ELECTRICAL DEVICE HEAT DISSIPATION STRUCTURE

Abstract

An electrical device heat dissipation structure includes an air blowing device, a casing, and a mating connector. The casing is disposed with at least one air outlet, an electrical connector and a power supply. The power supply provides power to the air blowing device. The mating connector has a chip. The mating connector is electrically connected with the electrical connector. The air blowing device is configured to blow air to the mating connector through the at least one air outlet, so as to improve dissipation of heat generated by the chip at work, and to reduce a temperature of the mating connector.

Claims

1. An electrical device heat dissipation structure, comprising: an air blowing device; a casing disposed with at least one air outlet, an electrical connector and a power supply, the power supply providing power to the air blowing device; and a mating connector having a chip, the mating connector electrically connecting the electrical connector, wherein the air blowing device is configured to blow air to the mating connector through the at least one air outlet, so as to improve dissipation of heat generated by the chip at work, and to reduce a temperature of the mating connector.

2. The electrical device heat dissipation structure of claim 1, wherein an insertion opening is disposed at one side of the casing, the mating connector plugs to the electrical connector through the insertion opening, a center line of the at least one air outlet intersect with a center line of the insertion opening at an intersection point, and the intersection point is located at the mating connector.

3. The electrical device heat dissipation structure of claim 1, wherein when view along a plug direction of the mating connector and the electrical connector, and toward the casing, the mating connector shields partially the at least one air outlet.

4. The electrical device heat dissipation structure of claim 1, further comprising a main board fixed in the casing, wherein the electrical connector is installed on the main board and located in the casing, and the power supply is installed in the casing and provides power supply to the main board.

5. The electrical device heat dissipation structure of claim 1, further comprising a main board fixed in the casing, wherein the electrical connector is installed on an installation board, the installation board is connected to the main board through a flexible printing board, and the power supply is installed in the casing and provides power supply to the main board.

6. The electrical device heat dissipation structure of claim 1, further comprising an air guide member covering the air blowing device, wherein the air guide member has an air blowing opening, and the air blowing opening directly faces the at least one air outlet.

7. The electrical device heat dissipation structure of claim 6, wherein the air guide member comprises mask portion that is circular, the mask portion covers on the air bowing device, a top surface of the mask portion is provided with at least one air inlet, the air blowing opening is formed by extending from a side of the mask portion toward the air outlets.

8. The electrical device heat dissipation structure of claim 7, wherein the at least one air inlet comprises a plurality of air inlets, and the plurality of the air inlets are symmetrically arranged in a circle relative to a center of the top surface of the mask portion, and a width of each of the air inlets gradually decreases along a direction toward a center of the top surface of the mask portion.

9. The electrical device heat dissipation structure of claim 8, wherein the air blowing device is a fan, a number of the plurality of air inlets is the same as a number of blades of the fan.

10. The electrical device heat dissipation structure of claim 1, wherein the mating connector comprises a plug and a circuit board connected to the plug, and the chip is mounted to the circuit board.

11. The electrical device heat dissipation structure of claim 10, further comprising: an inner metal shell enclosing the circuit board; a cable soldered to the circuit board; and a spring sleeved on one end of the cable, wherein one end of the spring extends a heat conductive portion toward a direction close to the inner metal shell, and the heat conductive portion contacts an outer surface of the inner metal shell.

12. The electrical device heat dissipation structure of claim 11, wherein at least one protrusion is disposed on a surface of the inner metal shell, an outer metal shell encloses the inner metal shell, an inner surface of the outer metal shell is in contact with the at least one protrusion, and an outer surface of the outer metal shell is provided with at least one slot.

13. The electrical device heat dissipation structure of claim 12, wherein when view along a plug direction of the mating connector and the electrical connector, and toward the casing, at least one air outlet is partially exposed to the at least one slot.

14. The electrical device heat dissipation structure of claim 12, wherein a barrier is disposed between two adjacent slots, and when view along a plug direction of the mating connector and the electrical connector, and toward the casing, at least adjacent two of the barriers shield a same one of the air outlet.

15. An electrical device heat dissipation structure, comprising: an air blowing device; a casing disposed with at least one opening and a power supply, the power supply providing power to the air blowing device; an electrical connector exposed to the opening; and a mating connector having a plug, a circuit board connected with the plug, and a chip disposed on the circuit board, wherein the plug is configured to be plugged to the electrical connector through the opening, wherein the air blowing device is configured to blow air to the mating connector through the opening, so as to improve dissipation of heat generated by the chip at work, and to avoid a temperature increase of the mating connector.

16. The electrical device heat dissipation structure of claim 15, wherein the opening includes a insertion opening and at least one air outlet disposed at a location around the insertion opening, the plug is inserted to the electrical connector through the insertion opening, and the air blowing device blows air to the mating connector through the at least one air outlet.

17. The electrical device heat dissipation structure of claim 16, wherein a center line of the at least one air outlet intersect with a center line of the insertion opening at an insertion point, and the intersection point is located at the mating connector.

18. The electrical device heat dissipation structure of claim 15, further comprising an inner metal shell enclosing the circuit board and an outer metal shell enclosing the inner metal shell, wherein at least one protrusion is disposed on a surface of the inner metal shell, an inner surface of the outer metal shell is in contact with the at least one protrusion, and an outer surface of the outer metal shell is provided with at least one slot.

19. The electrical device heat dissipation structure of claim 18, wherein when view along a plug direction of the mating connector and the electrical connector, and toward the casing, the outer metal shell shields the at least one opening partially.

20. The electrical device heat dissipation structure of claim 15, further comprising: an inner metal shell enclosing the circuit board; a cable soldered to the circuit board; and a spring sleeved on one end of the cable, wherein one end of the spring extends a heat conductive portion toward a direction close to the inner metal shell, and the heat conductive portion contacts an outer surface of the inner metal shell.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The accompanying drawings illustrate one or more embodiments of the invention and together with the written description, serve to explain the principles of the invention. Wherever possible, the same reference numbers are used throughout the drawings to refer to the same or like elements of an embodiment.

[0031] FIG. 1 is a schematic three-dimensional partial exploded view of an electrical device heat dissipation structure according to a first embodiment of the present invention.

[0032] FIG. 2 is a schematic three-dimensional view of the first embodiment of the present invention.

[0033] FIG. 3 is a partial sectional view of the first embodiment of the present invention.

[0034] FIG. 4 is a front view of the first embodiment of the present invention viewing toward the insertion opening.

[0035] FIG. 5 is a schematic three-dimensional exploded view of a mating connector in the electrical device heat dissipation structure according to one embodiment of the present invention.

[0036] FIG. 6 is a three-dimensional view partial exploded view of the mating connector according to one embodiment of the present invention.

[0037] FIG. 7 is a top sectional view of an electrical device heat dissipation structure according to a second embodiment of the present invention.

[0038] FIG. 8 is a front sectional view of the electrical device heat dissipation structure according to the second embodiment of the present invention.

[0039] FIG. 9 is a partial three-dimensional view and a local sectional view of an electrical device heat dissipation structure according to a third embodiment of the present invention.

[0040] FIG. 10 is a sectional view of the electrical device heat dissipation structure according to the third embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

[0041] The present invention is more particularly described in the following examples that are intended as illustrative only since numerous modifications and variations therein will be apparent to those skilled in the art. Various embodiments of the invention are now described in detail. Referring to the drawings, like numbers indicate like components throughout the views. As used in the description herein and throughout the claims that follow, the meaning of “a”, “an”, and “the” includes plural reference unless the context clearly dictates otherwise. Also, as used in the description herein and throughout the claims that follow, the meaning of “in” includes “in” and “on” unless the context clearly dictates otherwise. Moreover, titles or subtitles may be used in the specification for the convenience of a reader, which shall have no influence on the scope of the present invention.

[0042] It will be understood that when an element is referred to as being “on” another element, it can be directly on the other element or intervening elements may be present therebetween. In contrast, when an element is referred to as being “directly on” another element, there are no intervening elements present. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.

[0043] Furthermore, relative terms, such as “lower” or “bottom” and “upper” or “top,” may be used herein to describe one element's relationship to another element as illustrated in the Figures. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures. For example, if the device in one of the figures is turned over, elements described as being on the “lower” side of other elements would then be oriented on “upper” sides of the other elements. The exemplary term “lower”, can therefore, encompasses both an orientation of “lower” and “upper,” depending of the particular orientation of the figure. Similarly, if the device in one of the figures is turned over, elements described as “below” or “beneath” other elements would then be oriented “above” the other elements. The exemplary terms “below” or “beneath” can, therefore, encompass both an orientation of above and below.

[0044] As used herein, “around”, “about” or “approximately” shall generally mean within 20 percent, preferably within 10 percent, and more preferably within 5 percent of a given value or range. Numerical quantities given herein are approximate, meaning that the term “around”, “about” or “approximately” can be inferred if not expressly stated. As used herein, the terms “comprising”, “including”, “carrying”, “having”, “containing”, “involving”, and the like are to be understood to be open-ended, i.e., to mean including but not limited to.

[0045] The description will be made as to the embodiments of the present invention in conjunction with the accompanying drawings in FIGS. 1-10. In accordance with the purposes of this invention, as embodied and broadly described herein, this invention, in one aspect, relates to an electrical device heat dissipation structure.

[0046] As shown in FIGS. 1 and 2, an electrical device heat dissipation structure 100 of the present invention includes an casing 1, a main board 2 fixed inside the casing 1, an air blowing device 3 mounted on the main board 2, a power supply 7 disposed inside the casing 1 and providing power supply to the air blowing device 3 so that the air blowing device 3 is able to blow air, an air guide member 4 located inside the casing 1 and covered on the air blowing device 3, an electrical connector 5 accommodated in the casing 1 and electrically connected to the main board 2, and a mating connector 6 located outside the casing 1 and plug-connected to the electrical connector 5.

[0047] FIGS. 1-3 show a first embodiment of the electrical device heat dissipation structure 100 of the present invention. The casing 1 has a sidewall 11. An opening 12 is disposed on the sidewall 11. Each opening 12 includes a insertion opening 121 and multiple air outlets 122 located around the insertion opening 121. The electrical connector 5 is exposed at the insertion opening 121, so that the mating connector 6 may be plug-connected to the electrical connector 5 through the insert opening 121. The air guide member 4 has an air blowing opening 41. The air blowing opening 41 directly faces the air outlet 122, such that the air blowing device 3 can blow air to the mating connector 6 through the air outlet 122, so as to lower the temperature of the mating connector 6. To make air blown by the air blowing device 3 cover a maximum range of the mating connector 6 and accelerate a heat dissipation rate of the mating connector 6, in the side wall, the air outlets 122 are provided relatively tilted to the insertion opening 121, a center line of the air outlets 122 intersect with a central line of the inserting opening 121 at one point M, and the intersection point M is located on the mating connector 6. In this embodiment, the air blowing device 3 is a fan which is provided with eight fan blades 31, ensuring stability of the air blowing device 3 to a maximum degree. The air guide member 4 is provided with a circular mask portion 42 covered on the air blowing device 3. A top surface of the mask portion 42 is provided with eight air inlets 421, symmetrically arranged in a circle relative to a center of the top surface of the mask portion 42. Widths of the air inlets 421 gradually decrease to a direction close to the center of the mask portion 42. In this way, a number of the blades 31 of the air blowing device 3 is the same as a number of the air inlets 421, weak strength of the mask portion 42 caused by too many air inlets 421 is avoided, and reduced air quantity of the air outlets 122 due to too less number of air inlets 421 and too less of blowing air is avoided. In other embodiments, the number of the fan blades 31 and shapes, sizes, and the number of the air inlets 421 is not limited herein, as long as they satisfy an air volume required by the mating connector 6 for heat dissipation.

[0048] As shown in FIGS. 2, 4, 5, and 6, the mating connector 6 includes a plug 61, a circuit board 62, an inner metal shell 63, a cable 64, a spring 65, a plastic shell 66, and an outer metal shell 67. The plug 61 is plug-connected to the electrical connector 5 through the insertion opening 121. The circuit board 62 is electrically connected to the plug 61. The inner metal shell 63 encloses the circuit board 62. Four protrusions 631 are respectively disposed on each of an upper surface and a lower surface of the inner metal shell 63. The cable 64 is soldered on the circuit board 62. The spring 65 is sleeved on one end of the cable 64, to avoid bad contact with the circuit board 62 when the cable 64 is bent. Further, one end of the spring 65 extends a heat conductive portion 651 to a direction close to the inner metal shell 63. The heat conductive portion 651 contacts an outer surface of the inner metal shell 63 and transmits a part of heat on the inner metal shell 63 to the air, improving a heat dissipation capability and stability of the mating connector 6. The plastic shell 66 is injection molded outside the inner metal shell 6. The protrusions 631 are exposed at the plastic shell 66. The outer metal shell 67 encloses the plastic shell 66, and an inner surface of the outer metal shell 67 contacts the protrusions 631, so that heat from the inner metal shell 63 can be transmitted to the outer metal shell 67 through the protrusions 631, providing another path of heat dissipation to the mating connector 6. In addition, multiple slots 671 are disposed on an outer surface of the outer metal shell 67, increasing an outer surface area of the outer metal shell 67 and enhancing a heat dissipation capability of the outer metal shell 67. Along a plug direction of the mating connector 6 and the electrical connector 5, and viewing toward the casing 1, the air outlets 122 are partially exposed at the slots 671. Further, barriers 672 are disposed between adjacent slots 671. Along a plug direction of the mating connector 6 and the electrical connector 5, and viewing toward the casing 1, at least two adjacent barriers 672 shield a same air outlets 122, so that air blown from the air outlets 122 directly blows over the slots 671 and cools the outer metal shell 67. To enhance a signal transmission capability of the mating connector 6, a chip 68 is mounted on the circuit board. In this embodiment, the electrical connector 5 is a universal serial bus (USB) Type C female end capable of being plugged in dual orientation, and the mating connector 6 is a cable connector of a USB Type C male end. In other embodiments, types of the electrical connector 5 and the mating connector 6 can be randomly changed according to needs and are not limited herein.

[0049] FIGS. 7 and 8 show a second embodiment of the present invention. The second embodiment 2 fundamentally differs from the first embodiment 1 in that in this embodiment, the central line of the air outlets 122 is parallel to the central line of the insertion opening 121. However, along a plug direction of the mating connector 6 and the electrical connector 5, and viewing toward the casing 1, the mating connector 6 shields halves of areas of the air outlets 122. In this way, it can be ensured that the mating connector 6 is located on a path of blowing air from the air outlets 122, so that air blown from the air outlets 122 blows over the outer metal shell 67. In other embodiments, the mating connector 6 only needs to shield at least a portion of the air outlets 122, so that air blown from the air outlets 122 blows over the outer metal shell 67. Thus the structures and the locations of the air outlets 122 and the mating connector 6 are not limited to the embodiments of the present invention.

[0050] As shown in FIGS. 1 and 2, in a process of assembling the electrical device heat dissipation structure 100 according to one embodiment of the present invention, the main board 2 is first fixed to the casing 1, the electrical connector 5 is soldered to the main board 2, then the air blowing device 3 is mounted on the main board 2, the air guide member 4 is covered on the air blowing device 3, and at last, an upper cover of the casing 1 is closed, and the mating connector 6 is plugged to the electrical connector 5.

[0051] FIGS. 9 and 10 show a third embodiment of the present invention. The difference between the third embodiment and the first embodiment lies in that, in the third embodiment, the electrical connector 5 is installed on an installation board 9, the installation board 9 is connected to the main board 2 through the flexible printing board 8, the opening 12 is a larger through hole, such that after the electrical connector 5 and the mating connector 6 are plugged, the air blowing device 3 can blow the air through the opening 12 toward the mating connector 6 to lower the temperature of the mating connector 6, ensure normal performance of the chip, and also reduce the cost of the casing.

[0052] In summary, the electrical device heat dissipation structure 100 according to certain embodiments of the present invention has the following beneficial advantages:

[0053] (1) Multiple of the air outlets 122 are disposed around the insertion opening 122, so that the air blowing device 3 can blow air from the air outlets 122 to the mating connector 6, so as to lower temperature of the mating connector 6, avoid excessively high temperature of the chip 68, and improving an electrical transmission performance of the mating connector 6.

[0054] (2) The central lines of the air outlets 122 intersect with the central line of the insertion opening 121 at one point M, and the intersection point M is located on the mating connector 6, so that air blown from the heat dissipation holes 13 is blown to the mating connector 6 in an oriented manner, enhancing a heat dissipation effect.

[0055] (3) Along a plug direction of the mating connector 6 and the electrical connector 5, and viewing toward the casing 1, the mating connector 6 shields partially the air outlets 122, ensuring that the mating connector 6 is located on a path of blowing air from the air outlets 122, so that air blown from the air outlets 122 blows over the mating connector 6.

[0056] (4) The heat conductive portion 651 of the spring 65 contacts the inner metal shell 63, so that heat of the inner metal shell 63 can be dissipated through the spring 65, complementally enhancing a heat dissipation capability of the mating connector 6.

[0057] (5) The outer metal shell 67 contacts the inner metal shell 63 through the protrusions 631, providing another path of heat dissipation to the mating connector 6.

[0058] (6) The slots 671 are provided on the surface of the outer metal shell 67, which increase a heat dissipation area of the outer metal shell 67.

[0059] (7) The opening 12 is a large through hole, so that after the mating connector 6 is plugged into the electrical connector 5, the air blowing device 3 can blow the air to the mating connector 6 through the opening 12, so as to lower the temperature of the mating connector 6, ensure normal performance of the chip 68, and reduce cost of the casing 1.

[0060] The foregoing description of the exemplary embodiments of the invention has been presented only for the purposes of illustration and description and is not intended to be exhaustive or to limit the invention to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching.

[0061] The embodiments are chosen and described in order to explain the principles of the invention and their practical application so as to activate others skilled in the art to utilize the invention and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will become apparent to those skilled in the art to which the present invention pertains without departing from its spirit and scope. Accordingly, the scope of the present invention is defined by the appended claims rather than the foregoing description and the exemplary embodiments described therein.