LASER HEATING DEVICE FOR MOUNTING LED

Abstract

A laser heating device for mounting LED includes: a carrier substrate, an optical module and a laser generation module. The carrier substrate for carrying a circuit substrate includes a plurality of conductive pads, a plurality of conductors, and a plurality of LED chips. The conductors are respectively disposed on the conductive pads, and each of the LED chips is disposed in at least two of the corresponding conductors. The optical module is disposed above the carrier substrate. The laser generation module is adjacent to the optical module to provide a laser source having a first predetermined range. The conductor is irradiated by the laser source to mount the LED chip, the first predetermined range of the laser source is optically adjusted by the optical module to form a second predetermined range, and the first predetermined range is greater than, less than or equal to the second predetermined range.

Claims

1. A laser heating device for mounting LED, comprising: a carrier substrate for carrying a circuit substrate, wherein the circuit substrate includes a plurality of conductive pads, a plurality of conductors, and a plurality of LED chips, the conductors are respectively disposed on the conductive pads, and each of the LED chips is disposed on at least two of the corresponding conductors; an optical module disposed above the carrier substrate; and a laser generation module adjacent to the optical module so as to provide a laser source having a first predetermined range; wherein the conductor is mounted onto the LED chip by the irradiation of the laser source, the first predetermined range of the laser source is optically adjusted by the optical module to form a second predetermined range, and the first predetermined range is greater than, less than, or equal to the second predetermined range.

2. The laser heating device for mounting LED according to claim 1, wherein each of the LED chips includes an n-type conductive layer disposed in a stacked arrangement, a light-emitting layer passed through by the laser source and a p-type conductive layer; the n-type conductive layer is an n-type gallium nitride material layer or an n-type gallium arsenide material layer, and the light-emitting layer is a multi-quantum well structure layer, and the p-type conductive layer is a p-type gallium nitride material layer or a p-type gallium arsenide material layer; wherein the irradiation area of the laser source covers only one conductor or one of the LED chips, and the intensity of the laser source generated by the laser source generating module is adjustable; wherein the laser source does not pass through the circuit substrate but only passes through the LED chip.

3. The laser heating device for mounting LED according to claim 1, wherein each of the LED chips includes a base layer disposed in a stacked arrangement, an n-type conductive layer, a light-emitting layer passed through by the laser source and a p-type conductive layer; the base layer is a sapphire base layer, the n-type conductive layer is an n-type gallium nitride material layer or an n-type gallium arsenide material layer, the light-emitting layer is a multi-quantum well structure layer, and the p-type conductive layer is a p-type gallium nitride material layer or a p-type gallium arsenide material layer; wherein the irradiation area of the laser source only covers one conductor or one LED chip, and the intensity of the laser source generated by the laser source generating module is adjustable; wherein the laser source does not pass through the circuit substrate but only passes through the LED chip.

4. The laser heating device for mounting LED according to claim 1, further comprising: a pick and place module adjacent to the carrier substrate for placing each of the LED chips on at least two of the corresponding conductors; wherein the light from the light source laser source is projected through the LED chip onto the conductor to cure the conductor so that the LED chip is mounted onto the circuit substrate; wherein the first predetermined range has the same or different shape as the second predetermined range.

5. The laser heating device for mounting LED according to claim 1, further comprising: a temperature control module adjacent to the carrier substrate for detecting the temperature of the conductor so as to obtain a conductor temperature information; and a control module electrically connected between the temperature control module and the laser generation module; wherein, the control module adjusts the power output by the laser generation module according to the conductor temperature information.

6. A laser heating device for mounting LED, comprising: a circuit substrate for carrying a plurality of conductors, and a plurality of LED chips; an optical module disposed above the carrier substrate; and a laser generation module adjacent to the optical module so as to provide a laser source having a first predetermined range; wherein, the conductor is mounted onto the LED chip by the irradiation of the laser source, the first predetermined range of the laser source is optically adjusted by the optical module to form a second predetermined range, and the first predetermined range is greater than, less than, or equal to the second predetermined range.

7. The laser heating device for mounting LED according to claim 6, wherein each of the LED chips includes an n-type conductive layer disposed in a stacked arrangement, a light-emitting layer passed through by the laser source and a p-type conductive layer; the n-type conductive layer is an n-type gallium nitride material layer or an n-type gallium arsenide material layer, and the light-emitting layer is a multi-quantum well structure layer, and the p-type conductive layer is a p-type gallium nitride material layer or a p-type gallium arsenide material layer; wherein the irradiation area of the laser source covers only one conductor or one of the LED chips, and the intensity of the laser source generated by the laser source generating module is adjustable.

8. The laser heating device for mounting LED according to claim 6, wherein each of the LED chips includes a base layer disposed in a stacked arrangement, an n-type conductive layer, a light-emitting layer passed through by the laser source and a p-type conductive layer; the base layer is a sapphire base layer, the n-type conductive layer is an n-type gallium nitride material layer or an n-type gallium arsenide material layer, the light-emitting layer is a multi-quantum well structure layer, and the p-type conductive layer is a p-type gallium nitride material layer or a p-type gallium arsenide material layer; wherein the irradiation area of the laser source only covers one conductor or one LED chip, and the intensity of the laser source generated by the laser source generating module is adjustable.

9. The laser heating device for mounting LED according to claim 6, further comprising: a temperature control module adjacent to the carrier substrate for detecting the temperature of the conductor so as to obtain a conductor temperature information; and a control module electrically connected between the temperature control module and the laser generation module; wherein the control module adjusts the power output by the laser generation module according to the conductor temperature information.

10. A laser heating device for mounting LED, comprising: a circuit substrate for carrying a plurality of conductors; an optical module disposed above the carrier substrate; a laser generation module adjacent to the optical module so as to provide a laser source having a first predetermined range; a temperature control module adjacent to the carrier substrate for detecting the temperature of the conductor so as to obtain a conductor temperature information; and a control module electrically connected between the temperature control module and the laser generation module; wherein the first predetermined range of the laser source is optically adjusted by the optical module to form a second predetermined range, the first predetermined range is greater than, less than, or equal to the second predetermined range, and the first predetermined range has the same or different shape as the second predetermined range; wherein the control module adjusts the power output by the laser generation module according to the conductor temperature information.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The present disclosure will become more fully understood from the following detailed description and accompanying drawings.

[0011] FIG. 1 is a first operational schematic diagram of a laser heating device for mounting LED according to a first embodiment of the present disclosure.

[0012] FIG. 2 is a second operational schematic diagram of the laser heating device for mounting LED according to the first embodiment of the present disclosure.

[0013] FIG. 3 is a third operational schematic diagram of the laser heating device for mounting LED according to the first embodiment of the present disclosure.

[0014] FIG. 4 is a fourth operational schematic diagram of the laser heating device for mounting LED according to the first embodiment of the present disclosure.

[0015] FIG. 5 is a fifth operational schematic diagram of the laser heating device for mounting LED according to the first embodiment of the present disclosure.

[0016] FIG. 6 is an enlarged schematic view of a portion VI of FIG. 5.

[0017] FIG. 7 is a schematic diagram of irradiation of a second predetermined range of a laser source according to the first embodiment of the present disclosure.

[0018] FIG. 8 is a sixth operational schematic diagram of the laser heating device for mounting LED according to the first embodiment of the present disclosure.

[0019] FIG. 9 is a seventh operational schematic diagram of the laser heating device for mounting LED according to the first embodiment of the present disclosure.

[0020] FIG. 10 is a eighth operational schematic diagram of the laser heating device for mounting LED according to the first embodiment of the present disclosure.

[0021] FIG. 11 is a first operational schematic diagram of a laser heating device for mounting LED according to a second embodiment of the present disclosure.

[0022] FIG. 12 is a second operational schematic diagram of the laser heating device for mounting LED according to the second embodiment of the present disclosure.

[0023] FIG. 13 is a schematic structural view of a partial module of a laser heating device for mounting LED according to a third embodiment of the present disclosure.

[0024] FIG. 14 is a functional block diagram of the laser heating device for mounting LED according to the third embodiment of the present disclosure.

[0025] FIG. 15 is a first operational schematic diagram of a laser heating device for mounting LED according to a fourth embodiment of the present disclosure.

[0026] FIG. 16 is a second operational schematic diagram of the laser heating device for mounting LED according to the fourth embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

[0027] The present disclosure is more particularly described in the following examples that are intended as illustrative only since numerous modifications and variations therein will be apparent to those skilled in the art. Like numbers in the drawings indicate like components throughout the views. As used in the description herein and throughout the claims that follow, unless the context clearly dictates otherwise, the meaning of a, an, and the includes plural reference, and the meaning of in includes in and on. Titles or subtitles can be used herein for the convenience of a reader, which shall have no influence on the scope of the present disclosure.

[0028] The terms used herein generally have their ordinary meanings in the art. In the case of conflict, the present document, including any definitions given herein, will prevail. The same thing can be expressed in more than one way. Alternative language and synonyms can be used for any term(s) discussed herein, and no special significance is to be placed upon whether a term is elaborated or discussed herein. A recital of one or more synonyms does not exclude the use of other synonyms. The use of examples anywhere in this specification including examples of any terms is illustrative only, and in no way limits the scope and meaning of the present disclosure or of any exemplified term. Likewise, the present disclosure is not limited to various embodiments given herein. Numbering terms such as first, second or third can be used to describe various components, signals or the like, which are for distinguishing one component/signal from another one only, and are not intended to, nor should be construed to impose any substantive limitations on the components, signals or the like.

First Embodiment

[0029] Referring to FIG. 1 to FIG. 10, a first embodiment of the present disclosure provides a laser heating device Z for mounting LED, including: a carrier substrate M1, an optical module M2, and a laser generation module M3.

[0030] First, as shown in FIG. 1 and FIG. 2, the carrier substrate M1 carries a circuit substrate 10, and the load module M1 can be a stage device with a displacement function, but is not limited thereto. The circuit substrate 10 includes a plurality of conductive pads 100, a plurality of conductors 101, and a plurality of LED chips 102. The conductors 101 are respectively disposed on the conductive pads 100. For example, at least one of the conductors 101 can be disposed on each of the conductive pads 100, and the conductor 101 can be a solder ball or other type of conductive material, but the present disclosure is not limited thereto. The LED chips 102 are disposed on the circuit substrate 10, and each of the LED chips 102 is disposed on at least two conductors 101.

[0031] Further, as shown in FIG. 3, the laser heating device Z for mounting LED provided by the present disclosure further includes: a pick and place module M4 adjacent to the carrier substrate M1 for placing each of the LED chips 102 on the corresponding at least two of the conductors 101. For example, the present disclosure can also place a plurality of LED chips 102 on the circuit substrate 10 by pick and place module M4, and each of the LED chips 102 corresponds to at least two conductors 101. The pick and place module M4 can be a vacuum nozzle or any kind of pick and place machine. However, the present disclosure is not limited thereto.

[0032] The optical module M2 is disposed above the carrier substrate M1 and is located between the laser generation module M3 and the circuit substrate 10. The optical module M2 may be a lens structure or a light guide plate structure, but is not limited thereto. The laser source generating module M3 can provide a laser source L having a first predetermined range R1 and direct the light from the light source to the optical module M2. The first predetermined range R1 of the laser source L is formed by the optical adjustment of the optical module M2 to form a second predetermined range R2. The first predetermined range R1 may be greater than, less than, or equal to the second predetermined range R2. In the present embodiment, as an example, the first predetermined range R1 may be smaller than the second predetermined range R2, but the present disclosure is not limited thereto. The first predetermined range R1 and the second predetermined range R2 may have the same or different shapes.

[0033] Further, as shown in FIG. 4 to FIG. 7, when the light from the laser source L of the second predetermined range R2 is directed to each of the LED chips 102, the light passes through the n-type conductive layer N, the light-emitting layer M, and the p-type conductive of the LED chip 102 so as to project on at least two conductors 101 of the circuit substrate 10. Further, as shown in FIG. 6, each of the LED chips 102 may be a micro-semiconductor light-emitting element (Micro LED) including an n-type conductive layer N disposed in a stack, a light-emitting layer M passed through by the laser source L, and a p-type conductive layer P. The n-type conductive layer N may be an n-type gallium nitride material layer or an n-type gallium arsenide material layer, the light-emitting layer M is a multi-quantum well structure layer, and the p-type conductive layer P may be a p-type gallium nitride material layer or a p-type gallium arsenide material layer, but is not limited thereto. However, the above-mentioned examples are only one of the possible embodiments and the present disclosure is not limited thereto.

[0034] Further, as shown in FIG. 7, the second predetermined range R2 of the laser source L may cover a plurality of LED chips 102. For example, the second predetermined range R2 may cover 44 LED chips 102, but the present disclosure is not limited thereto. Moreover, the intensity 3 of the laser source L of the module M of the present disclosure may be adjusted by adjusting the laser source, so that the laser source L3 generated by the laser source generating module M3 passes only through the LED chip 102 without passing through the circuit substrate 10. However, the above-mentioned examples are only one of the possible embodiments and the present disclosure is not limited thereto.

[0035] Finally, as shown in FIG. 6 and FIG. 8, the conductor 101 disposed between the LED chip 102 and the circuit substrate 10 is cured by the irradiation of the laser source L, so that the LED chip 102 is mounted onto the circuit substrate 10. For example, when the conductor 101 disposed between the LED chip 102 and the circuit substrate 10 is irradiated by the laser source L, the conductor 101 is softened, and a connection with the LED chip 102 is made. Then, after the conductor 101 is cured, the LED chip 102 is mounted onto the circuit substrate 10 and electrically connected to the circuit substrate 10 through the conductor 101. However, the present disclosure is not limited thereto.

[0036] In addition, as shown in FIG. 9 to FIG. 10, the laser heating device Z for mounting LED provided by the present disclosure can further project the light from the laser source L generated by the laser source generating module M3 to the contact interface F of the LED chip 102 and the conductor 101, thereby reducing the connection strength between the LED chip 102 and the conductor 101. Thus, the LED chip 102 is removed from the circuit substrate 10 so that the LED chip 102 is easily detached from the conductor 101. For example, the present disclosure can also direct the laser source L generated by the laser source generating module M3 to the contact interface F between the LED chip 102 and the cured conductor 101 so as to soften part of the conductor 101 close to the contact interface F, and reduce the connection strength and bonding force between the LED chip 102 and the conductor 101, so that the LED chip 102 can be easily detached from the conductor 101 and removed from the circuit substrate 10. Then, at least two old conductors 101 separate from the LED chip 102 can be removed from the circuit substrate 10 using a special instrument (such as a scraper or grinder) to facilitate repositioning of the new conductor 101. However, the present disclosure is not limited thereto.

[0037] Further, as shown in FIG. 1 to FIG. 10, the present disclosure provides a laser heating device Z for mounting LED, including: a circuit substrate 10, an optical module M2, and a laser generation module M3. The circuit substrate 10 is used to carry a plurality of conductors 101 and a plurality of LED chips 102. The optical module M2 is disposed above the circuit substrate 10. The laser generation module M3 is adjacent to the optical module M2 to provide a laser source L having a first predetermined range R1. The conductor 101 is irradiated by the laser source L to fix the LED chip 102, and the first predetermined range R1 of the laser source L is optically adjusted by the optical module M2 to form a second predetermined range R2, which is greater than, less than or equal to the second predetermined range R2.

[0038] It should be noted that, in the above-mentioned embodiment, the wavelengths of the laser source L for bonding the conductor 101 to the LED chip 102 and the laser source L for reducing the conductor 11 may be the same as or different from each other.

Second Embodiment

[0039] Referring to FIG. 11 to FIG. 12 together with FIG. 1 to FIG. 10, a second embodiment of the present disclosure provides a laser heating device Z for mounting LED that is similar to that described in the first embodiment, and therefore similar steps in the process will not be described again. Further, with reference to FIG. 6 and according to FIG. 11 and FIG. 12 and FIG. 5 and FIG. 8, the difference between the second embodiment and the first embodiment of the present disclosure is that each of the LED chips 102 of the present embodiment may be a sub-millimeter light-emitting diode (Mini LED) including a base layer 1020 disposed in a stacked manner, an n-type conductive layer N, a light-emitting layer M passed through by the laser source L and a p-type conductive layer P. The base layer 1020 is a sapphire material layer, the n-type conductive layer N may be an n-type gallium nitride material layer or an n-type gallium arsenide material layer, the light-emitting layer M is a multi-quantum well structure layer, and the p-type conductive layer P may be a p-type gallium nitride material layer or a p-type gallium arsenide material layer, but the present disclosure is not limited thereto. The base layer 1020 may also be a quartz base layer, a glass base layer, a tantalum base layer, or a base layer of any material. However, the above-mentioned examples are only one of the possible embodiments and the present disclosure is not limited thereto.

[0040] For example, when the light from the laser source L of the second predetermined range R2 is directed to each of the LED chips 102, the light passes through the base layer 1020, the n-type conductive layer N, the light-emitting layer M, and the p-type conductive layer P, and is projected onto at least two conductors 101 of the circuit substrate 10. Next, the conductor 101 disposed between the LED chip 102 and the circuit substrate 10 is cured by irradiation of the laser source L so that the LED chip 102 is mounted on the circuit substrate 10. However, the above-mentioned examples are only one of the possible embodiments and the present disclosure is not limited thereto.

Third Embodiment

[0041] Referring to FIG. 13 to FIG. 14 together with FIG. 1 to FIG. 12, a third embodiment of the present disclosure provides a laser heating device Z for mounting LED that is similar to that described in the first embodiment, and therefore similar steps in the process will not be described again. Further, the difference between the third embodiment and the first embodiment of the present disclosure is that, the laser heating device Z for mounting LED provided by the present disclosure further includes: a temperature control module M5 and a control module M6. The temperature control module M5 is adjacent to the carrier substrate M1 for detecting the temperature of the conductor 101 to obtain a conductor temperature information. The control module M6 is electrically connected between the temperature control module M5 and the laser generation module M3. The control module M6 adjusts the power output by the laser generation module M3 according to the conductor temperature information.

[0042] For example, the temperature control module M5 can be a temperature sensor or a temperature controller, but the present disclosure is not limited thereto. A sensing end of the temperature control module M5 may be disposed on the carrier substrate M1 and adjacent to the circuit substrate 10, or the sensing end of the temperature control module M5 may be located outside the carrier substrate M1 and adjacent to one or a part of the conductor 101 on the circuit substrate 10. Moreover, the control module M6 is electrically connected to the carrier substrate M1, the laser generation module M3, the pick and place module M4, and the temperature control module M5. Therefore, at the same time as or after the laser source L is projected onto the conductor 101 on the circuit substrate 10, the temperature of the conductor 101 can be detected by the temperature control module M5 to obtain a conductor temperature information.

[0043] Then, the control module M6 can determine whether the power output by the laser generation module M3 is sufficient, too low or too high according to the conductor temperature information (for example, comparing the conductor temperature information with a preset temperature information, but the present disclosure is not limited thereto), and then the power output by the laser generation module M3 is appropriately adjusted. However, the above-mentioned examples are only one of the possible embodiments and the present disclosure is not limited thereto.

[0044] It is worth mentioning that, as shown in FIG. 1 to FIG. 14, the present disclosure further provides a laser heating device Z for mounting LED, including: a circuit substrate 10, an optical module M2, a laser generation module M3, a temperature control module M5, and a control module M6. The circuit substrate 10 is used to carry a plurality of conductors 101. The optical module M2 is disposed above the circuit substrate 10. The laser generation module M3 is adjacent to the optical module M2 to provide a laser source L having a first predetermined range R1. The temperature control module M5 is adjacent to the circuit substrate 10 for detecting the temperature of the conductor 101 to obtain a conductor temperature information. The control module M6 is electrically connected between the temperature control module M5 and the laser generation module M3. The first predetermined range R1 of the laser source L is optically adjusted by the optical module M2 to form a second predetermined range R2. The first predetermined range R1 is greater than, less than or equal to the second predetermined range R2, and the first predetermined range R1 and the second predetermined range R2 have the same or different shapes. The control module M6 adjusts the power output by the laser generation module M3 according to the conductor temperature information.

Fourth Embodiment

[0045] Referring to FIG. 15 to FIG. 16 together with FIG. 1 to FIG. 14, a fourth embodiment of the present disclosure provides a laser heating device Z for mounting LED that is similar to that described in the first embodiment, and therefore similar steps in the process will not be described again. Further, according to FIG. 15, FIG. 2 and FIG. 3, the difference between the fourth embodiment and the first embodiment of the present disclosure is that the laser heating device Z for mounting LED provided by the present disclosure can also have at least two conductors 101 disposed on each of the LED chips 102.

[0046] For example, in the present disclosure, at least two conductors 101 may be disposed on each of the LED chips 102, and the conductor 101 may be a solder ball, or other conductive materials having different shapes or structures, but the present disclosure is not limited thereto. Next, as shown in FIG. 15, a plurality of LED chips 102 are placed on the circuit substrate 10 by a pick and place module M4, and at least two conductors 101 of each of the LED chips 102 correspond to the conductive pads 100 of the circuit substrate 10. Then, the light from the laser source L generated by the laser generation module is directed to the LED chip 102. Next, when the conductor 101 disposed between the LED chip 102 and the circuit substrate 10 is irradiated by the laser source L, the conductor 101 is softened, and a connection with the circuit substrate 10 is made. Finally, after the conductor 101 is cured, the LED chip 102 is mounted onto the circuit substrate 10 and electrically connected to the circuit substrate 10 through the conductor 101. However, the above-mentioned examples are only one of the possible embodiments and the present disclosure is not limited thereto.

[0047] In conclusion, the laser heating device for mounting LED Z provided by the present disclosure has the technical features of a laser heating device Z for mounting LED, including: a carrier substrate M1, an optical module M2, and a laser generation module M3, the optical module M2 being disposed above the carrier substrate M1, the laser generation module M3 being adjacent to the optical module M2 to provide a laser source L having a first predetermined range R1 and the conductor 101 being irradiated by the laser source L to mount the LED chip 102, the first predetermined range R1 of the laser source L forming a second predetermined range R2 by optical adjustment of the optical module M2, and the first predetermined range R1 being greater than, less than, or equal to the second predetermined range R2 so that the LED chip can be mounted on a circuit substrate 10. Further, the laser heating device Z for mounting LED provided by the present disclosure can convert the first predetermined range R1 of the laser source L into the second predetermined range R2 by using the optical adjustment of the optical module M2 by the above-mentioned technical solution, so as to conduct the solid crystal process of the LED chip 102.

[0048] The foregoing description of the exemplary embodiments of the disclosure has been presented only for the purposes of illustration and description and is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching.

[0049] The embodiments were chosen and described in order to explain the principles of the disclosure and their practical application so as to enable others skilled in the art to utilize the disclosure and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will become apparent to those skilled in the art to which the present disclosure pertains without departing from its spirit and scope.