BARRIER MATERIAL FORMATION COMPOSITION, BARRIER MATERIAL, PRODUCTION METHOD FOR BARRIER MATERIAL, PRODUCT, AND PRODUCTION METHOD FOR PRODUCT

Abstract

The present invention provides a barrier material formation composition comprising a silane oligomer, at least a part of the silane oligomer being modified with a metal alkoxide.

Claims

1. A barrier material formation composition comprising a silane oligomer, at least a part of the silane oligomer being modified with a metal alkoxide.

2. The composition according to claim 1, wherein the ratio of the total number of silicon atoms bonded to three oxygen atoms each and silicon atoms bonded to four oxygen atoms each relative to the total number of silicon atoms in the silane oligomer is 50% or more.

3. The composition according to claim 1, wherein the silane oligomer has a silicon atom bonded to three oxygen atoms.

4. The composition according to claim 1, further comprising a silane monomer.

5. The composition according to claim 4, wherein the silane monomer contains a silicon atom bonded to three or four oxygen atoms.

6. The composition according to claim 4, wherein the silane monomer is one selected from the group consisting of alkyltrialkoxysilane, aryltrialkoxysilane, and tetraalkoxysilane.

7. The composition according to claim 4, wherein the content of the silane monomer is 100 parts by mass or less relative to 100 parts by mass of the silane oligomer.

8. The composition according to claim 1, wherein the metal alkoxide is an aluminum alkoxide.

9. A production method for a barrier material formation composition, comprising: a first step of providing a silane oligomer with at least a part thereof modified with a metal alkoxide; and a second step of mixing the silane oligomer and a silane monomer to obtain a barrier material formation composition.

10. The production method according to claim 9, wherein the first step comprises a step of causing a reaction between a silane oligomer and a metal alkoxide to modify at least a part of the silane oligomer with the metal alkoxide.

11. The production method according to claim 9, wherein the first step comprises a step of causing a reaction between a silane monomer and a metal alkoxide to form a silane oligomer with at least a part thereof modified with the metal alkoxide.

12. A production method for a barrier material, comprising a step of heating the barrier material formation composition according to claim 1 to form a barrier material.

13. A production method for a product having a moisture resistant treated member comprising: a first step of applying the barrier material formation composition according to claim 1 to a member; and a second step of heating the applied composition to form a barrier material on the member.

14. A production method for a product having a first member and a second member joined to the first member, and a moisture resistant treated joint between the first member and the second member, the production method comprising: a first step of disposing the barrier material formation composition according to claim 1 between a first member and a second member; and a second step of heating the composition to form a barrier material to join the first member to the second member via the barrier material.

15. A production method for a product having a moisture resistant member, the production method comprising: a first step of heating the barrier material formation composition according to claim 1 to make a moisture resistant member having a barrier material; and a second step of putting a plurality of members including the moisture resistant member together.

16. A barrier material comprising a polysiloxane compound doped with a metal atom, a ratio of the total number of silicon atoms bonded to three oxygen atoms each and silicon atoms bonded to four oxygen atoms each relative to the total number of silicon atoms in the polysiloxane compound being 50% or more.

17. The barrier material according to claim 16, wherein the polysiloxane compound contains a silicone atom bonded to three oxygen atoms.

18. The barrier material according to claim 16 or 17, wherein 90% or more of the oxygen atoms in the polysiloxane compound are bonded to silicon atoms.

19. The barrier material according to claim 16, having a light transmittance at 550 nm per 1 mm thickness of 95% or more.

20. A product comprising: a member; and the barrier material formed on the member according to claim 16.

21. A product comprising a first member, a second member, and the barrier material according to claim 16, the barrier material being disposed between the first member and the second member, the first member being joined to the second member via the barrier material.

22. A product assembled from a plurality of members comprising a moisture resistant member having the barrier material according to claim 16.

Description

USE EXAMPLE 1

[0119] The use in an embodiment relates to a product having a moisture resistant treated member. Such a product comprises a member and a barrier material formed on the member. The barrier material may be formed on one member or may be formed on a plurality of members.

[0120] For example, the barrier material may be formed to cover one or more members or may be formed to cover a junction between two members.

[0121] These products are produced by a production method comprising a first step of applying the barrier material formation composition to a member, and a second step of heating the applied composition to form a barrier material on the member.

[0122] Specific examples of the use include the following electronic components.

[0123] (Electronic Component A-1)

[0124] The electronic component in an embodiment comprises a substrate, a cover glass, an image sensor disposed between the substrate and the cover glass, a supporting member supporting the cover glass and the image sensor on the substrate, and the barrier member disposed on the junction between the cover glass and the supporting member.

[0125] The barrier material is excellent in moisture resistance, capable of sufficiently suppressing the fracture of the cover glass, the supporting member and the like due to expansion of moisture that has entered the internal part, even when used in a high temperature environment. The electronic component, therefore, is excellent in moisture resistance and even when moisture has entered the void space between the cover glass and the substrate, the fracture of the cover glass, the supporting member, or the like due to expansion of the moisture can be sufficiently prevented.

[0126] Such an electronic component can be produced, for example, by a production method comprising an application step of applying the barrier material formation composition to the junction between the supporting member and the cover glass, and a barrier material formation step of heating the applied composition to form a barrier material on the junction.

[0127] (Electronic Component A-2)

[0128] The electronic component in an embodiment comprises a substrate, an image sensor disposed on the substrate, and the barrier material disposed on the image sensor.

[0129] The barrier material can be made to have excellent moisture resistance and transparency. The barrier material, therefore, can be suitably used also as a sealing material for sealing an image sensor. Such an electronic component enables an image sensor package to be constructed without use of a cover glass, so that reduction in component size, improvement in handling, etc., can be expected.

[0130] In the use, the visible light transmittance (550 nm) per 1 mm thickness of the barrier material is preferably 95% or more, more preferably 97% or more, still more preferably 99% or more.

[0131] Such an electronic component can be produced, for example, by a production method comprising an application step of applying the barrier material formation composition to an image sensor, and a barrier material formation step of heating the applied composition to form a barrier material on the image sensor.

USE EXAMPLE 2

[0132] A use in an embodiment relates to a product having a first member and a second member joined to the first member, and a moisture resistant treated junction between the first member and the second member. Such a product comprises a first member, a second member, and a barrier material disposed between the first member and the second member, the first member and the second member being joined via the barrier material.

[0133] Such a product can be produced by a production method comprising a first step of disposing a barrier material formation composition between the first member and the second member, and a second step of joining the first member and the second member via the barrier material.

[0134] Specific examples of the use include the following electronic components.

[0135] (Electronic Component B-1)

[0136] The electronic component in an embodiment comprises a substrate, a cover glass, an image sensor disposed between the substrate and the cover glass, a supporting member supporting the cover glass and the image sensor on the substrate, and a barrier material joining the cover glass and the supporting member.

[0137] The barrier material is excellent in moisture resistance, capable of sufficiently suppressing the fracture due to expansion of moisture that has entered the internal part, even when used in a high temperature environment. The electronic component, therefore, is excellent in moisture resistance and even when moisture has entered a void space between the cover glass and the substrate, the fracture of the cover glass, the supporting member, or the like due to expansion of the moisture can be sufficiently prevented.

[0138] Such an electronic component can be produced, for example, by a production method comprising a step of disposing the barrier material formation composition between the supporting member and the cover glass, and a step of heating the composition to form a barrier material such that the supporting member and the cover glass are joined via the barrier material.

USE EXAMPLE 3

[0139] The use in an embodiment relates to a product comprising a moisture resistant member. Such a product comprises a moisture resistant member made of barrier material and may be, for example, an assembly of a plurality of members including the moisture resistant member.

[0140] Such a product can be produced by a production method comprising a first step of heating the barrier material formation composition to make a moisture resistant member made of barrier material, and a second step of putting a plurality of members including the barrier material together.

[0141] Specific examples of the use include the following electronic components.

[0142] (Electronic Component C-1)

[0143] The electronic component in an embodiment comprises at least one component selected from the group consisting of a substrate, an MEMS sensor, a wireless module and a camera module, and a moisture resistant member having a barrier material.

[0144] The barrier material is excellent in moisture resistance and dehumidifying property. The electronic component described above is therefore in excellence in moisture resistance, so that the degradation in sensing properties due to moisture absorption can be sufficiently prevented.

[0145] Such an electronic component can be produced, for example, by a production method comprising a step of heating a barrier material formation composition to make a moisture resistant member having a barrier material, and a step of putting a plurality of members including the moisture member together. The barrier material may be formed independently from the substrate and the components or may be integrally formed with the components by heating the barrier material formation composition applied to the components.

[0146] Although the preferred embodiment of the present invention has been described above, the present invention is not limited thereto.

EXAMPLES

[0147] The present invention is more specifically described with reference to Examples as follows, though the present invention is not limited thereto.

EXAMPLE 1

[0148] [Barrier Material Formation Composition 1]

[0149] After mixing of 3.8 parts by mass of aluminum sec-butoxide (manufactured by Matsumoto Fine Chemical Co., Ltd., product name: AL-3001, hereinafter abbreviated as AL-3001), 7.6 parts by mass of tert-butyl alcohol (manufactured by Wako Pure Chemical Industries, Ltd.), 0.3 parts by mass of water, and 64.9 parts by mass of a silane oligomer (product name: XR31-B1410, manufactured by Momentive Performance Materials), a reaction was performed at 70 C. for 1 hour. Subsequently, 23.4 parts by mass of methyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name: KBM-13, hereinafter abbreviated as MTMS) was mixed therewith to obtain a barrier material formation composition 1.

[0150] [Substrate with Barrier Material 1 for Evaluation]

[0151] One side of a 0.4 mm thick copper-clad laminate MCL-E-705G (product name, manufactured by Hitachi Chemical Co., Ltd.) was masked and immersed in a copper etching solution to remove the copper foil on the single side, so that a 40 mm square base substrate was made. Subsequently, the barrier material formation composition 1 was applied to the side of the base substrate with the copper foil removed so as to have a thickness of 35 m after drying and dried at 150 C. for 4 hours. A barrier material was thus formed on the substrate, and a substrate with barrier material 1 for evaluation was obtained.

EXAMPLE 2

[0152] [Barrier Material Formation Composition 2]

[0153] After mixing of 3.8 parts by mass of AL-3001, 7.6 parts by mass of tert-butyl alcohol, 0.3 parts by mass of water, and 64.9 parts by mass of a silane oligomer (product name: XR31-B2733, manufactured by Momentive Performance Materials), a reaction was performed at 70 C. for 1 hour. Subsequently, 23.4 parts by mass of tetraethoxysilane (manufactured by Wako Pure Chemical Industries, Ltd., hereinafter abbreviated as TEOS) was mixed therewith to obtain a barrier material formation composition 2.

[0154] [Substrate with Barrier Material 2 for Evaluation]

[0155] A barrier material was formed on a substrate in the same manner as in Example 1 except that the barrier material formation composition 1 was changed to the barrier material formation composition 2, so that a substrate with barrier material 2 for evaluation was obtained.

EXAMPLE 3

[0156] [Barrier Material Formation Composition 3]

[0157] A barrier material formation composition 3 was obtained in the same manner as in Example 2, except that 23.4 parts by mass of MTMS was mixed instead of TEOS.

[0158] [Substrate with Barrier Material 3 for Valuation]

[0159] A barrier material was formed on a substrate in the same manner as in Example 1 except that the barrier material formation composition 1 was changed to the barrier material formation composition 3, so that a substrate with barrier material 3 for evaluation was obtained.

EXAMPLE 4

[0160] [Barrier Material Formation Composition 4]

[0161] After mixing of 3.8 parts by mass of AL-3001, 7.6 parts by mass of tert-butyl alcohol, 0.3 parts by mass of water, and 64.9 parts by mass of a silane oligomer (product name: TSR-165, manufactured by Momentive Performance Materials), a reaction was performed at 70 C. for 1 hour. Subsequently, 23.4 parts by mass of TEOS was mixed therewith to obtain a barrier material formation composition 4.

[0162] [Substrate with Barrier Material 4 for Evaluation]

[0163] A barrier material was formed on a substrate in the same manner as in Example 1 except that the barrier material formation composition 1 was changed to the barrier material formation composition 4, so that a substrate with barrier material 4 for evaluation was obtained.

EXAMPLE 5

[0164] [Barrier Material Formation Composition 5]

[0165] A barrier material formation composition 5 was obtained in the same manner as in Example 1, except that 23.4 parts by mass of TEOS was mixed instead of MTMS and that 2.0 parts by mass of CR15 (product name, manufactured by Momentive Performance Materials) was further mixed as a curing catalyst.

[0166] [Substrate with Barrier Material 5 for Evaluation]

[0167] A barrier material was formed on a substrate in the same manner as in Example 1 except that the barrier material formation composition 1 was changed to the barrier material formation composition 5, so that a substrate with barrier material 5 evaluation was obtained.

EXAMPLE 6

[0168] [Barrier Material Formation Composition 6]

[0169] To the barrier material formation composition 2 in Example 2, 2.0 parts by mass of a curing catalyst (CR15) was further mixed, so that a barrier material formation composition 6 was obtained.

[0170] [Substrate with Barrier Material 6]

[0171] A barrier material was formed on a substrate in the same manner as in Example 1 except that the barrier material formation composition 1 was changed to the barrier material formation composition 6, so that a substrate with barrier material 6 for evaluation was obtained.

EXAMPLE 7

[0172] [Barrier Material Formation Composition 7]

[0173] To the barrier material formation composition 3 in Example 3, 2.0 parts by mass of a curing catalyst (CR15) was further mixed, so that a barrier material formation composition 7 was obtained.

[0174] [Substrate with Barrier Material 7 for Evaluation]

[0175] A bather material was formed on a substrate in the same manner as in Example 1, except that the barrier material formation composition 1 was changed to the barrier material formation composition 7, so that a substrate with barrier material 7 for evaluation was obtained.

EXAMPLE 8

[0176] [Barrier Material Formation Composition 8]

[0177] A barrier material formation composition 8 was obtained in the same manner as in Example 2, except that 23.4 parts by mass of methyl silicate MS53A (product name, manufactured by Colcoat Co., Ltd.) was mixed instead of TEOS.

[0178] [Substrate with Barrier Material 8 for Evaluation]

[0179] A substrate with barrier material 8 for evaluation was obtained in the same manner as in Example 1, except that the barrier material formation composition 1 was changed to the barrier material formation composition 8.

EXAMPLE 9

[0180] [Barrier Material Formation Composition 9]

[0181] After mixing of 3.8 parts by mass of AL-3001, 7.6 parts by mass of tert-butyl alcohol, 0.3 parts by mass of water, and 64.9 parts by mass of MTMS, a reaction was performed at 70 C. for 1 hour. Subsequently, 23.4 parts by mass of TEOS was mixed therewith, and 2.0 parts by mass of a curing catalyst (CR15) was further mixed with the resultant to obtain a barrier material formation composition 9.

[0182] [Substrate with Barrier Material 9 for Evaluation]

[0183] A substrate with barrier material 9 for evaluation was obtained in the same manner as in Example 1, except that the barrier material formation composition 1 was changed to the barrier material formation composition 9.

COMPARATIVE EXAMPLE 1

[0184] [Comparative Substrate 1 for Evaluation]

[0185] A 0.4 mm thick, 40 mm square copper-clad laminate MCL-E-705G was used as the substrate for evaluation in Comparative Example 1 (Comparative substrate 1 for evaluation).

COMPARATIVE EXAMPLE 2

[0186] [Comparative Substrate 2 for Evaluation]

[0187] A base substrate made by the method described in Example 1 was used as the substrate for evaluation in Comparative Example 2 (Comparative substrate 2 for evaluation).

[0188] The water absorption ratio under constant temperature and humidity and the dehumidification ratio under high temperature of the substrates for evaluation obtained in Examples and Comparative Examples were measured and evaluated by the following method. The results are shown in Table 1.

[0189] <(1) Measurement of Water Absorption Ratio Under Constant Temperature and Humidity>

[0190] The substrate for evaluation was dried at 130 C. for 1 hour in a safety oven (product name: SPHH-202, manufactured by Espec Corp.) to obtain a measurement sample. The mass of the obtained measurement sample was measured to determine the initial mass ml. Subsequently, the measurement sample was treated in an atmosphere at 85 C/85% RH in a constant temperature and humidity chamber (product name: SE-44CI-A, manufactured by KATO Inc.) for 100 hours, so that a sample after the constant temperature and humidity treatment was obtained. The mass of the measurement sample after the constant temperature and humidity treatment was measured to determine the mass m2 after the constant temperature and humidity treatment. From the initial mass ml and the mass m2 after the constant temperature and humidity treatment, the water absorption ratio Q.sub.A (%) was determined based on the following expression.

Q.sub.A=100(m1m2)/m2

[0191] <(2) Measurement of Dehumidification Ratio Under High Temperature>

[0192] The measurement sample after the constant temperature and humidity treatment in (1) described above was dried at 130 C. for 1 hour in a safety oven (product name: SPHH-202, manufactured by Espec Corp.) to obtain a measurement sample after the high temperature treatment. The mass m3 of the measurement sample after the high temperature treatment was measured, and the dehumidification ratio QD (%) was determined from m1, m2 and m3 described above based on the following expression.

Q.sub.D=100{1(m3m2)/(m1m2)}

TABLE-US-00001 TABLE 1 Water absorption ratio Dehumidification ratio Example 1 0.26 98.4 Example 2 0.21 98.6 Example 3 0.29 98.4 Example 4 0.24 98.2 Example 5 0.20 98.6 Example 6 0.20 98.8 Example 7 0.27 98.6 Example 8 0.19 98.8 Example 9 0.20 98.6 Comparative Example 1 0.09 66.6 Comparative Example 2 0.46 65.2

[0193] From the comparison between Examples 1 to 9 and Comparative Example 2, it was confirmed that the water absorption ratio under constant temperature and humidity was sufficiently suppressed by the barrier materials in Examples 1 to 9, and that the barrier materials in Examples 1 to 9 thus have excellent moisture resistance. Further, from the comparison between Examples 1 to 9 and Comparative Example 1, it was also confirmed that the barrier materials in Examples 1 to 9 are excellent in the dehumidification ratio, which is an index of the capability to allow the internal water to escape to the outside, as compared with the case of covering with a copper plate.

[0194] Further, the water absorption ratio after the measurement of the dehumidification ratio was about 0.03% in Comparative Example 1, whereas it was less than 0.005% in Examples 1 to 9. Thus, it was confirmed that use of the barrier materials in Examples 1 to 9 enables the internal water content to be significantly reduced by drying.

[0195] The light transmittance at 550 nm per 1 mm thickness of the barrier materials formed in Examples 1 to 9 was measured, resulting in 95% or more in any of Examples.