MEMS microphone

Abstract

The present application discloses a MEMS microphone, including: a substrate having a cavity; and a capacitor system mounted on the substrate. The capacitor includes a back plate connected to the substrate; and a diaphragm forming a capacitor with the back plate. The back plate includes a back plate main body and a first connecting portion extending from the back plate main body toward the substrate, the first connecting portion connects with the substrate, and the diaphragm connects to the back plate main body. The vibration or the stress from the substrate will not transferred to the diaphragm, but released via the first connecting portion.

Claims

1. A MEMS microphone, including: a substrate having a cavity; a capacitor system mounted on the substrate, and including a back plate connected to the substrate; and a diaphragm forming a capacitor with the back plate; wherein the back plate includes a back plate main body and a first connecting portion extending from the back plate main body toward the substrate, the first connecting portion connects with the substrate, and the diaphragm connects to the back plate main body, the diaphragm includes a diaphragm main body spaced from the back plate main body and a second connecting portion extending from an edge of the diaphragm main body, the diaphragm main body connects to the back plate main body by the second connecting portion.

2. The MEMS microphone as described in claim 1, wherein the diaphragm is received in the cavity.

3. The MEMS microphone as described in claim 1, wherein the diaphragm is out of the cavity.

4. The MEMS microphone as described in claim 1, wherein the second connecting portion is made of isolated material.

5. The MEMS microphone as described in claim 4, wherein a length of the first connecting portion is greater than a length of the second connecting portion.

6. The MEMS microphone as described in claim 1, wherein the second connecting portion is perpendicular to the diaphragm main body.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Many aspects of the exemplary embodiment can be better understood with reference to the following drawings. The components in the drawing are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present disclosure.

(2) FIG. 1 is a cross-sectional view of a MEMS microphone in accordance with an exemplary embodiment of the present invention.

(3) FIG. 2 is a stress inducing diagram of a related MEMS microphone.

(4) FIG. 3 is a stress inducing diagram of the MEMS microphone of the exemplary embodiment of the present invention.

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENT

(5) The present disclosure will hereinafter be described in detail with reference to exemplary embodiment. To make the technical problems to be solved, technical solutions and beneficial effects of the present disclosure more apparent, the present disclosure is described in further detail together with the figures and the embodiment. It should be understood the specific embodiment described hereby are only to explain the disclosure, not intended to limit the disclosure.

(6) Referring to FIG. 1, a MEMS microphone 100, in accordance with an exemplary embodiment of the present invention, includes a circuit board 1, a substrate 3 mounted on the circuit board 1, and a capacitor system 5 mounted on the substrate 3.

(7) The circuit board 1 is a printed circuit board, for outputting electrical signals and carrying internal components in the MEMS microphone 1.

(8) The substrate 3 is used for suspending the capacitor system 5, and forms a cavity 31 cooperatively with the capacitor system 5. The cavity 31 provides an accommodation space.

(9) The capacitor system 5 includes a back plate 51 connected to the substrate 3 and a diaphragm 53 connected to the back plate 51 for forming a capacitor.

(10) The back plate 51 includes a back plate main body 511 and a first connecting portion 51 extending from an edge of the back plate main body 511 toward the substrate 3, and the first connecting portion 51 connects to the substrate 3.

(11) The diaphragm 53 includes a diaphragm main body 531 parallel to and spaced from the back plate main body 511, and a second connecting portion 533 extending from an edge of the diaphragm main body 531. The diaphragm main body 531 connects to the back plate main body 511 by the second connecting portion 533. Especially, the diaphragm main body 531 is perpendicular to the second connecting portion 533.

(12) In the embodiment, the diaphragm main body 531 connects to a side of back plate 511 adjacent to the circuit board 1 by the second connecting portion 533. The diaphragm 53 is accommodated in the cavity 31. In fact, the diaphragm 53 can be connected to the side of the back plate 511 away from the cavity 31, which means the diaphragm 53 is out of the cavity 31.

(13) The second connecting portion 533 is made of insulative material for separating the back plate main body 511 from the diaphragm main body 531 to form a capacitor. In the embodiment, the second connecting portion has a length smaller than a length of the first connecting portion 513.

(14) Referring to FIG. 2, a stress inducing diagram of a related MEMS microphone is shown. According to the diagram, the diaphragm suffers grater stress, and the compliance of the diaphragm is badly affected, which leads to worse sensitivity.

(15) Referring to FIG. 3, a stress inducing diagram of the MEMS microphone of the present invention is shown. Compared to FIG. 2, it is noted that the diaphragm does not bear stress.

(16) The MEMS microphone provided by the present invention is such configured that the diaphragm main body 531 is connected to the back plate main body 511 by the insulative second connecting portion 533, not connected to the substrate 3 directly. Thus, the vibration or the stress from the substrate will not transferred to the diaphragm, but released via the first connecting portion 513. Accordingly, the compliance of the diaphragm is ensured, and the sensitivity of the microphone is improved.

(17) It is to be understood, however, that even though numerous characteristics and advantages of the present exemplary embodiment have been set forth in the foregoing description, together with details of the structures and functions of the embodiment, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms where the appended claims are expressed.