flame quenching and a carburizing quenching. Among them, the laser quenching has a high power density and fast heating/cooling rates, which would also serve the same purpose as the RTA. In another word, the TS layer can also be formed by direct deposition on the oxide buffer layer and subsequent laser quenching or other fast quenching (FQ) process.

[0043] While metal films and adjacent oxide films are thin, epitaxial relationship is generally maintained between them. The perfect epitaxy cannot, however, be expected because of the lattice mismatch between them, thus the both lattices are strained. For an iron thin film growing over a ferrous oxide (FeO) thin film, a tensile strain is induced in the Fe film, although the FeO lattice contracts to some extent, i.e., the FeO is in compression and correspondingly the Fe film is in tension. Fe films completely cover oxide substrates for thicknesses of a few ML, indicating that Fe “wets” the surface better than other elements such as Cu. The ability of the metal film to cover (wet) the oxide substrate correlates directly with the reactivity of the metal toward oxygen. For Fe films, there is a strong interaction between the films and the oxide substrate, i.e., oxidation of the metal over-layers and reduction of the substrate, at sub-monolayer thickness. Moreover, a rapid thermal annealing (RTA), or a laser quenching, induces a strong tensile strain in Fe thin films on oxide substrate, and promotes (100) ordering in Fe films. In another word, after a RTA or a laser quenching, a thin Fe film on an oxide substrate freezes in a (100) preferred orientation. Similarly, this is also true for CoFe to obtain BCC (100) orientation, and for FePt to obtain L10 ordering as well as (100) orientation.

[0044] FIG. 2 shows a schematic drawing of layer configuration of a pMTJ element 20 comprising an oxide buffer and a cube-textured reference layer, which are together sandwiched between a pSAF stack and a tunnel barrier layer, according to the invention. The pMTJ element comprises a perpendicular synthetic anti-ferromagnetic (pSAF) stack (1234), an oxide buffer layer (15), a cube-textured reference layer consisting of a textured starting layer (16A) and a spin polarization layer (16B), a tunnel barrier (17), a free layer (18) and a cap layer (19), wherein the pSAF stack (1234) consisting of a seed layer (11), a lower multilayer structure (12), an anti-ferromagnetic coupling (AFC) spacer (13) and an upper multilayer structure (14). The AFC spacer (13) provides RKKY magnetic coupling between the magnetic lower multilayer structure (12) and the magnetic upper multilayer (14). Similar to the prior art, the pSAF stack has a strong PMA from the same stack, however it is the OB layer (15) that replaces the TBBA layer and offers the cube-textured reference layer (16A, 16B) a stronger magnetic coupling to the pSAF and correspondingly a stronger pinning field. And moreover, the TS layer serves as a highly (100) textured seed layer for the SP layer to achieve a BCC (100) texture through an epitaxial growth, which is crucial for a high MR ratio.

[0045] In next sections, three embodiments of manufacturing pMTJ elements according to this invention are present. FIGS. 3, 4(A, B) and 7-10 show some key processing steps in the first embodiment of forming a pMTJ element having a boron-free cube-textured reference layer. FIGS. 3, 5(A, B, C) and 7-10 show some key processing steps in the second embodiment of forming a pMTJ element having a cube-textured reference layer. FIGS. 3, 6(A, B) and 7-10 show some key processing steps in the third embodiment of forming a pMTJ element having a cube-textured reference layer. In all above three embodiments, the first step is forming a pSAF stack, as shown in FIG. 3. The pSAF stack (1234) includes a FCC (111) PMA material multilayer such as seed-layer/(Co/X).sub.m/Co/Y/Co/(X/Co).sub.n, where X represents Pt, Pd or Ni metals, m and n are integers (normally m>n), and Y represents an AFC spacer made of Ru, Ir or Rh. One or two additional CoFe thin layer(s) may be inserted immediately adjacent to the AFC spacer for further enhancement of the RKKY coupling strength.

First Embodiment of Forming a pMTJ Element having a Cube-textured Reference Layer

[0046] After forming the pSAF stack (1234), an OB layer (15) is deposited on top of the pSAF, as shown in FIG. 4A. The material for the OB layer can be one selected from the group consisting of SiO2, BOx, SOx, AlOx, alkaline metal oxides and transition metal oxides. Preferably, the OB layer is made of an oxide having rocksalt crystalline structure, such as NiO, CoO, FeO, FeCoO.sub.2, NiFeO.sub.2, CoNiO.sub.2, MnO, VO, CrO, TiO, MgO, MgZnO, ZnO, CdO. The thickness of the OB layer is no more than 1.0 nm, preferably no more than 0.5 nm.

[0047] FIG. 4B is a cross-sectional view showing a configuration of an MTJ element 201 after depositing the TS layer (16A) with an ultra-low deposition rate on top of the OB layer (15), according to the first embodiment. The TS layer is preferred to be one selected from the group consisting of Fe, FeCo, Co, (Fe/Co).sub.n and (Fe/Pt).sub.n. The TS layer is formed by direct deposition on the OB layer with an ultra-low deposition rate of no more than 0.5 angstrom per second, preferably, with an ultra-low deposition rate of no more than 0.1 angstrom per second. After depositing the TS layer, a rapid thermal annealing (RTA) process is conducted in-situ in a special anneal chamber. FIG. 7 is a cross-sectional view showing a configuration of an MTJ element 300 after performing the rapid thermal annealing (RTA) process on the TS layer. The rapid thermal anneal (RTA) induces a strong tensile strain in Fe or (Fe/Pt).sub.n thin films on oxide substrate, and promotes (100) ordering or texture in Fe or (Fe/Pt).sub.n films. Once an L10 superlattice (100) textured (Fe/Pt).sub.n is formed, it provides an extra high PMA to the cube-textured reference layer.

[0048] After the RTA, the TS layer serves as a highly (100) texture seed layer for the SP layer to achieve a BCC (100) texture. The SP layer is one selected from the group consisting of CoFe, CoFe/Fe, (Fe/Pt).sub.n/CoFe, (Fe/Pd).sub.n/CoFe, (Fe/Pt).sub.n/CoFe/Fe and (Fe/Pd).sub.n/CoFe/Fe. FIG. 8 is a cross-sectional view showing a configuration of an MTJ element 400 after depositing the SP layer (16B) on the RTA-treated TS layer (16A). It is important to note that the cube-textured reference is totally boron-free. FIG. 9 is a cross-sectional view showing a configuration of an MTJ element 500 after depositing the tunnel barrier layer (17) on the reference layer that consists of the TS layer (16A) and the SP layer (16B). The tunnel barrier is made of MgO, MgZnO, MgAl.sub.xO.sub.y or ZnO. FIG. 10 is a cross-sectional view showing a configuration of an MTJ element 600 after depositing the free layer (18) on the tunnel barrier layer. The free layer can be selected among CoFe, Fe/CoFe, CoFe/Fe, Fe/CoFe/Fe with a thickness between 1-1.6 nm. An RTA process can be used for the formation of the free layer. For example, when the free layer is a bi-layer of Fe/CoFe, an RTA is preferably used after the deposition of the Fe sub-layer so that the Fe sub-layer is BCC (100) textured, and the CoFe sub-layer can grow epitaxially with a BCC (100) texture. In the first embodiment, boron-free pMTJ elements are formed, which is very different from the conventional pMTJ in the prior art.

Second Embodiment of Forming a pMTJ Element having a Cube-textured Reference Layer

[0049] After forming the pSAF stack (1234), a metal layer (15M) is deposited on top of the pSAF, as shown in FIG. 5A, according to the second embodiment. The material for the metal layer can be one selected from the group consisting of alkaline metals, transition metals, and alloy. Preferably, the metal layer is made of Ni, Co, Fe, FeCo, NiFe, CoNi, Mn, Mg, MgZn, Zn or Cd. The thickness of the metal layer is no more than 1.0 nm, preferably no more than 0.5 nm.

[0050] FIG. 5B is a cross-sectional view showing a configuration of an MTJ element 202 after oxidizing the metal layer with an oxygen gas flow or an oxygen-containing gas flow to form an OB layer (15), according to the second embodiment. FIG. 5C is a cross-sectional view showing a configuration of an MTJ element 202 after depositing a TS layer (16A), according to the second embodiment. The TS layer is preferred to be one selected from the group consisting of Fe, FeCo, Co, (Fe/Co).sub.n and (Fe/Pt).sub.n. The TS layer is formed by direct deposition on the OB layer with an ultra-low deposition rate of no more than 0.5 angstrom per second, preferably, with an ultra-low deposition rate of no more than 0.1 angstrom per second. After depositing the TS layer, a fast quenching (FQ) process is conducted in-situ by using a fast quenching chamber. FIG. 7 is a cross-sectional view showing a configuration of an MTJ element 300 after performing the fast quenching process on the TS layer. The fast quenching process induces a strong tensile strain in Fe thin films on oxide substrate, and promotes (100) ordering in Fe films Due to an excellent quality, a laser quenching process is preferred as the fast quenching process for this embodiment.

[0051] After the FQ process, the TS layer serves as a highly (100) texture seed layer for the SP layer to achieve a BCC (100) texture. The TS layer is one selected from the group consisting of CoFe, CoFe/Fe, (Fe/Pt).sub.n/CoFe, (Fe/Pd).sub.n/CoFe, (Fe/Pt).sub.n/CoFe/Fe, and (Fe/Pd).sub.n/CoFe/Fe. FIG. 8 is a cross-sectional view showing a configuration of an MTJ element 400 after depositing the SP layer on the FQ-treated TS layer. FIG. 9 is a cross-sectional view showing a configuration of an MTJ element 500 after depositing the tunnel barrier layer (17) on the cube-textured reference layer that consists of the TS layer (16A) and the SP layer (16B). The tunnel barrier is made of MgO, MgZnO, MgAl.sub.xO.sub.y or ZnO. FIG. 10 is a cross-sectional view showing a configuration of an MTJ element 600 after depositing the free layer (18) on the tunnel barrier layer. The free layer can be selected among CoFe, Fe/CoFe, CoFeB, FeB, Fe/CoFeB and Fe/CoFeB/(W, Mo)/CoFeB with a B composition between 15-30% and preferably at 20% and a thickness between 1-2.6 nm. The cap layer (not shown) can be MgO or other metal oxide.

Third Embodiment of Forming a pMTJ Element having a Cube-textured Reference Layer

[0052] In the third embodiment, the pSAF stack is directly oxidized after the pSAF stack is formed. FIG. 6A is a cross-sectional view showing a configuration of an MTJ element 202 after oxidizing the top surface of the pSAF stack with an oxygen gas flow or an oxygen-containing gas flow to form an OB layer (15), according to the third embodiment. FIG. 6B is a cross-sectional view showing a configuration of an MTJ element 202 after depositing a TS layer (16A), according to the second embodiment. The TS layer is preferred to be one selected from the group consisting of Fe, FeCo, Co and [Fe/Pt].sub.n. The TS layer is formed by direct deposition on the OB layer with an ultra-low deposition rate of no more than 0.5 angstrom per second, preferably, with an ultra-low deposition rate of no more than 0.1 angstrom per second. After the deposition of the TS layer, a rapid thermal annealing (RTA) process is conducted in-situ by a special anneal chamber. FIG. 7 is a cross-sectional view showing a configuration of an MTJ element 300 after performing the rapid thermal annealing (RTA) process on the TS layer. The rapid thermal anneal (RTA) induces a strong tensile strain in Fe thin films on oxide substrate, and promotes (100) ordering in Fe films.

[0053] After the RTA, the TS layer serves as a highly (100) texture seed layer for the SP layer to achieve a BCC (100) texture. The SP layer is one selected from the group consisting of CoFe, CoFe/Fe, (Fe/Pt).sub.n/CoFe, (Fe/Pd).sub.n/CoFe, (Fe/Pt).sub.n/CoFe/Fe, and (Fe/Pd).sub.n/CoFe/Fe. FIG. 8 is a cross-sectional view showing a configuration of an MTJ element 400 after depositing the SP layer (16B) on the RTP-treated TS layer. FIG. 9 is a cross-sectional view showing a configuration of an MTJ element 500 after depositing the tunnel barrier layer (17) on the cube-textured reference layer that consists of the TS layer (16A) and the SP layer (16B). The tunnel barrier is made of MgO, MgZnO, MgAlxOy or ZnO. FIG. 10 is a cross-sectional view showing a configuration of an MTJ element 600 after depositing the free layer (18) on the tunnel barrier layer. The free layer can be selected among CoFe, Fe/CoFe, CoFeB, FeB, Fe/CoFeB with a B composition between 15-30% and preferably at 20% and a thickness between 1-1.6 nm.

[0054] As an option, The TS layer consists of at least a first sub-layers and a second sub-layer, wherein the first sub-layer is preferred to be one selected from the group consisting of Fe, FeCo, Co, [Fe/Co].sub.n and [Fe/Pt].sub.n, and the second sub-layer contains Boron absorbing material, such as W and Mo. In this case, the SP layer can be one selected from the group consisting of CoFe, CoFeB, CoFe/Fe, CoFeB/Fe, (Fe/Pt).sub.n/CoFe, (Fe/Pd).sub.n/CoFe, (Fe/Pt).sub.n/CoFe/Fe, and (Fe/Pd).sub.n/CoFe/Fe.

[0055] The non-epitaxial texturing method described as above can be generalized to a tensile strain quenching (TSQ) technique which also comprises other quenching methods such as a pressure quenching (PQ) process. The TSQ technique can rapidly produce a tensile stress/strain in the TS film plane at a high temperature and correspondingly induce an energetically favored (100) texture, and have a successful retention of the (100) texture in the final TS layer as the temperature rapidly decreases to a room temperature. Other embodiments of this invention may include using any quenching technique, even at various processing stages. For example, the cube-textured reference layer may have the SP layer combined into the TS layer, and the TS layer is sandwiched between the OB layer and the tunnel barrier layer. The rapid thermal annealing, or the laser quenching, or any other TSQ techniques, is preferred to be applied after the formation of the tunnel barrier layer. Because the TS layer is sandwiched between two oxide layers, the quenching induced tensile strain is much larger than the one that a quenching process is applied immediately after the deposition of the TS layer. Similarly, the TSQ technique may also apply to formation of free layers in pMTJs. For example, if a free layer is boron-free and comprises at least one of an iron (Fe) layer, a cobalt (Co) layer, an alloy layer of cobalt iron (CoFe), an alloy layer of iron plantinum (FePt), an alloy layer of iron palladium (FePd), a laminated layer of (Fe/Co).sub.n, a laminated layer of (Fe/CoFe).sub.n, a laminated layer of (Fe/Pt).sub.n and a laminated layer of (Fe/Pd).sub.n, a TSQ process may be applied after formation of an oxide cap layer. If a free layer comprises a first free sub-layer which is boron-free and a second free sub-layer which contains boron, a TSQ process may be applied immediately after formation of the first free sub-layer.

[0056] While certain embodiments have been described above, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel embodiments described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.