CONTACTOR AND METHOD OF MANUFACTURING THE SAME
20240012023 ยท 2024-01-11
Assignee
Inventors
- Hwang Sub KOO (Suwon-si, KR)
- Jong Koon PARK (Yongin-si, KR)
- Ki Sang YUN (Hwaseong-si, KR)
- Kyung Ho KIM (Yongin-si, KR)
Cpc classification
H01R9/0524
ELECTRICITY
International classification
Abstract
A contactor for connection and signal transfer between conductors includes: a core part configured to extend in a longitudinal direction, contain a conductive particle and be formed to be elastically deformable; an insulation part configured to surround a transverse surface of the core part and be formed to be elastically deformable; and a shield part configured to surround a transverse surface of the insulation part to be spaced apart from the core part, contain a conductive particle and be formed to be elastically deformable.
Claims
1. A contactor for connection and signal transfer between conductors, comprising, a core part configured to extend in a longitudinal direction, contains a conductive particle and be formed to be elastically deformable; an insulation part configured to surround a transverse surface of the core part and be formed to be elastically deformable; and a shield part configured to surround a transverse surface of the insulation part to be spaced apart from the core part, contains a conductive particle and be formed to be elastically deformable.
2. The contactor of claim 1, wherein the core part, the insulation part, and the shield part are hardened by a phase change and integrally formed with each other.
3. The contactor of claim 1, wherein the core part, the insulation part, and the shield part are concentrically cylindrical.
4. The contactor of claim 1, wherein each of the core part and the shield part protrudes in the longitudinal direction compared to the insulation part.
5. The contactor of claim 1, wherein the insulation part protrudes in the longitudinal direction compared to the shield part, and the core part protrudes in the longitudinal direction compared to the insulation part.
6. The contactor of claim 1, wherein the core part and the shield part are different from each other in at least one of physical properties including hardness, Young's modulus, and resistivity.
7. The contactor of claim 1, wherein the conductive particles contained in the core part and the shield part are aligned in the longitudinal direction.
8. A method of manufacturing a contactor for connection and signal transfer between conductors, comprising, forming a core part configured to extend in a longitudinal direction, contain a conductive particle and be elastically deformable; forming an insulation part configured to surround a transverse surface of the core part and be elastically deformable; and forming a shield part configured to surround a transverse surface of the insulation part to be spaced apart from the core part, contain a conductive particle and be elastically deformable.
9. The method of manufacturing a contactor of claim 8, wherein the forming the core part includes, filling a core receptor of a core part mold with the core part in a liquid phase containing the conductive particle; aligning a magnetic flux concentration member including magnetic pads at positions corresponding to the core receptors and hardening the core part; and separating at least a part of the core part mold from the core part.
10. The method of manufacturing a contactor of claim 9, wherein the forming the insulation part includes, aligning an insulation part mold on the core part mold in order for a part of the core part to be inserted into an insulation receptor of the insulation part mold while another part of the core part is supported by the core part mold.
11. The method of manufacturing a contactor of claim 8, wherein the forming the insulation part includes, filling an insulation receptor of an insulation part mold with the insulation part in a liquid phase; hardening the insulation part; and separating at least a part of the insulation part mold from the insulation part.
12. The method of manufacturing a contactor of claim 11, wherein the forming the shield part includes, aligning a shield part mold on the insulation part mold in order for a part of the insulation part to be inserted into a shield receptor of the shield part mold while another part of the insulation part is supported by the insulation part mold.
13. The method of manufacturing a contactor of claim 8, wherein the forming the shield part includes, filling a shield receptor of a shield part mold with the shield part in a liquid phase containing the conductive particle; aligning a magnetic flux concentration member including magnetic pads at positions corresponding to the shield receptors and hardening the shield part; and separating the shield part mold from the shield part.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION THE INVENTION
[0028] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings to be readily implemented by a person with ordinary skill in the art to which the present invention belongs. However, it is to be noted that the present disclosure is not limited to the example embodiments but can be embodied in various other ways. In the drawings, parts irrelevant to the description are omitted in order to clearly explain the present disclosure, and like reference numerals denote like parts through the whole document.
[0029] Through the whole document, the term connected to or coupled to that is used to designate a connection or coupling of one element to another element includes both a case that an element is directly connected or coupled to another element and a case that an element is electronically connected or coupled to another element via still another element. Further, it is to be understood that the term comprises or includes and/or comprising or including used in the document means that one or more other components, steps, operation and/or existence or addition of elements are not excluded in addition to the described components, steps, operation and/or elements unless context dictates otherwise and is not intended to preclude the possibility that one or more other features, numbers, steps, operations, components, parts, or combinations thereof may exist or may be added.
[0030] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.
[0031]
[0032] The core part 110, the insulation part 120, and the shield part 130 according to an embodiment of the present disclosure may be hardened by a phase change and integrally formed with each other. For example, the core part 110, the insulation part 120, and the shield part 130 which are in a liquid phase may change to a solid phase, and may become hardened as the viscosity increases. The contactor 100 may form a structure in which the core part 110, the insulation part 120, and the shield part 130 are directly bonded to each other as one body through a phase change.
[0033] As described above, the contactor 100 according to the present disclosure is manufactured such that the core part 110, the insulation part 120, and the shield part 130 are connected to each other as one body, so that an assembly process can be omitted and manufacturing costs can be reduced, and also, each of the core part 110, the insulation part 120, and the shield part 130 can be manufactured in various shapes. Hereinafter, each of the components will be described.
[0034] The core part 110 according to an embodiment of the present disclosure may extend in a longitudinal direction, contain a conductive particle and may be formed to be elastically deformable. The core part 110 may serve as a conducting wire for signal transfer. Also, the shield part 130 according to an embodiment of the present disclosure may surround a transverse surface of the insulation part 120 to be spaced apart from the core part 110, contain a conductive particle and may be formed to be elastically deformable. The shield part 130 may be formed of a conductive material and may serve to shield interference during signal transmission of the core part 110.
[0035] For example, the core part 110 and the shield part 130 may be formed of a material including silicone containing a conductive particle. The core part 110 and the shield part 130 may include various types of polymer materials. The core part 110 and the shield part 130 may be formed of diene type rubber such as silicone, polybutadiene, polyisoprene, SBR, NBR, and hydrogen compounds thereof, or may be formed of a block copolymer such as a styrene butadiene block copolymer, a styrene isoprene block copolymer, and hydrogen compounds thereof. Also, the core part 110 and the shield part 130 may be formed of chloroprene, urethane rubber, polyethylene-based rubber, epichlorohydrin rubber, an ethylene-propylene copolymer, an ethylene propylene diene copolymer, and the like.
[0036] Further, the conductive particles contained in the core part 110 and the shield part 130 according to an embodiment of the present disclosure may be aligned in the longitudinal direction. For example, the conductive particles may be formed of a single conductive metal material, such as iron, copper, zinc, chromium, nickel, silver, cobalt, and aluminum, or an alloy of two or more of them, which are ferromagnetic materials. Furthermore, the conductive particles may be prepared by coating the surface of a core metal with a highly conductive metal, such as gold, silver, rhodium, palladium, platinum, or silver and gold, silver and rhodium, and silver and palladium. The conductive particles may further include a MEMS tip, flake, wire rod, carbon nanotube (CNT), graphene, etc. in order to improve conductivity.
[0037] The insulation part 120 according to an embodiment of the present disclosure may surround a transverse surface of the core part 110 and may be formed to be elastically deformable. Referring to
[0038] As described above, the contactor 100 according to the present disclosure including the core part 110, the insulation part 120, and the shield part 130 which are elastically deformable, is elastically deformable in the longitudinal direction and a transverse direction during connection between conductors, and thus, can secure connection with a structure and reduce a contact resistance by being pressed to be in close contact with the structure. Also, the contactor 100 can achieve effective interconnection even if there is a tolerance of a contact surface or a difference in shape.
[0039]
[0040] For example, the contactor 100 according to the present disclosure as illustrated in
[0041]
[0042] For example, the contactor 100 according to the present disclosure as illustrated in
[0043] The core part 110, the insulation part 120, and the shield part 130 according to an embodiment of the present disclosure may be designed to be different from each other in at least one of physical properties including hardness, Young's modulus, and resistivity. For example, the hardness and the Young's modulus of the core part 110 or the shield part 130 to be in direct contact with a terminal may be designed to be higher than those of the other components, and, thus, it is possible to improve the precision in connection and also possible to suppress deformation or damage caused by repeated uses.
[0044] Further, the core part 110 and the shield part 130 according to an embodiment of the present disclosure may be designed to be different from each other in properties (e.g., material, size, density, etc.) of the contained conductive particles, respectively. For example, regarding the material of the conductive particle, the core part 110 or the shield part 130 may employ a nickel particle for effective alignment of conductive particles or may employ a copper particle if necessary to improve electrical conductivity. The core part 110 or the shield part 130 may also employ a silica-coated particle for weight lightening.
[0045] For another example, regarding the size of the conductive particle, conductive particles having a greater size are generally easy to process and excellent in terms of electrical conductivity. However, conductive particles having a smaller size can be relatively uniformly distributed even in a member having a fine diameter and thus can improve the hardness or Young's modulus of the member. In view of these characteristics, the contactor 100 according to the present disclosure may be designed to include the core part 110 and the shield part 130 each having different hardness or Young's modulus by varying the material, size, and density of conductive particles contained therein.
[0046] As described above, in the contactor 100 according to the present disclosure, the core part 110 and the shield part 130 designed to have different physical properties from each other may satisfy various design requirements for a probe pin. That is, the core part 110 and the shield part 130 different from each other in physical properties may be formed respectively corresponding to a part requiring an excellent hardness and a part where elastic deformation is allowed.
[0047] Therefore, the contactor 100 according to the present disclosure can secure connection with a structure and reduce a contact resistance by being pressed to be in close contact with the structure through elastic deformation. Also, the contactor 100 can achieve effective interconnection even if there is a tolerance of a contact surface or a difference in shape.
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[0049] In a step S110, the core part 110 which extends in a longitudinal direction, contains a conductive particle and is elastically deformable may be formed.
[0050] In a step S120, the insulation part 120 which surrounds a transverse surface of the core part 110 and is elastically deformable may be formed.
[0051] In a step S130, the shield part 130 which surrounds a transverse surface of the insulation part 120 to be spaced apart from the core part 110, contains a conductive particle and is elastically deformable may be formed.
[0052] Hereinafter, the steps S110 to S130 will be described in detail.
[0053] For example, the core part 110 in a liquid phase may contain the conductive particle 111. The conductive particles 111 may be distributed inside the core part 110, and may be aligned in the longitudinal direction of the core part 110 through the following step. The conductive particles 111 may make a contact with each other to impart conductivity to the core part 110 in the longitudinal direction. When the core part 110 is compressed by a pressure in the longitudinal direction to inspect the inspection target object which is an electrical component, the conductive particles 111 may get closer to each other and electrical conductivity of the core part 110 may increase in the longitudinal direction.
[0054] Referring to
[0055] Referring to
[0056] In the step S112, the magnetic flux concentration member 240 may come in close contact with the core part mold 210 in order for the magnetic pads 241 to close the core receptors 211. For example, the magnetic flux concentration member 240 may be brought into close contact with an upper end and a lower end of the core part mold 210 in which the core receptors 211 are filled with the core part 110 in a liquid phase. The magnetic pads 241 may be configured to concentrate magnetic flux of the contactor 100 according to the present disclosure.
[0057] In the step S112, the core part 110 in a liquid phase may be hardened at a predetermined pressure and predetermined temperature. For example, the magnetic flux concentration member 240 may apply at least one of heat and pressure to the core part 110 in a liquid phase. The core part 110 in a liquid phase filled in each layer of the plurality of core part molds 210 may be integrally formed with each other through a phase change caused by at least one of the applied heat and pressure. That is, the core part 110 in a liquid phase may be hardened by applying heat and pressure to the magnetic flux concentration member 240 in close contact with the core part molds 210. In this case, as illustrated in
[0058] Referring to
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[0060] The step S120 of forming the insulation part may further include a step S122 of filling the insulation receptor 221 of the insulation part mold 220 with the insulation part 120 in a liquid phase. For example, referring to
[0061] Referring to
[0062] Referring to
[0063] Referring to
[0064] Referring to
[0065]
[0066] The step S130 of forming the shield part may further include a step S132 of filling the shield receptor 231 of the shield part mold 230 with the shield part 130 in a liquid phase containing a conductive particle. For example, referring to
[0067] Referring to
[0068] In the step S133, the shield part mold 230 may be aligned in order for a part of the insulation part 120 to be inserted into the shield receptor 231 of the shield part mold 230 while another part of the insulation part 120 is supported by the shield part mold 230. As described above, the shield receptor 231 of the aligned shield part mold 230 may be filled with the shield part 130 in a liquid phase.
[0069] Also, in the step S133, the shield part 130 in a liquid phase may be hardened at a predetermined pressure and predetermined temperature. For example, the magnetic flux concentration member 240 may apply at least one of heat and pressure to the shield part 130 in a liquid phase. The shield part 130 in a liquid phase filled in each layer of a plurality of shield part molds 230 may be integrally formed with each other through a phase change caused by at least one of the heat and pressure applied to the shield part 130 in a liquid phase. That is, the shield part 130 in a liquid phase may be hardened to be integrally formed with each other by applying heat and pressure to the magnetic flux concentration member 240 in close contact with the shield part molds 230.
[0070] The step S130 of forming the shield part may further include a step S134 of separating the shield part mold 230 from the shield part 130. For example, in the step S134, the shield part 130 in a liquid phase filled in each of the plurality of shield part molds 230 may be hardened and then, the manufactured shield part 130 may be separated from the shield part molds 230.
[0071] In the descriptions above, the steps S110 to S130 may be divided into additional steps or combined into fewer steps depending on an embodiment. In addition, some of the steps may be omitted and the sequence of the steps may be changed if necessary.
[0072] The above description of the present disclosure is provided for the purpose of illustration, and it would be understood by a person with ordinary skill in the art to which the present invention belongs that various changes and modifications may be made without changing technical conception and essential features of the present disclosure. Thus, it is clear that the above-described examples are illustrative in all aspects and do not limit the present disclosure. For example, each component described to be of a single type can be implemented in a distributed manner, likewise, components described to be distributed can be implemented in a combined manner.
[0073] The recitation of at least one of A, B and C should be interpreted as one or more of a group of elements consisting of A, B and C, and should not be interpreted as requiring at least one of each of the listed elements A, B and C, regardless of whether A, B and C are related as categories or otherwise.
[0074] The scope of the present disclosure is defined by the following claims rather than by the detailed description of the embodiment, and it should be understood that all modifications and embodiments conceived from the meaning and scope of the claims and their equivalents are included in the scope of the present disclosure.