INJECTION MOLDING APPARATUS AND INJECTION MOLDING METHOD
20200262102 ยท 2020-08-20
Assignee
Inventors
Cpc classification
B28B3/006
PERFORMING OPERATIONS; TRANSPORTING
C04B35/626
CHEMISTRY; METALLURGY
International classification
C04B35/626
CHEMISTRY; METALLURGY
Abstract
An injection molding apparatus including a mold, an injection device and a gas supply device is provided. The injection device is adapted to inject a ceramic powder material into the mold. The gas supply device is adapted to provide a gas into the mold to form a cavity in the ceramic powder material by the gas. In addition, an injection molding method is also provided.
Claims
1. An injection molding apparatus, comprising: a mold; an injection device, adapted to inject a ceramic powder material into the mold; and a gas supply device, adapted to provide a gas into the mold to form a cavity in the ceramic powder material by the gas.
2. The injection molding apparatus according to claim 1, wherein the mold has a gas injection channel communicating the inside of the mold and the outside of the mold, and the gas supply device is adapted to provide the gas into the mold through the gas injection channel.
3. The injection molding apparatus according to claim 2, wherein the injection device and the gas injection channel are located at a same side or different sides of the mold.
4. The injection molding apparatus according to claim 2, further comprising a pressure sensing component disposed in the gas injection channel.
5. An injection molding method, comprising: injecting a ceramic powder material into a mold by an injection device; and providing a gas into the mold by a gas supply device to form a cavity in the ceramic powder material by the gas.
6. The injection molding method according to claim 5, wherein while the ceramic powder material is injected into the mold, the gas is provided into the mold.
7. The injection molding method according to claim 5, wherein before the gas is provided into the mold, the ceramic powder material is not fully filled in the mold.
8. The injection molding method according to claim 7, wherein the ceramic powder material is pushed toward an inner wall surface of the mold by the gas.
9. The injection molding method according to claim 5, wherein before the ceramic powder material is provided into the mold, the gas is provided into the mold.
10. The injection molding method according to claim 9, wherein the ceramic powder material is compressed toward an inner wall surface of the mold by the gas.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
[0016]
[0017]
[0018]
[0019]
DESCRIPTION OF EMBODIMENTS
[0020]
[0021] Thus, in the present embodiment, a usage amount of the entire material can be reduced by forming the cavity in the ceramic powder material CR by the gas, so as to reduce material cost. In addition, after the usage amount of the entire material is reduced, a cooling time and a processing time can be reduced in a subsequent process, thereby enhancing production efficiency.
[0022] In the present embodiment, the mold 110 may have a gas injection channel 112. The gas injection channel 112 communicates the inside of the mold 110 with the outside of the mold 110. The gas supply device 130 is adapted to provide the gas into the mold 110 through the gas injection channel 112.
[0023] It should be noted that the invention does not limit the position where the gas injection channel 112 communicates with the mold 110, as long as the gas injection channel 112 can communicate the inside of the mold 110 and outside of the mold 110, it belongs to the scope of the invention. For example, in this embodiment, the gas supply device 130 may be an inlet connecting the mold 110 to communicate the inside of the mold 110 and the outside of the mold 110. In another embodiment not shown, the gas supply device 130 may be an outlet connecting the mold 110 to communicate the inside of the mold 110 and the outside of the mold 110. In yet another embodiment not shown, the gas supply device 130 may be an inlet and an outlet at the same time connecting the mold 110 to communicate the inside of the mold 110 and the outside of the mold 110.
[0024] The injection device 120 and the gas injection channel 112 may be located at a same side of the mold 110, and thus, a position at which the gas is injected into the mold 110 may be adjacent to a position at which the injection device 120 injects the ceramic powder material CR into the mold 110, such that the cavity R may be ensured to be formed in the ceramic powder material CR when the gas is injected into the mold 110. However, the invention is not limited to this. In another embodiment not shown, the injection device 120 and the gas injection channel 112 may be located on different sides of the mold 110.
[0025] In addition, a pressure sensing component 140 may be further included in the present embodiment. The pressure sensing component 140 is disposed in the gas injection channel 112. Thus, the pressure sensing component 140 may be employed to sense a pressure of the gas when being injected into the mold 110, so as to control an injection pressure when the gas supply device 130 injects the gas into the mold 110.
[0026] A main flow of an injection molding method of an embodiment of the invention is described with reference to the drawings below.
[0027] Specifically, in the present embodiment, as illustrated in
[0028] In light of the foregoing, the invention can achieve forming a cavity in the ceramic powder material by the gas, so as to reduce the usage amount of the entire material to reduce the material cost. In addition, after the usage amount of the entire material is reduced, the cooling time and the processing time can be reduced in a subsequent process, thereby enhancing the production efficiency.
[0029] Although the invention has been described with reference to the above embodiments, it will be apparent to one of the ordinary skill in the art that modifications to the described embodiment may be made without departing from the spirit of the invention. Accordingly, the scope of the invention will be defined by the attached claims not by the above detailed descriptions.