Process of surface-mounting three-dimensional package structure electrically connected by prepackaged metal

Abstract

The present invention relates to a process of a surface-mounting three-dimensional package structure electrically connected by a pre-packaged metal, comprising: taking a metal sheet; punching or etching the metal sheet; packaging a conductive metal-pillar frame; performing windowing and slotting; taking a substrate on which a chip is surface-mounted; fitting the conductive metal-pillar frame; performing packaging and grinding; surface-mounting a passive device; performing plastic packaging and ball-mounting; and performing cutting. The process of the present invention can improve the integration level and the reliability.

Claims

1. A process of a surface-mounting three-dimensional package structure electrically connected by a prepackaged metal, comprising: step 1, taking a metal sheet; step 2, punching or etching the metal sheet: punching or etching the metal sheet to form a conductive metal-pillar frame to facilitate follow-up interlayer conduction; step 3, packaging the conductive metal-pillar frame; step 4, performing windowing and slotting: windowing a required portion of the plastically-packaged conductive metal-pillar frame; step 5, taking a substrate on which a chip is surface-mounted; step 6, fitting the conductive metal-pillar frame: printing the conductive metal-pillar frame on the substrate by a solder paste or fitting the conductive metal-pillar frame to the substrate by a conductive adhesive for partially electrical connection with the substrate, wherein the windowed portion exactly accommodates the chip on the substrate; step 7, performing packaging and grinding: performing plastic packaging on the front side of the substrate by a molding compound and performing grinding to expose a surface of the conductive metal-pillar frame; step 8, surface-mounting a passive device: surface-mounting the passive device on the ground conductive metal-pillar frame; step 9, performing plastic packaging and ball-mounting: performing plastic packaging on the surface of the substrate on which the passive device is mounted, and performing ball-mounting on a lower surface of the substrate; and step 10, performing cutting: cutting the plastically-packaged substrate into single products.

2. The process of a surface-mounting three-dimensional package structure electrically connected by a prepackaged metal according to claim 1, wherein step 3 particularly comprises the sub-steps of performing plastic packaging on a hollow portion in the middle of the conductive metal-pillar frame and protecting the periphery of a metal pillar by a molding compound.

3. The process of a surface-mounting three-dimensional package structure electrically connected by a prepackaged metal according to claim 1, wherein step 3 particularly comprises the sub-steps of performing plastic packaging on the conductive metal-pillar frame and protecting the periphery and an upper surface of a metal pillar by a molding compound.

4. The process of a surface-mounting three-dimensional package structure electrically connected by a prepackaged metal according to claim 1, wherein a chip, a passive component, or a heat-dissipation device or a combination thereof is surface-mounted on the substrate.

5. The process of a surface-mounting three-dimensional package structure electrically connected by a prepackaged metal according to claim 1, wherein the plastic packaging adopts glue filling by a mold, compression glue filling, spray-coating or filming.

6. A process of a surface-mounting three-dimensional package structure electrically connected by a pre-packaged metal, comprising: step 1, taking a metal sheet; step 2, forming a metal-pillar circuit layer on a surface of the metal sheet by electroplating: forming a circuit layer on the surface of the metal sheet by electroplating and forming a conductive copper pillar above the circuit layer by electroplating; step 3, performing plastic packaging on the metal-pillar circuit layer: protecting the metal-pillar circuit layer on the surface of the metal sheet by a molding compound; step 4, performing windowing: windowing a required portion of the plastically-packaged metal-pillar circuit layer; step 5, removing the metal sheet; step 6, fitting the metal-pillar circuit layer and performing plastic packaging: taking a substrate on which a chip is surface-mounted, printing the metal-pillar circuit layer on the substrate by a solder paste or fitting the metal-pillar circuit layer to the substrate by a conductive adhesive for partially electrical connection with the substrate, performing the plastic packaging on an exposed portion of the chip for protection, and performing grinding to expose an upper surface of the metal-pillar circuit layer, wherein the windowed portion exactly accommodates the chip on the substrate; step 7, surface-mounting a passive device, and performing packaging and ball-mounting: mounting the passive device on the upper surface of the metal-pillar-circuit layer, performing plastic packaging on the surface of the substrate, on which the passive device is mounted, and performing ball-mounting on a lower surface of the substrate; step 8, performing cutting: cutting the plastically-packaged substrate into single products.

7. The process of a surface-mounting three-dimensional package structure electrically connected by a pre-packaged metal according to claim 6, wherein a chip, a passive component or a heat-dissipation device or a combination thereof is surface-mounted on the substrate.

8. The process of a surface-mounting three-dimensional package structure electrically connected by a pre-packaged metal according to claim 6, wherein the plastic packaging adopts glue filling by a mold, compression glue filling, spray-coating or filming.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIGS. 1-10 are schematic views of all procedures of a process of a surface-mounting three-dimensional package structure electrically connected by a pre-packaged metal according to Embodiment 1 of the present invention;

(2) FIGS. 11-18 are schematic views of all procedures of a process of a surface-mounting three-dimensional package structure electrically connected by a pre-packaged metal according to Embodiment 2 of the present invention; and

(3) FIGS. 19-26 are schematic views of all procedures of a process of a surface-mounting three-dimensional package structure electrically connected by a pre-packaged metal according to Embodiment 3 of the present invention.

DETAILED DESCRIPTION

(4) The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

Embodiment 1

(5) The present invention provides a process of a surface-mounting three-dimensional package structure electrically connected by a pre-packaged metal, including:

(6) step 1, taking a metal sheet:

(7) referring to FIG. 1, taking the metal sheet with an appropriate thickness;

(8) step 2, punching or etching the metal sheet:

(9) referring to FIG. 2, punching or etching the metal sheet to form a conductive metal-pillar frame to facilitate follow-up interlayer conduction, wherein the shape formed by punching and etching may be diversified, may be a metal pillar or other irregular shapes and may also be a simple circuit shape;

(10) step 3, packaging the conductive metal-pillar frame:

(11) referring to FIG. 3, performing plastic packaging on a hollow portion in the middle of the conductive metal-pillar frame, and protecting the periphery of a metal pillar by a molding compound, wherein plastic packaging does not need to be performed on an upper surface and a lower surface of the metal pillar;

(12) step 4, performing windowing and slotting:

(13) referring to FIG. 4, windowing a required portion of the plastically-packaged conductive metal-pillar frame;

(14) step 5, taking a substrate on which a chip is surface-mounted:

(15) referring to FIG. 5, taking the substrate on which a chip, a passive component or a heat-dissipation device or a combination thereof is surface-mounted;

(16) step 6, fitting the conductive metal-pillar frame:

(17) referring to FIG. 6, printing the conductive metal-pillar frame on the substrate by a solder paste or fitting the conductive metal-pillar frame to the substrate by a conductive adhesive for partially electrical connection with the substrate, wherein the windowed portion exactly accommodates the chip on the substrate;

(18) step 7, performing packaging and grinding:

(19) referring to FIG. 7, performing plastic packaging on the front side of the substrate by a molding compound and performing grinding to expose a surface of the conductive metal-pillar frame, wherein the plastic packaging may adopt glue filling by a mold, compression glue filling, spray-coating or filming, the molding compound may be epoxy resin with or without a filling substance, and this step can be omitted;

(20) step 8, surface-mounting a passive device:

(21) referring to FIG. 8, surface-mounting the passive device on the ground conductive metal-pillar frame, wherein it is certainly not limited to the passive device, and a required functional chip or an entire package may also be surface-mounted;

(22) step 9, performing plastic packaging and ball-mounting:

(23) referring to FIG. 9, performing plastic packaging on the surface of the substrate, on which the passive device is mounted, and performing ball-mounting on a lower surface of the substrate; and

(24) step 10, performing cutting:

(25) referring to FIG. 10, cutting the plastically-packaged substrate into single products.

Embodiment 2

(26) The present invention provides a process of a surface-mounting three-dimensional package structure electrically connected by a pre-packaged metal, including:

(27) step 1, taking a metal sheet:

(28) referring to FIG. 11, taking the metal sheet with an appropriate thickness;

(29) step 2, punching or etching the metal sheet:

(30) referring to FIG. 12, punching or etching the metal sheet to form a conductive metal-pillar frame to facilitate follow-up interlayer conduction, wherein the shape formed by punching and etching may be diversified, may be a metal pillar or other irregular shapes, and may also be a simple circuit shape;

(31) step 3, packaging the conductive metal-pillar frame;

(32) referring to FIG. 13, performing plastic packaging on the conductive metal-pillar frame and protecting the periphery and an upper surface of a metal pillar by a molding compound, wherein this plastic packaging method is simple and can be implemented by a conventional plastic packaging mold;

(33) step 4, performing windowing and slotting:

(34) referring to FIG. 14, windowing a required portion of the plastically-packaged conductive metal-pillar frame;

(35) step 5, fitting the conductive metal-pillar frame:

(36) referring to FIG. 15, taking a substrate on which a chip, a passive component or a heat-dissipation device or a combination thereof is surface-mounted, and printing the conductive metal-pillar frame on the substrate by a solder paste or fitting the conductive metal-pillar frame to the substrate by a conductive adhesive for partially electrical connection with the substrate, wherein the windowed portion exactly accommodates the chip on the substrate;

(37) step 6, performing packaging and grinding:

(38) referring to FIG. 16, performing plastic packaging on the front side of the substrate by a molding compound and performing grinding to expose a surface of the conductive metal-pillar frame, wherein the plastic packaging may adopt glue filling by a mold, compression glue filling, spray-coating or filling, the molding compound may be epoxy resin with or without a filling substance, and this step can be omitted;

(39) step 7, surface-mounting a passive device and performing packaging and ball-mounting:

(40) referring to FIG. 17, mounting the passive device on the surface of the ground conductive metal-pillar frame, performing plastic packaging on the surface of the substrate, on which the passive device is mounted, and performing ball-mounting on a lower surface of the substrate, wherein it is certainly not limited to the passive device, and a required functional chip or an entire package may also be surface-mounted; and

(41) step 8, performing cutting:

(42) referring to FIG. 18, cutting the plastically-packaged substrate into single products.

Embodiment 3

(43) step 1, taking a metal sheet:

(44) referring to FIG. 19, taking the metal sheet with an appropriate thickness;

(45) step 2, forming a metal-pillar circuit layer on a surface of the metal sheet by electroplating:

(46) referring to FIG. 20, forming a circuit layer on the surface of the metal sheet by electroplating and forming a conductive copper pillar above the circuit layer by electroplating;

(47) step 3, performing plastic packaging on the metal-pillar circuit layer:

(48) referring to FIG. 21, protecting the metal-pillar circuit layer on the surface of the metal sheet by a molding compound;

(49) step 4, performing windowing:

(50) referring to FIG. 22, windowing a required portion of the plastically-packaged metal-pillar circuit layer;

(51) step 5, removing the metal sheet:

(52) referring to FIG. 23, removing the metal sheet, wherein the remaining metal-pillar circuit layer is still in an entire frame shape;

(53) step 6, fitting the metal-pillar circuit layer and performing plastic packaging:

(54) referring to FIG. 24, taking a substrate on which a chip, a passive device or a heat-dissipation device and a combination thereof is surface-mounted, printing the metal-pillar circuit layer on the substrate by a solder paste or fitting the metal-pillar circuit layer to the substrate by a conductive adhesive for partially electrical connection with the substrate, performing the plastic packaging on an exposed portion of the chip for protection, and performing grinding to expose an upper surface of the metal-pillar circuit layer, wherein the windowed portion exactly accommodates the chip on the substrate;

(55) step 7, surface-mounting a passive device, and performing packaging and ball-mounting:

(56) referring to FIG. 25, mounting the passive device on the upper surface of the metal-pillar-circuit layer, performing plastic packaging on the surface of the substrate, on which the passive device is mounted, and performing ball-mounting on a lower surface of the substrate, wherein it is certainly not limited to the passive device, and a required functional chip or an entire package may also be surface-mounted; and

(57) step 8, performing cutting:

(58) referring to FIG. 26, cutting the plastically-packaged substrate into single products.

(59) In addition to the above embodiments, the present invention also includes other embodiments, and any technical solution formed by equivalent transformations or equivalent substitutions should fall within the protection scope defined by the claims of the present invention.