FRICTION-REDUCING AND ANTI-WEAR COMPOSITE MATERIAL FOR WADING KINEMATIC PAIR AND PREPARATION METHOD THEREFOR

Abstract

Disclosed is a friction-reducing and anti-wear composite material for a wading kinematic pair and a method of preparing the same. The friction-reducing and anti-wear composite material is prepared from carbon fiber (CF) among inorganic fillers, polyimide (PI) and polyether ether ketone (PEEK). These three materials are wet-mixed, dried and placed in a mold followed by curing by a heat press. The cured product is cooled and demolded to obtain the CF/PI/PEEK friction-reducing and anti-wear composite material for a wading kinematic pair. Tribological properties of the PEEK material are enhanced due to synergistic effect arising from hybrid organic-inorganic filling. The friction-reducing and anti-wear composite material provided in the invention has significantly reduced friction coefficient and wear volume loss under the seawater environment.

Claims

1. A friction-reducing and anti-wear composite material for a wading kinematic pair, comprising: a PEEK material as a matrix material; a high-strength chopped fiber as a reinforcing material; and a PI material for increasing abrasion resistance; wherein the PEEK material, the high-strength chopped fiber and the PI material are mixed followed by hot pressing to prepare the friction-reducing and anti-wear composite material.

2. The friction-reducing and anti-wear composite material of claim 1, wherein the high-strength chopped fiber is an inorganic filler CF; and the PEEK material, the high-strength chopped fiber and the PI material are wet-mixed in a volatile solvent.

3. The friction-reducing and anti-wear composite material of claim 2, wherein based on 70 parts by weight of the PEEK material, the inorganic filler CF is 3-20 parts by weight, and the PI material is 10-27 parts by weight.

4. The friction-reducing and anti-wear composite material of claim 3, wherein based on 70 parts by weight of the PEEK material, the inorganic filler CF is 5-10 parts by weight, and the PI material is 20-25 parts by weight.

5. The friction-reducing and anti-wear composite material of claim 2, wherein the PEEK material and the PI material are in the form of powder, and the inorganic filler CF is ground chopped fiber.

6. The friction-reducing and anti-wear composite material of claim 3, wherein the PEEK material and the PI material are in the form of powder, and the inorganic filler CF is ground chopped fiber.

7. A method for preparing a friction-reducing and anti-wear composite material, comprising: (1) preparing PEEK powder, PI powder and an inorganic chopped filler CF for use; (2) uniformly mixing the PEEK powder, the PI powder and the inorganic chopped filler CF to form a powder mixture; and (3) placing the powder mixture in a mold and pre-pressed and then hot pressing by a heat press for curing; and cooling and demolding the cured product to obtain a sample of the friction-reducing and anti-wear composite material.

8. The method of claim 7, wherein the PEEK powder, the PI powder and the inorganic chopped filler CF are uniformly wet-mixed in a volatile solvent and then dried to obtain the powder mixture.

9. The method of claim 8, wherein in step (3), the pre-pressing is performed under 20-30 MPa 2-4 times, for 3-5 min each time.

10. The method of claim 8, wherein in step (3), the hot pressing is performed with gradient temperature and pressure increase, where a maximum temperature is not more than 380 C., and a maximum pressure is not more than 120 MPa.

11. The method of claim 10, wherein step (3) comprises: preheating the mold to 145-155 C. at a rate of 90-110 C./h, applying a pressure of 30-40 MPa on the mold, and keeping the temperature at 145-155 C. for 1-2 h; raising the temperature of the mold to 255-265 C. at a rate of 40-60 C./h; increasing the pressure applied on the mold to 60-80 MPa; and keeping the temperature at 255-265 C. for 1 h; raising the temperature of the mold to 370-380 C. at a rate of 40-60 C./h, and when a temperature controller indicates that the temperature reaches the desired temperature, increasing the pressure applied on the mold to 100-120 MPa and keeping the temperature at 370-380 C. and the pressure at 100-120 MPa for 3-4 h, during which gas is discharged 2-3 times; after curing, lowering the temperature of the mold to 255-265 C. at a rate of 40-60 C./h; reducing the pressure of the mold to 60-80 MPa; and keeping the temperature at 255-265 C. for 1-2 h; cooling the mold naturally at a rate of 90-110 C./h; releasing the pressure of the mold and demolding.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0019] FIG. 1 is a bar graph showing the friction coefficient of various materials prepared in Examples 1-6 and Comparative Examples 1 and 2 under a seawater environment.

[0020] FIG. 2 a bar graph showing the wear volume loss of various materials prepared in Examples 1-6 and Comparative Examples 1 and 2 under the seawater environment.

[0021] FIG. 3 shows the hardness of three materials prepared in Example 1, Comparative Examples 2 and 3 under the seawater environment as a function of immerse time.

[0022] FIG. 4 shows the water absorption rate of the three materials prepared in Example 1, Comparative Examples 2 and 3 under the seawater environment as a function of immerse time.

[0023] FIG. 5 is bar graph showing the wear volume loss of the three materials prepared in Example 1, Comparative Examples 2 and 3 versus immerse time under the seawater environment.

DETAILED DESCRIPTION OF EMBODIMENTS

[0024] This invention will be described in detail below with reference to the accompanying drawings and embodiments to further illustrate the technical approaches and effects of the invention. The following embodiments are only for clearer illustration, and not intended to limit the scope of the invention.

Example 1

[0025] 20% by weight of PI powder, 10% by weight of CF powder and 70% by weight of PEEK powder were placed in a beaker. Absolute ethanol was added to the breaker to immerse the powder. The resulting mixture was mechanically stirred for 0.5 h to obtain a viscous mixture. Then the viscous mixture was dried at 140-160 C. for 3 h to obtain a powder mixture. Subsequently, the powder mixture was placed in a mold and pre-pressed under 20-30 MPa 3 times, for 3-5 min each time. The following was the curing and forming process. Specifically, the mold was preheated to 145-155 C. at a rate of 90-110 C./h; a pressure of 30-40 MPa was applied on the mold; and the temperature was kept at 145-155 C. for 1-2 h. The temperature of the mold was raised to 255-265 C. at a rate of 40-60 C./h; the pressure applied on the mold was increased to 60-80 MPa; and the temperature was kept at 255-265 C. for 1 h. The temperature of the mold was raised to 370-380 C. at a rate of 40-60 C./h, and when a temperature controller indicated that the temperature reached the desired temperature, the pressure applied on the mold was increased to 100-120 MPa; and the temperature at 370-380 C. and the pressure at 100-120 MPa were kept for 3-4 h, during which gas was discharged 2-3 times. After curing, the temperature of the mold was lowered to 255-265 C. at a rate of 40-60 C./h; the pressure of the mold was reduced to 60-80 MPa; and the temperature was kept at 255-265 C. for 1-2 h. The mold was naturally cooled at a rate of 90-110 C./h; and the pressure of the mold was released followed by demolding.

Example 2

[0026] 21% by weight of PI powder, 9% by weight of CF powder and 70% by weight of PEEK powder were placed in a beaker. Absolute ethanol was added to the breaker to immerse the powder. The resulting mixture was mechanically stirred for 0.5 h to obtain a viscous mixture. Then the viscous mixture was dried at 140-160 C. for 3 h to obtain a powder mixture. Subsequently, the powder mixture was placed in a mold and pre-pressed under 20-30 MPa 3 times, for 3-5 min each time. The following was the curing and forming process. Specifically, the mold was preheated to 145-155 C. at a rate of 90-110 C./h; a pressure of 30-40 MPa was applied on the mold; and the temperature was kept at 145-155 C. for 1-2 h. The temperature of the mold was raised to 255-265 C. at a rate of 40-60 C./h; the pressure applied on the mold was increased to 60-80 MPa; and the temperature was kept at 255-265 C. for 1 h. The temperature of the mold was raised to 370-380 C. at a rate of 40-60 C./h, and when a temperature controller indicated that the temperature reached the desired temperature, the pressure applied on the mold was increased to 100-120 MPa; and the temperature at 370-380 C. and the pressure at 100-120 MPa were kept for 3-4 h, during which gas was discharged 2-3 times. After curing, the temperature of the mold was lowered to 255-265 C. at a rate of 40-60 C./h; the pressure of the mold was reduced to 60-80 MPa; and the temperature was kept at 255-265 C. for 1-2 h. The mold was naturally cooled at a rate of 90-110 C./h; and the pressure of the mold was released followed by demolding.

Example 3

[0027] 22% by weight of PI powder, 8% by weight of CF powder and 70% by weight of PEEK powder were placed in a beaker. Absolute ethanol was added to the breaker to immerse the powder. The resulting mixture was mechanically stirred for 0.5 h to obtain a viscous mixture. Then the viscous mixture was dried at 140-160 C. for 3 h to obtain a powder mixture. Subsequently, the powder mixture was placed in a mold and pre-pressed under 20-30 MPa 3 times, for 3-5 min each time. The following was the curing and forming process. Specifically, the mold was preheated to 145-155 C. at a rate of 90-110 C./h; a pressure of 30-40 MPa was applied on the mold; and the temperature was kept at 145-155 C. for 1-2 h. The temperature of the mold was raised to 255-265 C. at a rate of 40-60 C./h; the pressure applied on the mold was increased to 60-80 MPa; and the temperature was kept at 255-265 C. for 1 h. The temperature of the mold was raised to 370-380 C. at a rate of 40-60 C./h, and when a temperature controller indicated that the temperature reached the desired temperature, the pressure applied on the mold was increased to 100-120 MPa; and the temperature at 370-380 C. and the pressure at 100-120 MPa were kept for 3-4 h, during which gas was discharged 2-3 times. After curing, the temperature of the mold was lowered to 255-265 C. at a rate of 40-60 C./h; the pressure of the mold was reduced to 60-80 MPa; and the temperature was kept at 255-265 C. for 1-2 h. The mold was naturally cooled at a rate of 90-110 C./h; and the pressure of the mold was released followed by demolding.

Example 4

[0028] 23% by weight of PI powder, 7% by weight of CF powder and 70% by weight of PEEK powder were placed in a beaker. Absolute ethanol was added to the breaker to immerse the powder. The resulting mixture was mechanically stirred for 0.5 h to obtain a viscous mixture. Then the viscous mixture was dried at 140-160 C. for 3 h to obtain a powder mixture. Subsequently, the powder mixture was placed in a mold and pre-pressed under 20-30 MPa 3 times, for 3-5 min each time. The following was the curing and forming process. Specifically, the mold was preheated to 145-155 C. at a rate of 90-110 C./h; a pressure of 30-40 MPa was applied on the mold; and the temperature was kept at 145-155 C. for 1-2 h. The temperature of the mold was raised to 255-265 C. at a rate of 40-60 C./h; the pressure applied on the mold was increased to 60-80 MPa; and the temperature was kept at 255-265 C. for 1 h. The temperature of the mold was raised to 370-380 C. at a rate of 40-60 C./h, and when a temperature controller indicated that the temperature reached the desired temperature, the pressure applied on the mold was increased to 100-120 MPa; and the temperature at 370-380 C. and the pressure at 100-120 MPa were kept for 3-4 h, during which gas was discharged 2-3 times. After curing, the temperature of the mold was lowered to 255-265 C. at a rate of 40-60 C./h; the pressure of the mold was reduced to 60-80 MPa; and the temperature was kept at 255-265 C. for 1-2 h. The mold was naturally cooled at a rate of 90-110 C./h; and the pressure of the mold was released followed by demolding.

Example 5

[0029] 24% by weight of PI powder, 6% by weight of CF powder and 70% by weight of PEEK powder were placed in a beaker. Absolute ethanol was added to the breaker to immerse the powder. The resulting mixture was mechanically stirred for 0.5 h to obtain a viscous mixture. Then the viscous mixture was dried at 140-160 C. for 3 h to obtain a powder mixture. Subsequently, the powder mixture was placed in a mold and pre-pressed under 20-30 MPa 3 times, for 3-5 min each time. The following was the curing and forming process. Specifically, the mold was preheated to 145-155 C. at a rate of 90-110 C./h; a pressure of 30-40 MPa was applied on the mold; and the temperature was kept at 145-155 C. for 1-2 h. The temperature of the mold was raised to 255-265 C. at a rate of 40-60 C./h; the pressure applied on the mold was increased to 60-80 MPa; and the temperature was kept at 255-265 C. for 1 h. The temperature of the mold was raised to 370-380 C. at a rate of 40-60 C./h, and when a temperature controller indicated that the temperature reached the desired temperature, the pressure applied on the mold was increased to 100-120 MPa; and the temperature at 370-380 C. and the pressure at 100-120 MPa were kept for 3-4 h, during which gas was discharged 2-3 times. After curing, the temperature of the mold was lowered to 255-265 C. at a rate of 40-60 C./h; the pressure of the mold was reduced to 60-80 MPa; and the temperature was kept at 255-265 C. for 1-2 h. The mold was naturally cooled at a rate of 90-110 C./h; and the pressure of the mold was released followed by demolding.

Example 6

[0030] 25% by weight of PI powder, 5% by weight of CF powder and 70% by weight of PEEK powder were placed in a beaker. Absolute ethanol was added to the breaker to immerse the powder. The resulting mixture was mechanically stirred for 0.5 h to obtain a viscous mixture. Then the viscous mixture was dried at 140-160 C. for 3 h to obtain a powder mixture. Subsequently, the powder mixture was placed in a mold and pre-pressed under 20-30 MPa 3 times, for 3-5 min each time. The following was the curing and forming process. Specifically, the mold was preheated to 145-155 C. at a rate of 90-110 C./h; a pressure of 30-40 MPa was applied on the mold; and the temperature was kept at 145-155 C. for 1-2 h. The temperature of the mold was raised to 255-265 C. at a rate of 40-60 C./h; the pressure applied on the mold was increased to 60-80 MPa; and the temperature was kept at 255-265 C. for 1 h. The temperature of the mold was raised to 370-380 C. at a rate of 40-60 C./h, and when a temperature controller indicated that the temperature reached the desired temperature, the pressure applied on the mold was increased to 100-120 MPa; and the temperature at 370-380 C. and the pressure at 100-120 MPa were kept for 3-4 h, during which gas was discharged 2-3 times. After curing, the temperature of the mold was lowered to 255-265 C. at a rate of 40-60 C./h; the pressure of the mold was reduced to 60-80 MPa; and the temperature was kept at 255-265 C. for 1-2 h. The mold was naturally cooled at a rate of 90-110 C./h; and the pressure of the mold was released followed by demolding.

Comparative Example 1

[0031] 20% by weight of PI powder and 80% by weight of PEEK powder were placed in a beaker. Absolute ethanol was added to the breaker to immerse the powder. The resulting mixture was mechanically stirred for 0.5 h to obtain a viscous mixture. Then the viscous mixture was dried at 140-160 C. for 3 h to obtain a powder mixture.

[0032] Subsequently, the powder mixture was placed in a mold and pre-pressed under 20-30 MPa 3 times, for 3-5 min each time. The following was the curing and forming process. Specifically, the mold was preheated to 145-155 C. at a rate of 90-110 C./h; a pressure of 30-40 MPa was applied on the mold; and the temperature was kept at 145-155 C. for 1-2 h. The temperature of the mold was raised to 255-265 C. at a rate of 40-60 C./h; the pressure applied on the mold was increased to 60-80 MPa; and the temperature was kept at 255-265 C. for 1 h. The temperature of the mold was raised to 370-380 C. at a rate of 40-60 C./h, and when a temperature controller indicated that the temperature reached the desired temperature, the pressure applied on the mold was increased to 100-120 MPa; and the temperature at 370-380 C. and the pressure at 100-120 MPa were kept for 3-4 h, during which gas was discharged 2-3 times. After curing, the temperature of the mold was lowered to 255-265 C. at a rate of 40-60 C./h; the pressure of the mold was reduced to 60-80 MPa; and the temperature was kept at 255-265 C. for 1-2 h. The mold was naturally cooled at a rate of 90-110 C./h; and the pressure of the mold was released followed by demolding.

Comparative Example 2

[0033] 25% by weight of PI powder and 75% by weight of PEEK powder were placed in a beaker. Absolute ethanol was added to the breaker to immerse the powder. The resulting mixture was mechanically stirred for 0.5 h to obtain a viscous mixture. Then the viscous mixture was dried at 140-160 C. for 3 h to obtain a powder mixture. Subsequently, the powder mixture was placed in a mold and pre-pressed under 20-30 MPa 3 times, for 3-5 min each time. The following was the curing and forming process. Specifically, the mold was preheated to 145-155 C. at a rate of 90-110 C./h; a pressure of 30-40 MPa was applied on the mold; and the temperature was kept at 145-155 C. for 1-2 h. The temperature of the mold was raised to 255-265 C. at a rate of 40-60 C./h; the pressure applied on the mold was increased to 60-80 MPa; and the temperature was kept at 255-265 C. for 1 h. The temperature of the mold was raised to 370-380 C. at a rate of 40-60 C./h, and when a temperature controller indicated that the temperature reached the desired temperature, the pressure applied on the mold was increased to 100-120 MPa; and the temperature at 370-380 C. and the pressure at 100-120 MPa were kept for 3-4 h, during which gas was discharged 2-3 times. After curing, the temperature of the mold was lowered to 255-265 C. at a rate of 40-60 C./h; the pressure of the mold was reduced to 60-80 MPa; and the temperature was kept at 255-265 C. for 1-2 h. The mold was naturally cooled at a rate of 90-110 C./h; and the pressure of the mold was released followed by demolding.

Comparative Example 3

[0034] Thermoset polyimide P84 (simply called PI-3) was prepared and dried at 140-160 C. for 3 h to obtain a powder mixture. Subsequently, the powder mixture was placed in a mold and pre-pressed under 20-30 MPa 3 times, for 3-5 min each time. The following was the curing and forming process. Specifically, the mold was preheated to 145-155 C. at a rate of 90-110 C./h; a pressure of 30-40 MPa was applied on the mold; and the temperature was kept at 145-155 C. for 1-2 h. The temperature of the mold was raised to 255-265 C. at a rate of 40-60 C./h; the pressure applied on the mold was increased to 60-80 MPa; and the temperature was kept at 255-265 C. for 1 h. The temperature of the mold was raised to 370-380 C. at a rate of 40-60 C./h, and when a temperature controller indicated that the temperature reached the desired temperature, the pressure applied on the mold was increased to 100-120 MPa; and the temperature at 370-380 C. and the pressure at 100-120 MPa were kept for 3-4 h, during which gas was discharged 2-3 times. After curing, the temperature of the mold was lowered to 255-265 C. at a rate of 40-60 C./h; the pressure of the mold was reduced to 60-80 MPa; and the temperature was kept at 255-265 C. for 1-2 h. The mold was naturally cooled at a rate of 90-110 C./h; and the pressure of the mold was released followed by demolding.

[0035] The material samples prepared in Examples 1-6 and Comparative Examples 1-2 were compared in terms of their tribological properties. The results were shown in FIGS. 1 and 2.

[0036] The tribological test under the seawater environment was carried out on a pin-on-disk tribometer at 100 N and 0.5 m/s with a turning radius of 21 mm, so as to obtain the friction coefficient and wear volume loss of materials. Counterparts of the kinematic pair were 17-4PH stainless steel pins with a diameter of 8 mm.

[0037] The CF/PI/PEEK sample prepared in Example 1, the CF/PEEK sample prepared in Comparative Example 2 and the PI-3 sample prepared in Comparative Example 3 were immersed in the seawater for 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55 and 60 days. The results on hardness and water absorption rate of these three samples versus immerse time were shown in FIG. 3 and FIG. 4.

[0038] The CF/PI/PEEK sample prepared in Example 1, the CF/PEEK sample prepared in Comparative Example 2 and the PI-3 sample prepared in Comparative Example 3 were immersed in seawater for 0, 20, 40 and 60 days. The tribological tests at 50 N and 0.5 m/s were carried out, and the results on the wear volume loss of these three samples versus immerse time was shown in FIG. 5.

[0039] It can be seen from FIGS. 1-5 that the CF/PI/PEEK samples of Examples 1-6 had a lower friction coefficient and smaller wear volume loss than the PI/PEEK sample prepared in Comparative Example 2, where the CF/PI/PEEK sample of Example 1 had the lowest friction coefficient and smallest wear volume loss. According to results of the experiments simulating under the seawater environment, the CF/PI/PEEK composite of Example 1 had highest hardness, lowest water absorption rate and smallest wear volume loss when compared to the CF/PEEK material prepared in Comparative Example 2 and the PI-3 material prepared in Comparative Example 3, indicating that the CF/PI/PEEK composite material (prepared from 20-25% by weight of PI powder, 5-10% by weight of CF powder and 70% by weight of PEEK powder) provided herein had excellent tribological properties under the seawater environment.