Solar/heat shield for pedestal housings used with active electronic devices and/or heat sensitive components
10757836 ยท 2020-08-25
Assignee
Inventors
- Michael A. Lemacks (Temecula, CA, US)
- Timothy S. Safranek (Heath, TX, US)
- Edward J. Burke (Temecula, CA, US)
Cpc classification
H05K9/0045
ELECTRICITY
H05K9/0086
ELECTRICITY
H05K9/0084
ELECTRICITY
H05K9/0009
ELECTRICITY
H05K7/20427
ELECTRICITY
H05K7/20418
ELECTRICITY
International classification
Abstract
A pedestal housing for heat reduction generated by electronic components within the pedestal housing having a cover in which the electronic components are located, a cap positioned on an upper surface of the cover for forming an attic above the cover, a support layer and an insulation layer positioned between the cover and the cap in the attic and a heat and solar barrier layer positioned within the attic for electromagnetic radiation reflection away from the electronic components and electromagnetic radiation absorption from a radiation source and the electronic components.
Claims
1. A pedestal housing configured for heat reduction within the pedestal housing for electronic components contained within the pedestal housing comprising: a cover having side walls and an integrally formed upper surface with the side walls, the upper surface enclosing the side walls; a cap positioned on the upper surface of the cover forming an attic above the cover; said cover and cap being subject to direct solar and radiant heat exposure; a support layer and an insulation layer positioned between the cover and the cap, the support layer having a plurality of legs which engage the upper surface of the cover to create an airgap between the support layer and the cover; the cap having a plurality of legs, wherein each leg of the cap contacts an upper layer and the cap; and a heat and solar barrier layer positioned within the attic.
2. The pedestal housing of claim 1 wherein the insulation layer is positioned on the support layer adjacent the cap.
3. The pedestal housing of claim 1 wherein the heat and solar barrier layer is positioned on the support layer.
4. The pedestal housing of claim 1 wherein the heat and solar barrier layer is co-molded with or applied to the support layer.
5. The pedestal housing of claim 1 wherein the heat and solar barrier layer is attached to the insulation layer.
6. The pedestal housing of claim 1 wherein the cover has at least one vent hole in an upper surface for ventilation.
7. The pedestal housing of claim 1 wherein the cover has a plurality of vents positioned around sides of the cover.
8. The pedestal housing of claim 6 wherein a fan is positioned in the vent hole.
9. The pedestal housing of claim 1 wherein the heat and solar barrier layer is a heat reflective material.
10. The pedestal housing of claim 1 wherein the heat and solar barrier layer is a heat absorption material.
11. The pedestal housing of claim 1 wherein the heat and solar barrier layer is an infrared reflective material comprising at least one of a transition metal, inorganic or organic material.
12. A pedestal housing for electronic components comprising: a housing component for receipt of the electronic components; the housing component having side walls and an integrally formed top portion with the side walls enclosing the electronic components within the pedestal housing; an attic component positioned above the housing component having a plurality of legs that supports the attic component above the top portion of the housing component; a support layer positioned between the attic component and the housing component having a plurality of legs that engage the top portion of the housing component and creates an airgap between the support layer and the top portion of the housing component; wherein each leg of the attic component contacts an upper surface of one leg of the support layer to create an second airgap between the support layer and the attic component; and a barrier layer positioned within the attic component for electromagnetic radiation reflection away from the electronic components or electromagnetic radiation absorption between a radiation source and the electronic components.
13. The pedestal housing of claim 12 further comprising an insulation layer in the attic component.
14. The pedestal housing of claim 13 wherein the barrier layer is positioned on the support layer.
15. The pedestal housing of claim 13 wherein the barrier layer and the support layer are co-molded.
16. The pedestal housing of claim 13 wherein the barrier layer is attached to the insulation layer.
17. The pedestal housing of claim 12 wherein the barrier layer is an infrared reflective material comprising at least one of a transition metal, inorganic or organic material.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1)
(2)
(3)
(4)
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(6)
DETAILED DESCRIPTION OF THE DRAWINGS
(7)
(8) The insulation support has a plurality of legs 27 positioned around the perimeter of the support which project downwardly and terminate in a pad 28. The pad rests on the top portion 22 of the cover 12 so that the insulation support is raised above the top portion 22 thereby creating or increasing an airgap between the cover 12 and the components which form the attic. The barrier layer 26, which is a heat/solar shield is positioned on a top surface 30 of the insulation support or forms the top surface of the insulation support by being co-molded with or applied to the insulation support. The insulation layer 16 is positioned on the insulation support and the cap 18 is positioned such that the insulation layer is below a bottom surface of the cap such that an air gap is created to enhance IR reflectivity. The cap 18 also has a plurality of legs 32 positioned around the perimeter of the cap extending downwardly which rests on the pads 28. The combination of the insulation 16 and the barrier layer provide electromagnetic radiation reflection away from protected components within the cover 12 and electromagnetic radiation absorption between the heat source and the components being shielded within the cover 12. These components also provide enhanced insulation to reduce heat transfer rates to the protected components. The insulation support and the barrier layer 26 allow for natural convection from the pedestal housing.
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(10) Methods of manufacture for the pedestal housing of the present invention can include injection molding, blow molding, rotational molding, vacuum molding, and other non-commercially available methods. The present invention is designed for thermal management to be optimized using electromagnetic reflection, absorption and insulation as well as airflow management. The pedestal housing also results in reduced EMR transmission. Infrared radiation reflective material can be added to plastic pigments during the manufacturing process. As shown in the heat dissipation testing chart below, temperature within the pedestal housing is significantly reduced by the construction of the present invention.
(11) TABLE-US-00001 TABLE I Heat Dissipation Testing 7 Dark 9 Lit 10 11 12 Lit 13 Dark 1 in 2 Top 3 Top 4 Back 6 Back Side Side Front Front Side Side Node Rear Front Low 5 Bottom High Rear 8 Bottom Rear Low High Front Front Room Sample ( C.) ( C.) ( C.) ( C.) ( C.) ( C.) ( C.) ( C.) ( C.) ( C.) ( C.) ( C.) ( C.) ( C.) Control 77.64 59.98 60.5 57.25 51.83 57.71 51.13 52.41 54.09 49.52 49.81 52.46 50.92 42.78 Control Insulation 75.45 56.81 57.9 55.37 50.5 55.58 50.41 51.14 52.99 48.95 47.62 49.93 49.54 42.44 Supervented 75.88 58.42 59.58 56.01 50.67 56.48 50.08 51.01 52.89 49.06 48.43 50.84 49.65 42.39 Vac No Insulation 75.7 57.43 58.18 55.99 50.45 55.97 49.77 50.69 52.46 48.88 47.09 51.08 49.5 42.32 Vac with Insulation 75.99 57.25 57.97 55.75 50.57 56.08 49.93 51.01 52.45 49.07 47.64 50.81 49.7 42.58 Chrome 75.58 56.75 57.8 55.53 50.36 55.66 49.88 50.76 52.54 48.71 47.21 50.79 49.4 42.13 Chrome with Insulation 75.45 56.8 57.9 55.37 50.5 55.57 50.41 51.14 53 48.95 47.63 49.94 49.53 42.41 Spin Weld 75.17 57.02 58.2 55.26 50.49 55.55 50.27 51.14 52.99 48.87 47.65 50.38 49.64 42.2 2442 73.57 55.89 55.6 53.27 48.96 54.41 49.16 49.44 48.8 50.88 51.1 49.09 48.36 42.16 2442 Spin Weld 73.15 55.51 54.56 52.76 49.02 54.48 49.23 48.62 48.18 50.71 51.63 49.14 46.76 42.22
(12) While the present invention has been described and illustrated by various embodiments thereof, it is to be understood that changes and modifications can be made therein which are within the intended scope of the invention as hereinafter claimed.