DENTAL IMPLANT WITH ELECTROSTIMULATION SYSTEM AND ITS PRODUCTION METHOD

Abstract

The present disclosure relates to a dental implant with electro-stimulation system by electric circuit comprising a plurality of overlapped discs wherein each disc comprises in its interior and in its upper end and lower end surfaces channels and respective holes, wherein each channel comprises an electrically conductive material comprised in said electric circuit. The channels further comprise a film that acts as a barrier between the material of the discs and the material of the electric circuit. The implant further comprises a battery or piezoelectric sensor that allows the creation of electric fields. This disclosure has the main advantage of stimulating bone growth throughout the whole surface of the implant as well as promoting an antimicrobial action through the electric fields.

Claims

1. A dental implant with an electric circuit electro-stimulation system, which comprises: a plurality of overlapping discs wherein each disc has, in an interior, in a lower end surface and an upper end surface of the disc, channels and respective external holes, wherein each channel has positioned therein an electrically conductive material included in the electric circuit electro-stimulation system.

2. The dental implant according to claim 1, wherein each channel includes an insulating film and electric components selected from wires or powders, which comprise said electric circuit electro-stimulation system.

3. The dental implant according to claim 1, wherein each disc includes, at a side portion, a plurality of holes for contacting said electric circuit electro-stimulation system, said holes being connected to the channels of the lower end surfaces and upper end surfaces of each disc.

4. The dental implant according to claim 1, wherein the channels of the upper end surface of each disc include a circular channel and a radial channel connected to said circular channel.

5. The dental implant according to claim 1, wherein the channels of the lower end surface of each disc include a circular channel and a radial channel connected to said circular channel.

6. The dental implant according to claim 4, wherein said radial channel is connected to holes on the side portion of each disc.

7. The dental implant for electro-stimulation by two electrical polarities according to claim 1, wherein the channels of the upper end surface of each disc and the channels of the lower end surface of each disc are arranged to be connected to reverse polarities.

8. The dental implant according to claim 7, wherein said discs are overlapped with the upper end surface and the lower end surface alternated with discs with the upper end surface and lower end surface reversed with each other.

9. The dental implant according to claim 8, wherein each disc comprises in each upper end and lower end surface a circular channel, wherein a radius of the circular channel of the lower end surface is smaller than a radius of the channel of the upper end surface.

10. The dental implant according to claim 8, wherein the circular channel or an internal channel of each disc are between the upper end surface and the lower end surface.

11. The dental implant according to claim 10, wherein each disc comprises two internal channels, each between the upper end surface and the lower end surface, wherein each internal channel is connected to one, and only one, of the circular channels of the upper end and the lower end surface.

12. The dental implant according to claim 1, wherein each disc comprises four holes at the exterior of said disc.

13. The dental implant according to claim 2, wherein the insulating film inserted into the channels includes titanium oxide.

14. The dental implant according to claim 2, wherein the electric wires or powders are composed of a conductive metallic material.

15. The dental implant according to claim 14, wherein the metallic material is selected from the group consisting of: platinum, rhodium, palladium, gold, silver, and combinations thereof.

16. The dental implant according to claim 1, wherein each disc has a thickness between 1 mm and 4 mm.

17. The dental implant according to claim 1, wherein the number of discs is predefined according to the size of the implant and the thickness of said discs.

18. The dental implant according to claim 1, wherein each disc is comprised of a material selected from the group consisting of: titanium, titanium alloys, and titanium composites.

19. The dental implant according to claim 1, wherein the discs are configured to be overlapped and connected by sintering.

20. The dental implant according to claim 1, wherein the electric circuit electro-stimulation system is located either at the top of the implant, in a crown of a tooth, or in an abutment.

21. The dental implant according to claim 1, further comprising an electronic device selected from the group consisting of: an electronic element, a battery, a battery control, a piezoresistive element, and combinations thereof.

22. The dental implant according to claim 1, arranged so that multiple electric fields, emitted on the lower end surface or the upper end surface of the implant, range from 5 to 100 mV.

23. A method of fabricating a dental implant, comprising the following steps: machining, by mechanical subtraction or laser ablation, the holes and channels of each disc; generating, in said channels, an insulating film which is obtained by a process selected from the group of laser heating, other oxidation processes, and a chemical route; placing electric wires or powders; sintering or melting the electric wires or powders by a process selected from the group consisting of using laser, or using pressure and temperature; overlapping each disc and sintering the overlapping discs at a pressure of 5 and 200 MPa, and a temperature between 800 and 1400 C., for periods between 2 to 60 minutes under a controlled atmosphere; performing a polishing or surface treatment by a process selected from the group consisting of particle blasting, laser, and acid etching, to have a predetermined surface texture.

24. The method according to claim 23, wherein the pressure is between 50 and 100 MPa.

25. The method according to claim 23, wherein the temperature is between 1000 C. and 1100 C.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0049] For an easier understanding, the following figures are attached, which represent preferred embodiments which are not intended to limit the object of the present description.

[0050] FIG. 1illustration of an embodiment of a disc of the implant with the holes constituting the internal electric circuit, with the positive circuit on one face and the negative circuit on the other face, and the horizontal and radial channels and the vertical channels.

[0051] FIG. 2schematic illustration of an example of a disc of the implant with the holes and channels where the internal electric circuit will be inserted with the respective protective electrical barrier or electrical insulation.

[0052] FIG. 3schematic illustration of an example of a mould, of a disc of the implant with the electric circuit impregnated in the channels shown in FIG. 1, in the form of powder or wire.

[0053] FIG. 4schematic illustration of an embodiment of the disc assembly which constitute the main body of the implant, with the internal electric circuit already impregnated in the channels.

[0054] FIG. 5schematic presentation of an embodiment of the process of sintering, under pressure and temperature, of the discs constituting the main body of the implant, with the internal electric circuit impregnated, where the discs are overlapped, inside of a mould, for example of graphite, and subjected to pressure and temperature.

[0055] FIG. 6illustration of an embodiment of the final implant, already consolidated by sintering and already with external thread, with the internal electric circuit already incorporated.

[0056] FIG. 7shows an embodiment of the implant with the control unit and battery, or piezoelectric element, already mounted on the top of the implant, either abutment or crown, and the electric fields generated along the surface of the implant.

DETAILED DESCRIPTION

[0057] The present disclosure includes a dental implant, which is composed of a metal or metal composite, biocompatible, which contains in its interior an electric circuit intended for bringing electric fields to multiple points of the surface of the implant. The positive and negative electrical poles lie in pairs along the surface of the implant 15 (FIG. 7), in order to create multiple micro electric fields. This circuit is fed by a small battery that is housed at the top of the implant 13 (FIG. 7), in the abutment or in the crown, and provides power to the electrical system, together with a chip 13 that coordinates electrical stimuli such as voltage intensity, actuation periods, frequency, among others, or alternatively the system is fed by a piezoelectric component 13, which is actuated by the force of mastication.

[0058] The implant material is preferably of titanium or its alloys, or composites based on titanium.

[0059] The implant comprises small discs 1 (FIG. 1), with thicknesses that may range between 1 mm and 4 mm, each disc. In what concerns the process, in these discs, which are in the form of cylinders 1, holes and vertical channels 3, 5 and horizontal and radial channels 2, 4, where the electric circuit of the implant will be inserted are machined by mechanical subtraction or by laser ablation, among others. These channels should be coated with an insulating film 6 that promotes an electrical barrier between the material of the disc, preferably titanium and the material of the electric circuit, platinum or rhodium or gold or silver, among others. This barrier is important because it avoids the dispersion of electric current throughout the implant randomly. Thus, this film is formed by titanium oxides, which can be obtained by laser heating, among other oxidation processes, or by chemical route. The film may have from tens of nanometers to tens of micrometers depending on the process and duration of the same.

[0060] After obtaining the film 6, the electric circuit is placed, that is, the radial, horizontal and vertical channels are filled by a metallic material 7, such as platinum or rhodium or palladium or gold or silver, among other biocompatible and electrically conductive metals. The filling can be made with wires or powders from the previous materials and these are sintered or melt, by laser or by other heat source thus filling the channels 7.

[0061] These discs are then mounted (overlapped) (FIG. 4), so as to give rise to the almost final shape of the implant (FIG. 5), and are placed within a mould consisting of a main body 8, an upper part 9, and a lower part 10, of a material such as graphite, or other refractory material, and subjected to sintering under pressure 11 (FIG. 5) between 5 and 200 MPa, preferably between 50 and 100 MPa and temperature 12 between 800 and 1400 C., preferably between 1000 and 1100 C. for periods between 2 to 60 minutes under controlled atmosphere, for example Argon, for consolidation of the discs with each other, and of the materials constituting the internal electrical system of the implant.

[0062] After consolidation of the main body of the implant, it now has a geometry close to the final one (FIG. 6), and can be subject to machining to definition of the final geometry or the thread. It can also be subject to a polishing, or to a surface treatment by particle blasting, acid etching, laser, among others, intended to create a surface texture suitable for a good connection to the bone tissues.

[0063] The abutment 14 should be mounted on the implant, on which the signal processing central and the battery 13, or alternatively the piezoelectric component 13 may be mounted, which will produce the electrical energy needed to create the electric fields at the multiple points of the surface of the implant 15. The electric fields in the surface of the implant may be in the range of 5 to 100 mv.

[0064] Bibliographic Refs.:

[0065] [1] U.S. Pat. No. 8,374,697 B2Electrical dental screw implant

[0066] [2] CN 103006343 BDental implant micro-electrical stimulation healing device

[0067] [3] WO 2006043748 A1Apparatus for accelerating osseointegration

[0068] [4] US 2003/0153965 A1Electrically conducting nanocomposite materials for biomedical applications

[0069] [5] U.S. Pat. No. 5,738,521 AMethod for accelerating osseointegration of metal bone implants using electrical stimulation.

[0070] In one embodiment the dental implant with electro-stimulation system may be characterized in that it comprises in its constitution discs comprising in its interior and at its lower and upper surfaces, channels 2, 4 and respective holes, wherein each channel contains an insulating film 6 and electric wires or powders 7 which constitute the electric circuit; and an electronic element 13.

[0071] In one embodiment the dental implant may be characterized in that the channels of each disc are radial and horizontal 2, 4 and vertical 3, 5.

[0072] In one embodiment the dental implant may be characterized in that each disc typically comprises 4 holes to the exterior of the implant.

[0073] In one embodiment the dental implant may be characterized in that the insulating film inserted in the channels is of titanium oxide.

[0074] In one embodiment the dental implant may be characterized in that the electric wires or powders are of electrically conductive metallic material.

[0075] In one embodiment the dental implant may be characterized in that the metallic material is preferably platinum or rhodium or palladium or gold or silver.

[0076] In one embodiment the dental implant may be characterized in that each disc comprises a thickness between 1 mm and 4 mm.

[0077] In one embodiment the dental implant may be characterized in that the number of discs is dependent on the size of the implant intended and on the thickness of the discs.

[0078] In one embodiment the dental implant may be characterized in that the material of the discs is based on titanium, its alloys or composites.

[0079] In one embodiment the dental implant may be characterized in that the discs are overlapped and connected by sintering.

[0080] In one embodiment the dental implant may be characterized in that the electronic element is located at the top of the implant, in the crown or in the abutment.

[0081] In one embodiment the dental implant may be characterized in that the electronic element consists of a battery and respective control or of a piezoresistive element.

[0082] In one embodiment the dental implant may be characterized in that it emits, on the surface of the implant, multiple electric fields from 5 to 100 mv.

[0083] In one embodiment, the method of obtaining the implant may be characterized in that it comprises the following steps: [0084] machining by mechanical subtraction or laser ablation the holes and channels of each disc; [0085] generating in said channels the insulating film which is obtained by heating by laser or other oxidation processes or by chemical route; [0086] placing the electric wires or powders and sintering them or melting them by laser, or by pressure and temperature; [0087] overlapping each disc and sintering them at a pressure of 5 to 200 MPa, preferably between 50 and 100 MPa and temperature between 800 and 1400 C., for periods between 2 and 60 minutes under controlled atmosphere; [0088] performing a polishing or surface treatment by particle blasting or by laser or acid etching, in order to create the desired surface texture.

[0089] In one embodiment the method may be characterized in that the pressure is preferably comprised between 50 and 100 MPa.

[0090] In one embodiment the method may be characterized in that the preferred temperature is between 1000 C. and 1100 C.

[0091] The term comprises or comprising when used in this document is intended to indicate the presence of the characteristics, elements, integers, steps and components mentioned, but does not prevent the presence or addition of one or more other features, elements, integers, steps and components, or groups of the same.

[0092] The present disclosure is not, of course, in any way restricted to the embodiments described in this document and a person of ordinary skill in the art may foresee many possibilities of modifying it and replacing of technical characteristics by equivalent ones, depending on the requirements of each situation, as defined in the appended claims. The following claims further define preferred embodiments.