SOUND REDUCTION DEVICE AND JOINING METHOD, AND A PART MACHINING METHOD WITH SOUND INSULATION

20180001428 · 2018-01-04

    Inventors

    Cpc classification

    International classification

    Abstract

    A sound reduction device for use in a mechanical machining method or a joining method, in particular a pulse-type joining method. The sound reduction device comprises a clamping device by means of which at least one part to be machined can be clamped at a plurality of clamping locations, as well as a plurality of engagement components which engage the part surface at a number of engagement points, in order to damp vibrations of the part. The present disclosure also describes a joining method and a machining method in combination with the sound reduction device.

    Claims

    1. A sound reduction device in combination with a setting device for use in a joining method, in particular in a pulse-like joining method or a high-speed bolt setting method, comprising the following features: a. a clamping device with which at least one part to be machined or a plurality of parts to be connected to each other can be clamped releasably at a plurality of clamping points between fastening components cooperating with each other, respectively, b. so that the joining is ensured, and wherein c. a number of engagement points with respective engagement components are provided by means of which the part is engageable at least on one side in at least a vibration-sensitive part portion so that a part vibration can be damped compared to a part vibration without engagement components.

    2. The sound-reduction device according to claim 1, in which the number of clamping points can be arranged in an edge portion of a part, while the vibration-sensitive part portion with an area in the range from 100 cm.sup.2 to 10 m.sup.2 can be engaged by the engagement components.

    3. The sound reduction device according to 2, by means of which the part can be engaged with 1 to 3 engagement components per standard area of 100 cm.sup.2 of the vibration-sensitive part portions.

    4. The sound reduction device according to claim 3, the engagement component of which has an engagement surface on the part consisting of metal or plastic or a hybrid consisting of metal core and plastic cover or bitumen or silicone.

    5. The sound reduction device according to claim 4, in which at least one engagement component has a sound damping layer which can be pressed against the at least one part on one side in at least a part portion so that a sound energy emitted by the part can be damped.

    6. The sound reduction device according to claim 5, in which the at least one sound damping layer is made of a material having a loss factor d in the range of 0.05≦d≦1.

    7. (canceled)

    8. A joining method using a setting device for joining at least a first part and a second part, in particular a pulse-like joining method, comprising the following steps: a. releasably fixing the at least two parts by means of a clamping device by means of which a plurality of parts to be connected are clamped at a plurality of clamping points between fastening components cooperating with each other, respectively, wherein the plurality of clamping points fastens the plurality of parts to a base, so that the joining of the parts is ensured, and b. at least one-sided engaging of at least one engagement component in at least a vibration-sensitive part portion of the at least two parts at at least one engagement point so that a part vibration can be damped compared to a part vibration without the engagement component, and c. joining the at least two parts by means of the setting device.

    9. The joining method according to claim 8, in which the number of clamping points is arranged in an edge portion of a part while the engagement components of the engagement points are arranged in at least one areal portion of a size of 100 cm.sup.2 to 10 m.sup.2.

    10. The joining method according to claim 8, with the further step: applying at least one sound damping layer on the part surface with the at least one engagement component, so that an amount of an emitted sound energy during the joining method is lower than an amount of sound energy without use of the sound damping layer.

    11. (canceled)

    12. (canceled)

    13. (canceled)

    14. The joining method according to claim 9, with the further step: applying at least one sound damping layer on the part surface with the at least one engagement component, so that an amount of an emitted sound energy during the joining method is lower than an amount of sound energy without use of the sound damping layer.

    15. The sound reduction device according to 1, by means of which the part can be engaged with 1 to 3 engagement components per standard area of 100 cm.sup.2 of the vibration-sensitive part portions.

    16. The sound reduction device according to claim 1, the engagement component of which has an engagement surface on the part consisting of metal or plastic or a hybrid consisting of metal core and plastic cover or bitumen or silicone.

    17. The sound reduction device according to claim 2, the engagement component of which has an engagement surface on the part consisting of metal or plastic or a hybrid consisting of metal core and plastic cover or bitumen or silicone.

    18. The sound reduction device according to claim 1, in which at least one engagement component has a sound damping layer which can be pressed against the at least one part on one side in at least a part portion so that a sound energy emitted by the part can be damped.

    19. The sound reduction device according to claim 2, in which at least one engagement component has a sound damping layer which can be pressed against the at least one part on one side in at least a part portion so that a sound energy emitted by the part can be damped.

    20. The sound reduction device according to claim 3, in which at least one engagement component has a sound damping layer which can be pressed against the at least one part on one side in at least a part portion so that a sound energy emitted by the part can be damped.

    21. The sound reduction device according to claim 18, in which the at least one sound damping layer is made of a material having a loss factor d in the range of 0.05≦d≦1.

    22. The sound reduction device according to claim 19, in which the at least one sound damping layer is made of a material having a loss factor d in the range of 0.05≦d≦1.

    23. The sound reduction device according to claim 20, in which the at least one sound damping layer is made of a material having a loss factor d in the range of 0.05≦d≦1.

    24. The joining method according to claim 8, wherein the joining by means of the setting device includes setting of a semi-hollow punch rivet or setting of a solid punch rivet.

    Description

    4. BRIEF DESCRIPTION OF THE ACCOMPANYING DRAWINGS

    [0018] Representative embodiments of the present disclosure will be explained in more detail with reference to the accompanying drawings. It shows:

    [0019] FIG. 1 is a schematic representation of an embodiment of a joining method with a sound reduction device,

    [0020] FIG. 2 is a further schematic representation of a part arrangement, and

    [0021] FIG. 3 is a flow chart of an embodiment of the joining method and the machining method.

    5. DETAILED DESCRIPTION

    [0022] Referring to FIG. 1, structure, function and use of a sound reduction device are described using the example of a joining method, preferably a pulse-like joining method. The sound reduction device can be used in combination with machining methods in the same way as in combination with joining methods. As soon as the machining method or joining method, such as sawing, punching, bending, bolt setting, generates vibrations in the machined part or in a plurality of parts, these are perceived as structure-borne sound. Structure-borne sound is transmitted to the environment as an airborne sound or noise. In addition, it is possible that structure-borne sound is transmitted between adjoining parts. In order to reduce the noise exposure of the environment, at least some implementations of the present invention repress or damp the structure-borne sound.

    [0023] FIG. 2 shows a schematic representation of two exemplary parts B1 and B2. The part B1 is a profile, here a hat profile. It is also conceivable that it is a T-profile, an L-profile, a tube profile or an H-profile. Such profiles have partially extended areal portions which are susceptible to vibration excitation and thus to the generation of structure-borne sound. Such portions are referred to as vibration-sensitive part portions 30. They are mostly larger than a flange portion 32 or a web portion 34, which often has vibration-repressive clamping points 12. Due to this characterization, vibration-sensitive part portions 30 preferably have a size G of 100 cm.sup.2≦G≦10 m.sup.2.

    [0024] Referring again to FIG. 2, the combination of the profile part B1 with, for example, a cover plate or, in general, an areal part B2 is here shown schematically. Due to their areal size, both parts B1 and B2 have vibration-sensitive part portions, which represent the preferred sources of structure-borne sound. It has been recognized that a part vibration and thus structure-borne sound can be dampened by a punctual as well as by an areal engaging, preferably a one-sided or a two-sided engaging, on such vibration-sensitive part portions 30. In this context, preferably a number of engagement points 22 per part portion 30 and/or a size of the engagement component 24, 26 abutting the part surface and/or a material of the engagement component 24, 26 abutting the part B1, B2 are selectively modified to be able to set the repressing behavior depending on the parts B1, B2. This is indicated in FIG. 2 in relation to the different vibration-sensitive part portions 30 of parts B1 and B2.

    [0025] Preferably, and with respect to the vibration-sensitive part portion 30 having a unit of area of 100 cm.sup.2 one to three, preferably one or two, engagement components 24 are arranged engaging the part surface. These engagement components 24 are preferably equally distributed over the unit of area and are arranged regularly. Accordingly, three to nine engagement components 24 preferably engage a vibration-sensitive part portion 30 of a size of approximately 300 cm.sup.2, since it consists of three units of area of 100 cm.sup.2 each.

    [0026] FIG. 1 schematically shows an arrangement for a pulse-like joining method of the two parts B1 and B2. A bolt-setting method according to EP 1 926 918 B2 is preferably used as a pulse-like joining method. For the various method arrangements of bolt setting, reference is made to the said European patent, which is incorporated into the description hereby.

    [0027] According to FIG. 1, the part B1 is a profile part with the flange 32. A plurality of clamping points 12 is provided on the flange 32, at which the part 1 can be releasably fixed to a base 16, for example a spanning device or a supporting structure. To this end, a movable clamping device 10 is arranged in the vicinity of each clamping point 12. This consists, for example, of at least two fastening components 14, 16, which are movable relative to each other. In this case, the fastening components 14, 16, which can be moved relative to each other, are a clamping arm or a clamping mechanism 14, which can be pivoted according to FIG. 1, and the base 16, which forms a fixed support with respect to the parts B1, B2. The pivoting movement of the clamping arm 14 serves for the movement between a clamping position, in which the part or parts 1, 2 are fixed between the clamping arm 14 and the base 16, and a release position in which the part(s) 1, 2 is/are no longer fixed. It is understood that the clamping mechanism 14 may also perform alternative motions to move between release position and clamping position. Optionally, a constructive support element is arranged below or adjacent to a joining portion of the parts B1 and B2 (in FIG. 1 covered by the parts B1 and B2 and therefore not shown), so that the parts B1 and B2 are not overloaded by the joining process.

    [0028] Although the components B1 and B2 are temporarily fixed at the clamping points and optionally have a mechanical support (not shown) adjacent to or in the joining portion, these clamping points 12 are not sufficient to prevent the structure-borne sound of the parts B1, B2 during the joining process by a setting device S sufficiently. As can be seen from FIG. 1, the bolts 40 are placed within the vibration-sensitive portions 30 or in portions adjacent to these vibration-sensitive part portions 30. This supports the occurrence of structure-borne sound and the associated noise pollution or exposure.

    [0029] With regard to a reduced noise emission during the joining and machining of the parts B1, B2, it is preferred to arrange a joining zone as close as possible to the clamping points 12, wherein the joining zone is the region into which the bolts 40 are set. In this way, a part vibration can already be reduced by the clamping points 12.

    [0030] It is also preferred to arrange one to ten clamping points per standard length of 1 m of the part B1; B2 to releasably fasten the part B1; B2, for example, in the flange portion.

    [0031] According to FIG. 1, the areal portion between the flanges 32 and webs 34 of the part B1 represents a vibration-sensitive part portion 30. This is indicated on the right-hand side of FIG. 1, although it also extends below the part B2 and on the left-hand side of FIG. 1. In addition, the part B2 also forms a vibration-sensitive part portion 30. In order to reduce vibrations in these vibration-sensitive part portions 30, it is first preferred to provide additional clamping points 12 (not shown) especially in these portions 30.

    [0032] According to a further embodiment, the sound reduction device comprises a number of engagement points 22 arranged in or adjacent to or next to the vibration-sensitive part portions 30. The engagement points 22 are preferably positioned in the vibration-sensitive part portions 30. At the engagement points 22 the component surface is engaged by mechanical engagement components 24. This engagement of the engagement component 24 takes place at the part B1; B2 preferably on one side or on both sides. By the engaging of the engagement component 24, component vibrations are damped or reduced.

    [0033] In order to achieve an optimal damping result by this engagement, the engagement area of the engagement component 24 engaging the part B1; B2 is made of metal or plastic or a hybrid consisting of metal core and plastic cover or bitumen or silicone or rubber or of damping cardboard.

    [0034] According to a further embodiment, the engagement surfaces of the engagement component 24 are formed as areal sound damping layers 26. These sound damping layers 26 are preferably adapted in size to the vibration-sensitive part portion 30. According to different embodiments of the disclosure their size varies between 1 cm.sup.2 and 2 m.sup.2, preferably between 4 cm.sup.2 and 0.4 m.sup.2.

    [0035] In addition to the number of engagement components, which comprise one to three engagement components 24 or engagement points 22 per unit of area of 100 cm.sup.2 in the vibration-sensitive part portion 30, the shape of the sound damping layer 26 can also be adjusted. Here it is preferred to adapt the shape of the sound damping layer 26 to the shape of the part or to form the sound damping layer 26 as large as possible.

    [0036] According to a further embodiment, the engagement surface of the engagement component 24 and the sound damping layer 26 are made of a viscoelastic material. This viscoelastic material is characterized by the loss factor d in the range of 0.05≦d≦1. The loss factor d describes the damping behavior of the contact area or sound damping layer 26, which is applied as a coating to the part B1; B2. The loss factor d is a measure of the proportion of kinetic energy introduced into the parts B1, B2, which is converted into heat within the material. Therefore the loss factor d is a material parameter, which can be taken from tables. In addition, the loss factor d is defined in DIN EN ISO 6721-3, which is hereby incorporated by reference in order to determine the loss factor. The structure-borne sound damping described by the loss factor d describes the conversion of the oscillation energy of the part B1; B2 by internal friction of the material of the sound damping layer 26 or the engagement surface of the engagement component 24 into heat.

    [0037] While on the one hand, the material used for the damping layer 26 can be characterized by the loss factor d, the following materials are on the other hand preferred as damping layer 26 according to the disclosure: plastics, hybrids consisting of metal core and plastic cover, bitumen, silicone, rubber and damping cardboard.

    [0038] During a joining method for connecting at least a first part and a second part B1, B2 or during a machining process of one or more parts B1, B2, a releasable fixing of the part or parts B1; B2 takes place in step I first. This fixing is realized by the clamping device 10 discussed above with the plurality of fastening components 14, 16 at the clamping points 12. Due to the present part geometry of the parts B1, B2, the vibration-sensitive part portions 30 are recognizable on account of their size (see above). Therefore, in the next step II, an at least one-sided engagement of the engagement surface of the engagement component 24 occurs adjacent to, in or next to these vibration-sensitive part portions 30. As soon as the engagement components 24 engage the parts B1, B2 by means of their engagement surfaces or by means of sound damping layers 26, an additional damping of possibly occurring vibrations of the components and thus a damping of the structure-borne sound is provided. Therefore, the joining of the at least two parts B1, B2 takes place in step IV or the machining of the at least one part B1 in step V.

    [0039] Certain embodiments or components or features of components have been noted herein as being “preferred” and such indications are to be understood as relating to a preference of the applicant at the time this application was filed. Such embodiments, components or features noted as being “preferred” are not required for implementation of the inventions disclosed herein unless otherwise indicated as being required, or unless specifically included within the claims that follow.