HEAT DISSIPATION DEVICE

Abstract

A heat dissipation device includes a main body and at least one heat conduction member. The main body has a top face. A periphery of the top face has a connection section. One end of the heat conduction member is correspondingly in contact and connection with the top face or the connection section. By means of the structure design of the present invention, the horizontal heat dissipation effect is greatly enhanced and the heat dissipation effect of the entire heat dissipation device is greatly enhanced.

Claims

1. A heat dissipation device comprising: a main body having a top face; and at least one heat conduction member, one end of the heat conduction member being correspondingly in contact and connection with the top face.

2. The heat dissipation device as claimed in claim 1, wherein the main body has an upper plate and a lower plate, the upper and lower plates being correspondingly mated with each other to together define a chamber, the top face being correspondingly formed on an outer side of the chamber.

3. The heat dissipation device as claimed in claim 2, wherein the upper and lower plates are made of the same material or different materials.

4. The heat dissipation device as claimed in claim 2, wherein the material of the upper and lower plates is selected from a group consisting of gold, silver, copper, aluminum, iron, stainless steel, ceramic material, commercial pure titanium and titanium alloy.

5. The heat dissipation device as claimed in claim 2, wherein the upper plate is defined as a condensation side, while the lower plate is defined as a heat absorption side.

6. The heat dissipation device as claimed in claim 1, wherein the heat conduction member is selected from a group consisting of graphite, graphene, heat pipe and copper plate.

7. The heat dissipation device as claimed in claim 1, wherein the heat conduction member is correspondingly in contact with and attaches to the top face by means of adhesion, diffusion bonding, welding, sintering or laser welding.

8. A heat dissipation device comprising: a main body having a top face, a periphery of the top face having a connection section; and at least one heat conduction member, one end of the heat conduction member being correspondingly in contact and connection with the top face or the connection section.

9. The heat dissipation device as claimed in claim 8, wherein the main body has an upper plate and a lower plate, the upper and lower plates being correspondingly mated with each other to together define a chamber, the top face and the connection section being respectively correspondingly formed on an outer side of the chamber.

10. The heat dissipation device as claimed in claim 9, wherein the upper and lower plates are made of the same material or different materials.

11. The heat dissipation device as claimed in claim 9, wherein the material of the upper and lower plates is selected from a group consisting of gold, silver, copper, aluminum, iron, stainless steel, ceramic material, commercial pure titanium and titanium alloy.

12. The heat dissipation device as claimed in claim 9, wherein the upper plate is defined as a condensation side, while the lower plate is defined as a heat absorption side.

13. The heat dissipation device as claimed in claim 8, wherein the heat conduction member is selected from a group consisting of graphite, graphene, heat pipe and copper plate.

14. The heat dissipation device as claimed in claim 8, wherein the heat conduction member has a first face, the first face being correspondingly flush with the top face.

15. The heat dissipation device as claimed in claim 8, wherein the heat conduction member is correspondingly in contact with and attaches to the connection section or the top face by means of adhesion, diffusion bonding, welding, sintering or laser welding.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:

[0012] FIG. 1A is a perspective assembled view of a conventional heat dissipation device;

[0013] FIG. 1B is a sectional view of the conventional heat dissipation device;

[0014] FIG. 2 is a perspective exploded view of a first embodiment of the heat dissipation device of the present invention;

[0015] FIG. 3 is a perspective assembled view of the first embodiment of the heat dissipation device of the present invention;

[0016] FIG. 4 is a sectional view of the first embodiment of the heat dissipation device of the present invention; and

[0017] FIG. 5 is a sectional view of a second embodiment of the heat dissipation device of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Please refer to FIGS. 2, 3 and 4. FIG. 2 is a perspective exploded view of a first embodiment of the heat dissipation device of the present invention. FIG. 3 is a perspective assembled view of the first embodiment of the heat dissipation device of the present invention. FIG. 4 is a sectional view of the first embodiment of the heat dissipation device of the present invention. The first embodiment of the heat dissipation device 2 of the present invention includes a main body 20 and at least one heat conduction member 3. The main body 20 has a top face 200. A periphery of the top face 200 has a connection section 201. In this embodiment, the main body 20 is, but not limited to, a vapor chamber for illustration purposes. Alternatively, the main body 20 can be a heat pipe, a heat plate or any other heat dissipation device.

[0019] The main body 20 has an upper plate 20a and a lower plate 20b. The upper and lower plates 20a, 20b are correspondingly mated with each other to together define a chamber 203. The top face 200 and the connection section 201 are respectively correspondingly disposed on an outer side of the chamber 203. A capillary structure 4 and a working fluid 5 are disposed in the chamber 203. The upper and lower plates 20a, 20b can be made of the same material or different materials and are assembled with each other to form the main body 20. The material of the upper and lower plates 20a, 20b is selected from a group consisting of gold, silver, copper, aluminum, iron, stainless steel, ceramic material, commercial pure titanium and titanium alloy. An outer face of the upper plate 20a, (that is, the top face) is defined as a condensation side, while an outer face of the lower plate 20b, (that is, the bottom face) is defined as a heat absorption side.

[0020] In this embodiment, one end of the heat conduction member 3 is correspondingly in contact and connection with the top face 200. The heat conduction member 3 is selectively graphite or graphene. The heat conduction member 3 is correspondingly in contact with and attaches to the top face 200 by means of adhesion, diffusion bonding, welding, sintering or laser welding.

[0021] It should be noted that the working fluid 5 in the chamber 203 is positioned where the vapor-liquid circulation is performed. In addition, the main body 20 is further formed with a flange 202 as an outermost periphery of the main body 20 for connection and sealing of the main body 20. Therefore, the flange 202 is a void area without vapor-liquid circulation effect.

[0022] Please further refer to FIG. 4. According to the structural design of the present invention, the outer face of the lower plate 20b, (that is, the heat absorption side) of the heat dissipation device 2 is in contact with and attaches to a heat source 6 to absorb the heat thereof. At this time, the vapor-liquid circulation of the working fluid in the chamber 203 is performed so as to conduct and dissipate the heat. Also, the heat can be transferred from one end to the other end of the heat conduction member 3 attached to the top face 200 so as to enhance the heat conduction and dissipation effect in the horizontal direction of the main body 20. The other end of the heat conduction member 3 can be further connected to a heat dissipation component (not shown) to dissipate the heat. The heat dissipation component can be a heat sink or a radiating fin assembly. Accordingly, the heat dissipation effect of the entire heat dissipation device 2 of the present invention can be greatly enhanced to improve the shortcoming of the conventional heat dissipation device that the heat conduction member 3 is simply attached to the flange 202 of the main body 20 and fails to achieve any heat transfer effect.

[0023] In addition, it should be noted that the number and size of the heat conduction member 3, one end of which is in contact and connection with the top face 200 are not limited. The number and size of the heat conduction member 3 can be adjusted in accordance with the requirement of a user for the arrangement.

[0024] Please now refer to FIG. 5, which is a sectional view of a second embodiment of the heat dissipation device of the present invention. The second embodiment is partially identical to the first embodiment in structure and thus will not be redundantly described hereinafter. The second embodiment is different from the first embodiment in that one end of the heat conduction member 3 is correspondingly in contact and connection with the connection section 201. The connection section 201 has the form of a stepped structure. The flange 202 further outward extends from the stepped structure. The stepped structure is continuously arranged or discontinuously arranged. In this embodiment, as shown in the drawing, the stepped structure is continuously arranged. A first face 30 of the heat conduction member 3 is correspondingly flush with the top face 200 of the main body 20 (as shown in FIG. 5). Alternatively, the first face 30 of the heat conduction member 3 is not flush with the top face 200 of the main body 20, that is, the first face 30 is selectively lower than or higher than the top face 200 (not shown).

[0025] In conclusion, in comparison with the conventional heat dissipation device, the present invention has the following advantages: [0026] 1. The horizontal heat conduction and dissipation effect is greatly enhanced. [0027] 2. The heat dissipation effect of the entire heat dissipation device is greatly enhanced.

[0028] The present invention has been described with the above embodiments thereof and it is understood that many changes and modifications in such as the form or layout pattern or practicing step of the above embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.