LASER CUTTING HEAD FOR CUTTING HARD, BRITTLE PRODUCTS AND LASER CUTTING DEVICE THEREOF

Abstract

The present disclosure relates to a laser cutting field, and in particular to a laser cutting head for cutting hard, brittle products and a laser cutting device for cutting hard, brittle products. The laser cutting head includes a polarizing element, a binary phase element and a focusing element. The polarizing element, the binary phase element and the focusing element are disposed in sequence. The polarizing element, the binary phase element, and the focusing element are structured and configured together such that a laser light is configured to pass through the polarizing element to form a polarizing laser light that is emitted to the binary phase element, the binary phase element modulating phase of the polarizing laser light. A diffractive laser light is formed in a location of the binary phase element, which is emitted to the focusing element.

Claims

1. A laser cutting head for cutting hard, brittle products, comprising: a polarizing element, a binary phase element and a focusing element, wherein the polarizing element, the binary phase element and the focusing element are disposed in sequence; wherein the polarizing element, the binary phase element, and the focusing element are structured and configured together such that a laser light is configured to pass through the polarizing element to form a polarizing laser light that is emitted to the binary phase element, the binary phase element modulating phase of the polarizing laser light; and wherein a diffractive laser light is formed in a location of the binary phase element, which is emitted to the focusing element, the focusing element using the diffractive laser light to emit a focusing laser light in a location of the focusing element for cutting hard, brittle products.

2. The laser cutting head according to claim 1, wherein the binary phase element comprises a base and a plurality of circular ring structures; the circular ring structures are disposed on the base and are sequentially disposed from inside to outside; a phase difference of two adjacent circular ring structures ranges from 0.5 to 2.

3. The laser cutting head according to claim 2, wherein the phase difference of two adjacent circular ring structures is .

4. The laser cutting head according to claim 2, wherein numbers of the circular ring structure are disposed as four.

5. The laser cutting head according to claim 1, wherein the focusing element is a focusing objective lens.

6. The laser cutting head according to claim 2, wherein he focusing element is a focusing objective lens.

7. The laser cutting head according to claim 3, wherein he focusing element is a focusing objective lens.

8. The laser cutting head according to claim 4, wherein he focusing element is a focusing objective lens.

9. The laser cutting head according to claim 5, wherein a Numerical Aperture value of the focusing objective lens ranges from 0.5-1.2.

10. The laser cutting head according to claim 9, wherein the Numerical Aperture value of the focusing objective lens is 0.8.

11. The laser cutting head according to claim 10, wherein polarizing direction of the polarizing element is radial.

12. A laser cutting device, comprising a laser device and a laser cutting head according to claim 1; the laser cutting head comprises a polarizing element, a binary phase element and a focusing element; the polarizing element, the binary phase element and the focusing element are disposed in sequence; the laser device emits a laser light to the laser cutting head.

13. The laser cutting device according to claim 12, wherein the laser cutting device further comprises a clamping device, the clamping device clamps hard, brittle products.

14. The laser cutting device according to claim 12, wherein the binary phase element comprises a base and a plurality of circular ring structures; the circular ring structures are disposed on the base and are sequentially disposed from inside to outside; a phase difference of two adjacent circular ring structures adjacent ranges from 0.5 to 2.

15. The laser cutting device according to claim 14, wherein the phase difference of two adjacent circular ring structures is .

16. The laser cutting device according to claim 15, wherein numbers of the circular ring structure are disposed as four.

17. The laser cutting device according to claim 12, wherein he focusing element is a focusing objective lens.

18. The laser cutting device according to claim 17, wherein a Numerical Aperture value of the focusing objective lens ranges from 0.5-1.2.

19. The laser cutting device according to claim 18, wherein the Numerical Aperture value of the focusing objective lens is 0.8.

20. The laser cutting device according to claim 19, wherein polarizing direction of the polarizing element is radial.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0016] The present disclosure is further described below with reference to the accompanying drawings, where:

[0017] FIG. 1 is a schematic diagram of a laser cutting head of the present disclosure.

[0018] FIG. 2 is a schematic diagram of a binary phase element of the present disclosure.

[0019] FIG. 3 is an effect diagram of a light spot of a focusing laser light of the present disclosure.

[0020] FIG. 4 is a coordinate diagram of light spot intensity of the present disclosure.

[0021] FIG. 5 is an effect diagram of peak power density of energy of a focusing laser light uniformly changing in a focal depth of the present disclosure.

[0022] FIG. 6 is a coordinate diagram of light spot energy density of the present disclosure.

[0023] FIG. 7 is an effect diagram of a light spot of a focusing laser light when a laser cutting head punches and cuts of the present disclosure.

[0024] FIG. 8 is a flow schematic diagram of light spot distribution of a focusing laser light when a laser cutting head punches and cuts of the present disclosure.

DETAILED DESCRIPTION

[0025] The present disclosure is further described below in detail with reference to the accompanying drawings and embodiments.

[0026] As shown in FIGS. 1-8, the present disclosure provides one embodiment of a laser cutting head for cutting hard, brittle products.

[0027] Specifically, referring to FIG. 1, the present disclosure provides the laser cutting head for cutting hard, brittle products 10, where the hard, brittle products 10 are transparent products such as glass or ceramic, etc. The hard, brittle products 10 are usually applied to electronic products. The laser cutting head includes a polarizing element 1, a binary phase element 2, and a focusing element 3. The polarizing element 1, the binary phase element 2 and the focusing element 3 are disposed in sequence. As shown in FIG. 1, the polarizing element 1, the binary phase element 2 and the focusing element 3 are sequentially disposed from top to bottom. The hard, brittle products are disposed below the focusing element 3. The laser cutting head further includes a housing. The polarizing element 1, the binary phase element 2 and the focusing element 3 are all disposed inside the housing and are disposed at a certain distance. The focusing element is disposed on a head end of the housing. And the housing protects the polarizing element 1, the binary phase element 2 and the focusing element 3 from damage. An external laser light is emitted to the polarizing element 1, and polarizing direction of the polarizing element 1 is radial. Due to the fact that spreading direction of the laser light is different from the polarizing direction of the polarizing element 1, so that a polarizing laser light is formed in a location of the polarizing element 1. And then the polarizing laser light is emitted to the binary phase element 2. The binary phase element 2 performs corresponding modulation on a phase of the polarizing laser light. A diffractive laser light is formed in a location of the binary phase element 2. The diffractive laser light is emitted to the focusing element 3, and a focusing laser light for cutting hard, brittle products 10 is formed in a location of the focusing element 3.

[0028] Referring to FIG. 3, a light spot of the focusing laser light is very small, so that a smaller heat affected area is formed in a surface and an interior of the hard, brittle products 10. A simulation result is shown in FIG. 4, where the X-axis is a transverse coordinate of the light spot and the Y-axis is intensity of the light spot. It is known that the light spot of the focusing laser light is very small. Referring to FIG. 5, peak power density change of energy in whole focal depth is uniform while the long focal depth is namely achieved. That is, the more uniform energy distribution in a focal depth direction is, the more uniform a stress effect inside cutting materials is. Referring to FIG. 6, the X-axis is a coordinate of the focal depth direction, and the Y-axis is intensity of the light spot. It is known that energy distribution of the focusing laser light in the focal depth direction is uniform.

[0029] The laser cutting head is low in machining difficulty and capable of ensuring machining precision. Furthermore, due to the fact that a mechanical installation mode is adopted, optical debugging is facilitated. Furthermore, an optical path is compact in structure, machining stability and error caused by machines and machining stability and error caused by spatial dimensions are reduced. Furthermore, the focusing laser light has more uniform energy distribution in the focal depth direction and more uniform stress effect inside cutting materials. So that the focusing laser light penetrates the hard, brittle products 10 to achieve an ideal cutting effect.

[0030] Referring FIG. 1 and FIG. 2, the binary phase element 2 is a binary optical element. A theoretical basis of the binary optical element is a diffraction theory of light, which utilizes computer-aided optimization design and manufacture of an ultra-large integrated circuit. The binary optical element is a diffractive optical element modulated by a pure phase. The binary phase element 2 is integrally made of transparent glass. The binary phase element 2 includes a base and a plurality of circular ring structures 21. The circular ring structures 21 are etched on the base and are sequentially disposed from inside to outside. Specifically as shown in FIG. 2, numbers of the circular ring structures 21 are disposed as four, and radiuses of the circular ring structures 21 are different. Furthermore, the circular ring structure 21 with the minimum radius is disposed inside. The circular ring structures are sequentially disposed from inside to outside according to radius size. A phase difference of two adjacent circular ring structures ranges from 0.5 to 2. The phase difference is a difference of the laser light between different amplitude states. Furthermore, the phase difference of two adjacent circular ring structures is n.

[0031] It should be noted that, focusing laser lights having different focal depths are obtained by changing the light spot size of the laser light emitted to the polarizing element 1 and changing parameters of an internal annular structure corresponding to a binary phase plate. Thus, penetrating and cutting of the hard, brittle products with different thicknesses is finally realized, and requirements of cutting process of hard, brittle material parts of different electronic products are satisfied.

[0032] Furthermore, the focusing element 3 is a focusing objective lens. The focusing objective lens focuses the diffractive laser light after receiving the diffractive laser light, and emits the diffractive laser light to the hard, brittle products 10. A Numerical Aperture value of the focusing objective lens ranges from 0.5-1.2. The Numerical Aperture value is a numerical aperture, and is a parameter value for measuring a capability of a lens of the focusing objective lens collecting an angle range of the laser light. A formula is as follow: NA=n*sin , n is a refractive index of a working medium of the lens, is half of a maximum aperture angle when the laser light enters or exits the lens. In one embodiment, the Numerical Aperture value of the focusing objective lens is relatively high, that is, the maximum aperture angle of an emergent laser light of the lens of the focusing objective lens is relatively large. Furthermore, the Numerical Aperture value of the focusing objective lens is 0.8.

[0033] It should be noted that, referring to FIG. 7, circular light spots with different radiuses are obtained by changing a topological charge number of a radial polarizing laser light passed through the polarizing element. Referring to FIG. 8, when the long focal depth is obtained, the light spots in the whole focal depths are uniformly distributed so as to realize taper-free punching and cutting of transparent brittle materials.

[0034] The present disclosure further provides one embodiment of a laser cutting device.

[0035] Specifically, the laser cutting device includes a laser device and the laser cutting head. The laser device emits the laser light to the laser cutting head. The laser cutting head emits the focusing laser light to the hard, brittle products 10, and the focusing laser light performs a cutting operation on the hard, brittle products 10.

[0036] Furthermore, the laser cutting device further includes a clamping device. The clamping device clamps the hard, brittle products 10. When the focusing laser light performs the cutting operation, the clamping device is required to clamp the hard, brittle products 10.

[0037] It should be understood that the specific embodiments described herein are only used to explain the present disclosure and are not intended to limit the present disclosure. Equivalent changes or modifications made by a scope of the present disclosure are covered by the present disclosure.