SOUND REDUCTION DEVICE AND JOINING METHOD, AND A PART MACHINING METHOD WITH SOUND INSULATION
20180001428 · 2018-01-04
Inventors
Cpc classification
B23Q3/065
PERFORMING OPERATIONS; TRANSPORTING
B23Q11/0032
PERFORMING OPERATIONS; TRANSPORTING
International classification
B23Q11/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A sound reduction device for use in a mechanical machining method or a joining method, in particular a pulse-type joining method. The sound reduction device comprises a clamping device by means of which at least one part to be machined can be clamped at a plurality of clamping locations, as well as a plurality of engagement components which engage the part surface at a number of engagement points, in order to damp vibrations of the part. The present disclosure also describes a joining method and a machining method in combination with the sound reduction device.
Claims
1. A sound reduction device in combination with a setting device for use in a joining method, in particular in a pulse-like joining method or a high-speed bolt setting method, comprising the following features: a. a clamping device with which at least one part to be machined or a plurality of parts to be connected to each other can be clamped releasably at a plurality of clamping points between fastening components cooperating with each other, respectively, b. so that the joining is ensured, and wherein c. a number of engagement points with respective engagement components are provided by means of which the part is engageable at least on one side in at least a vibration-sensitive part portion so that a part vibration can be damped compared to a part vibration without engagement components.
2. The sound-reduction device according to claim 1, in which the number of clamping points can be arranged in an edge portion of a part, while the vibration-sensitive part portion with an area in the range from 100 cm.sup.2 to 10 m.sup.2 can be engaged by the engagement components.
3. The sound reduction device according to 2, by means of which the part can be engaged with 1 to 3 engagement components per standard area of 100 cm.sup.2 of the vibration-sensitive part portions.
4. The sound reduction device according to claim 3, the engagement component of which has an engagement surface on the part consisting of metal or plastic or a hybrid consisting of metal core and plastic cover or bitumen or silicone.
5. The sound reduction device according to claim 4, in which at least one engagement component has a sound damping layer which can be pressed against the at least one part on one side in at least a part portion so that a sound energy emitted by the part can be damped.
6. The sound reduction device according to claim 5, in which the at least one sound damping layer is made of a material having a loss factor d in the range of 0.05≦d≦1.
7. (canceled)
8. A joining method using a setting device for joining at least a first part and a second part, in particular a pulse-like joining method, comprising the following steps: a. releasably fixing the at least two parts by means of a clamping device by means of which a plurality of parts to be connected are clamped at a plurality of clamping points between fastening components cooperating with each other, respectively, wherein the plurality of clamping points fastens the plurality of parts to a base, so that the joining of the parts is ensured, and b. at least one-sided engaging of at least one engagement component in at least a vibration-sensitive part portion of the at least two parts at at least one engagement point so that a part vibration can be damped compared to a part vibration without the engagement component, and c. joining the at least two parts by means of the setting device.
9. The joining method according to claim 8, in which the number of clamping points is arranged in an edge portion of a part while the engagement components of the engagement points are arranged in at least one areal portion of a size of 100 cm.sup.2 to 10 m.sup.2.
10. The joining method according to claim 8, with the further step: applying at least one sound damping layer on the part surface with the at least one engagement component, so that an amount of an emitted sound energy during the joining method is lower than an amount of sound energy without use of the sound damping layer.
11. (canceled)
12. (canceled)
13. (canceled)
14. The joining method according to claim 9, with the further step: applying at least one sound damping layer on the part surface with the at least one engagement component, so that an amount of an emitted sound energy during the joining method is lower than an amount of sound energy without use of the sound damping layer.
15. The sound reduction device according to 1, by means of which the part can be engaged with 1 to 3 engagement components per standard area of 100 cm.sup.2 of the vibration-sensitive part portions.
16. The sound reduction device according to claim 1, the engagement component of which has an engagement surface on the part consisting of metal or plastic or a hybrid consisting of metal core and plastic cover or bitumen or silicone.
17. The sound reduction device according to claim 2, the engagement component of which has an engagement surface on the part consisting of metal or plastic or a hybrid consisting of metal core and plastic cover or bitumen or silicone.
18. The sound reduction device according to claim 1, in which at least one engagement component has a sound damping layer which can be pressed against the at least one part on one side in at least a part portion so that a sound energy emitted by the part can be damped.
19. The sound reduction device according to claim 2, in which at least one engagement component has a sound damping layer which can be pressed against the at least one part on one side in at least a part portion so that a sound energy emitted by the part can be damped.
20. The sound reduction device according to claim 3, in which at least one engagement component has a sound damping layer which can be pressed against the at least one part on one side in at least a part portion so that a sound energy emitted by the part can be damped.
21. The sound reduction device according to claim 18, in which the at least one sound damping layer is made of a material having a loss factor d in the range of 0.05≦d≦1.
22. The sound reduction device according to claim 19, in which the at least one sound damping layer is made of a material having a loss factor d in the range of 0.05≦d≦1.
23. The sound reduction device according to claim 20, in which the at least one sound damping layer is made of a material having a loss factor d in the range of 0.05≦d≦1.
24. The joining method according to claim 8, wherein the joining by means of the setting device includes setting of a semi-hollow punch rivet or setting of a solid punch rivet.
Description
4. BRIEF DESCRIPTION OF THE ACCOMPANYING DRAWINGS
[0018] Representative embodiments of the present disclosure will be explained in more detail with reference to the accompanying drawings. It shows:
[0019]
[0020]
[0021]
5. DETAILED DESCRIPTION
[0022] Referring to
[0023]
[0024] Referring again to
[0025] Preferably, and with respect to the vibration-sensitive part portion 30 having a unit of area of 100 cm.sup.2 one to three, preferably one or two, engagement components 24 are arranged engaging the part surface. These engagement components 24 are preferably equally distributed over the unit of area and are arranged regularly. Accordingly, three to nine engagement components 24 preferably engage a vibration-sensitive part portion 30 of a size of approximately 300 cm.sup.2, since it consists of three units of area of 100 cm.sup.2 each.
[0026]
[0027] According to
[0028] Although the components B1 and B2 are temporarily fixed at the clamping points and optionally have a mechanical support (not shown) adjacent to or in the joining portion, these clamping points 12 are not sufficient to prevent the structure-borne sound of the parts B1, B2 during the joining process by a setting device S sufficiently. As can be seen from
[0029] With regard to a reduced noise emission during the joining and machining of the parts B1, B2, it is preferred to arrange a joining zone as close as possible to the clamping points 12, wherein the joining zone is the region into which the bolts 40 are set. In this way, a part vibration can already be reduced by the clamping points 12.
[0030] It is also preferred to arrange one to ten clamping points per standard length of 1 m of the part B1; B2 to releasably fasten the part B1; B2, for example, in the flange portion.
[0031] According to
[0032] According to a further embodiment, the sound reduction device comprises a number of engagement points 22 arranged in or adjacent to or next to the vibration-sensitive part portions 30. The engagement points 22 are preferably positioned in the vibration-sensitive part portions 30. At the engagement points 22 the component surface is engaged by mechanical engagement components 24. This engagement of the engagement component 24 takes place at the part B1; B2 preferably on one side or on both sides. By the engaging of the engagement component 24, component vibrations are damped or reduced.
[0033] In order to achieve an optimal damping result by this engagement, the engagement area of the engagement component 24 engaging the part B1; B2 is made of metal or plastic or a hybrid consisting of metal core and plastic cover or bitumen or silicone or rubber or of damping cardboard.
[0034] According to a further embodiment, the engagement surfaces of the engagement component 24 are formed as areal sound damping layers 26. These sound damping layers 26 are preferably adapted in size to the vibration-sensitive part portion 30. According to different embodiments of the disclosure their size varies between 1 cm.sup.2 and 2 m.sup.2, preferably between 4 cm.sup.2 and 0.4 m.sup.2.
[0035] In addition to the number of engagement components, which comprise one to three engagement components 24 or engagement points 22 per unit of area of 100 cm.sup.2 in the vibration-sensitive part portion 30, the shape of the sound damping layer 26 can also be adjusted. Here it is preferred to adapt the shape of the sound damping layer 26 to the shape of the part or to form the sound damping layer 26 as large as possible.
[0036] According to a further embodiment, the engagement surface of the engagement component 24 and the sound damping layer 26 are made of a viscoelastic material. This viscoelastic material is characterized by the loss factor d in the range of 0.05≦d≦1. The loss factor d describes the damping behavior of the contact area or sound damping layer 26, which is applied as a coating to the part B1; B2. The loss factor d is a measure of the proportion of kinetic energy introduced into the parts B1, B2, which is converted into heat within the material. Therefore the loss factor d is a material parameter, which can be taken from tables. In addition, the loss factor d is defined in DIN EN ISO 6721-3, which is hereby incorporated by reference in order to determine the loss factor. The structure-borne sound damping described by the loss factor d describes the conversion of the oscillation energy of the part B1; B2 by internal friction of the material of the sound damping layer 26 or the engagement surface of the engagement component 24 into heat.
[0037] While on the one hand, the material used for the damping layer 26 can be characterized by the loss factor d, the following materials are on the other hand preferred as damping layer 26 according to the disclosure: plastics, hybrids consisting of metal core and plastic cover, bitumen, silicone, rubber and damping cardboard.
[0038] During a joining method for connecting at least a first part and a second part B1, B2 or during a machining process of one or more parts B1, B2, a releasable fixing of the part or parts B1; B2 takes place in step I first. This fixing is realized by the clamping device 10 discussed above with the plurality of fastening components 14, 16 at the clamping points 12. Due to the present part geometry of the parts B1, B2, the vibration-sensitive part portions 30 are recognizable on account of their size (see above). Therefore, in the next step II, an at least one-sided engagement of the engagement surface of the engagement component 24 occurs adjacent to, in or next to these vibration-sensitive part portions 30. As soon as the engagement components 24 engage the parts B1, B2 by means of their engagement surfaces or by means of sound damping layers 26, an additional damping of possibly occurring vibrations of the components and thus a damping of the structure-borne sound is provided. Therefore, the joining of the at least two parts B1, B2 takes place in step IV or the machining of the at least one part B1 in step V.
[0039] Certain embodiments or components or features of components have been noted herein as being “preferred” and such indications are to be understood as relating to a preference of the applicant at the time this application was filed. Such embodiments, components or features noted as being “preferred” are not required for implementation of the inventions disclosed herein unless otherwise indicated as being required, or unless specifically included within the claims that follow.