Composite magnetic sheet and forming method of composite magnetic sheet
11710588 · 2023-07-25
Assignee
Inventors
Cpc classification
B29C51/02
PERFORMING OPERATIONS; TRANSPORTING
B29K2063/00
PERFORMING OPERATIONS; TRANSPORTING
H01F41/0246
ELECTRICITY
B29K2033/08
PERFORMING OPERATIONS; TRANSPORTING
B29K2505/00
PERFORMING OPERATIONS; TRANSPORTING
International classification
B29C51/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A forming method of a composite magnetic sheet. The forming method comprises a preparing step, a forming step and a heat-treating step. In the preparing step, magnetic slurry is prepared by mixing at least a soft magnetic powder having a flat shape, a first resin having a solid component and a second resin having a solid component, weight loss of the solid component of the first resin being 4.0% or less at 220° C., weight loss of the solid component of the second resin being 5.0% or more at 220° C. In the forming step, the magnetic slurry is formed into an intermediate body having a sheet-like shape. In the heat-treating step, the intermediate body is heat-treated at a heat-treatment temperature between 220° C. and 400° C. (both inclusive).
Claims
1. A forming method of a composite magnetic sheet, the forming method comprising: mixing at least a soft magnetic powder, a first resin and a second resin to form magnetic slurry, the soft magnetic powder having a flat shape, the first resin having a solid component, weight loss of the solid component of the first resin being 4.0% or less at 220° C., the second resin having a solid component, weight loss of the solid component of the second resin being 5.0% or more at 220° C.; forming an intermediate body having a sheet-like shape from the magnetic slurry; and heat-treating the intermediate body at a heat-treatment temperature between 260° C. and 400° C. (both inclusive), whereby the first resin forms a binder which binds particles of the soft magnetic powder to each other, wherein the first resin is an organic resin, and the binder has an organic substance as its main component.
2. The forming method as recited in claim 1, wherein in the magnetic slurry, a ratio of the first resin to the soft magnetic powder is between 2 and 15 weight % (both inclusive), and a ratio of the second resin to the first resin is between 20 and 150 weight % (both inclusive).
3. The forming method as recited in claim 1, wherein: the first resin is made of epoxy resin; and the second resin is made of polyacrylic acid ester.
4. The forming method as recited in claim 1, wherein the second resin is incompatible to the first resin.
5. The forming method as recited in claim 1, wherein the heat-treating includes heat-pressing the intermediate body at the heat-treatment temperature.
6. The forming method as recited in claim 1, wherein the heat-treating includes heat-pressing the intermediate body at a temperature of 200° C. or less and heating the intermediate body to the heat-treatment temperature after the heat-pressing.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11) While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It should be understood, however, that the drawings and detailed description thereto are not intended to limit the invention to the particular form disclosed, but on the contrary, the intention is to cover all modifications, equivalents and alternatives falling within the spirit and scope of the present invention as defined by the appended claims.
DESCRIPTION OF PREFERRED EMBODIMENTS
(12) Referring to
(13) Referring to
(14) Referring to
(15) Referring to
(16) Then, in the mixing soft magnetic powder step, a solvent, a binder resin and a viscosity improver are prepared. The binder resin is resin which is hardened and binds the soft magnetic powder 20 when heated. The solvent should be liquid which is easily volatilized at a low temperature about under 60° C. For example, glycol can be used as the solvent. Referring to
(17) As shown in
(18) The first resin 32 of the present embodiment is made of epoxy resin. The second resin 42 of the present embodiment is made of polyacrylic acid ester. However, the present invention is not limited thereto. The first resin 32 may be made of any organic resin, provided that the organic resin has TG characteristics in which the weight loss of the solid component is 4.0% or less at 220° C. The second resin 42 may be made of any organic resin, provided that the organic resin has TG characteristics in which the weight loss of the solid component is 5.0% or more at 220° C.
(19) Referring to
(20) The mixture which is made as described above contains only the soft magnetic powder 20, the solvent, the binder resin and the viscosity improver. The binder resin is made of one kind of the first resin 32. The viscosity improver is made of one kind of the second resin 42. However, the present invention is not limited thereto. For example, the mixture may contain another material in addition to the aforementioned materials. For example, the mixture may contain a third resin which has TG characteristics different from those of the first resin 32 and the second resin 42. The third resin may work as the binder resin together with the first resin 32. Thus, the binder resin may contain the first resin 32 and the third resin. In this instance, the third resin may be made of phenol resin.
(21) Referring to
(22) Summarizing the explanation described above with reference to
(23) Referring to
(24) In the forming step of the forming intermediate body step, the preliminary body is punched into a required shape so that sheets are made. A predetermined number of the sheets are stacked so that the composite magnetic sheet 10 (see
(25) Referring to
(26) Summarizing the explanation described above, the forming method of the composite magnetic sheet 10 (see
(27) Referring to
(28) Referring to
(29) The aforementioned discharge of the gas and the air further widen the discharge passages so that open pores are formed. The open pores open outward at various parts of the surface of the intermediate body 14. In addition, the discharge of the gas and the air improves the filling rate of metal of the intermediate body 14, i.e. volume ratio of the soft magnetic powder 20 to the intermediate body 14. For example, the filling rate of metal of the intermediate body 14 is improved by 5% or more.
(30) Summarizing the explanation described above with reference to
(31) Referring to
(32) The lead-free reflow process is usually performed under a relatively high reflow temperature of 220° C. or more. The weight of a viscosity improver of an existing composite magnetic sheet is significantly lost on ignition at this reflow temperature. On the contrary, a heat-treatment for making the existing composite magnetic sheet is usually performed under a temperature of about 200° C. The viscosity improver of the composite magnetic sheet is not sufficiently decomposed under this temperature of about 200° C. but is significantly decomposed during the reflow process which is performed when the composite magnetic sheet is incorporated in the circuit board. The decomposition of the viscosity improver during the reflow process generates gas in the composite magnetic sheet, and this generated gas might cause the expansion of the composite magnetic sheet.
(33) In contrast, the composite magnetic sheet 10 of the present embodiment is made of the magnetic slurry which contains the first resin 32 and the second resin 42. Under a usual reflow temperature, the first resin 32 is slightly decomposed, while the second resin 42 is significantly decomposed in comparison with the first resin 32. Moreover, the heat-treatment for making the composite magnetic sheet 10 is performed under a temperature equal to or more than the usual reflow temperature. According to the forming method of the present embodiment, the first resin 32 forms the binder 30 of the composite magnetic sheet 10 during the heat-treatment while being slightly decomposed. The thus-formed binder 30 is hardly decomposed even during a reflow process. Moreover, the second resin 42 is sufficiently decomposed in advance during the heat-treatment so that generation of gas in accordance with the decomposition of the second resin 42 can be reduced during the reflow process. Thus, the present embodiment provides the composite magnetic sheet 10, which is capable of reducing expansion thereof during the reflow process.
(34) As can be seen from the explanation described above, the heat-treatment temperature during the heat-treatment of the present embodiment should be equal to or more than the reflow temperature of the reflow process which is to be performed to a circuit board (not shown) containing the composite magnetic sheet 10. Considering that the usual reflow temperature is about 220° C., the heat-treatment temperature should be 220° C. or more. Moreover, from a viewpoint of more sufficient decomposition of the second resin 42 by the heat-treatment (see
(35) If the amount of the first resin 32 to the soft magnetic powder 20 in the magnetic slurry is lower than 2 weight %, the binder 30 of the composite magnetic sheet 10 might be insufficiently formed, and thereby the composite magnetic sheet 10 having a required strength might not be obtained. On the contrary, if the amount of the first resin 32 to the soft magnetic powder 20 is higher than 15 weight %, the filling rate of the soft magnetic powder 20 of the composite magnetic sheet 10 is lowered, and thereby the composite magnetic sheet 10 having required magnetic properties might not be obtained. Therefore, the ratio of the first resin 32 to the soft magnetic powder 20 in the magnetic slurry is preferred to be between 2 and 15 weight % (both inclusive).
(36) If the amount of the second resin 42 to the first resin 32 in the magnetic slurry is lower than 20 weight %, the magnetic slurry having a required viscosity might not be obtained, and thereby the homogeneous intermediate body 14 might not be obtained. On the contrary, if the amount of the second resin 42 to the first resin 32 is higher than 150 weight %, the binder 30 of the composite magnetic sheet 10 might not securely bind the soft magnetic powder 20, and thereby the composite magnetic sheet 10 having a required strength might not be obtained. Therefore, the ratio of the second resin 42 to the first resin 32 in the magnetic slurry is preferred to be between 20 and 150 weight % (both inclusive).
(37) Referring to
(38) Referring to
(39) Referring to
(40) In each of the heat-pressing with high temperature step and the heat-pressing with low temperature step, the heating of the intermediate body 14 (see
(41) In each of the heat-pressing with high temperature step and the heat-pressing with low temperature step, an upper surface and a lower surface of the intermediate body 14 (see
(42) The heat-treating step can be performed under various environments. For example, the heat-treating step can be performed in air or can be performed in vacuum atmosphere. When the heat-treating step is performed in air, pore ratio, i.e. ratio of the pores 50 (see
(43) Referring to
(44) The composite magnetic sheet 10 has a cross-section having two-phase structure which is formed of a dense part and the pores 50. The dense part comprises the soft magnetic powder 20 and the binder 30 firmly adhered to each other. The pores 50 includes the open pores and closed pores. The open pores are spaces connected to each other and open outward of the composite magnetic sheet 10. Each of the closed pores is a space closed within the composite magnetic sheet 10. Almost all the pores 50 of the present embodiment are the open pores.
(45) The binder 30 is hardly decomposed even when the composite magnetic sheet 10 is heated. In addition, the air in the pores 50 is discharged outward from the openings of the composite magnetic sheet 10 even when the air is expanded by heating. Therefore, the composite magnetic sheet 10 is hardly changed even when heat about the reflow temperature is applied. Even in a situation in which the air in the pores 50 is thermally expanded when the composite magnetic sheet 10 is used, the air is discharged outward from the openings. As can be seen from the explanation described above, the present embodiment enables to reduce the expansion of the composite magnetic sheet 10 which might be caused during the reflow process or might be caused by thermal elevation in use. Thus, the present embodiment provides the composite magnetic sheet 10 which is suitable to be incorporated in a circuit board, particularly in a printed circuit board.
(46) For example, the fact whether the composite magnetic sheet 10 is suitable to be incorporated in a circuit board or not can be determined by a reflow test (predetermined test) which is performed to the composite magnetic sheet 10. For example, this predetermined test can be performed under a temperature condition where a holding time at a temperature of 220° C. or more is 60 seconds, another holding time at a temperature between 240° C. and 250° C. (both inclusive) is 10 seconds or less, and a peak temperature is 260° C. From a viewpoint of obtaining the composite magnetic sheet 10 which is suitable to be incorporated in a circuit board, the composite magnetic sheet 10 is preferred to be reduced in weight by 0.25% or less when the predetermined test is performed to the composite magnetic sheet 10. Moreover, in order to incorporate the composite magnetic sheet 10 into a printed circuit board which satisfies the general thickness standard, changed in thickness of the composite magnetic sheet 10 is preferred to be within ±3% upon the aforementioned predetermined test, and increase in thickness of the composite magnetic sheet 10 is particularly preferred to be less than 3% upon the aforementioned predetermined test.
(47) When the heat-treating step (see
(48) Ratio of the soft magnetic powder 20 to the whole composite magnetic sheet 10 is 90 weight % or more. The composite magnetic sheet 10 has such a high filling rate of metal and thereby has magnetic properties required for the composite magnetic sheet 10 which is incorporated and used in a circuit board (not shown). However, the present invention is not limited thereto. For example, weight ratio of each of the soft magnetic powder 20, the binder 30 and the pores 50 to the composite magnetic sheet 10 may be designed based on the usage of the composite magnetic sheet 10.
(49) The soft magnetic powder 20 of the present embodiment contains a plurality of particles each made of soft magnetic metal. All the particles are made of the same soft magnetic metal and have shapes and characteristics similar to each other. For example, each particle is made of the same Fe-based alloy having soft magnetism. Each particle has a flat shape which extends roughly along the XY-plane. However, the present invention is not limited thereto. For example, material of each particle is not limited to Fe-based alloy. The soft magnetic powder 20 may contain particles made of two or more kinds of soft magnetic metals different from each other.
(50) The binder 30 of the present embodiment is formed by thermosetting the first resin 32 (see
(51) After the composite magnetic sheet 10 is formed as described above, the composite magnetic sheet 10 may be impregnated with resin such as phenol resin, acrylic resin or epoxy resin so that the open pores of the pores 50 of the composite magnetic sheet 10 are filled with resin. In other words, the pores 50 may be, at least in part, filled with resin. When the pores 50 is filled as described above, intrusion of moisture in the air to the pores 50 can be prevented, and thereby expansion of the composite magnetic sheet 10 due to thermal variation in use can be reduced.
EXAMPLES
(52) Hereafter, more specific explanation will be made about the present invention with reference to Examples and Comparative examples of the composite magnetic sheets according to the present invention. Examples and Comparative examples of the composite magnetic sheets were made as described below, and characteristics thereof were measured as described below.
(53) (Making Soft Magnetic Powder)
(54) Fe-based alloy powder was used as a material of a soft magnetic powder. The powder was flattened by using a ball-mill.
(55) (Forming Magnetic Slurry)
(56) A solvent, a binder resin (first resin) and a viscosity improver (second resin) were prepared. Glycol was used as the solvent. Epoxy resin was used as the binder resin. Polyacrylic acid ester was used as the viscosity improver. Examples 1 to 3 of mixtures were prepared by mixing the soft magnetic powder, the solvent, the binder resin and the viscosity improver in such a ratio that the magnetic slurry of Table 1 could be obtained. The mixture was poured into a container. Each of Examples 1 to 3 of magnetic slurry shown in Table 1 was formed by stirring the mixture in the container. In each magnetic slurry, the viscosity improver was partially segregated from the binder resin.
(57) TABLE-US-00001 TABLE 1 components contained in magnetic slurry [weight %] ratio to soft magnetic soft powder [weight %] magnetic epoxy polyacrylic epoxy polyacrylic powder resin acid ester glycol resin acid ester (*1) Example 1 37.7 1.5 0.4 60.4 4.0 1.1 26.7 Example 2 37.6 1.5 0.8 60.1 4.0 2.1 53.3 Example 3 37.5 1.5 1.1 59.9 4.0 2.9 73.3 (*1) ratio of polyacrylic acid ester to epoxy resin [weight %]
(58) (Forming Intermediate Body)
(59) Examples 1 to 3 of the magnetic slurry were applied on films, respectively, by using a slot die. Each of the films was made of polyethylene terephthalate (PET). Thereafter, Examples 1 to 3 of the magnetic slurry were dried at temperature of 60° C. for 1 hour so that the solvent was volatilized. As a result, Examples 1 to 3 of preliminary bodies were formed. Examples 1 to 3 of the preliminary bodies were cut by using trimming die, and thereby a plurality of rectangular sheets were made. Each of the rectangular sheets had a lateral size of 26 to 27 mm and a vertical size of 14 to 15 mm. Each of Examples 1 to 3 of intermediate bodies was made by stacking a predetermined number of the rectangular sheets. For each of Examples 1 to 3, a plurality of the intermediate bodies were made. The thus-obtained intermediate bodies contained the components of the ratio shown in Table 2.
(60) TABLE-US-00002 TABLE 2 components contained in intermediate body [weight %] soft magnetic powder epoxy resin polyacrytic acid ester Example 1 95.2 3.8 1.0 Example 2 94.3 3.8 1.9 Example 3 93.5 3.7 2.8
Forming Examples 1 to 3 of Composite Magnetic Sheets
(61) Each of Examples 1 to 3 of the intermediate bodies was protected by a release sheet and was put into a die. While a high pressure about 50 kgf/cm2 was applied to the intermediate body in the die, the intermediate body was heated to a heat-treatment temperature of 300° C. and was held at the heat-treatment temperature for 1 hour. As a result, for each of Examples 1 to 3, a plurality of composite magnetic sheets were made. Each of the composite magnetic sheets had a thickness about 2 to 4 mm.
Forming Comparative Examples 1 to 3 of Composite Magnetic Sheets
(62) Each of Examples 1 to 3 of the intermediate bodies was protected by a release sheet and was put into a die. While a high pressure about 50 kgf/cm.sup.2 was applied to the intermediate body in the die, the intermediate body was heated to a heat-treatment temperature of 200° C. and was held at the heat-treatment temperature for 1 hour. As a result, for each of Comparative examples 1 to 3, a plurality of composite magnetic sheets were made. Each of the composite magnetic sheets had a thickness about 2 to 4 mm.
(63) (Reflow Test)
(64) A reflow process at a temperature of 260° C. was performed once for each of Examples 1 to 3 and Comparative examples 1 to 3 of the composite magnetic sheets. Change in weight and change in thickness by the reflow process were measured. In the reflow process, the composite magnetic sheet was heated so that the temperature of the composite magnetic sheet was monotonically raised to 260° C. In this temperature increase process, the composite magnetic sheet was held at a temperature of 220° C. or more for 60 seconds and thereafter was held at a temperature between 240 and 250° C. for 10 seconds or less. The measurement result is shown in Table 3 and
(65) TABLE-US-00003 TABLE 3 change in composite magnetic ratio of soft magnetic heat treatment sheet by reflow process powder to whole composite temperature in weight increase in magnetic sheet [weight %] reflow process loss [%] thickness [%] Example 1 95.7 300° C. 0.05 0.32 Example 2 95.2 0.09 0.04 Example 3 94.7 0.11 0.25 Comparative 95.4 200° C. 0.26 6.08 example 1 Comparative 94.6 0.36 11.62 example 2 Comparative 93.8 0.47 15.20 example 3
(66) Referring to Tables 1 and 3 and
(67) In contrast, for Comparative examples 1 to 3 of the composite magnetic sheets which are heat-treated at 200° C., as the ratio of polyacrylic acid ester to the soft magnetic powder in the magnetic slurry is higher, weight loss and increase in thickness rapidly become higher. It is considered that each of Comparative examples 1 to 3 of the composite magnetic sheets which are heat-treated at 200° C. contains a large amount of remaining composition of polyacrylic acid ester. It is considered that this remaining composition is decomposed to generate gas during the reflow process so that the composite magnetic sheets is expanded.
(68) (Strength Test)
(69) A strength test was performed to each of Example 3 and Comparative example 3 of composite magnetic sheets 10X as described below. Referring to
(70) Referring to
(71) (Measurement of Characteristics)
(72) For each of Example 3 and Comparative example 3 of the composite magnetic sheets, density and permeability, more specifically real component μ′ of complex relative permeability at frequency of 1 MHz, were measured. The density and the permeability of Example 3 of the composite magnetic sheet were 4.50 g/cc and 270, respectively. The density and the permeability of Comparative example 3 of the composite magnetic sheet were 4.25 g/cc and 230, respectively. This measurement result shows that the density and the permeability of the composite magnetic sheet is improved by the heat-treatment at 300° C.