Adhesive composition for base with low-energy surface

Abstract

The present invention provides a stable organic solvent solution-type adhesive composition that is in a solution state even at low temperatures and that has excellent adhesion to polyolefin base materials, in particular polyethylene substrates (both LDPE and HDPE). The invention provides an adhesive resin composition comprising a modified polyethylene copolymer (component A) having a melting point of less than 80 C., a terpene-based tackifier (component B), and an organic solvent (component C), wherein component B is contained in an amount of 30 to 100 parts by weight, per 100 parts by weight of component A.

Claims

1. An adhesive composition comprising: a modified polyethylene copolymer (component A) having a melting point of less than 80 C.; a terpene-based tackifier (component B); and an organic solvent (component C), wherein component A is at least one member selected from the group consisting of an ethylene--olefin copolymer, an ethylene-acrylic acid copolymer, an ethylene-acrylic acid alkyl ester copolymer, an ethylene-,-unsaturated carboxylic acid copolymer, and an ethylene-,-unsaturated carboxylic acid anhydride copolymer, and wherein component B is contained in an amount of 30 to 100 parts by weight, per 100 parts by weight of component A.

2. The adhesive composition according to claim 1, wherein the terpene-based tackifier (component B) is a terpene phenol resin.

3. The adhesive composition according to claim 1, wherein the organic solvent (component C) is an alicyclic hydrocarbon compound and/or an aromatic hydrocarbon compound.

4. The adhesive composition according to claim 1, wherein the weight percentage of component A and component B is 20 wt % or less, based on the total weight of component A, component B, and component C.

5. The adhesive composition according to claim 1, further comprising a polypropylene-based resin (component D) in an amount of less than 15 parts by weight, per 100 parts by weight of component A.

6. The adhesive composition according to claim 2, wherein the organic solvent (component C) is an alicyclic hydrocarbon compound and/or an aromatic hydrocarbon compound.

7. The adhesive composition according to claim 2, wherein the weight percentage of component A and component B is 20 wt % or less, based on the total weight of component A, component B, and component C.

8. The adhesive composition according to claim 3, wherein the weight percentage of component A and component B is 20 wt % or less, based on the total weight of component A, component B, and component C.

9. The adhesive composition according to claim 6, wherein the weight percentage of component A and component B is 20 wt % or less, based on the total weight of component A, component B, and component C.

10. The adhesive composition according to claim 2, further comprising a polypropylene-based resin (component D) in an amount of less than 15 parts by weight, per 100 parts by weight of component A.

11. The adhesive composition according to claim 3, further comprising a polypropylene-based resin (component D) in an amount of less than 15 parts by weight, per 100 parts by weight of component A.

12. The adhesive composition according to claim 6, further comprising a polypropylene-based resin (component D) in an amount of less than 15 parts by weight, per 100 parts by weight of component A.

Description

EXAMPLES

(1) The present invention is specifically described below with reference to Examples. However, the scope of the present invention is not limited to the following Examples. In the Examples and Comparative Examples, when the term portion is simply referred to, the term represents parts by weight. The following are the measurement and evaluation methods used in the present invention.

(2) 1) Measurement of Solids Concentration of Adhesive Composition

(3) A sample (adhesive composition) (about 1 g) is weighed in an aluminum cup having a diameter of 5 cm and a height of 1 cm. Subsequently, the aluminum cup containing the sample is dried in a vacuum dryer at 60 C. for 6 hours. The aluminum cup removed from the vacuum dryer is placed in a desiccator, and left to stand for cooling at room temperature for 30 minutes. The aluminum cup is removed from the desiccator to be weighed, and the solids concentration (wt %) of the sample (adhesive composition) is calculated from the weight change before and after the vacuum drying (the following formula).
Solids concentration of adhesive composition (wt %)=[(sample weight before vacuum drying)(sample weight after vacuum drying)]/(sample weight before vacuum drying)100
2) Qualitative Analysis of Composition Weight Ratio (Tackifier Content)

(4) The dried sample (resin) obtained through the measurement of the solids concentration above was dissolved in deuterochloroform, and the ratio of the modified polyethylene copolymer, tackifier, and polypropylene-based resin was determined by .sup.1H-NMR analysis, using a nuclear magnetic resonance (NMR) analyzer Gemini 400-MR produced by Varian Medical Systems.

(5) 3) Measurement of Viscosity of Adhesive Composition

(6) The adhesive compositions obtained in the Examples and Comparative Examples were each placed in a 50-cc glass sample tube provided with an airtight stopper, and maintained in a constant-temperature water tank at 25 C. for 12 hours. Subsequently, 0.6 g of the sample was subjected to measurement using a Viscometer TV-22 (E-type viscometer) produced by Toki Sangyo Co., Ltd., under the following conditions: rotor: No. 0.8 (=48)R24, range: H, rotation number: 5 rpm, and temperature: 25 C.

(7) 4) Measurement of the Melting Point of the Modified Polyethylene Copolymer by DSC

(8) About 5 mg of the modified polyethylene copolymer sample was weighed in a hermetically sealable aluminum pan, and a warming and cooling cycle of 50 C..fwdarw.200 C..fwdarw.50 C. at a rate of 10 C./min was repeated twice, using a DSC Q2000 produced by TA Instruments Japan Inc. The minimum point temperature of the endothermic peak that appeared when the temperature was increased the second time was read as the melting point.

(9) 5) Evaluation of Storage Stability of Adhesive Composition

(10) The adhesive compositions prepared in the Examples and Comparative Examples were stored while being left to stand in an incubator (20 C. or 15 C.). The change in appearance of the solutions after being left to stand for 24 hours was observed, and the results were evaluated based on the following criteria.

(11) A: the adhesive composition maintained the flowability equivalent to that at the time when it was prepared.

(12) B: the viscosity of the adhesive composition increased, but the flowability was maintained.

(13) C: the adhesive composition was solidified, and had no flowability.

(14) 6) Evaluation 1 of Adhesion to Polyethylene Substrate (Cross-Cut Peel Test)

(15) The adhesive compositions obtained in the Examples and Comparative Examples were each applied to a high density polyethylene (HDPE) test piece (thickness: 2 m, size: 25 mm100 mm, density: 0.95 g/cm.sup.3) produced by Paltek corporation or a low density polyethylene (LDPE) test piece of the same size (density: 0.92 g/cm.sup.3) produced by the same company, using a wire bar (#16E) such that the film thickness after drying became 10 m, and dried in a hot air dryer at 90 C. for 10 minutes. After the test pieces removed from the dryer were left to stand at room temperature for 1 hour, a grid of 100 squares was formed at 1-nm intervals on the coating surface using a cutter knife, adhesive cellophane tape was applied to the surface of the grid portion, and the tape was peeled off (cross-cut peel test). The number of squares peeled off was counted, and the results were shown as 0/100 when all of the squares were peeled off, and 100/100 when none of the squares were peeled off. Table 2 shows the results.

(16) 7) Evaluation 2 of Adhesion to LDPE Polyethylene Substrate (Film 90 Peel Test)

(17) The adhesive compositions obtained in the Examples and Comparative Examples were each applied to an LDPE film having a thickness of 40 m (density: 0.92 g/cm.sup.3) produced by Nakagawa Seitaikako Co., Ltd. using a wire bar (#16E) such that the film thickness after drying became 10 m, and dried in a hot air dryer at 90 C. for 10 minutes. After drying, the film was cut into 10 strip shaped pieces (2.5 cm10 cm), and the coating surfaces were bonded to each other, followed by heat-sealing at 90 C. at a pressure of 3 kgf/cm.sup.2 for 30 seconds to produce 5 specimens on which a heat-sealed layer with a width of 1 cm was formed. The end of the specimen was clamped between chucks of a tensile tester (RTM-100 produced by Orientec) and pulled in the vertical direction using a load cell of 5 kgf at a pulling speed of 50 mm/min at 25 C. in air; in this manner, a 90 peel test was performed. Table 2 shows the average value calculated using the obtained five values of peel strength.

Example 1

(18) The following starting materials were placed in a 1-L glass flask equipped with a thermometer, a condenser, and a stirring rod, and stirred at 80 C. for 1 hour to homogeneously dissolve the resin content, thus preparing an adhesive composition. Kernel (registered trademark) KJ640T
(a modified polyethylene copolymer produced by Japan Polyethylene Corporation): 100 parts YS Polyster (registered trademark) T130
(a terpene phenol-based tackifier produced by Yasuhara Chemical Co., Ltd.): 50 parts MCH (methylcyclohexane): 850 parts

(19) After cooling, the solution was collected to obtain the adhesive composition. The solids concentration and the amounts of the modified polyethylene copolymer resin and the tackifier were measured, and based on these results, the weight ratio of each component above was determined. Table 1 shows the results, together with the measurement values of the melting points of the modified polyethylene copolymers. Additionally, in accordance with the evaluation and measurement methods described above, the solution viscosity at 25 C. and the solution (adhesive composition) storage stability at 20 C. or 15 C. were measured, and the cross-cut peel test with respect to the HDPE and LDPE films, and the 90 peel test with respect to the LDPE film were performed. Table 2 shows the evaluation results.

Example 2

(20) The following starting materials were placed in a 1-L glass flask equipped with a thermometer, a condenser, and a stirring rod, and stirred at 80 C. for 1 hour to homogeneously dissolve the resin content, thus preparing an adhesive composition. Rexpearl ET350X
(a modified polyethylene copolymer produced by Japan Polyethylene Corporation): 100 parts YS Polyster T130
(a terpene phenol-based tackifier produced by Yasuhara Chemical Co., Ltd.): 70 parts Toluene: 963 parts

(21) After cooling, the solution was collected, and the solution characteristics of the obtained adhesive composition, and the adhesion of the obtained adhesive composition to a polyethylene substrate were measured as in Example 1. Tables 1 and 2 show the results.

Example 3

(22) The following starting materials were placed in a 2-L glass flask equipped with a thermometer, a condenser, and a stirring rod, and stirred at 80 C. for 1 hour to homogeneously dissolve the resin content, thus preparing an adhesive composition. Kernel KJ640T
(a modified polyethylene copolymer produced by Japan Polyethylene Corporation): 100 parts YS Polyster U130
(a terpene phenol-based tackifier produced by Yasuhara Chemical Co., Ltd.): 40 parts MCH (methylcyclohexane): 793 parts

(23) After cooling, the solution was collected, and the solution characteristics of the obtained adhesive composition, and the adhesion of the obtained adhesive composition to a polyethylene substrate were measured as in Example 1. Tables 1 and 2 show the results.

Example 4

(24) The following starting materials were placed in a 2-L glass flask equipped with a thermometer, a condenser, and a stirring rod, and stirred at 80 C. for 1 hour to homogeneously dissolve the resin content, thus preparing an adhesive composition. Kernel KJ640T
(a modified polyethylene copolymer produced by Japan Polyethylene Corporation): 90 parts Hardlen DX-526P (chlorine content: 26 wt %)
(a chlorinated modified polypropylene copolymer produced by Toyobo Co., Ltd.): 10 parts YS Polyster T130
(a terpene phenol-based tackifier produced by Yasuhara Chemical Co., Ltd.): 50 parts CH (cyclohexane): 765 parts Ethyl acetate: 85 parts

(25) After cooling, the solution was collected, and the solution characteristics of the obtained adhesive composition, and the adhesion of the obtained adhesive composition to a polyethylene substrate were measured as in Example 1. Tables 1 and 2 show the results.

Example 5

(26) The following starting materials were placed in a 2-L glass flask equipped with a thermometer, a condenser, and a stirring rod, and stirred at 80 C. for 1 hour to homogeneously dissolve the resin content, thus preparing an adhesive composition. Kernel KJ640T
(a modified polyethylene copolymer produced by Japan Polyethylene Corporation): 90 parts L-Modu 5400
(a polypropylene resin produced by Idemitsu Kosan Co., Ltd.): 10 parts YS Polyster T130
(a terpene phenol-based tackifier produced by Yasuhara Chemical Co., Ltd.): 50 parts CH (cyclohexane): 765 parts Ethyl acetate: 85 parts

(27) After cooling, the solution was collected, and the solution characteristics of the obtained adhesive composition, and the adhesion of the obtained adhesive composition to a polyethylene substrate were measured as in Example 1. Tables 1 and 2 show the results.

Example 6

(28) The following starting materials were placed in a 2-L glass flask equipped with a thermometer, a condenser, and a stirring rod, and stirred at 80 C. for 1 hour to homogeneously dissolve the resin content, thus preparing an adhesive composition. Kernel KJ640T
(a modified polyethylene copolymer produced by Japan Polyethylene Corporation): 100 parts Hardlen DX-526P (chlorine content: 26 wt %)
(a chlorinated modified polypropylene copolymer produced by Toyobo Co., Ltd.): 10 parts Clearon K100
(a hydrogenated terpene-based tackifier produced by Yasuhara Chemical Co., Ltd.): 50 parts CH (cyclohexane): 765 parts Butyl acetate: 85 parts

(29) After cooling, the solution was collected, and the solution characteristics of the obtained adhesive composition, and the adhesion of the obtained adhesive composition to a polyethylene substrate were measured as in Example 1. Tables 1 and 2 show the results.

Example 7

(30) The following starting materials were placed in a 2-L glass flask equipped with a thermometer, a condenser, and a stirring rod, and stirred at 80 C. for 1 hour to homogeneously dissolve the resin content, thus preparing an adhesive composition. Kernel KJ640T
(a modified polyethylene copolymer produced by Japan Polyethylene Corporation): 110 parts YS Polyster T130
(a terpene phenol-based tackifier produced by Yasuhara Chemical Co., Ltd.): 110 parts MCH (methylcyclohexane): 780 parts

(31) After cooling, the solution was collected, and the solution characteristics of the obtained adhesive composition, and the adhesion of the obtained adhesive composition to a polyethylene substrate were measured as in Example 1. Tables 1 and 2 show the results.

Comparative Example 1

(32) An adhesive composition was obtained as in Example 1, except that Kernel KJ640T was changed to Rexpearl (registered trademark) ET330H (a modified polyethylene resin produced by Japan Polyethylene Corporation, melting point: 86 C.). Table 1 shows the solution characteristics of the obtained adhesive composition. As shown in Table 1, the obtained adhesive composition was in the solidified state at room temperature (25 C.) and could not be applied to a substrate; therefore, the evaluation of the adhesion was impossible.

Comparative Example 2

(33) An adhesive composition was obtained as in Example 1, except that Kernel KJ640T was changed to Rexpearl ET720X (a modified polyethylene resin produced by Japan Polyethylene Corporation, melting point: 98 C.). Table 1 shows the solution characteristics of the obtained adhesive composition. As shown in Table 1, the obtained adhesive composition was in the solidified state at room temperature (25 C.) and could not be applied to a substrate; therefore, the evaluation of the adhesion was impossible.

Comparative Example 3

(34) An adhesive composition was obtained as in Example 1, except that Kernel KJ640T was changed to Nucrel (registered trademark) N1560 (a modified polyethylene resin produced by Mitsui Chemicals, Inc., melting point: 95 C.). Table 1 shows the solution characteristics of the obtained adhesive composition. As shown in Table 1, the obtained adhesive composition was in the solidified state at room temperature (25 C.) and could not be applied to a substrate; therefore, the evaluation of the adhesion was impossible.

Comparative Example 4

(35) The following starting materials were placed in a 1-L glass flask equipped with a thermometer, a condenser, and a stirring rod, and stirred at 80 C. for 1 hour to homogeneously dissolve the resin content, thus preparing an adhesive composition. Kernel KJ640T (melting point: 58 C.)
(a modified polyethylene resin produced by Japan Polyethylene Corporation): 150 parts MCH (methylcyclohexane): 850 parts

(36) After cooling, the solution was collected, and the solution characteristics of the obtained adhesive composition, and the adhesion of the obtained adhesive composition to a polyethylene substrate were measured as in Example 1. Tables 1 and 2 show the results.

Comparative Example 5

(37) The following starting materials were placed in a 1-L glass flask equipped with a thermometer, a condenser, and a stirring rod, and stirred at 80 C. for 1 hour to homogeneously dissolve the resin content, thus preparing an adhesive composition. Kernel KJ640T (melting point: 58 C.)
(a modified polyethylene resin produced by Japan Polyethylene Corporation): 100 parts YS Polyster T130
(a terpene phenol-based tackifier produced by Yasuhara Chemical Co., Ltd.): 20 parts MCH (methylcyclohexane): 680 parts

(38) After cooling, the solution was collected, and the solution characteristics of the obtained adhesive composition, and the adhesion of the obtained adhesive composition to a polyethylene substrate were measured as in Example 1. Tables 1 and 2 show the results.

Comparative Example 6

(39) The following starting materials were placed in a 1-L glass flask equipped with a thermometer, a condenser, and a stirring rod, and stirred at 80 C. for 1 hour to homogeneously dissolve the resin content, thus preparing an adhesive composition. Kernel KJ640T (melting point: 58 C.)
(a modified polyethylene resin produced by Japan Polyethylene Corporation): 100 parts YS Polyster T130
(a terpene phenol-based tackifier produced by Yasuhara Chemical Co., Ltd.): 120 parts MCH (methylcyclohexane): 1247 parts

(40) After cooling, the solution was collected, and the solution characteristics of the obtained adhesive composition, and the adhesion of the obtained adhesive composition to a polyethylene substrate were measured as in Example 1. Tables 1 and 2 show the results.

Comparative Example 7

(41) An adhesive composition was obtained as in Example 1, except that the YS Polyster T130 was changed to YS resin SX-100 (a styrene resin produced by Yasuhara Chemical Co., Ltd.), and the solution characteristics of the obtained adhesive composition, and the adhesion of the obtained adhesive composition to a polyethylene substrate were measured as in Example 1. Tables 1 and 2 show the results.

Comparative Example 8

(42) An adhesive composition was obtained as in Example 1, except that the YS Polyster T130 was changed to Hariester TF (a rosin-based resin produced by Harima Chemicals Group, Inc.), and the solution characteristics of the obtained adhesive composition, and the adhesion of the obtained adhesive composition to a polyethylene substrate were measured as in Example 1. Tables 1 and 2 show the results.

Comparative Example 9

(43) An adhesive composition was obtained as in Example 1, except that the YS Polyster T130 was changed to Haritack SE10 (a rosin-based resin produced by Harima Chemicals Group, Inc.), and the solution characteristics of the obtained adhesive composition, and the adhesion of the obtained adhesive composition to a polyethylene substrate were measured as in Example 1. Tables 1 and 2 show the results.

Comparative Example 10

(44) An adhesive composition was obtained as in Example 1, except that the YS Polyster T130 was changed to Neotall (registered trademark) 125HK (a rosin-based resin produced by Harima Chemicals Group, Inc.), and the solution characteristics of the obtained adhesive composition, and the adhesion of the obtained adhesive composition to a polyethylene substrate were measured as in Example 1. Tables 1 and 2 show the results.

Comparative Example 11

(45) An adhesive composition was obtained as in Example 1, except that the YS Polyster T130 was changed to Super ester A-75 (a rosin-based resin produced by Arakawa Chemical Industries, Ltd.), and the solution characteristics of the obtained adhesive composition, and the adhesion of the obtained adhesive composition to a polyethylene substrate were measured as in Example 1. Tables 1 and 2 show the results.

Comparative Example 12

(46) An adhesive composition was obtained as in Example 1, except that the YS Polyster T130 was changed to Ester gum H (a rosin-based resin produced by Arakawa Chemical Industries, Ltd.), and the solution characteristics of the obtained adhesive composition, and the adhesion of the obtained adhesive composition to a polyethylene substrate were measured as in Example 1. Tables 1 and 2 show the results.

Comparative Example 13

(47) An adhesive composition was obtained as in Example 1, except that the YS Polyster T130 was changed to Ester gum AA-L (a rosin-based resin produced by Arakawa Chemical Industries, Ltd.), and the solution characteristics of the obtained adhesive composition, and the adhesion of the obtained adhesive composition to a polyethylene substrate were measured as in Example 1. Tables 1 and 2 show the results.

Comparative Example 14

(48) An adhesive composition was obtained as in Example 1, except that the YS Polyster T130 was changed to Arkon (registered trademark) P-90 (an alicyclic saturated hydrocarbon-based resin produced by Arakawa Chemical Industries, Ltd.), and the solution characteristics of the obtained adhesive composition, and the adhesion of the obtained adhesive composition to a polyethylene substrate were measured as in Example 1. Tables 1 and 2 show the results.

Comparative Example 15

(49) An adhesive composition was obtained as in Example 1, except that the YS Polyster T130 was changed to Arkon M-90 (an alicyclic saturated hydrocarbon-based resin produced by Arakawa Chemical Industries, Ltd.), and the solution characteristics of the obtained adhesive composition, and the adhesion of the obtained adhesive composition to a polyethylene substrate were measured as in Example 1. Tables 1 and 2 show the results.

Comparative Example 16

(50) An adhesive composition was obtained as in Example 1, except that the YS Polyster T130 was changed to Pinecrystal (registered trademark) KR-50M (a rosin metal salt-based resin produced by Arakawa Chemical Industries, Ltd.), and the solution characteristics of the obtained adhesive composition, and the adhesion of the obtained adhesive composition to a polyethylene substrate were measured as in Example 1. Tables 1 and 2 show the results.

(51) As is clear from Tables 1 and 2, according to the present invention, it is possible to obtain adhesive compositions with excellent stability at low temperatures and excellent adhesion to both low density polyethylene (LDPE) substrates and high density polyethylene (HDPE) substrates.

(52) Comparative Examples 1 to 3 serve as examples in which the modified polyethylene copolymer (component A) had a melting point of more than 80 C., Comparative Examples 4 to 6 serve as examples in which the amount of component B was outside the range of 30 to 100 parts by weight, per 100 parts by weight of component A, and Comparative Examples 7 to 16 serve as examples in which a tackifier other than those of terpene-based tackifiers was used as component B.

(53) TABLE-US-00001 TABLE 1 Adhesive resin component Composition weight ratio Weight ratio Modified polyethylene Component A/ Component A + copolymer Organic Polypropylene- Component B/ Component B + Ex./ (component A); Tackifier solvent based resin Component C/ Component D Comp. Ex. melting point ( C. ) (component B) (component C) (component D) Component D wt % Ex-1 Kernel KJ640T: 58 C. YS Polyster T130 MCH None 10/5/85/0 15 Ex-2 Rexpearl ET350X: 73 C. YS Polyster T130 Toluene None 10/7/96/0 15 Ex-3 Kernel KJ640T: 58 C. YS Polyster T130 MCH None 10/4/79/0 15 Ex-4 Kernel KJ640T: 58 C. YS Polyster T130 CH/ethyl Hardlen DX-526P 9/5/85/1 15 acetate = 90/10 Ex-5 Kernel KJ640T: 58 C. YS Polyster T130 CH/ethyl L-Modu S400 9/5/85/1 15 acetate = 90/10 Ex-6 Kernel KJ640T: 58 C. Clearon K100 CH/ethyl Hardlen DX-526P 9/5/85/1 15 acetate = 90/10 Ex-7 Kernel KJ640T: 58 C. YS Polyster T130 MCH None 10/8/64/0 22 Comp. Ex-1 Rexpearl ET330H: 86 C. YS Polyster T130 MCH None 10/5/85/0 15 Comp. Ex-2 Rexpearl ET720X: 98 C. YS Polyster T130 MCH None 10/5/85/0 15 Comp. Ex-3 Nucrel N1560: 90 C. YS Polyster T130 MCH None 10/5/85/0 15 Comp. Ex-4 Kernel KJ640T: 58 C. None MCH None 15/0/85/0 15 Comp. Ex-5 Kernel KJ640T. 58 C. YS Polyster T130 MCH None 10/2/68/0 15 Comp. Ex-6 Kernel KJ640T: 58 C. YS Polyster T130 MCH None 10/12/125/0 15 Comp. Ex-7 Kernel KJ640T: 58 C. YS resin SX-100 MCH None 10/5/85/0 15 Comp. Ex-8 Kernel KJ640T: 58 C. Hariester TF MCH None 10/5/85/0 15 Comp. Ex-9 Kernel KJ640T: 58 C. Haritack SE10 MCH None 10/5/85/0 15 Comp. Ex-10 Kernel KJ640T: 58 C. Neotall 125HK MCH None 10/5/85/0 15 Comp. Ex-11 Kernel KJ640T: 58 C. Super ester A-75 MCH None 10/5/85/0 15 Comp. Ex-12 Kernel KJ640T: 58 C. Ester gum H MCH None 10/5/85/0 15 Comp. Ex-13 Kernel KJ640T: 58 C. Ester gum AA-L MCH None 10/5/85/0 15 Comp. Ex-14 Kernel KJ640T: 58 C. Arkon P-90 MCH None 10/5/85/0 15 Comp. Ex-15 Kernel KJ640T: 58 C. Arkon M-90 MCH None 10/5/85/0 15 Comp. Ex-16 Kernel KJ640T: 58 C. Pinecrystal KR-50M MCH None 10/5/85/0 15

(54) TABLE-US-00002 TABLE 2 Evaluation criteria Solution viscosity Solution storage HDPE film LDPE film LDPE film Ex./ at 25 C. stability Cross-cut Cross-cut 90 peel strength Comp. Ex. (mPa/s) 20 C. 15 C. peel test peel test (N/cm) Ex-1 157 A B 100/100 100/100 3.0 Ex-2 97 A B 100/100 100/100 2.8 Ex-3 158 A B 95/100 100/100 3.2 Ex-4 128 A A 100/100 95/100 2.5 Ex-5 121 A A 100/100 90/100 2.4 Ex-6 104 A A 70/100 100/100 2.6 Ex-7 267 A B 100/100 70/100 2.0 Comp. Ex-1 Unmeasurable C C Unmeasurable Unmeasurable Unmeasurable Comp. Ex-2 Unmeasurable C C Unmeasurable Unmeasurable Unmeasurable Comp. Ex-3 Unmeasurable C C Unmeasurable Unmeasurable Unmeasurable Comp. Ex-4 986 B C 20/100 100/100 3.9 Comp. Ex-5 348 A C 35/100 98/100 3.4 Comp. Ex-6 47 A A 10/100 15/100 0.5 Comp. Ex-7 134 A A 0/100 100/100 1.8 Comp. Ex-8 176 A C 10/100 100/100 2.2 Comp. Ex-9 170 A B 0/100 100/100 2.6 Comp. Ex-13 176 A C 0/100 25/100 0.8 Comp. Ex-11 171 A C 0/100 100/100 2.4 Comp. Ex-12 167 A B 0/100 100/100 2.2 Comp. Ex-13 138 A B 0/100 100/100 2.2 Comp. Ex-14 163 A B 0/100 100/100 3.0 Comp. Ex-15 132 A B 0/100 90/100 1.9 Comp. Ex-16 178 A C 0/100 40/100 1.2

INDUSTRIAL APPLICABILITY

(55) The adhesive composition according to the present invention has excellent storage stability at low temperatures and excellent adhesion to polyolefin-based resin substrates, in particular, polyethylene-based resin substrates, and is useful for the application of a primer, a coating composition, an ink, a coating agent, and an adhesive for painting, printing, gluing, or coating with respect to these substrates.