Substrate carrier apparatus and liquid crystal display manufacturing device

Abstract

This application provides a substrate carrier apparatus and a liquid crystal display (LCD) manufacturing device. The substrate carrier apparatus includes: a carrier platform, configured to carry a substrate; and a conductor, including a power receiving terminal and a ground terminal, where the power receiving terminal is electrically connected to the substrate, and the ground terminal is grounded.

Claims

1. A substrate carrier apparatus, applied to manufacture at least one display, comprising: a carrier platform, configured to carry a substrate; and a conductor, comprising a power receiving terminal and a ground terminal, wherein the power receiving terminal is electrically connected to the substrate, and the ground terminal is grounded; wherein the conductor is a conducting wire or an electrostatic discharge (ESD) rope made of a slightly flexible conducting material; wherein a diameter of the ESD rope is 1 millimeter, and a distance between the ESD rope and the substrate is less than 3 centimeters; and wherein there is a plurality of conductors respectively electrically connected to corners of the substrate.

2. The substrate carrier apparatus according to claim 1, wherein the conductor is located between the substrate and the carrier platform.

3. A liquid crystal display (LCD) manufacturing device, comprising a substrate carrier apparatus, wherein the substrate carrier apparatus comprises: a carrier platform, configured to carry a substrate; and a conductor, comprising a power receiving terminal and a ground terminal, wherein the power receiving terminal is electrically connected to the substrate, and the ground terminal is grounded; and the conductor is located between the substrate and the carrier platform; wherein the conductor is a conducting wire or an electrostatic discharge (ESD) rope made of a slightly flexible conducting material; wherein a diameter of the ESD rope is 1 millimeter, and a distance between the ESD rope and the substrate is less than 3 centimeters; and wherein there is a plurality of conductors respectively electrically connected to corners of the substrate.

4. A substrate carrier apparatus, applied to manufacture at least one display, comprising: a carrier platform, configured to carry a substrate; and a conductor, comprising a power receiving terminal and a ground terminal, wherein the power receiving terminal is electrically connected to the substrate, and the ground terminal is grounded; the conductor is located between the substrate and the carrier platform, and the power receiving terminal of the conductor is located between the substrate and the carrier platform; the conductor is a conducting wire or an electrostatic discharge (ESD) rope made of a slightly flexible conducting material; a diameter of the ESD rope is 1 millimeter, and a distance between the ESD rope and the substrate is less than 3 centimeters; the substrate is of a rectangular shape or a square shape; and there is a plurality of conductors respectively electrically connected to corners of the substrate.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a schematic diagram of a substrate carrier apparatus according to an embodiment of this application;

(2) FIG. 2 is a partial schematic diagram showing that a conductor of a substrate carrier apparatus is electrically connected to a substrate and is grounded according to an embodiment of this application;

(3) FIG. 3 is a schematic diagram of a distance between a conductor of a substrate carrier apparatus and a substrate according to an embodiment of this application and

(4) FIG. 4 is a schematic diagram showing that a plurality of conductors of a substrate carrier apparatus is respectively electrically connected to corners of a substrate according to an embodiment of this application.

DETAILED DESCRIPTION

(5) The following embodiments are described with reference to the accompanying drawings, which are used to exemplify specific embodiments for implementation of this application. Terms about directions mentioned in this application, such as on, below, front, back, left, right, in, out, and side surface merely refer to directions in the accompanying drawings. Therefore, the used terms about directions are used to describe and understand this application, and are not intended to limit this application.

(6) The accompanying drawings and the descriptions are considered to be essentially exemplary, rather than limitative. In the figures, units with similar structures are represented by using the same reference number. In addition, for understanding and ease of description, the size and the thickness of each component shown in the accompanying drawings are arbitrarily shown, but this application is not limited thereto.

(7) In the accompanying drawings, for clarity, thicknesses of a layer, a film, a panel, an area, and the like are enlarged. In the accompanying drawings, for understanding and ease of description, thicknesses of some layers and areas are enlarged. It should be understood that when a component such as a layer, a film, an area, or a base is described to be on another component, the component may be directly on the another component, or there may be an intermediate component.

(8) In addition, in this specification, unless otherwise explicitly described to have an opposite meaning, the term include is understood as including the component, but not excluding any other component. In addition, in this specification, on means that a component is located on or below a target component, but does not mean that the component needs to be located on top of the gravity direction.

(9) To further describe the technical means adopted in this application to achieve the intended application objective and effects thereof, specific implementations, structures, features, and effects of a substrate carrier apparatus and an LCD manufacturing device provided according to the present disclosure are described below in detail with reference to the accompanying drawings and preferred embodiments.

(10) Referring to FIG. 1 to FIG. 4, FIG. 1 is a schematic diagram of a substrate carrier apparatus according to an embodiment of this application; FIG. 2 is a partial schematic diagram showing that a conductor of a substrate carrier apparatus is electrically connected to a substrate and is grounded according to an embodiment of this application; FIG. 3 is a schematic diagram of a distance between a conductor of a substrate carrier apparatus and a substrate according to an embodiment of this application; FIG. 4 is a schematic diagram showing that a plurality of conductors of a substrate carrier apparatus is respectively electrically connected to corners of a substrate according to an embodiment of this application. Referring to FIG. 1 and FIG. 2, a substrate carrier apparatus 100 for carrying a substrate provided in this application includes: a carrier platform 110, configured to carry a substrate 120; and a conductor 130, including a power receiving terminal 131 and a ground terminal 132. The power receiving terminal 131 is electrically connected to the substrate 120, and the ground terminal 132 is grounded.

(11) The objective of this application may be further achieved and the technical problem of this application may be further resolved by using the following technical solutions.

(12) In an embodiment of this application, the conductor 130 is located between the substrate 120 and the carrier platform 110. More specifically, the power receiving terminal 131 of the conductor 130 is located between the substrate 120 and the carrier platform 110.

(13) In an embodiment of this application, the conductor 130 is a slightly flexible conducting material.

(14) In an embodiment of this application, the conductor 130 is a conducting wire.

(15) In an embodiment of this application, the conductor 130 is an ESD rope. A diameter of the ESD rope is approximately 1 millimeter.

(16) In an embodiment of this application, as shown in FIG. 3, a distance H between the ESD rope and the substrate is less than 3 centimeters.

(17) In an embodiment of this application, as shown in FIG. 4, the conductor 130 is electrically connected to an edge of the substrate 120. Further, there is a plurality of conductors 130 respectively electrically connected to edges of the substrate 120. When the substrate 120 is of a rectangular shape or a square shape, there is a plurality of conductors 130 respectively electrically connected to corners of the substrate.

(18) As described above, another objective of this application is to provide an LCD manufacturing device, including a substrate carrier apparatus. Still referring to FIG. 1 to FIG. 4, FIG. 1 is a schematic diagram of a substrate carrier apparatus according to an embodiment of this application; FIG. 2 is a partial schematic diagram showing that a conductor of a substrate carrier apparatus is electrically connected to a substrate and is grounded according to an embodiment of this application; FIG. 3 is a schematic diagram of a distance between a conductor of a substrate carrier apparatus and a substrate according to an embodiment of this application; FIG. 4 is a schematic diagram showing that a plurality of conductors of a substrate carrier apparatus is respectively electrically connected to corners of a substrate according to an embodiment of this application. Referring to FIG. 1 and FIG. 2, a substrate carrier apparatus 100 for carrying a substrate provided in this application includes: a carrier platform 110, configured to carry a substrate 120; and a conductor 130, including a power receiving terminal 131 and a ground terminal 132. The power receiving terminal 131 is electrically connected to the substrate 120, and the ground terminal 132 is grounded.

(19) The objective of this application may be further achieved and the technical problem of this application may be further resolved by using the following technical solutions.

(20) In an embodiment of this application, the conductor 130 is located between the substrate 120 and the carrier platform 110. More specifically, the power receiving terminal 131 of the conductor 130 is located between the substrate 120 and the carrier platform 110.

(21) In an embodiment of this application, the conductor 130 is a slightly flexible conducting material.

(22) In an embodiment of this application, the conductor 130 is a conducting wire.

(23) In an embodiment of this application, the conductor 130 is an ESD rope. A diameter of the ESD rope is approximately 1 millimeter.

(24) In an embodiment of this application, as shown in FIG. 3, a distance H between the ESD rope and the substrate is less than 3 centimeters.

(25) In an embodiment of this application, as shown in FIG. 4, the conductor 130 is electrically connected to an edge of the substrate 120. Further, there is a plurality of conductors 130 respectively electrically connected to edges of the substrate 120. When the substrate 120 is of a rectangular shape or a square shape, there is a plurality of conductors 130 respectively electrically connected to corners of the substrate.

(26) In this application, a conductor is electrically connected to a substrate located on a carrier platform, so that electricity can be removed or neutralized at any time, and static electricity generated by friction with air during transfer of the substrate or static electricity from outside can be eliminated, thereby avoiding static electricity. In addition to the foregoing descriptions, the electrostatic neutralizer or the electrostatic eliminator known and used in the related art does not need to be used in this application. Therefore, extra electric power may not be required, thereby reducing costs. In this application, because the conductor is electrically connected to the substrate located on the carrier platform, mounting is easy, and time can be efficiently saved. In this application, an ESD rope is used as a conductor. Because the ESD rope neither oxidizes nor rusts, contamination is avoided.

(27) The terms such as in some embodiments and in various embodiments are repeatedly used. The terms usually refer to different embodiments, but they may further refer to a same embodiment. The terms such as comprising, having and including are synonyms, unless other meanings are indicated in the context.

(28) The foregoing descriptions are merely preferred embodiments of this application, and are not intended to limit this application. Although this application has been disclosed above through the preferred embodiments, the embodiments are not intended to limit this application. A person skilled in the art can make some equivalent variations, alterations or modifications to the above-disclosed technical content without departing from the scope of the technical solutions of this application to obtain equivalent embodiments. Any simple alteration, equivalent change or modification made to the above embodiments according to the technical essence of this application without departing from the content of the technical solutions of this application shall fall within the scope of the technical solutions of this application.