Sound-absorbing material, sound-absorbing particle and speaker module manufacturing process, particle and module

Abstract

The present invention relates to the technical field of electroacoustic products, and discloses sound-absorbing material, sound-absorbing particle, speaker module manufacturing processes, a particle and a module. The process comprises the following steps: placing a raw powder of a porous sound-absorbing material into a heating furnace to perform calcination, and introducing a processing gas during the calcination, wherein the calcination temperature is 120 C. to 800 C., and the calcination time is 6 h to 72 h.

Claims

1. A process for treating a sound-absorbing particle, comprising following steps: S1: providing a raw powder of a porous sound-absorbing material; S2: performing passivation treatment on the raw powder of the porous sound-absorbing material using the process for treating the sound-absorbing material, wherein the process for treating the sound-absorbing material comprises following steps: placing the raw powder of the porous sound-absorbing material of step S1 into a heating furnace for performing calcination to the raw powder, and introducing a processing gas during the calcination, wherein a calcination temperature is 120 C. to 800 C., and a calcination time is 6 h to 72 h; and S3: granulating the raw powder of the porous sound-absorbing material processed in the Step S2 to form the granulated sound-absorbing material.

2. The process for treating the sound-absorbing particle according to claim 1, further comprising following steps: S4: performing baking treatment on the granulated sound-absorbing material prepared in the Step S3, and meanwhile purging the granulated sound-absorbing material with air or inert gas, wherein a treatment temperature is 30 C. to 300 C., and a treatment time is 0.5 h to 72 h.

3. The process for treating the sound-absorbing particle according to claim 1, wherein the porous sound-absorbing material is zeolite, the calcination temperature is 120 C. to 400 C., and the calcination time is 6 h to 72 h.

4. The process for treating the sound-absorbing particle according to claim 3, wherein the calcination temperature is 300 C., and the calcination time is 24 h.

5. The process for treating the sound-absorbing particle according to claim 3, wherein the processing gas is high purity oxygen.

6. The process for treating the sound-absorbing particle according to claim 1, wherein the porous sound-absorbing material is activated carbon, the calcination temperature is 200 C. to 800 C., and the calcination time is 12 h to 72 h.

7. The process for treating the sound-absorbing particle according to claim 6, wherein the processing gas is high purity nitrogen.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a schematic structural diagram of a speaker module according to the present disclosure.

(2) In the FIGURE, 10: housing of module; 20: speaker unit; 30: sound-absorbing particle; 40: separator; 50: seal element.

DETAILED DESCRIPTION OF EMBODIMENTS

(3) The present disclosure is further described in the following with reference to the accompanying drawings and embodiments.

(4) A process for treating a sound-absorbing material comprises following steps: placing a raw powder of a porous sound-absorbing material into a heating furnace for performing calcination to the raw power, and introducing a processing gas during the calcination, wherein a calcination temperature is 120 C. to 800 C., and a calcination time is 6 h to 72 h.

Embodiment I

(5) The porous sound-absorbing material is natural zeolite. Raw powder of the natural zeolite is placed into a muffle furnace to perform calcination to the raw power, and high purity oxygen is introduced during the calcination, wherein a calcination temperature is 120 C. to 350 C., and a calcination time is 6 h to 72 h.

Embodiment II

(6) This embodiment is basically identical to Embodiment I, and a difference resides in that: the calcination temperature is 120 C., and the calcination time is 72 h.

Embodiment III

(7) This embodiment is basically identical to Embodiment I, and the difference resides in that: the calcination temperature is 300 C., and the calcination time is 24 h.

Embodiment IV

(8) This embodiment is basically identical to Embodiment I, and the difference resides in that: the calcination temperature is 350 C., and the calcination time is 6 h.

Embodiment V

(9) The porous sound-absorbing material is artificial zeolite. Raw powder of the artificial zeolite is placed into the muffle furnace to perform calcination to the raw power, and the high purity oxygen is introduced during the calcination, wherein a calcination temperature is 150 C. to 400 C., and a calcination time is 6 h to 72 h.

Embodiment VI

(10) This embodiment is basically identical to Embodiment V, and the difference resides in that:

(11) the calcination temperature is 150 C., and the calcination time is 72 h.

Embodiment VII

(12) This embodiment is basically identical to Embodiment V, and the difference resides in that:

(13) the calcination temperature is 300 C., and the calcination time is 24 h.

Embodiment VIII

(14) This embodiment is basically identical to Embodiment V, and the difference resides in that:

(15) the calcination temperature is 400 C., and the calcination time is 6 h.

Embodiment IX

(16) The porous sound-absorbing material is activated carbon. Raw powder of the activated carbon is placed into the muffle furnace to perform calcination to the raw power, and high purity nitrogen is introduced during the calcination, wherein a calcination temperature is 200 C. to 800 C., and a calcination time is 12 h to 72 h.

Embodiment X

(17) This embodiment is basically identical to Embodiment IX, and the difference resides in that:

(18) the calcination temperature is 200 C., and the calcination time is 72 h.

Embodiment XI

(19) This embodiment is basically identical to Embodiment IX, and the difference resides in that:

(20) the calcination temperature is 500 C., and the calcination time is 36 h.

Embodiment XII

(21) This embodiment is basically identical to Embodiment IX, and the difference resides in that:

(22) the calcination temperature is 800 C., and the calcination time is 12 h.

(23) After performing passivation treatment on the raw powder of the porous sound-absorbing material in the above embodiments, defects of oxygen atoms in a molecular sieve lattice are repaired, channels and channel structures of the porous material are perfected, the material surface activity is reduced, chemical adsorption of small organic molecules of gas is reduced, and thus the effect of improving the F0 of the speaker module is enhanced.

Embodiment XIII

(24) A process for treating a sound-absorbing particle comprises following steps:

(25) S1: providing raw powder of a porous sound-absorbing material;

(26) S2: performing passivation treatment on the raw powder of the sound-absorbing material using the corresponding process for treating the sound-absorbing material according to Embodiment I to Embodiment XII based on different types of the sound-absorbing materials; and

(27) S3: granulating the raw powder of the sound-absorbing material processed in the Step S2 to form the granulated sound-absorbing material, namely, a sound-absorbing particle.

Embodiment XIV

(28) This embodiment is basically identical to Embodiment XIII, and the difference resides in:

(29) further comprising Step S4: performing baking treatment on the granulated sound-absorbing material prepared in the Step S3, and meanwhile purging the granulated sound-absorbing material with air or inert gas, wherein a treatment temperature is 30 C. to 300 C., and a treatment time is 0.5 h to 72 h.

Embodiment XV

(30) This embodiment is basically identical to Embodiment XIV, and the difference resides in that:

(31) the treatment temperature is 30 C., and the treatment time is 72 h.

Embodiment XVI

(32) This embodiment is basically identical to Embodiment XIV, and the difference resides in that:

(33) the treatment temperature is 100 C., and the treatment time is 24 h.

Embodiment XVII

(34) This embodiment is basically identical to Embodiment XIV, and the difference resides in that:

(35) the treatment temperature is 300 C., and the treatment time is 0.5 h.

Embodiment XVIII

(36) There is provided a sound-absorbing particle, a raw material thereof is the raw powder of the natural zeolite, the raw powder of the artificial zeolite or the raw powder of the activated carbon. The sound-absorbing particle is processed into a spherical or nearly spherical particle using the process for treating a sound-absorbing particle according to Embodiment XIII to Embodiment XVII. The spherical or nearly spherical particle is the sound-absorbing particle.

(37) The sound-absorbing particle is poor in chemical adsorption of small organic molecules of gas, and an unobstructed channel thereof is strong in quick adsorption-desorption and high in reliability, which may enhance the effect of improving the F0 of the speaker module, and greatly enhance the reliability of the speaker module.

Embodiment XIX

(38) A process for packaging a speaker module comprises following steps:

(39) SA: fixing a speaker unit into a housing of the speaker module, so that an inner cavity of the speaker module is separated, by the speaker unit, into a front acoustic cavity and a rear acoustic cavity; and providing a sound-absorbing particle to be filled into the rear acoustic cavity, wherein the sound-absorbing particle is the sound-absorbing particle prepared using the process for treating a sound-absorbing particle according to Embodiment XIII;

(40) SB: performing baking treatment on the sound-absorbing particle and the speaker module semi-finished product assembled in the Step SA, and meanwhile purging the speaker module semi-finished product and the sound-absorbing particle with air or inert gas, wherein a baking temperature is 30 C. to 300 C., and a treatment time is 0.5 h to 72 h; and

(41) SC: filling the baked sound-absorbing particle into the rear acoustic cavity of the speaker module semi-finished product, and sealing the rear acoustic cavity, thereby finishing a packaging procedure of the speaker module.

Embodiment XX

(42) This embodiment is basically identical to Embodiment XIX, and the difference resides in that:

(43) the treatment temperature is 30 C., and the treatment time is 72 h.

Embodiment XXI

(44) This embodiment is basically identical to Embodiment XIX, and the difference resides in that:

(45) the treatment temperature is 100 C., and the treatment time is 24 h.

Embodiment XXII

(46) This embodiment is basically identical to Embodiment XIX, and the difference resides in that:

(47) the treatment temperature is 300 C., and the treatment time is 0.5 h.

Embodiment XXIII

(48) A process for packaging a speaker module comprises following steps:

(49) Sa: fixing a speaker unit into a housing of the speaker module so that an inner cavity of the speaker module is separated, by the speaker unit, into a front acoustic cavity and a rear acoustic cavity; and providing a sound-absorbing particle to be filled into the rear acoustic cavity, wherein the sound-absorbing particle is the sound-absorbing particle prepared using the process for treating a sound-absorbing particle according to Embodiment XIV to Embodiment XVII;

(50) Sb: performing baking treatment on the speaker module semi-finished product assembled in the Step Sa, and meanwhile purging the speaker module semi-finished product with air or inert gas, wherein a baking temperature is 30 C. to 300 C., and a treatment time is 0.5 h to 72 h; and

(51) Sc: filling the sound-absorbing particle into the rear acoustic cavity of the baked speaker module semi-finished product, and sealing the rear acoustic cavity, thereby finishing a packaging procedure of the speaker module.

Embodiment XXIV

(52) This embodiment is basically identical to Embodiment XXIII, and the difference resides in that:

(53) the treatment temperature is 30 C., and the treatment time is 72 h.

Embodiment XXV

(54) This embodiment is basically identical to Embodiment XXIII, and the difference resides in that:

(55) the treatment temperature is 100 C., and the treatment time is 24 h.

Embodiment XXVI

(56) This embodiment is basically identical to Embodiment XXIII, and the difference resides in that:

(57) the treatment temperature is 300 C., and the treatment time is 0.5 h.

Embodiment XXVII

(58) As shown in FIG. 1, there is provided a speaker module, which is packaged using the process for packaging a speaker module according to any one of Embodiment XIX to Embodiment XXVI, including a housing 10 of the module. The housing 10 of the module is accommodated therein a speaker unit 20. An inner cavity of the whole module is separated, by the speaker unit 20, into a front acoustic cavity and a rear acoustic cavity. A mesh separator 40 is arranged at a position, in the rear acoustic cavity, close to the speaker unit 20. The rear acoustic cavity is separated, by the separator 40 into a filling area and a non-filling area. The speaker unit is located in the non-filling area. A filling hole is provided on a position, of the housing 10 of the module, corresponding to the filling area. When assembling the module, the sound-absorbing particle 30 is filled into the filling area via the filling hole. A seal element 50 is covered on an outer side of the filling hole after the filling, and the rear acoustic cavity of the module is sealed.

(59) The speaker module is high in reliability, good in low and medium frequency performance, and high in overall acoustic performance.

(60) The present disclosure is not limited to the above specific embodiments, and all transformations made by those of ordinary skill in the art based on the above conception without creative labor fall within the scope of protection of the present disclosure.