METHOD FOR PRODUCING FILM

Abstract

The present application provides a method for producing a film. In the present application, for example, a method for producing a film which can be applied to production of a heat-dissipating material such as a heat pipe can be provided.

Claims

1. A method for producing a film, the method comprising: pattern-coating a slurry containing thermally conductive metal particles on a metal substrate; and sintering the pattern-coated slurry to form a porous metal layer on the metal substrate to thereby produce the film that includes the metal substrate and the porous metal layer.

2. The method for producing the film according to claim 1, wherein the thermally conductive metal particles are any one or a mixture of two or more selected from the group consisting of iron particles, cobalt particles, copper particles, gold particles, aluminum particles, silver particles, nickel particles, molybdenum particles, platinum particles and magnesium particles.

3. The method for producing the film according to claim 1, wherein an average particle diameter of the thermally conductive metal particles is in a range of from 100 nm to 200 m.

4. The method for producing the film according to claim 1, wherein the slurry further comprises a binder.

5. The method for producing the film according to claim 1, wherein the slurry further comprises one or more binders selected from the group consisting of alkyl cellulose, polyalkylene carbonate, polyvinyl alcohol and polyvinyl acetate.

6. The method for producing the film according to claim 4, wherein the binder is contained in the slurry in a ratio of from about 5 to about 200 parts by weight relative to 100 parts by weight of the thermally conductive metal particles.

7. The method for producing the film according to claim 1, wherein the slurry further comprises a dispersant.

8. The method for producing the film according to claim 7, wherein the dispersant is an alcohol.

9. The method for producing the film according to claim 7, wherein the dispersant is contained in the slurry in a ratio of from about 10 to about 500 parts by weight relative to 100 parts by weight of the thermally conductive metal particles.

10. The method for producing the film according to claim 1, wherein the porous metal layer having has a thickness of at most 500 m.

11. The method for producing the film according to claim 1, wherein the porous metal layer comprises pores having an average pore size of at most 100 m.

12. The method for producing the film according to claim 1, wherein the porous metal layer has a porosity of at least 30%.

13. The method for producing the film according to claim 1, wherein the metal substrate is an iron substrate, a stainless steel substrate, a copper substrate, a gold substrate, an aluminum substrate, a silver substrate, a nickel substrate, a molybdenum substrate, a platinum substrate or a magnesium substrate.

14. A method for manufacturing a heat pipe, the method comprising: providing a first film including a first metal substrate and a first porous metal layer formed on the first metal substrate and a second film including a second metal substrate and a second porous metal layer formed on the second metal substrate; and bonding edge portions of the first and second metal substrates, wherein the first and second porous metal layers are produced by the method of claim 1, and the first and second porous metal layers face each other after the bonding.

15. The method for producing the film according to claim 1, further comprising drying the pattern-coated slurry before sintering the pattern-coated slurry.

16. The method for producing the film according to claim 15, wherein drying the pattern-coated slurry is performed at a temperature in a range of from about 20 C. to about 150 C. for about from 20 minutes to about 5 hours.

17. The method for producing the film according to claim 1, wherein sintering the pattern-coated slurry is performed at a temperature in a range of from about 300 C. to about 2000 C. for about from 30 minutes to about 10 hours.

18. The method for producing the film according to claim 1, wherein sintering the pattern-coated slurry is performed in an atmosphere including hydrogen and argon.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0055] FIGS. 1 and 2 are diagrams schematically showing processes disclosed in the present application.

[0056] FIGS. 3 and 4 are photographs showing the shapes of the films produced in Examples.

MODE FOR INVENTION

[0057] Hereinafter, the present application will be specifically described by way of examples, but the scope of the present application is not limited to the following examples.

Example 1

[0058] Preparation of Slurry

[0059] A slurry was prepared by blending copper particle powder (thermal conductivity: 401 W/mK, form: dendrite type, average length: about 40 m) with a binder (polyvinylacetate) and a dispersant (terpinol). Here, the weight of the copper particle powder is about 10 g, the weight of the polyvinylacetate is about 3 g, and the weight of the dispersant (terpinol) is about 17 g.

[0060] Production of Film

[0061] The prepared slurry was pattern-printed on a copper foil as a substrate. The pattern-printed form is as shown in FIGS. 3 and 4. Subsequently, it was dried at a temperature of about 120 C. for about 1 hour to form a green film. Thereafter, a porous copper layer was formed by heat-treating the green film at a temperature of about 1000 C. for about 2 hours in a hydrogen/argon gas atmosphere to remove organic components. The thickness of the formed copper layer was about 21.5 m, and the porosity was about 70% or so.