Method for producing a component provided with at least one electrically conductive conductor body

Abstract

Method for producing a component provided with at least one electrically conductive conductor body, wherein the conductor body is surrounded at least in portions, in particular largely, in an integrally bonded and/or interlocking fashion by an injection-molded body formed from an injection-molding material. The method includes receiving the conductor body at least in portions in or on a receiving region of a carrier body, the receiving region delimiting a receiving space. The method also includes encapsulating the carrier body, provided with the conductor body, at least in portions with the injection-molding material to form a component comprising at least the conductor body, the carrier body and the injection-molded body.

Claims

1. A method for producing a component provided with at least one electrically conductive conductor body, wherein the conductor body is surrounded at least in portions, in particular largely, in an integrally bonded and/or interlocking fashion by an injection-molded body formed from an injection-molding material, the method comprising: receiving the conductor body at least in portions in or on a receiving region of a carrier body, which receiving region delimits a receiving space, encapsulating the carrier body, provided with the conductor body, at least in portions with the injection-molding material to form a component comprising at least the conductor body, the carrier body and the injection-molded body.

2. The method according to claim 1, wherein after and/or during the receiving of the conductor body in or on the carrier body, the geometric shape of the carrier body is modified at least in portions, wherein with the modification of the geometric shape of the carrier body the conductor body undergoes, at least in portions, a change in shape that is similar or identical, in particular in comparison with the deformation of the carrier body.

3. The method according to claim 2, wherein the change in shape of the conductor body and/or the carrier body after arranging the conductor body in or on the receiving region of the carrier body comprises a deformation such that a body volume formed by the conductor body and/or the carrier body becomes more compact.

4. The method according to claim 2, wherein at least one portion of the conductor body and/or of the carrier body undergoes a linear and/or a rotational movement during its deformation, in particular the conductor body and/or the carrier body is bent during the deformation.

5. The method according to claim 1, wherein the conductor body and/or the carrier body, in particular during or already prior to its deformation, at least in portions has at least a spiral shape, preferably a spiral shape comprising at least a basic cone-like shape and/or a basic cylinder-like shape and/or a basic pyramid-like shape, and particularly preferably the spiral shape is compressed along an axis of the spiral shape during the deformation of the conductor body and/or the carrier body.

6. The method according to claim 1, wherein a first portion of the conductor body and/or carrier body has a first, spiral, in particular cone-like or pyramid-like, basic shape and a second portion of the conductor body and/or carrier body has a second, spiral, in particular cone-like or pyramid-like, basic shape, wherein a tapering region of the first spiral basic shape faces towards or faces away from a tapering region of the second spiral basic shape.

7. The method according to claim 1, wherein, after or during the receiving of the conductor body in or on a receiving region of the carrier body, in a first injection-molding process, a first injection-molded body is molded onto or overmolded on the conductor body and/or the carrier body at least in portions, in particular completely, and in a second injection-molding process carried out in time after the first injection-molding process, a second injection-molded body is molded onto or overmolded on the first injection-molded body and/or the conductor body and/or the carrier body at least in portions.

8. The method according to claim 1, wherein after or during the receiving of the conductor body in or on a receiving region of the carrier body, the carrier body provided with the conductor body is received at least in portions, in particular completely, in or on a receiving volume of a base body, wherein, during the encapsulation, in particular by means of the injection-molding material, the conductor body, the carrier body and the base body are connected to one another at least in portions in an integrally bonded and/or interlocking fashion.

9. The method according to claim 1, wherein: in or on the carrier body and/or in or on the receiving volume of the base body, at least one contact means is arranged before or during the encapsulation and forms an electrically conductive connection to the conductor body, preferably at least one contact means region of the contact means is exposed after the encapsulation and/or at least one contact means region of the at least one contact means projects out of the main volume of extent of the component after the encapsulation.

10. The method according to claim 1, wherein: in or on the carrier body and/or in or on the receiving volume of the base bod, before or during the encapsulation there is arranged at least one iron core and/or electrical component and/or magnetic-field-conducting element, which during the encapsulation is encapsulated with the injection-molding material at least in portions.

11. The method according to claim 1, wherein a conductor body is used which is designed as a stranded wire body and is formed at least from a group of electrically conductive individual wires preferably the stranded wire body has at least in portions, in particular completely, at least one group of electrically conductive individual wires which are designed as high-frequency stranded wires and/or high-voltage stranded wires and/or as individual wires insulated from one another by an insulating layer, in particular by means of an insulating layer designed as a lacquer layer.

12. The method according to claim 1, wherein that the carrier body and/or the base body is produced at least in portions, in particular completely, from an injection-molding method and/or from an additive manufacturing method.

13. The method according to claim 1, wherein the carrier body and/or the base body is formed at least in portions, in particular completely, from a plastics material, preferably from a thermoplastic.

14. The method according to claim 1, wherein the carrier body comprises at least two carrier sub-bodies, wherein the carrier sub-bodies are assembled before and/or during the receiving of the conductor body in or on the receiving region of the carrier body.

15. The method according to claim 1, wherein a carrier body is used which comprises at least two carrier sub-bodies, wherein at least two carrier sub-bodies in each case comprise a receiving sub-region for forming the receiving region at least in portions, wherein the at least one conductor body, in particular at least in the state of the encapsulated component, is received in the at least two receiving sub-regions.

16. The method according to claim 1, wherein a carrier body is used, the receiving region of which has, at least in portions, an L-shaped and/or a U-shaped and/or a V-shaped and/or a C-shaped and/or a W-shaped cross-sectional geometry, and in particular the carrier body has, at least largely, a constant cross-sectional geometry.

17. The method according to claim 1, wherein a carrier body is used, the receiving region of which has a first axial length in a first receiving region portion and a second axial length, different from the first axial length, in a further receiving region portion, preferably a first receiving region portion located closer to the center of the component has a greater axial length than a further receiving region portion located further away from the center of the component.

18. The method according to claim 1, wherein a carrier body is used, which comprises a guide device at least in portions on a surface of at least one wall portion facing away from the receiving region, wherein the guide device carries out a selective guidance of injection-molding material fed to the carrier body during the encapsulation, preferably at least one guide device on the carrier body side is adapted to the geometric shape of a base body and/or the position and/or orientation of at least one injection opening of an injection mold for encapsulating the conductor and carrier body received therein, in order to achieve a defined encapsulation of the conductor and carrier body.

19. The method according to claim 1, wherein at least one conductor body received in the receiving region of the carrier body, at least in the state before the carrier body provided with the conductor body is encapsulated with the injection-molding material, is held in or on the receiving region by means of a holding means, in particular on the carrier body side, in an interlocking and/or integrally bonded and/or frictionally engaged fashion.

20. The method according to claim 1, wherein while the conductor body is being received in or on the receiving region of the carrier body, the conductor body is guided at least in portions, in particular completely, into the receiving region by means of a guide means, in particular on the carrier body side.

21. The method according to claim 2, wherein during the modification of the geometric shape of the conductor body and/or the carrier body, an at least partial, in particular complete, guidance of a relative movement of at least two carrier body sub-regions by means of a guide portion, in particular on the carrier body side, and/or an interlocking and/or a frictionally engaged and/or integrally bonded connection of at least two connection portions, in particular on the carrier body side takes place.

22. The method according to claim 1, wherein a first conductor body is received in a receiving region delimiting a first receiving space and a further conductor body is received in a receiving region delimiting a further receiving space, in particular before at least one carrier body provided with the conductor body is encapsulated with an injection-molding material.

23. A component, in particular electric coil, comprising a conductor body and a carrier body, produced in a method according to claim 1.

24. A device for producing a component comprising a conductor body and a carrier body by a method according to claim 1.

Description

[0066] The invention is explained in greater detail by means of exemplary embodiments in the drawings. In the drawings:

[0067] FIG. 1 shows a schematic exploded view of a component according to an exemplary embodiment;

[0068] FIG. 2 shows a schematic depiction of a component in the final state of manufacture according to an exemplary embodiment;

[0069] FIG. 3 shows a perspective semi-transparent principle depiction of a component in the final state of manufacture according to an exemplary embodiment;

[0070] FIG. 4 shows a perspective view of a carrier body in an undeformed state according to an exemplary embodiment;

[0071] FIG. 5 shows a perspective view of a carrier body in a deformed state according to an exemplary embodiment;

[0072] FIG. 6 shows a schematic sectional view of the carrier body in a deformed state according to an exemplary embodiment;

[0073] FIG. 7 shows a principle depiction of a carrier body in an undeformed state according to an exemplary embodiment;

[0074] FIG. 8 shows a principle depiction of a carrier body in an undeformed state according to an exemplary embodiment;

[0075] FIG. 9 shows a principle depiction of a carrier body according to FIG. 6 or 7 in a deformed state;

[0076] FIG. 10 shows a schematic detailed view of a close-up region of two adjacent carrier body portions according to an exemplary embodiment;

[0077] FIG. 11 shows a schematic detailed view of a close-up region of two adjacent sub-body portions according to an exemplary embodiment;

[0078] FIG. 12 shows a perspective principle depiction of a carrier body in a deformed state according to an exemplary embodiment; and

[0079] FIG. 13 shows a perspective principle view of a conductor body formed as a stranded wire body.

[0080] A method for producing a component 1 provided with at least one electrically conductive conductor body 2 is explained below. The conductor body 2 of the manufactured product, i.e. of the component 1 in the finished state, is surrounded here at least in portions, in particular largely, in an integrally bonded and/or interlocking fashion by an injection-molded body 4 formed from an injection-molding material 3. As can be seen in FIG. 2, an injection-molding material is arranged or formed or molded between and/or around a group of component parts, namely between and/or around a conductor body 2, a carrier body 7 and a base body 16.

[0081] The method provides for the method steps that the conductor body 2 is received at least in portions in or on a receiving region 6 of a carrier body 7, which receiving region delimits a receiving space 5, cf. FIG. 1, which shows a carrier body 7 which has a U-shaped receiving space 5 defined by wall portions 27 on the carrier body side. The conductor body 2 is inserted into this U-shaped receiving space 5. In a subsequent method step, the carrier body 7, provided with the conductor body 2, is encapsulated at least in portions with the injection-molding material 3 to form a component 1 comprising at least the conductor body 2, the carrier body 7 and the injection-molded body 4. FIG. 1 shows an exploded view of the conductor body 2, the carrier body 7, the base body 16 and a contact means 17. The conductor body 2, the carrier body 7 and the contact means 17 can be fitted or inserted in a receiving volume 15 of the base body 16 and lastly encapsulated at least in portions by an injection-molding material 3, so that the component 1 is present in its final state of manufacture, cf. FIGS. 2 and 3.

[0082] After and/or during the receiving of the conductor body 2 in or at the carrier body 7, the geometric shape of the carrier body 7 can optionally be modified at least in portions, wherein, with the modification of the geometric shape of the carrier body 7, the conductor body 2 undergoes or is given, at least in portions, a change in shape that is similar or identical, in particular in comparison with the deformation of the carrier body 7. An exemplary change in shape of the carrier body 7 can be seen from the comparison of FIG. 4 (undeformed state) and FIG. 5 (deformed state). If the conductor body 2 is inserted or placed in the receiving region 6 of the carrier body 7 before the deformation of the carrier body 7, the conductor body 2 also undergoes a change in shape at the same time as the change in shape of the carrier body 7 or with a slight time delay. It is possible that the change in shape of the conductor body 2 and/or the carrier body 7 after arranging the conductor body 2 in or on the receiving region 6 of the carrier body 7 comprises a deformation such that a body volume 8 formed by the conductor body 2 and/or the carrier body 7 becomes more compact.

[0083] The body volume 8 of the conductor body 2 and of the carrier body 7 can be understood as a reference volume or standard volume (for example, by circumscribing these bodies 2, 7 by a rectangle or cylinder or cube) of these two bodies 2 and 7 to indicate the compactness of the bodies 2, 7. In FIG. 4, the two basic shapes 11, 12 indicate approximately the body volume 8; in FIG. 5, the body volume 8 is indicated by a dashed line. In other words, in the undeformed state the carrier body 7 and/or the conductor body 2 is present in a state comprising a larger filling dimension than in the deformed state. The deformed state can, for example, correspond to the final state of manufacture of at least the carrier body 7 and/or the conductor body 2, so that in the deformed state of the two bodies 2, 7 an encapsulation and thus their integrally bonded connection allows this target state or this target geometry to be fixed.

[0084] At least one portion of the conductor body 2 and/or the carrier body 7, during deformation thereof, can perform or undergo a linear and/or a rotational movement. In particular, the conductor body 2 and/or the carrier body 7 is bent at least in portions, in particular completely, during the deformation.

[0085] In a method step preceding the deformation of the carrier body 7, it can be provided that during the insertion or receiving of the conductor body 2 in or on the receiving region 6 of the carrier body 2, the conductor body 2 undergoes a selective change in shape. For example, a conductor body 2 can undergo an elastic and/or plastic change in shape or deformation during its insertion into the receiving region 6 due to the counter force acting on the conductor body 2 by means of the carrier body 7. In this case, the conductor body 2 can preferably follow the shape predefined by the, in particular more rigid, carrier body 7 or its receiving region surface. In other words, by receiving the conductor body 2 in or on the carrier body 7, the carrier body 7 can have a shaping effect on the conductor body 2. In this way, it is possible, for example, to achieve also more complex or technically difficult modifications to the shape of the conductor body 2 in a simple and cost-effective manner by means of a selective embodiment of the carrier body 7 and its shaping effect during the receiving of the conductor body 2.

[0086] The conductor body 2 and/or the carrier body 7 may, in particular before its deformation, have at least in portions, preferably largely, particularly preferably completely, at least one spiral shape 9, in particular a spiral shape 9 comprising at least a basic cone-like shape and/or a basic cylinder-like shape and/or a basic pyramid-like shape. It is possible that, during the deformation of the conductor body 2 and/or the carrier body 7, the spiral shape 9 is compressed along an axis 10 of the spiral shape 9, particularly preferably along an axis of symmetry of the spiral shape 9, or is subjected to compressive forces pointing towards the center of the spiral shape 9. As shown for example in FIG. 4, the carrier body 7 (and/or the conductor body 2) may have a curved line-like shape, wherein this line-like shape extends in the manner of at least one spiral within the space.

[0087] In other words, the carrier body 7 provided with the conductor body 2 can be compressed in such a way that parts of the carrier body 7 are sunk into spaces predefined by the shape of the carrier body 7, cf. FIGS. 4 and 5.

[0088] It is possible that a first portion of the conductor body 2 and/or carrier body 7 has a first, spiral, in particular cone-like or pyramid-like, basic shape 11 and a second portion of the conductor body 2 and/or carrier body 7 has a second, spiral, in particular cone-like or pyramid-like, basic shape 12, wherein a tapering region 13 of the first spiral basic shape 11 faces towards or faces away from a tapering region 14 of the second spiral basic shape 12. A spiral basic shape 11, 12 can be understood to mean, for example, a course of at least a portion, in particular a complete course, of a carrier body 7 and/or of a conductor body 2, according to which a portion of the carrier body 7 and/or of the conductor body 2 runs lying at least substantially in or on a basic shape surface of a basic shape 11, 12. For example, as shown in FIG. 4, the line-like course of the carrier body 7 can extend running substantially on a surface of a pyramid. In the example shown in FIG. 4, the line-like carrier body 7 runs along ends of two pyramid-shaped or pyramid-like basic shapes 11, 12, the tips or tapering regions of said ends facing each other. The basic shapes 11, 12 have been schematically visualized in FIG. 4 by dash-and-double-dot lines.

[0089] In FIGS. 7 and 8, further or alternative configurations of the carrier body 7 are shown in abstract form, in which case the carrier body 7 and/or the carrier body 7 provided with a conductor body 2 may have spiral shapes tapering in pairs in portions. In FIG. 7, four, for example conical, basic shapes 11, 12 are shown, wherein the upper and the lower pair 42, 42 of the basic shapes 11, 12 in each case face each other with their widened end region. In the deformed or compressed state (see FIG. 9), the carrier body portions are nested in one another or moved into each other, at least in portions. In FIG. 8, the pairs of basic shapes 42, 42 in each case face each other with their tapered end regions, wherein the deformed state of this embodiment can also be seen in FIG. 9. The arrows 43 shown in FIG. 8 indicate the winding direction of the conductor body 2 within the basic shape 11, 12, wherein it can be seen that the winding direction or the direction of rotation of a receiving space course on the carrier body side remains constant inside and outside the basic shape pairs 42, 42.

[0090] After and/or during the receiving of the conductor body 2 in or on a receiving region 6 of the carrier body 7 provided with the conductor body 2, the group formed from conductor body 2 and carrier body 7 can be received at least in portions, in particular completely, in or on a receiving volume 15 of a base body 16, wherein the conductor body 2 and the carrier body 7 and the base body 16 are connected to one another at least in portions in an integrally bonded and/or interlocking fashion during the encapsulation, in particular by means of the injection-molding material 3. The base body 16 can, for example, have a pot-like shape or a pot shape, so that an inner receiving volume 15 is surrounded or defined by a circumferential wall extending circumferentially on the base body side, in particular in the manner of a closed ring. It is possible that the base body 16, in particular having a pot-like shape, has a recess 37. A collar portion 34, for example, may extend at this recess 37. The collar portion 34 may, for example, have a cylindrical shape and form, in the manner of a cylindrical wall, a channel 35 extending at the recess 37 over the main volume of extent 36 of the base body 16. In other words, the channel 35 traverses the base body 16, wherein the collar portion 34, in particular on the base body side, delimits the channel 35 from the receiving volume 15 of the base body 16 in a manner impervious to injection-molding material, in particular in the injection state. It can be provided here that the collar portion 34 prevents, at least in portions, in particular completely, that during the injection of injection-molding material 3 into or onto the receiving volume 15 of the base body 16, injection-molding material 3 can enter or penetrate the channel 35.

[0091] It may prove advantageous if the channel 35 runs substantially coaxially with an axis of a conductor body 2 and/or carrier body 7, in particular a spiral conductor body, received in the receiving volume 15 of the base body 16.

[0092] In an advantageous embodiment, it may be provided that (a) in or on the carrier body 7 and/or (b) in or on the receiving volume 15 of the base body 16, at least one contact means 17 is arranged before or during the encapsulation and forms an electrically conductive connection to the conductor body 2. In this case, for example, at least one contact means region 18 of the contact means 17 may be exposed after encapsulation and/or at least one contact means region 18 of the at least one contact means 17 projects out of the main volume of extent of the component 1 after the encapsulation; cf. FIG. 2. The contact means region 18 projecting out of the main volume of extent 36 of the base body 15 may, for example, serve as an interface or as a plug contact for a corresponding plug/socket counterpart (not shown).

[0093] It can optionally be provided that (a) in or on the carrier body 7 and/or (b) in or on the receiving volume 15 of the base body 16 at least one iron core (not shown) and/or electrical component (not shown) and/or magnetic-field-conducting element (not shown) is arranged before or during the encapsulation and is encapsulated with or by the injection-molding material 3 at least in portions during the encapsulation. This makes it possible to connect further elements of the component 1 to the carrier body 7 and/or the base body 16, in particular non-detachably, in the course of the encapsulation.

[0094] A conductor body 2 can, for example, be designed as a stranded wire body 19 and can have at least one group of electrically conductive individual wires 38; cf. FIG. 13. Preferably, the stranded wire body 19 has at least in portions, in particular completely, at least one group of electrically conductive individual wires 38, which is/are designed as high-frequency stranded wires and/or high-voltage stranded wires and/or as individual wires 38 insulated from one another or with respect to one another by an insulating layer 39, in particular by an insulating layer 39 designed as a lacquer layer. The group of individual wires 38, for example each provided with an insulating layer 39, can optionally be insulated from the environment 41 via at least one insulating means 40. The environment 41 is thus intended to mean the area directly adjacent to the insulating means 40, which can be, for example, an injection-molded body 4 or a carrier body 7. An insulating means 40 can also be used for a conductor body 2 comprising a solid wire.

[0095] In an advantageous embodiment, it can be achieved with the use of the carrier body 7 that an insulating means 40 of the conductor body 2, in particular of the stranded wire body 19, and/or an insulating layer 39 of a stranded wire body 19 has to fulfil a lower requirement with regard to its electrical effectiveness or its electrical insulating effect, since the actual electrical insulating function can be performed at least in part by the carrier body 7 and/or by the injection-molded body 4. In a further embodiment, an insulating means 40 of the conductor body 2 can be dispensed with at least in portions, in particular completely. For example, the insulating material 40 can be dispensed with at least in portions, in particular completely, along the longitudinal axis or along the course of the conductor body 2 and/or the individual wires 38.

[0096] The carrier body 7 and/or the base body 16 can be produced at least in portions, in particular completely, from an injection-molding method and/or from an additive manufacturing method. For this purpose, for example, the carrier body 7 and/or the base body 16 can be formed at least in portions, in particular completely, from a plastics material, preferably from a thermoplastic. Particularly preferably, the plastics material is selected in such a way that it can be processed in an injection-molding method, so that, for example, the carrier body 7 and/or the base body 16 can be produced in the course of a plastics injection-molding method.

[0097] The carrier body 7 may, for example, comprise at least two carrier sub-bodies, wherein the carrier sub-bodies are assembled before and/or during the receiving of the conductor body 2 in or on the receiving region 6 of the carrier body 7 (not shown). In other words, the carrier sub-bodies may initially be present as separate elements, in particular elements produced separately from one another, and may be joined to one another in a frictionally engaged and/or interlocking and/or integrally bonded fashion before or during the receiving of the conductor body. For example, assembly or connection of the carrier sub-bodies takes place by means of a clip connection (i.e. snap-lock connection), wherein the portions forming the clip connection can be formed, in particular in one piece, on the carrier sub-bodies. By means of a carrier body 7 comprising several separate parts or carrier sub-bodies, the production of the carrier sub-body 7 can be simplified and/or the possibilities of the constructive geometric design of the carrier element 7 can be extended.

[0098] A carrier body 7 can, for example, comprise at least two carrier sub-bodies, wherein at least two carrier sub-bodies each comprise a receiving sub-region for forming the receiving region 6 at least in portions. Here, optionally, at least in the state of the encapsulated component 1, the at least one conductor body 2 can be received in the at least two receiving sub-regions. The term receiving sub-regions is to be understood to mean longitudinal portions along the course of the carrier body 7.

[0099] For example, a carrier body 7 of which the receiving region 6 has an L-shaped and/or a U-shaped and/or a V-shaped and/or a C-shaped and/or a W-shaped cross-sectional geometry at least in portions can be used. In particular, the carrier body 7 has a constant cross-sectional geometry at least in portions, preferably largely, particularly preferably completely. The embodiment shown in FIG. 6 has a largely constant cross-sectional geometry of the carrier body 7, according to which only the innermost turn or the innermost carrier sub-portion has a flatter shape than the other carrier sub-portions arranged further outward.

[0100] For example, a receiving region 6 of the carrier body 7 may have a first axial length 24 in a first receiving region portion 23 and a second axial length 24, different from the first axial length 24, in a further receiving region portion 23. Preferably, a first receiving region portion 23 located closer to the center 25 of the component 1 and/or the carrier body 7 has a greater axial length 24 than a further receiving region portion 23, which is located further away from the center 25 of the component 1 and/or from the center 25 of the carrier body 7 and which has an axial length 24; cf. FIG. 6. An advantage can be found here in the fact that if the inner diameter of a component 1 designed as an electric coil is predefined, a flattening of the innermost and/or outermost carrier body portion or receiving region portion 23, 23 can represent an effective and simple means of reducing the radial annular length 20 of the carrier body 7 in the deformed state.

[0101] For example, a carrier body 7 can be used which comprises at least in portions, in particular completely, a guide device 28 on a surface 26 of at least one wall portion 27 facing away from the receiving region 6, wherein the guide device 28 carries out a targeted guidance of injection-molding material 3 fed to the carrier body 7 during the encapsulation. Here, for example, the guide device 28 can have a protrusion with a defined geometric shape which cooperates with a corresponding recess of an opposite wall portion 27, 27 in order to achieve a defined end position of the wall portions 27, 27; cf. FIG. 11. Preferably, at least one guide device 28 on the carrier body side is adapted to the geometric shape of a base body 16 and/or the position and/or orientation of at least one injection opening of an injection mold for encapsulation of the conductor and carrier body 2, 7 received therein, in order to achieve a defined encapsulation of the conductor and carrier body 2.

[0102] The guide device 28, in particular on the carrier body side, can for example alternatively or additionally have a spacing function, by means of which at least two wall portions 27, 27 of the carrier body 7 are held at a defined spacing 21 at least in the deformed state of the carrier body 7. Alternatively or additionally, a separate element, for example a spacing device, of the carrier body 7, in particular of the wall portion 27, 27, can be provided to achieve such a spacing 21.

[0103] The gap formed by the spacing 21 can be used to guide and/or place the injection-molding material 3 during the encapsulation process. Consequently, the guide device 28, 28 or the spacing device can ensure a gap during the encapsulation in order to be able to carry out the encapsulation process in a more defined and/or quicker way; cf. FIG. 10.

[0104] At least one conductor body 2 received in the receiving region 6 of the carrier body 7, at least in the state before the carrier body 7 provided with the conductor body 2 is encapsulated with the injection-molding material 3, can, for example, be held in or on the receiving region 6 by means of a holding means 29, in particular on the carrier body side, in an interlocking and/or integrally bonded and/or frictionally engaged fashion. In the embodiment according to FIG. 6, the holding means 29 is formed as a one-piece or single-material component of the material forming the carrier body 7. The holding means 29 can be designed, for example, as a latching means and/or as a holding means 29 projecting into and/or adjoining the receiving space 5 of the receiving region 6 of the carrier body 7. In particular in the state of the inserted conductor body 2, the holding means 29 can, for example, contact the conductor body 2 or apply a clamping and/or pretensioning force thereto. Thus, the conductor body 2 can be fixed or held in a defined region of the carrier body 7. Consequently, during the encapsulation and/or during a displacement of the assembly consisting of conductor body 2 and carrier body 7 into an injection mold, an undesired relative movement of the bodies 2, 7 can be prevented by the holding means 29. The holding means 29 can also hold the conductor body 2 received in the receiving region 6 of the carrier body 7 during the deformation or bending of the carrier body 7 and the deformation or bending of the conductor body 2 in the receiving region 6 of the carrier body 7 or can prevent the conductor body 2 from moving out.

[0105] During the receiving of the conductor body 2 in or on the receiving region 6 of the carrier body 7 by means of a guide means 32, in particular on the carrier body side (see FIG. 6), for example, the conductor body 2 can be guided at least in portions, in particular completely, into the receiving region 6. In other words, for example, guide means 32 on the carrier body side can be guided at least during part of the feed path of the conductor body 2 into the receiving region 6 of the carrier body 7 or can be selectively influenced in respect of their movement path. It is possible, at least in portions, to form the holding means 29 and the guide means 32 in one piece or as one element which fulfils both functions.

[0106] During the modification of the geometric shape of the conductor body 2 and/or of the carrier body 7, for example (a) an at least partial, in particular complete, guidance of a relative movement 30, 30 of at least two carrier body sub-regions 31, 31 by means of a guide portion (not shown), in particular on the carrier body side, and/or (b) an interlocking and/or a frictionally engaged and/or integrally bonded connection of at least two connection portions 33, 33, in particular on the carrier body side, can take place. The guide portions, for example on the carrier body side, and/or the connection portions 33, 33, for example on the carrier body side, can perform guiding and/or connecting or holding functions in conjunction with the selective deformation or the change in shape and the fixing, at least in portions, of the change in shape by means of the carrier body 7 itself. A guide portion can, for example, additionally fulfil the function of a spacing device at least in portions, so that a spacing 21 can be produced on account of the guide portion.

[0107] If the carrier body is produced using an injection-molding method (for example plastics injection-molding method) or an additive manufacturing method (for example CLIP, SLA, etc.), the guiding and/or connecting or holding function can be implemented in a simple and cost-effective way. FIGS. 6 and 12 show two connection portions 33, 33 hooked into one another, which hook into one another, for example, during a compression of the carrier body sub-regions 31, 31 and consequently form an interlocking and/or frictionally engaged connection. In this case, a first carrier body sub-region 31 may be provided with a first connection portion 33 and a second carrier body sub-region 31 may be provided with a second connection portion 33, wherein in the compressed state the interconnected connection portions 33, 33 prevent the compressed state from springing back or decompressing.

[0108] For example, a first conductor body 2 can be received in a receiving region 6 delimiting a first receiving space 5 and a further conductor body 2 can be received in a receiving region 6 delimiting a further receiving space 5 (not shown). Further, before at least one carrier body 7 provided with the conductor body 2 is encapsulated with an injection-molding material 3, at least two conductor bodies 2 can optionally be received in different receiving spaces 5 (not shown). This can result in a component 1 in which different conductor bodies 2 are arranged at different locations. The electrically and/or magnetically effective functionality of the component 1 can be extended by appropriately actuating or energizing the different conductor bodies 2 via contact means 17 assigned to the respective conductor bodies 2.

[0109] The invention also relates to a component 1, in particular a component designed as an electric coil; cf. FIGS. 2 and 3. This component 1, in particular designed as an electric coil, can be installed in a vehicle, preferably in a motor vehicle. Alternatively or additionally, the component can be used as part of a sensor system and/or an actuator system, in particular in vehicle construction.

[0110] Lastly, the invention comprises a device for producing a component 1 comprising a conductor body 2 and a carrier body 7 according to a method described herein.

[0111] FIG. 12 shows the transition of the receiving region 5 from a first to a second axial plane. In this context, an axial plane is a plane running perpendicular to the axis 10 of the spiral shape 9 of the conductor body 2 and/or the carrier body 7, in particular perpendicular to the coil axis. In other words, the at least two axial planes are axially offset from each other. This transition region 22 can be understood as a discontinuity in the spiral shape 9, since in this region there may be deviations from the rest of the shape and/or arrangement of the conductor body 2 and/or the carrier body 7. It is also apparent from FIG. 12 that a first connection portion 33 extends from the first axial plane (which is at the bottom in the drawing) into the second axial plane and engages there with the second connection means 33, which is formed by a part of the carrier body 7 lying in the second axial plane, and in particular prevents the carrier body 7 from springing back into an undeformed state; cf. FIG. 4.

LIST OF REFERENCE SIGNS

[0112] 1 component [0113] 2 conductor body [0114] 3 injection-molding material [0115] 4 injection-molded body [0116] 5 receiving space [0117] 6 receiving region [0118] 7 carrier body [0119] 8 body volume of 2 and 7 [0120] 9 spiral shape of 2 and/or 7 [0121] 10 axis of 9 [0122] 11 first basic shape of 2 and/or 7 [0123] 12 further basic shape of 2 and/or 7 [0124] 13 tapered region of 11 [0125] 14 tapered region of 12 [0126] 15 receiving volume of 16 [0127] 16 base body [0128] 17 contact means [0129] 18 contact means region of 17 [0130] 19 stranded wire body [0131] 20 annular length of 7 [0132] 21 spacing of 27, 27 [0133] 22 transition region [0134] 23, 23 receiving region portion (cross-sectional portion) [0135] 24, 24 axial length of 23, 23 [0136] 25 center of 1 [0137] 26 surface of 27 [0138] 27, 27 wall portion of 7 [0139] 28 guide device [0140] 29 holding means [0141] 30 relative movement [0142] 31, 31 carrier body sub-region/carrier sub-body [0143] 32 guide means [0144] 33, 33 connection portions [0145] 34 collar portion [0146] 35 channel [0147] 36 main volume of extent of 16 [0148] 37 recess of 16 [0149] 38 individual wire [0150] 39 insulating layer [0151] 40 insulating means [0152] 41 environment [0153] 42, 42 basic shape pair