APPARATUS, SYSTEM, AND METHOD FOR RADIATION HARDENED PLASTIC AND FLEXIBLE ELASTOMER SCINTILLATOR
20200264323 ยท 2020-08-20
Inventors
Cpc classification
G01T1/2006
PHYSICS
International classification
C09K11/02
CHEMISTRY; METALLURGY
Abstract
A scintillating material that is a radiation hardened plastic and flexible elastomer is disclosed. The material is useful in a wide range of high energy particle environments and can be used to create detectors. Such detectors can be used in physics experiments or in medical treatment or imaging. The scintillator can be radiation hardened so as to allow for an extended lifetime over other materials.
Claims
1. An apparatus for detecting high energy particles comprising: a scintillating material comprising a base material and having a primary fluor and a secondary fluor, wherein the base material is selected from the group consisting of a siloxane material and a plastic.
2. The apparatus of claim 1, wherein the primary fluor comprises bis-MSB.
3. The apparatus of claim 1, wherein the secondary fluor comprises pTP.
4. The apparatus of claim 1, wherein the base material comprises HARDSIL.
5. The apparatus of claim 1, wherein the base material comprises 99% HARDSIL.
6. A high energy particle detector comprising: A scintillating tile comprising a siloxane elastomer formulated to be radiation hardened and having a primary fluor and a secondary fluor. an optical waveguide configured to collect photons generated by scintillation in the scintillating tile; and a photodetector connected to the optical waveguide.
7. The detector of claim 6, wherein the photodetector comprises a photomultiplier tube.
8. The detector of claim 6, wherein the optical waveguide comprises a fiber optic cable.
9. The detector of claim 6, wherein the primary fluor comprises bis-MSB.
10. The detector of claim 6, wherein the secondary fluor comprises pTP.
11. A method for creating a scintillating material, the method comprising: providing a base material; melting a primary fluor into the base material; melting a secondary fluor into the base material; and melting a curing agent into the base material; wherein the base material is selected from the group consisting of a siloxane material and a plastic.
12. The method of claim 11, wherein melting a primary fluor comprises heating the base material to between 65 C and 100 C.
13. The method of claim 11, wherein melting a primary fluor comprises heating the base material to 90 C.
14. The method of claim 11, wherein melting a primary fluor comprises heating the base material until the primary fluor dissolves.
15. The method of claim 11, wherein the primary fluor comprises bis-MSB.
16. The method of claim 11, wherein the secondary fluor comprises pTP.
17. The method of claim 11, wherein the curing agent comprises dicumyl peroxide.
18. The method of claim 11, wherein the base material comprises HARDSIL.
19. The method of claim 18, wherein the base material comprises 99% HARDSIL.
20. The method of claim 11, further comprising the step of pouring the base material into a mold.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] So that the manner in which the above recited features of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and the invention may admit to other equally effective embodiments.
[0016]
[0017]
[0018]
[0019]
[0020] Other features of the present embodiments will be apparent from the Detailed Description that follows.
DETAILED DESCRIPTION OF THE EMBODIMENTS
[0021] In the following detailed description of the preferred embodiments, reference is made to the accompanying drawings, which form a part hereof, and within which are shown by way of illustration specific embodiments by which the invention may be practiced. It is to be understood that other embodiments may be utilized and structural changes may be made without departing from the scope of the invention. Electrical, mechanical, logical and structural changes may be made to the embodiments without departing from the spirit and scope of the present teachings. The following detailed description is therefore not to be taken in a limiting sense, and the scope of the present disclosure is defined by the appended claims and their equivalents.
[0022] In the following detailed description of the preferred embodiments, reference is made to the accompanying drawings, which form a part hereof, and within which are shown by way of illustration specific embodiments by which the invention may be practiced. It is to be understood that other embodiments may be utilized and structural changes may be made without departing from the scope of the invention.
[0023]
[0024] The present invention, according to an embodiment, uses polysiloxanes that are relatively optically transparent while simultaneously having resistance to damage when exposed to ionizing radiation. These radiation hardened materials can survive high dosages of radiation, including, in an embodiment, more than 107 rad.
[0025] A siloxane is a functional group having a structural formula of:
##STR00001##
[0026] where the SiOSi linkage may be largely responsible for the characteristic chemical reactions of those molecules. Chains can be made from silicon oxide due to their more stable bonding than, for example, silicon-silicon bonding. Siloxanes may be made from various techniques, including step-growth polymerization and ring-opening copolymerization.
[0027] Polysiloxanes are among the most important organosilicon polymers used in polymer chemistry Step-growth polymerization of linear polysiloxanes include homocondensations of silanol-ended siloxanes or heterocondensations of silanol-ended species with monomers.
[0028] Polysiloxanes of the following structural formula which are substantially optically transparent may be employed in the practice of the invention:
wherein n is an integer from 1 to 3; m is the degree of polymerization; and R may be the same or different where n is 2 or 3 and is, e.g., lower alkyl such as methyl and ethyl; cycloalkyl, such as cyclohexyl; phenyl, biphenyl, naphthyl, vinyl, hydrogen or other bulky aromatic group. A polysiloxane wherein R is entirely methyl has no scintillating properties and requires an addition of a scintillating substance.
[0029] In a polysiloxane wherein at least some of the R groups are phenyl, the polymer itself has scintillating characteristics. The polymer can then more efficiently transfer electromagnetic energy into the dissolved fluorescent organic additives. Thus, phenyl-substituted polysiloxanes, according to an embodiment, require lesser amounts of dissolved scintillator. The light output from the polysiloxane scintillator depends, among other factors, upon the phenyl concentration of the polymer. In addition, phenyl groups enhance the bulk modulus, radiation resistance and mechanical properties of the plastic.
[0030]
[0031]
[0032] The radiation hardened elastomer scintillators, according to an embodiment, are produced by the following method. Embodiments of these scintillators can be made with a variety of base materials, which range from soft elastomers to rigid plastics. For a flexible elastomer scintillator, an optically clear flexible polysilicone base material is used. In alternative embodiments, a hard plastic base material is used. The various base materials, such as the plastic, may or may not be radiation hardened as desired for the particular use case.
[0033] A polysiloxane base material of commercially available HARDSIL material is used, according to an embodiment. A 99% by weight HARDSIL material is combined with the primary fluor, the secondary fluor and the curing agent. Before adding the curing agent to the mix, the solubility of the primary and secondary fluors are determined by adding, stirring and incrementing amounts of the fluors into the HARDSIL while heating on a hot plate until the fluors no longer dissolved in the liquid or until 2% by weight was reached.
[0034] In an embodiment of the present invention, bis-MSB dissolves readily at 2% by weight in the HARDSIL base. If the amounts are added incrementally, pTP dissolves in HARDSIL up to 2% by weight at higher temperatures. The HARDSIL/pTP mixture may need to be heated to approximately 65 C. in order for the pTP to dissolve at 1% by weight and approximately 90 C. to dissolve at 2% by weight. Visible evaporation of the HARDSIL occurs near 100 C., and careful control of the temperature may be required.
[0035] Note that the solubility of each fluor is different and the particular suitability of a method for incorporating the fluor in the polysiloxane depends on the concentration of fluor which is desired. The amount can be adjusted to meet a particular need.
[0036] A mold is provided for the mix to cure in. This mold can be sized and shaped to the preferred scintillator design, such as, according to an embodiment, rectangular rods having a thickness of 6.5 mm. The mold is comprised of steel with a Teflon coating. In an embodiment, the mold is preferably preheated to 150 C. in a curing furnace to prevent the fluors from precipitating out of the liquid mixture and/or creating a density gradient while curing. The fully mixed liquid scintillator is then poured into the mold and cured for six hours at 150 C. and two hours at 200 C., according to an embodiment. After curing, the edges of the scintillators are then polished to a mirror finish before testing. Polishing can be performed using a Buehler polishing machine, model ECOMET 3, using grit 320 or higher polishing paper.
[0037] In a further embodiment, an alternative process for producing the radiation hardened scintillators is provided. A base material of Gelest HARDSIL CC is used along with a catalyst of dicumyl peroxide. The fluors (scintillators) added are p-terphenyl and 1,4-Bis(2-Methylstyryl)benzene. Concentrations of 0.91% (by weight) of each scintillator and dicumyl peroxide are used.
[0038] In general, the scintillation compounds and peroxide catalyst are incorporated into the base resin at 100 C, and tile forms are created by open-face castings using PTFE molds. The curing cycle is 8 hours at 130 C under nitrogen gas. The post cure cycle is 2 hours at 200 C, also under nitrogen gas.
[0039] The detailed process 400 is shown in
[0040] The post cure heating removes the peroxide break down products (acetophenone, phenyl-2-propanol). Failure to execute the post cure will result in a bloom appearing on the surface of the scintillator tile. Furthermore, a 2.25% dimensional shrinkage is observed in the cured forms. Machining can be done to refine the dimensions of the pieces.
[0041] The above process can be used to create tiles of size 20 mm100 mm5 mm. Larger parts can also be made using the same process. In other embodiments, different base material can be used. Other, less expensive base materials allow for extruded forms and fibers to be produced and potentially lower costs.
[0042] While the foregoing written description of the invention enables one of ordinary skill to make and use what is considered presently to be the best mode thereof, those of ordinary skill will understand and appreciate the existence of variations, combinations, and equivalents of the specific embodiment, method, and examples herein. The invention should therefore not be limited by the above described embodiment, method, and examples, but by all embodiments and methods within the scope and spirit of the invention. To the extent necessary to understand or complete the disclosure of the present invention, all publications, patents, and patent applications mentioned herein are expressly incorporated by reference therein to the same extent as though each were individually so incorporated.
[0043] While the foregoing written description of the invention enables one of ordinary skill to make and use what is considered presently to be the best mode thereof, those of ordinary skill will understand and appreciate the existence of alternatives, adaptations, variations, combinations, and equivalents of the specific embodiment, method, and examples herein. Those skilled in the art will appreciate that the within disclosures are exemplary only and that various modifications may be made within the scope of the present invention. In addition, while a particular feature of the teachings may have been disclosed with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations as may be desired and advantageous for any given or particular function. Furthermore, to the extent that the terms including, includes, having, has, with, or variants thereof are used in either the detailed description and the claims, such terms are intended to be inclusive in a manner similar to the term comprising.
[0044] Other embodiments of the teachings will be apparent to those skilled in the art from consideration of the specification and practice of the teachings disclosed herein. The invention should therefore not be limited by the described embodiment, method, and examples, but by all embodiments and methods within the scope and spirit of the invention. Accordingly, the present invention is not limited to the specific embodiments as illustrated herein, but is only limited by the following claims.