LED LIGHT BULB
20200318821 ยท 2020-10-08
Inventors
Cpc classification
F21V23/006
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21K9/238
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21K9/232
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21Y2109/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V29/502
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V19/006
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V29/70
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V3/02
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21Y2115/10
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
F21V23/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21K9/232
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21K9/238
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V19/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V29/502
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V29/70
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Abstract
The LED light bulb includes a housing, a bulb holder, at least one LED illuminating member disposed in the housing for comprehensive and effective illumination, and a driver board that is disposed in the bulb holder and has a gallium nitride transistor. The LED illuminating member includes a plurality of LED chips, without reflectors, packaged and arranged in a staggering manner for comprehensive and effective illumination. Through the gallium nitride transistor having the advantages of high efficiency, high frequency and low load cycle power conversion, the LED illuminating member has better illuminating performance and can reduce the size of its driver board. The driver board can be installed in a conventional lamp, without the limitation of the size of the driver board.
Claims
1. An LED light bulb, comprising: a housing, a bulb holder, at least one LED illuminating member disposed in the housing for comprehensive and effective illumination, and a driver board that is disposed in the bulb holder and has a gallium nitride transistor; the housing being a hollow sphere made of a light-permeable material; the bulb holder being disposed at one end of the housing, the bulb holder having an end portion and a threaded portion to form a positive terminal and a negative terminal for supplying power; the LED illuminating member including a plurality of LED chips without reflectors, the LED chips being arranged on a transparent substrate in a staggering manner, a positive conductive wire and a negative conductive wire being disposed on the transparent substrate, the LED chips and the positive conductive wire being electrically connected to the negative conductive wire through a plurality of wires, one end of each of the positive conductive wire and the negative conductive wire being connected to a conductive pin that is fixed by a conductive adhesive composed of high-temperature silica gel, copper powder and palladium powder, the conductive pin being further electrically connected to the driver board; positive and negative power input portions of the driver board being connected to the threaded section and the end portion of the bulb holder through wires, wherein when the bulb holder is connected with a power source, the LED illuminating member is driven by the driver board to emit light, wherein one side of the driver board, corresponding to the LED illuminating member, is coated with a layer of heat isolation adhesive to form a heat insulation layer, and a periphery of the heat insulation layer fills a gap between the driver board and an inner wall of the bulb holder, the conductive pin stands erect from the driver board to support the transparent substrate while the heat insulation layer made of the heat isolation adhesive is configured to fasten the conductive pin, the transparent substrate extends vertically in longitudinal direction, making LED chips facing horizontal.
2. (canceled)
3. The LED light bulb as claimed in claim 1, wherein a region of two surfaces of the transparent substrate, covered by the LED chips, is coated with an encapsulant which can increase brightness.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0009]
[0010]
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0011] Referring to
[0012] The housing 1 is a hollow sphere made of a light-permeable material. In general, it is made of a glass material. The bulb holder 2 is disposed at one end of the housing 1. The bulb holder 2 has an end portion 21 and a threaded portion 22 to form a positive terminal and a negative terminal for supplying power.
[0013] The LED illuminating member 3 includes a plurality of LED chips 31 without reflectors. The LED chips 31 are arranged on a transparent substrate 34 in a staggering manner. A positive conductive wire 32 and a negative conductive wire 33 are disposed on the transparent substrate 34. The LED chips 31 and the positive conductive wire 32 are electrically connected to the negative conductive wire 33 through a plurality of wires 311. A region of two surfaces of the transparent substrate 34, covered by the LED chips 31, is coated with an encapsulant 35 which can increase brightness, such as fluorescent adhesive. One end of each of the positive conductive wire 32 and the negative conductive wire 33 is connected to a conductive pin 37 that is fixed by a conductive adhesive 36. The conductive adhesive 36 is made by adding copper powder and palladium powder to high-temperature silica gel. The conductive adhesive 36 is heated to bond the conductive pin 37 to the transparent substrate 34 and electrically connected to the positive and negative conductive wires 32, 33. The conductive adhesive 36 allows the conductive pin 37 to be fixed on the transparent substrate 34 stably and can withstand a temperature of 170 degrees or higher.
[0014] The driver board 4 having the gallium nitride transistor 41 is electrically connected to the conductive pin 37 of the LED illuminating member 3. One side of the driver board 4, corresponding to the LED illuminating member 3, is coated with a layer of heat dissipation adhesive to form a heat insulation layer 42. The periphery of the heat insulation layer 42 fills the gap between the driver board 4 and the inner wall of the bulb holder 2. The heat insulation layer 42 is used to fix the driver board 4 in the bulb holder 2 and block the heat energy generated when the LED illuminating member 3 emits light. The positive and negative power input portions of the driver board 4 are connected to the threaded section 22 and the end portion 21 of the bulb holder 2 through wires. When the bulb holder 2 is connected with a power source, the LED illuminating member 3 is driven by the driver board 4 to emit light.
[0015] As known from the foregoing description, the advantage of the present invention is that the LED illuminating member 3 is composed of a plurality of LED chips 31, without reflectors, packaged and arranged in a staggering manner, so that the each LED chip 31 can emit light on its circumference and can effectively emit light in a comprehensive manner. The heat generated by the staggered LED chips 31 is dispersed without being concentrated together, thereby increasing the luminous efficiency and prolonging the service life of the LED chips 31.
[0016] Another advantage of the present invention is to use a driver board having a gallium nitride transistor. Because the gallium nitride transistor has the advantages of high efficiency, high frequency and low load cycle power conversion, the LED illuminating member has better illuminating performance and can reduce the size of its driver board. This makes the bulb design the same size as a conventional bulb without the limitation of the size of the driver board, such that the driver board can be installed in a conventional lamp. The heat insulation layer is used to fix the driver board in the bulb holder and block the heat energy generated when the LED illuminating member emits light, thereby prolonging the service life of the driver board.
[0017] Another advantage of the present invention is that the conductive adhesive is made by adding copper powder and palladium powder to high-temperature silica gel. The conductive adhesive is heated to bond the conductive pin to the transparent substrate, so that the conductive pin can be fixed very firmly on the transparent substrate without falling or breaking and can withstand a temperature of 170 degrees or higher.
[0018] Although particular embodiments of the present invention have been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the present invention. Accordingly, the present invention is not to be limited except as by the appended claims.