Silicon wafer with homogeneous radial oxygen variation

Abstract

The invention relates to a silicon wafer having a radial variation of oxygen concentration of less than 7%, determined over the entire radius of the silicon wafer. The wafers are produced in the P.sub.V region with rotation of crystal and crucible in the same direction, and in the presence of a horizontal magnetic field of defined intensity.

Claims

1. A silicon wafer with a diameter of at least 300 mm, sliced from a silicon single crystal pulled according to the CZ method, having a radial variation of oxygen concentration of less than 7%, calculated according to (O.sub.maxO.sub.min/O.sub.min)*100%, wherein O.sub.max is the maximal and O.sub.min is the minimal oxygen concentration determined over the entire radius of the silicon wafer.

2. The silicon wafer of claim 1, wherein the radial variation of the oxygen concentration is less than 5%.

3. The silicon wafer of claim 1, wherein the radial variation of the oxygen concentration is less than 2%.

4. The silicon wafer of claim 1, wherein the silicon wafer is doped with nitrogen and has a nitrogen concentration of not less than 510.sup.12 atoms/cm.sup.3 and not more than 3.510.sup.13 atoms/cm.sup.3.

5. The silicon wafer of claim 1, wherein an oxygen concentration in the silicon wafer is from 510.sup.17 atoms/cm.sup.3 to 610.sup.17 atoms/cm.sup.3.

6. The silicon wafer of claim 5, wherein the silicon wafer is doped with hydrogen and has a hydrogen concentration of not less than 310.sup.13 atoms/cm.sup.3 and not more than 810.sup.13 atoms/cm.sup.3.

7. An epitaxial silicon wafer which is p/p+ doped, comprising a silicon wafer of claim 1, as a substrate, the epitaxial silicon wafer comprising BMD nuclei whose density, averaged over the radius of the silicon wafer, is not less than 110.sup.5 cm.sup.3 and not more than 110.sup.7 cm.sup.3, a density of BMD nuclei differing by no more than 20% from the average value from the center to the edge of the epitaxial silicon wafer.

8. The epitaxial silicon wafer of claim 7, wherein a resistivity is not less than 5 mcm and not more than 10 mcm.

9. An epitaxial silicon wafer which is p/p doped, comprising a silicon wafer of claim 1, as a substrate, the epitaxial silicon wafer having a BMD density in the region of the silicon substrate wafer from the center to the edge of the epitaxial silicon wafer of not less than 110.sup.8 cm.sup.3 after a heat treatment at a temperature of 1000 C. over a period of 16 h, a density of BMD differing by no more than 20% from the average value from the center to the edge of the epitaxial silicon wafer.

10. A method for producing a silicon wafer of claim 1, comprising: a) providing a silicon melt in a crucible; b) pulling a silicon single crystal from the melt according to the CZ method, oxygen being incorporated into the single crystal; c) applying a horizontal magnetic field to the melt during the pulling of the silicon single crystal; d) rotating the growing crystal and the crucible during the pulling of the single crystal; e) providing the silicon wafer by processing the silicon single crystal; wherein a magnetic flux density of the applied horizontal magnetic field is 1900-2600 Gs in the middle of the crucible, and the growing crystal is rotated at at least 8 rpm.

11. The method as claimed in claim 10, wherein the magnetic flux density is 2000-2400 Gs.

12. The method of claim 10, wherein the magnetic flux density is 2150-2350 Gs.

13. The method of claim 10, wherein the crystal and the crucible are rotated in the same sense, wherein the crucible is rotated at 0.3-0.8 rpm.

14. The method of claim 10, wherein the crystal is rotated at at least 10 rpm.

15. The method of claim 13, wherein the crystal is rotated at at least 10 rpm.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 shows radial oxygen profiles in the case of different magnetic flux densities.

(2) FIG. 2 shows radial oxygen profiles in the case of different magnetic flux densities.

(3) FIG. 3 shows radial oxygen profiles in the case of different magnetic flux densities.

(4) FIG. 4 shows radial oxygen profiles in the case of different crystal rotations.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

(5) The radial variation of the oxygen concentration is determined as follows:
(O.sub.maxO.sub.min/O.sub.min)*100%,
where O.sub.max denotes the maximum oxygen concentration over the entire radius of the silicon wafer, and O.sub.min denotes the minimum oxygen concentration over the entire radius of the silicon wafer.

(6) The measurement of the oxygen concentration is carried out by means of FTIR according to SEMI MF951. For example, the Bruker Equinox55s spectrometer is 30 suitable for this. With this instrument, standard SEMI wafers with diameters of 100, 125, 150, 200 and 300 mm can be measured. It is, however, also suitable for studying ingot pieces.

(7) In order to determine the oxygen concentration in the edge region, it is advantageous to study ingot pieces and not standard wafers. In this way, it is also possible to study the oxygen concentration in the edge region of crystals with a diameter of 450 mm.

(8) The silicon wafer exhibits a radial variation of the oxygen concentration of less than 7%, the entire radius of the silicon wafer being taken into account. In one embodiment, the radial variation of the oxygen concentration of the silicon wafer is less than 5%. Preferably, the radial variation of the oxygen concentration of the silicon wafer is less than 2%.

(9) The silicon wafer has a diameter of 150 mm, 200 mm, 300 mm or 450 mm.

(10) In one embodiment, the silicon wafer is epitaxially coated.

(11) In one embodiment, the silicon wafer is heat-treated before the epitaxial coating, in order to stabilize BMD nuclei.

(12) In another embodiment, the silicon wafer is doped with nitrogen and has a nitrogen concentration of not less than 510.sup.12 atoms/cm.sup.3 and not more than 3.510.sup.13 atoms/cm.sup.3.

(13) Preferably, the oxygen concentration in the silicon wafer is from 510.sup.17 atoms/cm.sup.3 to 610.sup.17 atoms/cm.sup.3.

(14) In one embodiment, the silicon wafer is doped with boron. The boron concentration lies in a range of from 3.1010.sup.18 atoms/cm.sup.3 to 8.4310.sup.18 atoms/cm.sup.3.

(15) In another embodiment, the silicon wafer is doped with nitrogen and hydrogen. A nitrogen concentration is not less than 510.sup.12 atoms/cm.sup.3 and not more than 3.510.sup.13 atoms/cm.sup.3. A hydrogen concentration is not less than 310.sup.13 atoms/cm.sup.3 and not more than 810.sup.13 atoms/cm.sup.3.

(16) In one embodiment, the silicon wafer is provided with an epitaxial layer, the epitaxial silicon wafer being p/p+ doped and comprising BMD nuclei whose density, averaged over the radius of the silicon wafer, determined by IR tomography, is not less than 110.sup.5 cm.sup.3 and not more than 110.sup.7 cm.sup.3. Furthermore, the variation of the density of BMD nuclei along the radius of the epitaxial silicon wafer is low. The density of BMD nuclei varies by no more than 20% from the average value from the center to the edge of the epitaxial silicon wafer.

(17) In one embodiment, the silicon wafer is provided with an epitaxial layer, the epitaxial layer being p/p doped and having a BMD density in the region of the silicon substrate wafer from the center to the edge of the epitaxial silicon wafer of not less than 110.sup.8 cm.sup.3, preferably not less than 510.sup.8 cm.sup.3, after a heat treatment at a temperature of 1000 C. over a period of 16 h. Furthermore, the variation of the BMD density along the radius of the epitaxial silicon wafer is low. The BMD density varies by no more than 20% from the average value from the center to the edge of the epitaxial silicon wafer.

(18) The silicon wafer according to the invention may be produced according to the invention by a method comprising

(19) a) providing a silicon melt in a crucible;

(20) b) pulling a silicon single crystal from the melt according to the CZ method, oxygen being incorporated into the single crystal;

(21) c) applying a horizontal magnetic field to the melt during the pulling of the silicon single crystal;

(22) d) rotating the growing crystal and the crucible during the pulling of the single crystal;

(23) e) providing the silicon wafer by processing the silicon single crystal; wherein a magnetic flux density of the applied horizontal magnetic field is 1900-2600 Gs in the middle of the crucible, and the growing crystal is rotated at at least 8 rpm.

(24) In one embodiment, the magnetic flux density is 2000-2400 Gs.

(25) In another embodiment, the magnetic flux density is 2150-2350 Gs.

(26) Expressed in SI units, 1 Gs=0.1 mT.

(27) Preferably, the crystal and the crucible are rotated in the same sense.

(28) In another embodiment, the crucible is rotated at 0.3-0.8 rpm.

(29) In a particularly preferred embodiment, the growing crystal is rotated at at least 10 rpm.

(30) The provision of the silicon wafer comprises cutting of the crystal into wafers and subsequently performing various mechanical and chemical-mechanical processing steps of the side surfaces and the edge on the silicon wafer.

(31) In one embodiment, the silicon wafer is provided with an epitaxial layer on a polished side surface.

(32) It has been found that a homogeneous radial oxygen distribution of the silicon wafer can be achieved, also taking into account the complete edge region of the silicon wafer, only when both the magnetic flux density lies in the range specified above and a particular minimum speed is complied with for the crystal rotation.

(33) When applying high magnetic flux densities, for example of 2700 Gs, a strong decrease in the oxygen concentration at the edge is found, in the case of 300 mm wafers for example in a region with a distance of 140-150 mm from the center of the wafer. The effect of this is that the radial variation of the oxygen concentration over the entire radius of the wafer can be more than 10%.

(34) Such a decrease in the oxygen concentration at the edge is likewise found when the rotational speed of the crystal is less than 8 rpm. The rotation, known per se, of the crystal and the crucible is carried out by means of a suitable drive unit.

(35) It is particularly advantageous that pulling of the crystals can be carried out without LPits and COPs despite the reduction of the magnetic field. To date, it has been assumed that high magnetic flux densities (for example 3000 Gs) are needed in order to homogenize V/G.

(36) By reducing the edge decrease in the oxygen concentration, the BMD density can be kept high at the edge of an epitaxial silicon wafer, or in a silicon wafer which has been subjected to a heat treatment.

(37) In one embodiment, an epitaxial silicon wafer which is p/p+ doped is produced. To this end oxygen and boron are incorporated into the single crystal during the pulling of the single crystal, the concentration of oxygen in the single crystal being not less than 510.sup.17 atoms/cm.sup.3 and not more than 610.sup.17 atoms/cm.sup.3, and the resistivity of the single crystal being not less than 5 mcm and not more than 10 mcm.

(38) A heat treatment of the silicon substrate wafer before the epitaxy, for the purpose of stabilizing BMD nuclei, is not necessary when the single crystal is pulled and cooled under conditions which reinforce the creation of BMD nuclei and their stabilization.

(39) In particular, the single crystal should be cooled relatively slowly in the temperature range of from 1000 C. to 800 C., in which case the cooling rate in this temperature range is not less than 0.5 C./min and not more than 1.2 C./min.

(40) The single crystal is pulled under conditions, under which a relatively low concentration of oxygen and a relatively high concentration of boron are incorporated into the single crystal. In order to adjust the boron concentration in the single crystal, the melt is doped with boron.

(41) Furthermore, the single crystal is pulled under conditions which allow the formation of monocrystalline silicon in which the vacancies dominate over the interstitial silicon atoms as point defects (v region).

(42) The pulled single crystal is processed to form substrate wafers of monocrystalline silicon. After the processing steps, the substrate wafer has a polished edge and at least one polished side surface. Preferably, both side surfaces, i.e. the front side and the back side, are polished.

(43) An epitaxial layer of silicon is deposited on the polished side surface of the substrate wafer, or the polished front side. Even in the edge region, the resulting epitaxial silicon wafer has a high number of BMD nuclei which can be developed into BMDs.

(44) After standard tests, such as a heat treatment at a temperature of 1000 C. over a period of 16 h, or a first heat treatment at a temperature of 780 C. over a period of 3 h followed by a second heat treatment at a temperature of 1000 C. over a period of 16 h, the BMD density in the region of the substrate wafer of the epitaxial silicon wafer from the center to the edge of the epitaxial silicon wafer is not less than 110.sup.8 cm.sup.3, preferably not less than 510.sup.8 cm.sup.3. Furthermore, the variation of the BMD density along the radius of the epitaxial silicon wafer is low. The BMD density varies by no more than 20% from the average value from the center to the edge of the epitaxial silicon wafer.

(45) In another embodiment, the melt is doped with oxygen, nitrogen and hydrogen. The oxygen concentration is not less than 4.910.sup.17 atoms/cm.sup.3 and not more than 5.710.sup.17 atoms/cm.sup.3, the nitrogen concentration is not less than 510.sup.12 atoms/cm.sup.3 and not more than 3.510.sup.13 atoms/cm3, and the hydrogen concentration is not less than 310.sup.13 atoms/cm.sup.3 and not more than 810.sup.13 atoms/cm.sup.3.

(46) Furthermore, the single crystal is pulled under conditions which allow the formation of monocrystalline silicon in which the vacancies dominate over the interstitial silicon atoms as point defects (v region).

(47) The presence of hydrogen suppresses the formation of nuclei of OSF defects, and contributes to making the radial profile of the density of BMDs more uniform, particularly in the edge region of the silicon wafer. The hydrogen concentration in the silicon wafer should therefore be not less than 310.sup.13 atoms/cm.sup.3. The single crystal is pulled in an atmosphere which contains hydrogen, the partial pressure of hydrogen preferably being not less than 5 Pa and not more than 15 Pa.

(48) A silicon wafer is separated from the grown crystal and processed further. In this case, the upper and lower side surfaces as well as the edge of the silicon wafer are subjected to one or more mechanical processing steps and at least one polish. An epitaxial layer is preferably deposited on the polished side surface of the silicon wafer. The silicon wafer and the epitaxial layer are doped with an electrically active dopant, for example boron, preferably according to the doping of a pp doped epitaxial silicon wafer.

(49) The density of BMD nuclei averaged over the radius of the silicon wafer, determined by IR tomography, is not less than 110.sup.5 cm.sup.3 and not more than 110.sup.7 cm.sup.3. The density of BMD nuclei varies by no more than 20% from the average value from the center to the edge of the epitaxial silicon wafer.

(50) The silicon wafer with an epitaxial layer, resulting from the deposition of an epitaxial layer on the front side of the silicon wafer, has, despite the deposition of the epitaxial layer, the potential of being able to form BMDs whose density is sufficient to impart the required effect as in internal Getter to the silicon wafer. The density of BMDs does, however, remain low enough and its radial profile homogeneous enough so that problems due to overlay defects are avoided.

(51) The BMDs are preferably formed in the course of the production of electronic components in the epitaxial layer and heat treatments involved in this. They may, however, also be formed by subjecting the silicon wafer to one or more heat treatments after the deposition of the epitaxial layer and before the production of electronic components.

(52) The features specified in relation to the above-described embodiments of the silicon wafer according to the invention, or the epitaxial silicon wafers according to the invention, may be applied correspondingly to the production method according to the invention. Conversely, the features specified in relation to the above-described embodiments of the method according to the invention may be applied correspondingly to the silicon wafer according to the invention, or the epitaxial silicon wafers according to the invention. These and other features of the embodiments according to the invention will be explained in the description of the figures and in the claims. The individual features may be implemented either separately or in combination as embodiments of the invention. Furthermore, they may describe advantageous embodiments which are individually protectable.

(53) In the examples below, crystals with a diameter of about 300 mm were grown in accordance with the method according to the invention. The radial oxygen variation was determined on these crystals, or the ingot pieces or silicon wafers produced to therefrom.

(54) FIG. 1 shows the radial oxygen profiles, determined by means of FTIR, in the case of different magnetic flux densities (3000 Gs, 2800 Gs, 2720 Gs, 2420 Gs, 2350 Gs)

(55) The crystal rotation is 10 rpm, the crucible rotation is 0.3 rpm. The crystal and the crucible are rotated in the same sense.

(56) The lower the magnetic flux density, the lower the edge decrease.

(57) In the case of a magnetic flux density of 2350 Gs, there is a radial oxygen variation of 2.3%.

(58) In further measurements, it has been found that, in the case of a magnetic flux density of 2150-2350 Gs, the radial oxygen variation is often even less than 2%.

(59) FIG. 2 shows the radial oxygen profiles of FIG. 1 in the edge region (R=140-150 mm). Beyond a radial position of about 144 mm, a significant decrease in the oxygen concentration is found in the case of magnetic flux densities of more than 2700 Gs.

(60) FIG. 3 shows the radial oxygen profiles, determined by means of FTIR, in the case of the magnetic flux densities 2150 Gs and 3000 Gs. The crystal rotation is 10 rpm, the crucible rotation is 0.3 rpm. The crystal and the crucible are rotated in the same sense.

(61) For the radial oxygen variation, if the entire radius is taken into account, 3.1% is found in the case of 2150 Gs and 19.2% is found in the case of 3000 Gs.

(62) If, however, an edge region of 10 mm is not taken into account, i.e. the radial oxygen variation is determined only from R=0 to R=140 mm, 2.5% is found in the case of 2150 Gs and 5.4% is found in the case of 3000 Gs.

(63) This shows a significant decrease in the oxygen concentration at the edge (R=140-150 mm) in the case of excessively high magnetic fields.

(64) FIG. 4 shows the radial oxygen profiles, determined by means of FTIR, in the case of different crystal rotations. The crucible rotation is 0.3 rpm. The crystal rotation is varied: 4, 6, 8 and 10 rpm. The magnetic flux density is 2300 Gs.

(65) It is found that the oxygen concentration decreases significantly with decreasing crystal rotation. The decrease already begins at a radial distance of about 80 mm.

(66) In the case of a crystal rotation of 10 rpm, a radial oxygen variation of 1.5% is found.

(67) The above description of exemplary embodiments is to be interpreted by way of example. The disclosure thereby carried out on the one hand makes it possible for the person skilled in the art to understand the present invention and the advantages associated therewith, and on the other hand also comprises variations and modifications of the described structures and methods which are evident within the understanding of the person skilled in the art. All such variations and modifications and equivalents are therefore meant to be covered by the protective scope of the claims.