SPUTTERING PROCESSING AND APPARATUS

Abstract

A process for sputtering a plurality of integrated circuit (IC) units, the process having at least the steps of: applying a layer to a holding ring; cutting an array of apertures in the layer; transferring the holding ring to a template positioned within a placement station; aligning the array of apertures with an array of recesses in the template; delivering IC units to the holding ring, each IC unit corresponding to an aligned aperture and recess, and then; applying a sputtering process to the IC units engaged with the holding ring.

Claims

1. A process for sputtering a plurality of integrated circuit (IC) units, the process comprising the steps of: applying a layer to a holding ring; cutting an array of apertures in the layer; transferring the holding ring to a template positioned within a placement station; aligning said array of apertures with an array of recesses in said template; delivering IC units to said holding ring, each IC unit corresponding to an aligned aperture and recess, and applying a sputtering process to said IC units engaged with said holding ring.

2. The process according to claim 1, further including the step, between the applying step and the cutting step, of applying a backing layer to said holding ring.

3. The process according to claim 2, wherein the cutting step comprises laser cutting.

4. The process according to claim 3, wherein the delivering step includes engaging the IC units with a picker and disengaging them to transfer to the holding ring.

5. The process according to claim 4, wherein the delivering step includes engaging the IC units with a picker and disengaging them to transfer to the holding ring.

6. The process according to claim 5, wherein the applying step includes placing a double-sided tape to the holding ring.

7. The process according to claim 6, wherein the layer is a double-sided tape and the cutting step includes cutting the double-sided tape and then peeling a backing tape to expose an adhesive surface and remove the cut portions of the double-sided tape.

8. The process according to claim 1, wherein the cutting step comprises laser cutting.

9. The process according to claim 2, wherein the delivering step includes engaging the IC units with a picker and disengaging them to transfer to the holding ring.

10. The process according to claim 8, wherein the delivering step includes engaging the IC units with a picker and disengaging them to transfer to the holding ring.

11. The process according to claim 1, wherein the delivering step includes engaging the IC units with a picker and disengaging them to transfer to the holding ring.

12. The process according to claim 9, wherein the delivering step includes engaging the IC units with a picker and disengaging them to transfer to the holding ring.

13. The process according to claim 10, wherein the delivering step includes engaging the IC units with a picker and disengaging them to transfer to the holding ring.

14. The process according to claim 11, wherein the delivering step includes engaging the IC units with a picker and disengaging them to transfer to the holding ring.

15. The process according to claim 1, wherein the delivering step includes engaging the IC units with a picker and disengaging them to transfer to the holding ring.

16. The process according to claim 1, wherein the applying step includes placing a double-sided tape to the holding ring.

17. A placement station comprising: a template having an array of recesses; said template arranged to receive a holding ring having an array of apertures; said apertures and recesses arranged to align so as to receive a plurality of integrated circuit (IC) units for sputtering.

18. The placement station according to claim 17, wherein the IC units are ball grid array (BGA) chips, said apertures sized to allow solder ball connections of the BGA chips to pass through the aperture but retain the IC portion of the BGA chip.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0010] It will be convenient to further describe the present invention with respect to the accompanying drawings that illustrate possible arrangements of the invention. Other arrangements of the invention are possible and consequently, the particularity of the accompanying drawings is not to be understood as superseding the generality of the preceding description of the invention.

[0011] FIGS. 1A and 1B are sequential views of the application of layer to a holding ring according to one embodiment of the present invention;

[0012] FIGS. 2A and 2B are sequential views of the laser cutting process according to a further embodiment of the present invention;

[0013] FIGS. 3 and 4 are sequential views of the application of a holding ring to a template according to a further embodiment of the present invention, and;

[0014] FIG. 5 is an elevation view of a unit positioned within an aligned aperture of a laser cut layer and recess of a template according to a further embodiment of the present invention.

DETAILED DESCRIPTION

[0015] The invention therefore provides a reusable template having an array of apertures corresponding to IC units. The process begins with the units being inspected, flipped, aligned and oriented. The inspection, alignment and orientation step include conducting a top vision inspection then moving the units to a flipper and subsequently a picker for aligning the units. By having the template fixed to the sputtering table, IC units are delivered directly to the sputtering table to position on a laser cut tape, bonded to a holding ring, which in turn is placed on the template. Following the sputtering process, the units are ejected, aligned and further inspected before being offloaded.

[0016] FIGS. 1A and 1B show the preparation of a holding ring 10 prior to laser cutting of the apertures. The ring 10 receives a double-sided sputtering tape 15 covering the void in the ring 10. The sputtering tape 15 may be an adhesive layer applied to the holding ring. A lower layer, such as a sub-tape 20 is then attached underneath the tape 15 so as to cover any adhesive backing of the sputtering tape 15. Because the stencil of the prior art is affixed to the sputtering tape 15, the adhesive areas not cut are then covered. However, given the removal of the stencil from the process a lower layer, such as a sub-tape 20 is used as a cover for this adhesive section.

[0017] It will be appreciated that a layer having a peripheral adhesive portion sufficient to stick to the holding ring 10 may also be used such that the sub-tape 20 is not required. A peripheral section 17 as shown in FIG. 1A is required to stick to the ring 10. However, in this separate embodiment, no further adhesive quality is required of the peripheral adhesive layer.

[0018] FIGS. 2A and 2B correspond to the laser cutting process 55 whereby a laser cutter 60 cuts apertures in the sputtering tape 15 and the sub-tape 20 in order to create an array of apertures 25 for receiving the IC units. Once the array of apertures 25 is cut into the tape, the backing tape 22 of the double-sided sputtering tape 15 is removed, ready for receiving the IC units.

[0019] FIGS. 3 and 4 shows the next step in the process involving a placement station 30. The ring 10 having the laser cut apertures 25 in the sputtering tape and sub-tape is lowered onto the placement table 35. In this embodiment, the placement table 35 includes a template 40 having an array of recesses 45 corresponding to the laser cut apertures 25 in the sputtering tape that are aligned as the holding ring 10 is lowered onto the template. Thus, the template 40 takes the place of the stencil during the placement process without the need for an individual stencil prior to or following sputtering. The cost savings in replacing the stencil with the template 40 is therefore significant as the template 40 can be reused for each placement process as compared to the stencil that is subsequently discarded.

[0020] FIG. 5 shows the ring 10 in place over the template 40 with the IC units 50 placed on the sputtering tape 15 over the template recesses 45 and thus aligning the apertures 25 as previously described. The units 50 are engaged by a picker to move the units to the template and inspecting the underside of the units during delivery by the picker. The IC units in this case are BGA chips, which are positioned on the adhesive surface of the sputtering tape 15, which fits over the template 40. The BGA chip 50 includes solder ball connections 55 around the chip 50 that fit within the void created by the alignment of the recesses 45 and apertures 25.