HIGH FIDELITY FEEDTHROUGH SYSTEM
20200243227 ยท 2020-07-30
Inventors
Cpc classification
H01B19/00
ELECTRICITY
International classification
Abstract
A system for the manufacturing of high-fidelity insulated components is described. Per field requirements, components crafted via the process are hermetically sealed, and are configured to employ appropriately matched materials in accordance with their inherent properties of thermal expansion. A pin, glass insulator, and ferule are present. As opposed to conventional insulated components which employ stainless steel as an inefficient conductor, the unique matching process of the system provides for the use of copper and silver alloys to maximize efficiency while maintaining a hermetic seal. Specific glass is selected in accordance with the desired alloy in order to maintain similar degrees of expansion and contraction per temperature variations.
Claims
1. A system of matching conductive materials to corresponding insulators in accordance with their inherent expansion properties for use in high signal integrity components connected to alternating current signals in an airborne environment comprising: oxidation baking a pin and a ferule of the component; placing appropriate glass bead in a desired position as an insulator around the pin and ferule; fusion baking the glass between the pin and ferule, creating a hermetic seal; placing the assembled glass, pin, and ferule into an oxidation removal bath, removing all oxidation from the fusion baking; and polishing the finished component.
2. The system of claim 1, wherein the pin and ferule of the component are composed of an alloy that contains any combination of Copper and/or Silver; and wherein the alloy is non-magnetic.
3. The system of claim 1, wherein the insulator is composed of a glass having CTE less than 2% of conductor CTE.
4. A sealed conductor apparatus capable of maintaining a hermetic seal even when expanded and contracted in an airborne environment comprising: a pin, said pin composed of any combination of silver and copper; wherein said combination of silver and copper are non-magnetic; a glass material, a ferule, said ferule composed of an alloy that contains any combination of Copper and/or Silver; and wherein said glass material is an insulator disposed around said pin, between said ferule.
5. The system of claim 4, wherein said glass material is composed of a glass having a CTE within 2% of conductor CTE.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0014] The present invention will be better understood with reference to the appended drawing sheets, wherein:
[0015]
[0016]
[0017]
[0018]
[0019]
[0020]
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT OF THE PRESENT INVENTION
[0021] The present invention is a system of thermal matching components for the construction of hermetic feedthroughs requiring high signal fidelity. The final assembly shall be interchangeable with present terminals for electromechanical device manufacturers. The starting point will be terminal pin and body that are ideal for radio signal transmission. Of primary consideration is conductivity of the pin. The best conductors of electricity are silver and copper. Any alloy combination of these two elements will have high conductivity and no magnetic properties. The secondary property will be the metal stiffness. The barrel must be stiff enough to endure fabrication & the pin must also be tolerant of package handling.
Materials
[0022] In construction of high performance feedthroughs, the primary property of the terminal should be high conductivity. Metals that can be magnetized should be excluded due to their adverse effects on signal integrity. Additionally, resistance to corrosion is necessary to eliminate the need for post plating with magnetic nickel. The third conductor consideration is minimum stiffness to ensure the terminal's ability to hold its shape.
[0023] The complimentary feedthrough component is the insulator. The thermally matched glass shall be bondable to candidate conductors. As such, the closest match in expansion properties is ideal. Additionally, the insulator should have low porosity which insures an atmospheric barrier across high pressure differentials. Likewise, the insulator preferably has a low loss tangent with a dielectric constant between 4 and 20 for acceptable RF design characteristics.
[0024] The feedthrough assembly shall have temperature expansion closer to aluminum than conventional feedthroughs made with Kovar 42 and Corning 7070 materials to enhance overall package reliability.
Process
[0025] The process of feedthrough manufacture starts with fusing one glass and the two metal pieces together. Selection of thermal matched candidates must be fused together; the critical aspect of conductor/insulator choice is bondability. In terms of manufacturing of such components, the pairing of an insulator to a conductor must form a strong enough bond to ensure a seal across a wide temperature range. Additionally, the melting points of the conductor and insulator must be within the range of industry process limits for feedthrough assembly. Terminal rings, beads and pins are initially hand placed together inside of a holding block or firing fixture. The group of feedthroughs in fixture are then sent through a conveyer belt firing oven at temperatures above 450 C. The parts are then cooled and cleaned of oxidation. The finished feedthroughs are ready for direct installation into customer packages. This process is depicted in
Design
[0026] The present invention takes into account matching the best conductions with the closest expansion glass. Any metal with conductivity higher than baseline Kovar 42 with an International Annealed Copper Standard (IACS) of 4 would be considered advantageous. This includes the top 13 metals, per the chart shown in
[0027] Though none of the best conductors prove an ideal choice, a sufficient compromise can be found by alloying the top two elements silver and copper. The proper ratio of the two metals will achieve high conductivity, low magnetic permeability, sufficient strength and resistance to corrosion. There are two commercially available Ag/Cu alloys that have been developed for high luster and strength: sterling silver (Ag 92.5/Cu 7.5) for jewelry and coin silver (Ag 90/Cu10) for money. As such, insulators should fall within 5% of conductor CTE to ensure a good seal.
[0028] The matching of insulators will be selections from the higher expansion glasses available in industry. The insulator known as DG-0091 from Materials Research Group has an ideal CTE of 18.8, which provides a match difference of <2% when paired with sterling. Glass insulators known to the industry are depicted in
[0029] As a corollary, coin silver is best suited to be paired with Viox Ceredyne glass #37903. This alloy was developed with high strength to be used as circulated coinage. It has a CTE of 18.2 and the insulator has a CTE of 18.26. While this is a slightly superior match than sterling to DG-0091, both combinations will achieve the goals of providing a high electrical efficiency hermetic seal. Selecting materials in this manner for conductors enhances their manufacturability, as they are directly solderable without the need for post plating.
[0030] The ideal matched pairs used in the manufacturing of the component via the system of the present invention, is depicted via a table in
[0031] It should be understood that the present invention is a system of matching ideal materials to their respective components. The components employed include a pin (10), a ferule (20), and a glass (30). Similarly, it should be understood, per convention, that the glass (30) is originally a glass bead, which, during the manufacturing process of the present invention, is changed from the original bead shape to the final insulator shape as shown in
[0032] Having illustrated the present invention, it should be understood that various adjustments and versions might be implemented without venturing away from the essence of the present invention. Further, it should be understood that the present invention is not solely limited to the invention as described in the embodiments above, but further comprises any and all embodiments within the scope of this application. That being any conductor alloy comprised of any Copper, Silver, and/or Titanium. It should be understood that the alloy of the pin (10) has a higher conductivity than traditional pins presently used in such components which are commonly made of steel, or occasionally aluminum. As such, the present invention presents a superior mechanism by which transmissions and/or current may be conveyed across a hermetic sealed component.
[0033] The foregoing descriptions of specific embodiments of the present invention have been presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the present invention to the precise forms disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiment was chosen and described in order to best explain the principles of the present invention and its practical application, to thereby enable others skilled in the art to best utilize the present invention and various embodiments with various modifications as are suited to the particular use contemplated.