ULTRASOUND TRANSDUCER PROBE WITH MULTI-ROW ARRAY ACOUSTIC STACKS AND ULTRASOUND IMAGING SYSTEM
20240008840 ยท 2024-01-11
Inventors
Cpc classification
B06B1/067
PERFORMING OPERATIONS; TRANSPORTING
International classification
A61B8/00
HUMAN NECESSITIES
Abstract
An ultrasound transducer probe with multi-row array acoustic stacks comprises an central acoustic stack and two side acoustic stacks, the central acoustic stack has an inverted trapezoidal shape backing, and the two side acoustic stacks are mounted on each of the two elevation direction sides of the central acoustic stack with an outward tilted angle , this angle ranges from 0 to 30 degrees. When all the acoustic stacks are electronically powered in the same time, an acoustic field with enlarged elevation section will be created to facilitate needle imaging.
Claims
1. An ultrasound transducer probe with multi-row array acoustic stacks, comprising: a central acoustic stack (41) for central row element array, fastened on support structure; side acoustic stacks (42-43) for side row element arrays, mounted on each of the two elevation direction sides of the central acoustic stack (41) with an outward tilted angle , wherein the angle ranges from 0 to 30 degrees; the central acoustic stack (41) and the side acoustic stacks (42-43) are used for transmitting and receiving ultrasonic signals; and a shell, disposed to house all of the acoustic stacks and the support structure.
2. The ultrasound transducer probe of claim 1, wherein the central acoustic stack (41) has an inverted trapezoidal shape backing with a tilted angle , and the angle a matches the angle .
3. The ultrasound transducer probe of claim 2, wherein all the acoustic stacks are put together with gap in between such that the flex circuitry boards (44-46) of all acoustic stacks can go through.
4. The ultrasound transducer probe of claim 3, wherein the support structure includes a support shelf (20) and frames (30), the three acoustic stacks are held together by the frames (30), and the frames (30) are provided at both ends of the three acoustic stacks and fastened on the top of the support shelf (20).
5. The ultrasound transducer probe of claim 4, wherein the support shelf (20) and acoustic stacks are set with gap in between for the flex circuitry boards (44-46) to go through.
6. The ultrasound transducer probe of claim 4, wherein the shell includes body shell (11) and head shell (12), the support shelf (20) is mounted on body shell (11), and the head shell (12) is used to house all the acoustic stacks.
7. The ultrasound transducer probe of claim 1, further comprising a lens (50) at least disposed on top of the central acoustic stack (41).
8. The ultrasound transducer probe of claim 7, wherein the lens (50) is disposed on top of all the acoustic stacks and fastened on the head shell (12).
9. The ultrasound transducer probe of claim 1, wherein the central acoustic stack (41) includes a first matching layer (411), a second matching layer (412) and a piezoelectric layer (413) sequentially, the underneath of piezoelectric layer (413) is metalized to form ground electrode and signal electrode that connected to the flex circuitry board (44).
10. The ultrasound transducer probe of claim 9, an acoustic backing layer (414) is disposed below the piezoelectric layer (413) and flex circuitry board (44), and the flex circuitry board (44) extends downward along the two sides of the acoustic backing layer (414).
11. The ultrasound transducer probe of claim 9, wherein each of the side acoustic stacks (42-43) includes a first matching layer (411), a second matching layer (412) and a piezoelectric layer (413) sequentially, the underneath of piezoelectric layer (413) is metalized to form ground electrode and signal electrode connected to the flex circuitry board (45-46).
12. The ultrasound transducer probe of claim 11, an acoustic backing layer is placed below the piezoelectric layer (413) and flex circuitry board (44), and the flex circuitry board (45-46) extends downward along the two sides of the acoustic backing layer.
13. The ultrasound transducer probe of claim 12, wherein the lower end of the acoustic backing layer (414) of the central acoustic stack (41) forms the inverted trapezoidal shape, and the acoustic backing layers of the side acoustic stacks (42-43) are arranged to match the acoustic backing layer (414) of the central acoustic stack (41).
14. The ultrasound transducer probe of claim 1, wherein each of the side acoustic stacks (42-43) has the same number of array elements as the central acoustic stack (41).
15. The ultrasound transducer probe of claim 1, wherein each of the side acoustic stacks (42-43) has the same height of array element as the central acoustic stack (41).
16. The ultrasound transducer probe of claim 1, wherein each side acoustic stack (42-43) is provided with an independent control circuit , one or two control buttons for the control circuit are located on the body shell (11).
17. The ultrasound transducer probe of claim 1, two or more side acoustic stacks are mounted on each of the two elevation sides of the central acoustic stack (41).
18. An ultrasound imaging system, comprising: an user interface, used for information interaction with the processing system of the ultrasound imaging system; an ultrasound transducer probe electrically connected to the processing system, the ultrasound transducer probe comprising: a central acoustic stack (41) for central row element array, fastened on support structure; and side acoustic stacks (42-43) for side row element arrays, mounted on each of the two elevation direction sides of the central acoustic stack (41) with an outward tilted angle , the angle ranges from 0 to 30 degrees; the central acoustic stack (41) and the side acoustic stacks (42-43) are used for transmitting and receiving ultrasonic signals; and a shell, disposed to house all of the acoustic stacks and support structure.
19. The ultrasound transducer probe of claim 5, wherein the shell includes body shell (11) and head shell (12), the support shelf (20) is mounted on body shell (11), and the head shell (12) is used to house all the acoustic stacks.
20. The ultrasound transducer probe of claim 2, wherein the central acoustic stack (41) includes a first matching layer (411), a second matching layer (412) and a piezoelectric layer (413) sequentially, the underneath of piezoelectric layer (413) is metalized to form ground electrode and signal electrode that connected to the flex circuitry board (44).
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0037]
[0038]
[0039]
[0040]
[0041]
[0042]
[0043]
[0044]
[0045]
[0046]
[0047]
[0048]
[0049]
[0050]
[0051]
DETAILED DESCRIPTION OF THE EMBODIMENTS
[0052] For further understanding of the present invention, the present invention is described in detail with reference to the drawings and embodiments.
[0053]
[0054] In a coordinate system of
[0055] An example embodiment of such an ultrasound transducer probe is described with more details with the aid of
[0056] As shown in
[0057] Furthermore, some lens material is filled on top of the three acoustic stacks to form lens 50, and the lens mounted on the head shell.
[0058] In an embodiment, all the acoustic stacks are put together with gap in between such that flex circuitry boards 44, 45, and 46 of each acoustic stack 43, 42 and 41 can go through. The flex circuitry boards 44, 45 and 46 are used to transmit or receive signals or transmit electric power for some components in acoustic stacks.
[0059]
[0060] In a preferred embodiment, the acoustic stacks are fastened between the two frames 30 by screw sets 31. And the screw sets 31 are screwed into the acoustic stacks in azimuth direction so that it won't shake, and it is easy to remove and install the acoustic stacks.
[0061]
[0062]
[0063] In a preferred embodiment, both the first and second matching layers have a thickness of wavelength of the probe center frequency. The piezoelectric layer has a thickness of wavelength of the center frequency, and can be made from piezo-ceramic, piezoelectric single crystal, piezoelectric composite material. The underneath of the piezoelectric layer 413 is metalized to form ground electrodes and signal electrodes such that flex circuitry board 44 which is bonded under the piezoelectric layer 413 can connect with the ground electrodes and signal electrodes of each acoustic element. Below the piezoelectric layer 413 and flex circuitry board 44 is an acoustic backing layer 414. The acoustic backing layer 414 has an inverted trapezoidal shape, with its bigger size end bonding with piezoelectric layer 413. The acoustic backing layer 414 can be constructed with an epoxy and alumina powder, or with epoxy and Tungsten powder, or with epoxy, alu mina and Tungsten powder and some other materials. The backing layer 414 is used to give mechanical support to the acoustic piezoelectric layer 413 and other layers above 413, to provide maximal efficiency in the electromechanical coupling, and to prevent reverberation. Typically, the backing layer 414 can have an acoustic impedance range from 5 MRayls to 20MRalys or higher.
[0064] The flex circuitry board 44 has its signal traces and ground traces split into two groups, typically the even group and the odder group. The two groups of signal traces and ground traces go down as the flex circuitry board 44 extends downward along the two sides of the backing layer 414. The side acoustic stacks 42-43 have similar acoustic structure with the central acoustic stack 41, but the acoustic backing layer in the side acoustic stacks 42-43 has a different shape as shown in
[0065] The acoustic elements in the side acoustic stack 42/43 may be made in the same material as the elements in the central acoustic stack 41, e.g., made by piezo-ceramic or piezo-single crystal (PMN-PT, PIN-PT) material, thick film of piezo-ceramic or piezo-single crystal (PMN-PT, PIN-PT) material, or they can be made by 1-3 composites of piezo-ceramic or piezo-single crystal (PMN-PT, PIN-PT) material. The 1-3 composites material may include regular post structure, such as square post, triangular post or random structure. Furthermore, the multi-row array ultrasound transducer in whole can be made using cMUT technology which is basically silicon chips.
[0066]
[0067]
[0068]
[0069]
[0070] Due to the fundamental that the image pixel at certain depth and lateral position is formed by the summation of the tissue signals of the resolution cell volume centered at that spatial location, a thick elevation volume often results in lower image spatial resolution and a more haze like image, thus it worsens contrast resolution as more tissue is integrated inside this volume and contributes to the final reflected signal.
[0071] To avoid the degradation of image resolution, often the contrast resolution, in normal imaging with this specially designed ultrasound transducer, a separate control is added such that only when needed, the arrays in two side rows will be turned on to form a thick acoustic field in elevation direction. Each of the three element arrays can be powered and electronically or manually controlled separately.
[0072]
[0073]
[0074] Objects in the acoustic volume 704, such as tissue, bones, needles, wires, etc. can be clearly defined in ultrasound image. The acoustic volume 704 has a pretty thin slice thickness in elevation direction. If the needle 60, full or part of it, falls in this acoustic volume 704, it will show up in the real time image. As during the biopsy or interventional surgery procedure, the needle often is in parallel and outside to this thin wall like acoustic volume 704, e.g., it is on the plane but falling outside the acoustic volume 704, as a result it can't be captured by the acoustic volume 704, thus not visible in the formed ultrasound image. This could be a serious issue to an inexperienced clinician.
[0075] As a comparison, in
[0076]
[0077] In an embodiment, the side row element arrays and the central row element array may have the same number of array elements, and may have the same element pitch. In order to further improve the visual effect of the ultrasonic probe on the puncture and interventional surgery needles, in another embodiment, the side row element arrays may have different element pitch and even different numbers of elements. Therefore, the effective thickness of the acoustic field generated by the probe is increased as much as possible to enable the acoustic field to capture the puncture needle body parallel to the main direction of the acoustic field more easily.
[0078] As an example of an ultrasound imaging system, it includes the above-mentioned ultrasound transducer probe and an user interface used for information interaction with the processing system. In this system, a user manipulates the processing system through the user interface, so that the system enters into a needle head guidance working mode for tissue biopsy or interventional surgery.
[0079] It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design many alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word comprising does not exclude the presence of elements or steps other than those listed in a claim. The word a or an preceding an element does not exclude the presence of a plurality of such elements. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.