MANUFACTURING METHOD OF A PIEZOELECTRIC MICROPHONE WITH PILLAR STRUCTURE

Abstract

A manufacturing method of a microphone is disclosed, wherein a patterned upper electrode is obtained by a first deposition of conductive material in such a way to form pads of the patterned electrode, and pillars are formed by of successive depositions of rigid conductive material, in aligned position on the pads of the patterned electrode. The first deposition and the successive depositions are made by screen-printing, dispenser-printing or spray-coating of material in liquid or semifluid state.

Claims

1. Production method of a microphone, wherein the microphone (100) comprises: a film of piezoelectric material; a lower electrode disposed on a lower side of the piezoelectric film; a patterned upper electrode comprising pads disposed on an upper side of the piezoelectric film; pillars disposed on the pads of the patterned electrode; a rigid dish disposed on said pillars; said method comprising the following steps: making of the patterned upper electrode by means of a first deposition of conductive material on an upper side of the piezoelectric film in such a way to form the pads of the patterned electrode; and making of the pillars by means of successive depositions of rigid material, in aligned position on the pads of the patterned electrode, wherein said first deposition and said successive depositions are made by means of screen-printing, dispenser-printing or spray-coating of material in liquid or semifluid state.

2. The method of claim 1, wherein said lower electrode is obtained by means of a deposition of conductive material on the lower side of the piezoelectric film by means of screen-printing, dispenser-printing or spray-coating of material in liquid or semifluid state.

3. The method of claim 1, wherein the rigid material of the pillars is the same conductive material of the patterned upper electrode.

4. The method of claim 3, wherein the rigid material of the pillars and the conductive material of the patterned upper electrode are silver paste.

5. The method of claim 1, wherein said pillars are obtained by means of a plurality of successive depositions, alternating with a thermal annealing process between a deposited layer and the following deposited layer.

6. The method of claim 5, wherein each pillar has a thickness of approximately 48-56 m that is obtained with 8 successive depositions.

7. The method of claim 1, wherein at least 90 pillars with 1 mm diameter are obtained, oppositely spaced in such a way that a ratio between surface of the rigid dish exposed to the acoustic field and surface of the section of all pillars higher than 30 is obtained.

8. The method of claim 1, wherein said piezoelectric film is made of polyvinylidene fluoride (PVDF) or aluminum nitride (AlN) and polylactic acid (PLLA).

9. The method of claim 1, wherein said rigid dish is of polyethylene terephthalate (PET).

10. Production method of a microphone, wherein the microphone comprises: a film of piezoelectric material; a lower electrode disposed on a lower side of the piezoelectric film; a rigid dish; a patterned upper electrode comprising pads disposed on a lower side of the rigid dish; pillars disposed on the pads of the patterned electrode and on the piezoelectric film; said method comprising the following steps: making of the patterned upper electrode by means of a first deposition of conductive material on a lower side of the rigid dish in such a way to form the pads of the patterned electrode; and making of the pillars by means of successive depositions of rigid conductive material, in aligned position on the pads of the patterned electrode; wherein said first deposition and said successive depositions are made by means of screen-printing, dispenser-printing or spray-coating of material in liquid or semifluid state.

11. The method of claim 10, wherein said lower electrode is obtained by means of a deposition of conductive material on the lower side of the piezoelectric film by means of screen-printing, dispenser-printing or spray-coating of material in liquid or semifluid state.

12. The method of claim 10, wherein the rigid material of the pillars is the same conductive material of the patterned upper electrode.

13. The method of claim 12, wherein the rigid material of the pillars and the conductive material of the patterned upper electrode are silver paste.

14. The method of claim 10, wherein said pillars are obtained by means of a plurality of successive depositions, alternating with a thermal annealing process between a deposited layer and the following deposited layer.

15. The method of claim 14, wherein each pillar has a thickness of approximately 48-56 m that is obtained with 8 successive depositions.

16. The method of claim 10, wherein at least 90 pillars with 1 mm diameter are obtained, oppositely spaced in such a way that a ratio between surface of the rigid dish exposed to the acoustic field and surface of the section of all pillars higher than 30 is obtained.

17. The method of claim 10, wherein said piezoelectric film is made of polyvinylidene fluoride (PVDF) or aluminum nitride (AlN) and polylactic acid (PLLA).

18. The method of claim 10, wherein said rigid dish is of polyethylene terephthalate (PET).

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

[0036] Additional features of the invention will appear clearer from the following detailed description, which refers to merely illustrative, not limiting embodiments, which are shown in the appended figures, wherein:

[0037] FIG. 1 is a diagrammatic perspective view of a pillar microphone according to the prior art;

[0038] FIG. 2 is an exploded diagrammatic perspective view of a second embodiment of a microphone according to the prior art;

[0039] FIGS. 3A, 3B, 3C, 3D and 3E are diagrammatic views of a manufacturing method of a third embodiment of a microphone according to the prior art;

[0040] FIGS. 4B and 4B are SEM views of the patterned film of FIG. 3c;

[0041] FIG. 5 is a diagrammatic perspective view of a first embodiment of a microphone with pillar structure according to the invention;

[0042] FIG. 6 is a diagrammatic perspective view of a second embodiment of a microphone with pillar structure according to the invention;

[0043] FIG. 7 is a diagrammatic sectional view of the microphone of FIG. 6;

[0044] FIG. 8 is a plan view of a pattern for the creation of a screen for the deposition, by means of screen-printing, of the patterned upper electrode of the microphone of FIG. 7

[0045] FIG. 9 is a plan view of a rigid dish with patterned electrode and pillars of the microphone of FIG. 7;

[0046] FIG. 10 is an enlarged view of a portion of FIG. 9;

[0047] FIG. 11 is a block diagram that shows a measure setup for a microphone according to the invention and a reference microphone; and

[0048] FIG. 12 is a chart that shows the sensitivity as a function of the frequency measured in the microphone according to the invention.

DETAILED DESCRIPTION OF THE INVENTION

[0049] FIG. 5 shows a microphone (100) according to a first embodiment of the invention. FIG. 6 shows a microphone (200) according to a second embodiment of the invention.

[0050] Both embodiments comprise a rigid structure suitable for transferring a force (acoustic pressure (Pa)), which is incident on a rigid dish (4), on a confined area of a film (2) made of piezoelectric material. Such a rigid structure is composed of the rigid dish (4) and a plurality of pillars (3). The rigidity of the rigid dish (4) and of the pillars (3) is sufficient to guarantee an effective transfer of the force, avoiding undesired resonance phenomena. The number of pillars (3) is such to ensure the stability of the rigid structure, while maintaining a high area ratio (sensitivity).

[0051] In both embodiments, the piezoelectric film (2) produces the same quantity of polarization charge on the stressed surfaces, in correspondence of the base of the pillars (3).

[0052] In the microphone (100) of the first embodiment, a patterned electrode (6) is obtained on the upper surface of the piezoelectric film (2). The patterned shape of the patterned electrode (6) is composed of conductive pads (61) that cover only the contact area between the film (2) and the pillars (3), minimizing the equivalent capacity. The conductive tracks (62) that interconnect the pads (61) of the patterned electrode (6) have a minimum thickness, in such a way to reduce parasitic capacitative effects. In the microphone (100) of the first embodiment, a voltage signal (V) is picked up at the ends of the two terminals (50, 60) connected to an electrode (5) that is shaped like a plate and is disposed under the film (2) and to the patterned electrode (6) that is disposed above the film (2).

[0053] The microphone (200) of the second embodiment has pillars (3) of electrically conductive material, obtaining a patterned electrode (6) on a lower surface of the rigid dish (4). The delocalization of the patterned electrode (6), with the same patterned shape and without considering the parasitic effects, does not involve a variation of the equivalent capacity; therefore, the voltage signal (V) between the terminals (50, 60) of the two electrodes (5, 6) will be equal to the one obtained in the microphone (100) of the first embodiment.

[0054] The main characteristic of the invention is the manufacturing of the patterned electrode (6) and of the pillars (3) with substrate deposition technologies, such as screen-printing, dispenser-printing or spray-coating. These technologies permit an Additive Manufacturing of the patterned electrode (6) and of the pillars (3) by means of multiple aligned depositions of metallic material in solution. Each deposition is followed by an evaporation step of the solvent, obtaining a thin metallic layer that is characterized by a variable thickness on micrometric or nanometric scale. The expected thickness of each deposition depends on the technology used and on the process parameters. Multiple depositions will provide pillars with the desired height.

[0055] The use of metallic material in solution (for example, silver paste) makes it possible to manufacture the patterned electrode and the pillars in one work session, avoiding material waste. Moreover, a good mechanical rigidity and a good electrical conductivity of the pillars are guaranteed.

[0056] The pillars are formed by means of multiple depositions starting from the patterned electrode. The aforementioned technologies ensure high accuracy, and guarantee a high ratio between the area of the rigid dish (4) and the sectional area of the pillars (3) (which is a critical factor for the microphone sensitivity). Moreover, the manufacturing process is considerably easier than the solution with patterned piezoelectric film of the prior art.

[0057] The manufacturing process of the microphone (100) according to the first embodiment of the invention comprises the following steps: [0058] the lower electrode (5) is obtained on a lower side of the piezoelectric film (2), by means of a deposition or print technique of a conductive material; [0059] the patterned upper electrode (6) is obtained on an upper side of the piezoelectric film (2) by means of a first deposition or print of conductive material that forms the pads (61) of the patterned electrode; [0060] the pillars (3) are obtained on the pads (61) of the patterned electrode by means of successive depositions or prints of rigid material, in aligned position with the pads (61) of the patterned electrode (6). [0061] the rigid dish (4) is constrained to the pillars (3) and/or to the piezoelectric film (2) by means of a conductive glue, in such a way to obtain an assembly; and [0062] the assembly is glued on a rigid substrate (7).

[0063] The manufacturing process of the microphone (200) according to the second embodiment of the invention comprises the following steps: [0064] the lower electrode (5) is obtained on a lower side of the piezoelectric film (2) by means of a deposition or print technique of a conductive material; [0065] the patterned upper electrode (6) is obtained on a lower side of the rigid dish (4) by means of a first deposition or print of conductive material that forms the pads (61) of the patterned electrode; [0066] the pillars (3) are obtained on the pads (61) of the patterned electrode by means of successive depositions or prints of conductive material, in aligned position with the pads (61) of the patterned electrode (6); [0067] the piezoelectric film (4) is constrained to the pillars (3) and/or to the rigid dish (4) by means of a conductive glue, in such a way to obtain an assembly; and [0068] the assembly is glued on a rigid substrate (7).

[0069] The manufacturing of the pillars (3) from the patterned electrode (6) avoids the critical step for the optical alignment between the pillars and the patterned electrode.

[0070] The main advantages of the screen-printing technology (or of other printing technologies) compared to the traditional deposition technologies are: [0071] immediate scalability for mass production (commercial screen-printing machines can easily print on substrates with 500 mm500 mm dimensions). [0072] The traditional manufacturing technologies are of subtractive type (i.e. the material is deposited everywhere and then is removed), whereas the technology of the present invention is of additive type (i.e. the material is only deposited where it is necessary). Such an approach minimizes the waste of material. [0073] Microphones can be manufactured at low cost, with a high throughput, and with low input barriers (screen-printing machines can be purchased for a few tens of thousands of Euro and can print on large areas. The use of dispense printing is cost-effective and does not require the use of screens). [0074] The design can be easily scaled to obtain different shapes and dimensions. Furthermore, the use of conformal substrates permits to insert the microphone in previously designed objects, with high design flexibility.

[0075] A manufacturing process of the microphone (200) according to the second embodiment of the invention is described below.

[0076] With reference to FIG. 7, a piezoelectric film (2) of Polyvinylidene Fluoride (PVDF), with thickness of 39 m is used as active element. The piezoelectric film (2) is already polarized, without electrodes. The use of the PVDF is justified by its high sensitivity under voltage compared to ceramic materials. Moreover, the PVDF has a high resistance to contaminants and radiations and is heavy-metal free. However, other materials with the same piezoelectric properties, such as Aluminum Nitride (AlN) and Polylactic Acid (PLLA), can be used.

[0077] The rigid dish (4) is a PET plate with 100 m thickness. The substrate (7) is made of PMMA.

[0078] The lower electrode (5) is deposited on a lower side of the piezoelectric film (2) of PVDF with screen-printing or dispenser-printing technology by means of deposition of a conductive material (for example silver). The lower electrode (5) is shaped like a plate with a thickness higher than 5 micrometers.

[0079] The patterned upper electrode (6) is obtained on the rigid dish (4) (made of PET, for example), with screen-printing or dispenser-printing technology, by means of a first deposition of conductive material. In case of screen-printing, during the design step, a screen is defined according to the geometry and arrangement of the elements to be printed. FIG. 8 shows a pattern used to prepare the screen needed for the deposition of silver to obtain the patterned upper electrode (6).

[0080] No screen is necessary in case of dispenser-printing because the elements are printed directly from a Gerber file.

[0081] With reference to FIGS. 9 and 10, the patterned electrode (6) is composed of 96 pads (61) with circular shape and 1 mm diameter (pillar base), spaced by 5 mm in the longitudinal direction and 10 mm in the transverse direction. The tracks (62) that connect the pads (61) have a width of 0.5 mm.

[0082] The rigid dish (4) (made of PET, for example) has an area A=55=25 cm.sup.2 exposed to the acoustic field. The sectional area of each pillar is S=0.52*=0.785 mm.sup.2. The high number of 96 pillars (3) is necessary to guarantee the stability of the rigid dish (4) made of PET. Therefore, the total sectional area of all pillars is ST=75.36 mm.sup.2. In view of the above, a ratio between the area of the rigid dish and the sectional area of all pillars equal to R=A/S=33.17 is obtained. Such a ratio (R) is sufficiently high to guarantee an excellent sensitivity.

[0083] If at least 90 pillars with 1 mm diameter are obtained, which are oppositely spaced by 5 mm in longitudinal direction and 10 mm in transverse direction, a ratio (R) between the area of the rigid dish and the sectional area of all pillars higher than 30 is obtained.

[0084] The patterned electrode (6) has an external pad (65) with rectangular shape that is disposed outside the active area to make the acquisition of the voltage signal easier. The external pad (65) permit to obtain a weldable contact outside the active area, making the correct acquisition of the voltage signal easier, without interfering with the dynamics of the system.

[0085] The pillars (3) are obtained by means of successive depositions of a conductive material (silver, for example), in aligned position with the pads (61) of the patterned electrode. Several depositions are performed and each deposition produces a layer of 6-7 m of silver, for a total thickness of approximately 48-56 m, preferably 55 m for each pillar. A thermal annealing process must be performed between two consecutive deposited layers in order to make the pillar solid and conductive.

[0086] After the annealing process, the screen (in case of screen-printing) or the nozzles (in case of dispenser printing) must be accurately repositioned. The depositions that are performed to obtain the pillars are aligned by means of cameras and high-precision micromanipulators, with a maximum misalignment tolerance of 10% (0.05 mm). This characteristic is fundamental in order to obtain pillars with a high shape factor. Experimental tests confirmed that the thickness of 55 m of the pillar (3) is a limitation for the realization of high-quality uniform pillars.

[0087] A thin copper strip (66) is added in the proximity of the silver external pad (65) in order to make a welding that is necessary to pick up the signal. The electrical connection between the copper strip (66) and the rectangular pad (65) is guaranteed by silver paste disposed on the rectangular pad (65) that acts as bridge.

[0088] The piezoelectric film (2) made of PVDF is glued to the substrate (7) made of PMMA with cyanoacrylate adhesive.

[0089] A thin copper strip is disposed between the piezoelectric film (2) made of PVDF and the substrate (7) and is connected to the lower electrode (5). The electrical connection between the copper strip and the lower electrode (5) is guaranteed by silver paste disposed on the lower electrode that acts as bridge.

[0090] The rigid dish (4) made of PET is glued on the two edges of the piezoelectric film (2) made of PVDF with cyanoacrylate adhesive (9) (FIG. 7). The adhesion is performed at a suitable distance from the active area. Alternatively, the rigid dish (4) made of PET can be directly constrained to the pillars (3) without being anchored to the edges with cyanoacrylate adhesive.

[0091] The sensitivity of the microphone (200) was measured in free field simulated in anechoic chamber by means of an Exponential Sinusoidal Sweep (ESS) technology. A secondary characterization method according to the IEC 61094-8 standard is used to make a comparison with free-field calibrated Bruel & Kjaer laboratory microphone of type 4189.

[0092] FIG. 11 shows a measure setup for the microphone (200) according to the invention and for a reference microphone (B). The microphone (200) of the invention and the reference microphone (B) are disposed at a distance of 1 m to ensure far-field conditions. Both microphones are contained in a Faraday cage (400) to minimize the electromagnetic interference. The output voltage of the microphone (200) is conditioned by a voltage buffer, which is characterized by a high input impedance (10 M), in such a way to ensure a cut-off frequency outside the audio band.

[0093] A dynamic speaker (401) and the Faraday cage (400) are disposed in an anechoic chamber (402). The dynamic speaker (401) generates a pressure signal of ESS type.

[0094] The reference microphone (B) is used to measure the actual incident sound pressure, which is necessary to determine the sensitivity of the microphone (200) according to the invention. The measured sensitivity was normalized at a standard pressure of 94 dB SPL.

[0095] FIG. 12 shows the sensitivity of the microphone (200) according to the invention as a function of the frequency. As shown in FIG. 12, the sensitivity is approximately constant around 100 V/Pa (80 dB V/Pa). Therefore the sensitivity values of the microphone (200) according to the invention are considerably better than the sensitivity values of the traditional microphones, which approximately range from 1 mV/Pa (dynamic) to 50 mV/Pa (capacitor)).

[0096] Numerous equivalent variations and modifications, which are within the reach of an expert of the field and fall in any case within the scope of the invention as disclosed by the appended claims, can be made to the present embodiments of the invention.