LASER PROCESSING DEVICE

Abstract

A controller causes a laser beam to move over a strip electrode along a predetermined path to cut the strip electrode into a tab shape. The predetermined path includes a first path, a second path, and a third path. The first path extends from a first position to a second position. The second position is positioned further outside in a width direction perpendicular to the conveyance direction and further in the conveyance direction than the first position. The second path extends from the second position to a third position. The third position is positioned in a direction opposite the conveyance direction with respect to the second position. The third path extends from the third position to a fourth position.

Claims

1. A laser processing device for processing a strip electrode, the laser processing device comprising: a conveyance device configured to convey the strip electrode in a conveyance direction; a laser irradiating unit configured to irradiate the strip electrode with a laser beam and configured to change the irradiating direction of the laser beam; a controller configured to control the laser irradiating unit so as to cut the strip electrode into a tab shape by causing the laser beam to move along a predetermined path on the strip electrode, the predetermined path including a first path extending from a first position to a second position positioned further outside in a width direction perpendicular to the conveyance direction and further in the conveyance direction than the first position, and a second path extending from the second position to a third position positioned in a direction opposite the conveyance direction with respect to the second position, and a third path extending from the third position to a fourth position positioned further inside in the width direction and further in the conveyance direction than the third position, and the controller being further configured to cause the laser beam to move from the first position to the second position along the first path, cause the laser beam to move from the second position to the third position along the second path, and cause the laser beam to move from the third position to the fourth position along the third path.

2. The laser processing device according to claim 1, wherein the fourth position is a same position as the first position.

3. The laser processing device according to claim 1, further comprising a guide configured to hold the strip electrode, the guide including a notch having a first edge section that follows the first path and a second edge section that follows the second path, the first edge section being inclined with respect to the width direction toward the outside of the strip electrode in the width direction and toward the conveyance direction, and the second edge section being positioned in the direction opposite the conveyance direction with respect to the first edge section, and being inclined with respect to the width direction toward the outside of the strip electrode in the width direction and toward the direction opposite the conveyance direction.

4. The laser processing device according to claim 3, wherein the guide includes a first upper guide plate disposed in the conveyance direction with respect to the notch and disposed above an end material cut off from the strip electrode, and a first lower guide plate disposed in the conveyance direction with respect to the notch and disposed below the end material, and at least one of the first upper guide plate and the first lower guide plate has a tapered shape that faces the notch.

5. The laser processing device according to claim 3, wherein the laser irradiating unit is disposed above the guide, and the guide includes a first upper guide plate disposed in the conveyance direction with respect to the notch and disposed above an end material cut off from the strip electrode, and a second upper guide plate disposed in the direction opposite the conveyance direction with respect to the notch and disposed above the strip electrode, and at least one of the first upper guide plate and the second upper guide plate has a tapered shape that faces upward.

6. The laser processing device according to claim 1, further comprising a suction roller disposed in the conveyance direction with respect to the guide and configured to suction the end material cut off from the strip electrode.

7. A method for controlling a laser processing device in order to cut a strip electrode into a tab shape by causing a laser beam to move over the strip electrode, the method comprising: conveying the strip electrode in a conveyance direction; irradiating the laser beam onto the strip electrode; causing the laser beam to move from a first position to a second position along a first path extending from the first position to the second position positioned further outside in a width direction perpendicular to the conveyance direction and further in the conveyance direction than the first position; causing the laser beam to move from the second position to a third position along a second path extending from the second position to the third position positioned in a direction opposite the conveyance direction with respect to the second position; and causing the laser beam to move from the third position to a fourth position along a third path extending from the third position to the fourth position positioned further inside in the width direction and further in the conveyance direction than the third position.

8. The method according to claim 7, wherein the fourth position is a same position as the first position.

9. The laser processing device according to claim 2, further comprising a guide configured to hold the strip electrode, the guide including a notch having a first edge section that follows the first path and a second edge section that follows the second path, the first edge section being inclined with respect to the width direction toward the outside of the strip electrode in the width direction and toward the conveyance direction, and the second edge section being positioned in the direction opposite the conveyance direction with respect to the first edge section, and being inclined with respect to the width direction toward the outside of the strip electrode in the width direction and toward the direction opposite the conveyance direction.

10. The laser processing device according to claim 9, wherein the guide includes a first upper guide plate disposed in the conveyance direction with respect to the notch and disposed above an end material cut off from the strip electrode, and a first lower guide plate disposed in the conveyance direction with respect to the notch and disposed below the end material, and at least one of the first upper guide plate and the first lower guide plate has a tapered shape that faces the notch.

11. The laser processing device according to claim 9, wherein the laser irradiating unit is disposed above the guide, and the guide includes a first upper guide plate disposed in the conveyance direction with respect to the notch and disposed above an end material cut off from the strip electrode, and a second upper guide plate disposed in the direction opposite the conveyance direction with respect to the notch and disposed above the strip electrode, and at least one of the first upper guide plate and the second upper guide plate has a tapered shape that faces upward.

12. The laser processing device according to claim 9, further comprising a suction roller disposed in the conveyance direction with respect to the guide and configured to suction the end material cut off from the strip electrode.

13. The laser processing device according to claim 10, further comprising a suction roller disposed in the conveyance direction with respect to the guide and configured to suction the end material cut off from the strip electrode.

14. The laser processing device according to claim 11, further comprising a suction roller disposed in the conveyance direction with respect to the guide and configured to suction the end material cut off from the strip electrode.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0018] FIG. 1 is a schematic view illustrating a configuration of a laser processing device according to an embodiment.

[0019] FIG. 2 is a perspective view illustrating an example of a strip electrode.

[0020] FIG. 3 is a block diagram of a control system of the laser processing device.

[0021] FIG. 4 is a perspective view illustrating a portion of the laser processing device.

[0022] FIG. 5A is a top view illustrating a predetermined path of a laser beam.

[0023] FIG. 5B is a top view illustrating an example of a tab shape of the strip electrode processed by the laser processing device.

[0024] FIG. 6 is a perspective view illustrating laser processing positions of the strip electrode.

[0025] FIG. 7 is a view illustrating a change of the predetermined path when the length of the tab is changed.

[0026] FIG. 8 is a view illustrating a predetermined path and the shape of a notch of a guide according to a first modified example.

[0027] FIG. 9 is a view illustrating the path of a laser beam according to the prior art.

[0028] FIG. 10 is a view illustrating the path of a laser beam according to the prior art.

DESCRIPTION OF EMBODIMENTS

[0029] A laser processing device for processing a strip electrode according to an embodiment will be explained below with reference to the drawings. FIG. 1 is a schematic side view illustrating a configuration of a laser processing device 1 according to the embodiment. Arrow A1 in the drawing represents the conveyance direction of a strip electrode 100.

[0030] FIG. 2 is a view illustrating an example of the strip electrode 100. As illustrated in FIG. 2, the strip electrode 100 includes an edge 101. The edge 101 is one edge in the width direction of the strip electrode 100. The width direction of the strip electrode 100 is a direction perpendicular to the longitudinal direction of the strip electrode 100. The width direction of the strip electrode 100 is a direction perpendicular to the conveyance direction A1 of the strip electrode 100 in the laser processing device 1.

[0031] The strip electrode 101 includes a metal foil 105 and an active material layer 106. The active material layer 106 is applied to at least one surface of the metal foil 105. The strip electrode 100 includes a coated section 102 and an uncoated section 103. The active material layer 106 is provided to the coated section 102. The uncoated section 103 is provided along the edge 101. The uncoated section 103 is a portion to which the active material layer 106 is not provided. The metal foil 105 is exposed in the uncoated section 103. The laser processing device 1 forms a tab 200 in the strip electrode 100 by cutting the uncoated section 103 with a laser beam L1.

[0032] As illustrated in FIG. 1, the laser processing device 1 includes a winding out shaft 2, a winding shaft 3, a conveyance device 4, a plurality of rollers 5a to 5n, and a laser irradiating unit 6. The strip electrode 100 (referred to below as electrode roll 110) wound into a roll is assembled onto the winding out shaft 2. The winding shaft 3 winds up the processed strip electrode 100 into a roll.

[0033] The conveyance device 4 causes the strip electrode 100 to move from the winding out shaft 2 to the winding shaft 3. The conveyance device 4 includes a first driving motor 11 and a second driving motor 12. The first driving motor 11 is connected to the winding out shaft 2. The first driving motor 11 causes the winding out shaft 2 to rotate. The second driving motor 12 is connected to the winding shaft 3. The second driving motor 12 causes the winding shaft 3 to rotate.

[0034] The plurality of rollers 5a to 5n are provided so as to be able to rotate about the centers of the rollers 5a to 5n. The plurality of rollers 5a to 5n include a first dancer roller 5a, a nip roller 5b, a second dancer roller 5c, and a plurality of guide rollers 5d to 5n. The first dancer roller 5a is disposed between the winding out shaft 2 and the nip roller 5b.The first dancer roller 5a applies a predetermined tension to the strip electrode 100 let out from the winding out shaft 2. The nip roller 5b is disposed between the first dancer roller 5a and the second dancer roller 5c. The nip roller 5b includes a first roller 5p and a second roller 5q. The nip roller 5b presses the strip electrode 100 between the first roller 5p and the second roller 5q. The second dancer roller 5c is disposed between the winding shaft 3 and the nip roller 5b. The second dancer roller 5c imparts a predetermined tension to the strip electrode 100 wound up by the winding shaft 3.

[0035] The laser irradiating unit 6 cuts the strip electrode 100 by irradiating the laser beam L1 onto the strip electrode 100. The laser irradiating unit 6 is a so-called galvanoscanner-type laser device. The laser irradiating unit 6 includes a laser oscillator 13 and a head 14. The laser oscillator 13 generates the laser beam L1. The head 14 is connected to the laser oscillator 13 by means of a fiber cable 15. The head 14 is disposed between the winding out shaft 2 and the winding shaft 3.

[0036] As illustrated in FIG. 1, the head 14 includes a mirror 16. The mirror 16 is disposed so as to be able to rotate. FIG. 3 is a block diagram of a control system of the laser processing device 1. The mirror 16 is connected to a laser actuator 17 illustrated in FIG. 3. The laser actuator 17 is, for example, an electric motor. The rotation angle of the mirror 16 is changed by the laser actuator 17. The laser irradiating unit 6 causes the irradiation direction of the laser from the head 14 to change by changing the rotation angle of the mirror 16. Consequently, the strip electrode 100 is cut into a desired shape.

[0037] FIG. 4 is a perspective view illustrating a portion of the laser processing device 1. As illustrated in FIG. 4, the head 14 is disposed above the strip electrode 100. The strip electrode 100 is conveyed in the horizontal direction below the head 14. The laser processing device 1 includes a first air blow device 18 and a second air blow device 19. The first air blow device 18 and the second air blow device 19 are disposed between the head 14 and the strip electrode 100. The first air blow device 18 blows air toward positions (referred to below as laser processing positions) where the strip electrode 100 receives the laser beam L1. Consequently, fumes generated by the processing by the laser beam L1 are blown away. The second air blow device 19 blows air so that the fumes do not adhere to the mirror 16.

[0038] The laser processing device 1 includes a guide 20. The guide 20 is disposed below the head 14. The guide 20 holds the strip electrode 100 around the laser processing positions. The guide 20 includes a workpiece guide 21 and a foil guide 22. The workpiece guide 21 holds the coated section 102. The workpiece guide 21 includes an upper plate 23 and a lower plate 24. The upper plate 23 is disposed above the coated section 102. The lower plate 24 is disposed below the coated section 102. The coated section 102 is sandwiched between the upper plate 23 and the lower plate 24. The coated section 102 is conveyed between the upper plate 23 and the lower plate 24. The foil guide 22 holds the uncoated section 103. A detailed explanation of the foil guide 22 is provided below.

[0039] The laser processing device 1 includes a recovery device 25. The recovery device 25 recovers the metal foil 105 (referred to below as end material 107) cut off from the strip electrode 100. The recovery device 25 includes a suction roller 26, a first nip roller 27, a second nip roller 28, and a recovery duct 29. The suction roller 26 is positioned in the conveyance direction A1 with respect to the foil guide 22. The suction roller 26 suctions the end material 107. For example, a plurality of pores are provided to the surface of the suction roller 26. The inside of the suction roller 26 is set to a negative pressure by a suction device 30 illustrated in FIG. 3. The suction device 30 is, for example, a pump or a fan. The suction roller 26 rotates by means of a third driving motor 31 illustrated in FIG. 3. The first nip roller 27 and the second nip roller 28 face the suction roller 26. The first nip roller 27 is disposed above the suction roller 26. The first nip roller 27 is disposed in the conveyance direction A1 with respect to the suction roller 26. Due to the rotation of the suction roller 26, the end material 107 passes between the suction roller 26 and the first nip roller 27 and is fed to the recovery duct 29.

[0040] As illustrated in FIG. 3, the laser processing device 1 includes a controller 32. The controller 32 includes a processor, such as a CPU, and a memory, such as a RAM or a ROM. The controller 32 controls the first driving motor 11 and the second driving motor 12 thereby letting out the strip electrode 100 from the electrode roll 110, causing the strip electrode 100 to move over the plurality of rollers 5a to 5n, and winding the strip electrode 100 in a roll shape on the winding shaft 3.

[0041] The controller 32 controls the laser oscillator 13 thereby causing the laser beam to be irradiated from the head 14. The controller 32 controls the laser actuator 17 thereby changing the irradiation direction of the laser beam L1 from the head 14. The controller 32 causes the laser beam L1 from the head 14 to move along a predetermined path on the strip electrode 100 thereby cutting the edge 101 of the strip electrode 100 into a shape having a tab 200 and a bottom side 201 as illustrated in FIG. 2. As illustrated in FIG. 2, the bottom side 201 extends in the conveyance direction A1. The tab 200 includes a first side 202, a second side 203, and a top side 204. The first side 202 and the second side 203 extend in the width direction from the bottom side 201. The top side 204 extends in the conveyance direction A1. The predetermined path of the laser beam L1 is explained below.

[0042] FIG. 5A is a top view illustrating a laser processing position of the strip electrode 100. The controller 32 causes the laser beam L1 to move over the strip electrode 100 following a predetermined path 40 illustrated in FIG. 5A. The predetermined path 40 includes a first path 42, a second path 42, and a third path 43. The first path 41 is inclined with respect to the width direction. The first path 41 extends from a first position P1 to a second position P2. The first position P1 is separated from the edge 101 of the strip electrode 100 toward the inside in the width direction. The second position P2 is positioned further to the outside in the width direction and further in the conveyance direction A1 than the first position P1.

[0043] The second path 42 is parallel to the conveyance direction A1. The second path 42 extends from the second position P2 to a third position P3. The third position P3 is positioned in a direction opposite the conveyance direction A1 with respect to the second position P2. The third path 43 is inclined with respect to the width direction in the opposite direction from the first path 41. The third path 43 extends from the third position P3 to a fourth position P4. The fourth position P4 is positioned further inside in the width direction and in the conveyance direction A1 than the third position P3. In the present embodiment, the fourth position P4 is the same as the first position P1. Therefore, the predetermined path 40 has a triangular loop shape with the first position P1, the second position P2, and the third position P3 as the vertices.

[0044] The controller 32 maintains the laser beam L1 at the first position P1. Consequently, the strip electrode 100 is cut along the bottom side 201 as illustrated in FIG. 5B. Next, the laser beam L1 is moved from the first position P1 to the second position P2 along the first path 41. Consequently, the strip electrode 100 is cut along the first side 201 as illustrated in FIG. 5B. Next, the controller 32 causes the laser beam L1 to move from the second position P2 to the third position P3 along the second path 42. Consequently, the strip electrode 100 is cut along the top side 204 as illustrated in FIG. 5B. Next, the controller 32 causes the laser beam L1 to move from the third position P3 to the first position P1 along the third path 43. Consequently, the strip electrode 100 is cut along the second side 203 as illustrated in FIG. 5B. The controller 32 maintains the laser beam L1 at the first position P1. Consequently, the strip electrode 100 is cut again along the bottom side 201. By repeating the above processing, a plurality of tabs 200 are formed with gaps therebetween in the strip electrode 100.

[0045] The foil guide 22 will be discussed next. FIG. 6 is a perspective view illustrating the laser processing positions on the strip electrode 100. As illustrated in FIG. 5A and 6, the foil guide 22 includes a notch 50. The notch 50 has a shape that follows the predetermined path 40. Specifically, the notch 50 includes a first edge section 51 and a second edge section 52. The first edge section 51 has a shape that follows the first path 41. The first edge section 51 is inclined with respect to the width direction toward the outside of the strip electrode 100 in the width direction and toward the conveyance direction A1.

[0046] The second edge section 52 is positioned in the opposite direction in the conveyance direction A1 with respect to the second edge section 52. The second edge section 52 has a shape that follows the third path 43. The second edge section 52 is inclined with respect to the width direction toward the outside of the strip electrode 100 in the width direction and toward the direction opposite the conveyance direction A1.

[0047] As illustrated in FIG. 6, the foil guide 22 includes a first upper guide plate 53, a first lower guide plate 54, a second upper guide plate 55, and a second lower guide plate 56. The first upper guide plate 53 is disposed in the conveyance direction A1 with respect to the notch 50. The first upper guide plate 53 is disposed above the end material 107 that is cut off from the strip electrode 100. The first lower guide plate 54 is disposed in the conveyance direction Al with respect to the notch 50. The first lower guide plate 54 is disposed below the end material 107. The above-mentioned suction roller 26 is disposed in the conveyance direction A1 with respect to the first upper guide plate 53 and the first lower guide plate 54.

[0048] The inlet of the gap between the first upper guide plate 53 and the first lower guide plate 54 has a tapered shape that faces the notch 50. Specifically the first upper guide plate 53 includes a first inlet tapered face 57. The first lower guide plate 54 includes a second inlet tapered face 58. The first inlet tapered face 57 and the second inlet tapered face 58 are inclined so that the gap between the first inlet tapered face 57 and the second inlet tapered face 58 narrows toward the conveyance direction A1. The end material 107 passes through the inlet between the first inlet tapered face 57 and the second inlet tapered face 58 and enters the gap between the first upper guide plate 53 and the first lower guide plate 54. Consequently, the end material 107 enters easily into the gap between the first upper guide plate 53 and the first lower guide plate 54.

[0049] The second upper guide plate 55 is disposed opposite the conveyance direction A1 with respect to the notch 50. The second upper guide plate 55 is disposed above the strip electrode 100. The second upper guide plate 55 is disposed opposite the conveyance direction A1 with respect to the notch 50. The second lower guide plate 56 is disposed below the strip electrode 100. The first upper guide plate 53 and the second upper guide plate 55 have tapered shapes that face upward. Specifically the first upper guide plate 53 includes a first upper tapered face 59. The second upper guide plate 55 includes a second upper tapered face 60. The first upper tapered face 59 and the second upper tapered face 60 are inclined so that the distance between the first upper tapered face 59 and the second upper tapered face 60 widens upward. Consequently, the first upper guide plate 53 and the second upper guide plate 55 are less likely to interfere with the laser beam L1.

[0050] In the laser processing device 1 according to the previously discussed present embodiment, the tab 200 is formed in the strip electrode 100 by moving the laser beam along the predetermined path 40. In addition, as illustrated in FIG. 7, the length of the tab 200 in the width direction of the strip electrode 100 is changed by changing the lengths of the first path 41 and the third path 43. In FIG. 7, the length of the first path 41 is extended along the inclination direction of the first path 41. Consequently, the second position P2 is changed to P2. The length of the third path 43 is extended along the inclination direction of the third path 43. Consequently, the third position P3 is changed to P3. In this way, the length of the tab 200 in the width direction of the strip electrode 100 can be changed without changing the inclination angles of the first path 41 and the third path 43.

[0051] The strip electrode 100 is held by the guide 20. The laser beam L1 passes through the notch 50 of the guide 20 and is irradiated onto the strip electrode 100, whereby the tab 200 is formed in the strip electrode 100. The notch 50 has a shape that follows the predetermined path 40 of the laser beam L1 whereby rattling of the strip electrode 100 is effectively suppressed. Consequently, the strip electrode 100 can be cut with high precision.

[0052] In addition, the length of the tab 200 is changed in the width direction of the strip electrode 100 by changing the lengths of the first path 41 and the third path 43 without changing the inclination angles of the first path 41 and the third path 43. As a result, a common guide 20 can be used even when forming tabs 200 of different lengths.

[0053] Although an embodiment of the present disclsoure has been described so far, the present disclosure is not limited to the above embodiment and various modifications may be made within the scope of the disclosure. The configuration of the laser processing device 1 is not limited to the configuration of the above embodiment and may be modified.

[0054] The structures or dispositions of the winding out shaft 2, the winding shaft 3, the conveyance device 4, the plurality of rollers 5a to 5n, or the laser irradiating unit 6 are not limited to those of the above embodiment and may be changed. For example, the laser irradiating unit 6 is not limited to a galvanoscanner type and may be another type. The structure or disposition of the suction roller 26 is not limited to the above embodiment and may be changed.

[0055] The structure or disposition of the foil guide 22 is not limited to the above embodiment and may be changed. Only one of the first upper guide plate 53 and the first lower guide plate 54 may have a tapered shape that faces the notch. Only one of the first upper guide plate 53 and the second upper guide plate 55 may have a tapered shape that faces upward. Alternatively, the foil guide 22 may be omitted.

[0056] The predetermined path 40 is not limited to the above embodiment and may be changed. For example, FIG. 8 illustrates a predetermined path 40 according to a first modified example. As illustrated in FIG. 8, the fourth position P4 may be a position different from the first position P1. The predetermined path 40 may include a fourth path 44. The fourth path 44 may extend from the fourth position P4 to the first position P1. The controller 32 may cause the laser beam L1 to move along the fourth path 44 from the fourth position P4 to the first position P1. Consequently, the strip electrode 100 may be cut along the bottom side 201. In addition, the notch 50 of the foil guide 22 may be changed to match the shape of the predetermined path 40 according to the first modified example.

[0057] According to the present disclosure, the length of a tab can be changed in the width direction of a strip electrode without changing the inclination angle of the path of a laser beam in a laser processing device.