TRANSFERRING VISCOUS MATERIALS

Abstract

A method and device are described to transfer a viscous functional material onto a receiving substrate. A plate is provided having a cavity surface that includes a cavity. A plurality of individually addressable resistive heater elements are provided that are in thermal contact with respective zones of the cavity. Viscous functional material is provided in the cavity with a material composition that, when sufficiently heated, generates a gas at an interface between the cavity surface in the cavity and the functional material, to transfer the functional material from the cavity by the gas generation onto the receiving substrate. Respective portions of the viscous functional material in respective zones of the cavity are heated by supplying respective ones of the plurality of individually addressable heater elements with an electric power having a respective time dependent magnitude.

Claims

1. A transfer method of a functional material, onto a receiving substrate, the method comprising: providing a plate having a donor surface that includes at least one donor area that is formed as a cavity in the donor surface and having a plurality of individually addressable resistive heater elements in thermal contact with respective zones of the cavity forming the at least one donor area; filling the cavity forming the at least one donor area with functional material, the functional material being one selected from the group consisting of: an electric conductor, an electric insulator, a thermal conductor and a thermal insulator; and wherein the functional material has a viscosity of at least 50 Pa.Math.s and a material composition that, when sufficiently heated, generates a gas at an interface between the donor surface in the donor area and the functional material, to transfer the functional material from the at least one donor area by the gas generation onto the receiving substrate; and heating respective portions of the viscous functional material in respective zones of the at least one donor area, wherein the heating respective portions of the viscous functional material is by supplying respective ones of the plurality of individually addressable heater elements with an electric power having a respective time dependent magnitude.

2. The transfer method of claim 1, wherein the functional material has a viscosity of at most 1000 Pa.Math.s.

3. The transfer method according to claim 1, wherein the heating is performed in a plurality of heating cycles, wherein during mutually different phases within a heating cycle, of the plurality of heating cycles, a respective one of at least a subset of the plurality of individually addressable heater elements is provided with an electric power, wherein the electric energy provided within a single phase of a heating cycle is below a threshold value at which a transfer of the functional material occurs, and wherein a total amount of electric energy provided in the plurality of heating cycles exceeds the threshold value.

4. The transfer method according to claim 1, wherein the plurality of individually addressable heater elements are arranged in successive zones of the at least one donor area, wherein the heating is performed by sequentially supplying electric power to a respective one of the plurality of individually addressable heater elements, and wherein a non-linear relationship exists between a rank of the individually addressable heater elements in the succession and a point in time at which a supply of electric power is initiated to a particular addressed one of the individually addressable heater elements.

5. The transfer method according to claim 4, wherein the successive zones include at least a first zone, a one but last zone and a last zone, wherein heating the last zone is postponed with a delay period after the heating the one-but last zone.

6. The transfer method according to claim 4, wherein the zones include at least a first zone, a one but first zone, a central zone, a one but last zone and a last zone, wherein the method comprises, in order, performing steps of: ejecting sections of the viscous functional material from the first zone and the last zone by heating associated resistive heater elements, thus allowing sections corresponding to the first zone and the last zone to fold towards each other; pulse-wise heating the heater elements associated with the one but first zone and the one but last zone to gradually release sections of the viscous functional material in the one but first zone and the one but last zone, thus allowing sections corresponding to the one but first zone and the one but last zone to fold towards each other; and ejecting folded functional material, arising from the ejecting and pulse-wise heating, by heating the heater element associated with the central zone.

7. The transfer method according to claim 6, wherein the at least one donor area has a central zone extending over a length in a first direction (X) and has at each longitudinal end a wing extending at both sides of the central zone in a second direction (Y) transverse to the first direction, wherein the wings each extend in the at least a first zone, a one but first zone, the one but last zone and the last zone, wherein the at least one donor area comprises a first portion of viscous functional material, wherein the plate further comprises between the wings, at respective sides of the central zone, a first additional donor area with a first additional portion of viscous functional material, and a second additional donor area with a second additional portion of viscous functional material, wherein the first donor area and the second additional donor area each extend in at least two zones outside the central zone, wherein during operation of the method the first additional portion and the second additional portion of viscous functional material fuse into a continuous electrically conducting strip extending in the second direction on the receiving substrate, wherein the first portion forms an electrically conductive bridge, wherein the functional material present in the wings is folded during the transfer as a respective leg of the bridge arranged at mutually opposite sides of the continuous electrically conducting strip and the functional material present in the central zone forms a body of the bridge extending between the legs and crossing over the electrically strip.

8. The transfer method according to claim 1, wherein the plate and the receiving substrate are moved relative to each other while in the process of transferring functional material from the at least one donor area, a first portion thereof already adheres to the receiving substrate while another portion thereof remains adhered to the plate surface in the donor area.

9. The transfer method of claim 1, wherein the functional material is provided with a solvent and a solid state composition of more than 50 vol % solid state material.

10. The transfer method according to claim 1, wherein the functional material is a conductive material taken from the group consisting of: an electroconductive polymer, a metallized polymer, a solder paste, and a conductive adhesive.

11. A transfer device for transferring of a functional material, onto a receiving substrate, the device comprising: a plate having a donor surface that includes at least one donor area that is formed as a cavity in the donor surface and that is filled with the functional material, the functional material being one selected from the group consisting of: an electric conductor, an electric insulator, a thermal conductor and a thermal insulator, and wherein the functional material has a viscosity of at least 50 Pa.Math.s and a material composition that, when sufficiently heated, generates a gas at an interface between the donor area surface in the donor area and the functional material, to transfer the functional material from the at least one donor area by the gas generation onto the receiving substrate; a plurality of individually addressable resistive heater elements each of the individually addressable resistive heater elements being in thermal contact with a respective zone of the cavity forming the at least one donor area; and control circuitry configured to supply an electric power having a respective time dependent magnitude to respective ones of the plurality of individually addressable resistive heater elements.

12. The transfer device according to claim 11, wherein the functional material has a viscosity of at most 1000 Pa.Math.s.

13. The transfer device according to claim 11, wherein the resistive heater elements are arranged in a heater matrix comprising: a first set of powerlines arranged in a first planar direction of the plate, and a second set of powerlines arranged in a second planar direction transverse to the first planar direction; and wherein respective heater elements are electrically connected to respective pairs of a powerline of the first set and a powerline of the second set.

14. The transfer device according to claim 13, wherein the resistive heater elements are of a material with a negative temperature coefficient or are varistor heater elements.

15. A non-transient computer-readable medium comprising computer-executable instructions that when executed by a programmable processor causes a transfer device, comprising a plate having a donor surface that includes at least one donor area that is formed as a cavity in the donor surface and having a plurality of individually addressable resistive heater elements in thermal contact with respective zones of the cavity forming the at least one donor area, to transfer a functional material, onto a receiving substrate according to a method comprising: filling the cavity forming the at least one donor area with functional material, the functional material being one selected from the group consisting of: an electric conductor, an electric insulator, a thermal conductor and a thermal insulator; and wherein the functional material has a viscosity of at least 50 Pa.Math.s and a material composition that, when sufficiently heated, generates a gas at an interface between the donor surface in the donor area and the functional material, to transfer the functional material from the at least one donor area by the gas generation onto the receiving substrate; and heating respective portions of the viscous functional material in respective zones of the at least one donor area, wherein the heating respective portions of the viscous functional material is by supplying respective ones of the plurality of individually addressable heater elements with an electric power having a respective time dependent magnitude.

16. The transfer device according to claim 11, wherein the control circuitry is configured to supply the electric power in a plurality of heating cycles, wherein the controller, during mutually different phases within a heating cycle, provides a respective one of at least a subset of the plurality of individually addressable heater elements with an electric power, wherein the electric energy provided within a single phase is below a threshold value at which a transfer of the functional material occurs, and the total amount of electric energy provided in the plurality of heating cycles exceeds the threshold value.

17. The transfer device according to claim 11, wherein the transfer device is configured to move the plate and the receiving substrate relative to each other while in the process of transferring functional material from the at least one donor area, a first portion thereof already adheres to the receiving substrate while another portion thereof remains adhered to the plate surface in the donor area.

18. The transfer device according to claim 11, wherein the plurality of individually addressable heater elements are arranged in successive zones of the at least one donor area, wherein the controller is configured to sequentially supply an electric power to a respective one of the plurality of individually addressable heater elements, and wherein a non-linear relationship exists between a rank of the individually addressable heater elements in the succession and a point in time at which a supply of electric power is initiated to a particular addressed one of the individually addressable heater elements.

19. The transfer device according to claim 18, wherein the successive zones include at least a first zone, a one but last zone and a last zone, wherein the controller is configured to postpone initiating a supply of electric power to the heater element heating the last zone with a delay period after having supplied an electric power to the heater element of the one-but last zone.

20. The transfer device according to claim 18, wherein the zones include at least a first zone, a one but first zone, a central zone, a one but last zone and a last zone, the controller being configured to sequentially perform: supplying an electric power to the resistive heater elements of the first and the last zone to eject sections of the viscous functional material therein, thus allowing sections corresponding to the first zone and the last zone to fold towards each other; pulse-wise supplying an electric power to the heater elements associated with the one but first zone and the one but last zone to gradually release sections of the viscous functional material in the one but first zone and the one but last zone, thus allowing sections corresponding to the one but first zone and the one but last zone to fold towards each other; and supplying an electric power to the heater element associated with the central zone to eject folded functional material arising from the supplying an electric power to the resistive heater elements of the first and the last zone and pulse-wise supplying an electric power to the heater elements associated with the one but first zone and the one but last zone.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0026] These and other aspects are described in more detail with reference to the drawing. Therein:

[0027] FIG. 1 schematically shows an embodiment of the improved transfer device;

[0028] FIG. 1A shows in more detail elements of an improved transfer device;

[0029] FIG. 2 schematically shows a first embodiment of the improved transfer method;

[0030] FIG. 3 schematically shows a second embodiment of the improved transfer method;

[0031] FIG. 4A-4H shows individual steps of the second embodiment of FIG. 3 in more detail;

[0032] FIG. 5 shows a third embodiment of the improved transfer method;

[0033] FIG. 6A-6F shows individual steps of the third embodiment of FIG. 5 in more detail;

[0034] FIG. 7 shows a fourth embodiment of the improved transfer method;

[0035] FIG. 8A-8E shows individual steps of the fifth embodiment of the improved transfer method;

[0036] FIG. 9A-9C presents examples of resistive heater elements in an embodiment of the transfer device;

[0037] FIG. 10 shows a sixth embodiment of the improved transfer method;

[0038] FIG. 11A, 11B, 11C shows examples of further embodiments of the improved transfer method.

DETAILED DESCRIPTION OF EMBODIMENTS

[0039] Like reference symbols in the various drawings indicate like elements unless otherwise indicated.

[0040] FIG. 1 schematically shows a transfer device 1 for transferring of a viscous functional material 50, e.g. an electrically conducting material, onto a receiving substrate 20, such as a circuit board having electronic components to be electrically interconnected. The transfer device 1 comprises a plate 10 that has a cavity surface 11 with at least one cavity 12 filled with the functional material 50 to be transferred. The functional material 50 has a material composition that, when sufficiently heated, generates a gas at an interface between the cavity surface 11 and the functional material 50. The resulting gas pressure therewith causes a transfer of the functional material 50 from the cavity 12 onto the receiving substrate 20. In the embodiment shown, the plate 10 comprises a carrier layer 15 and a cover layer 16 of which the latter has a low thermal conductivity to restrict a heat flow to the surface 11 outside the range of the (at least one) cavity 12 and an encapsulation layer 17 of an electrically insulating material. The transfer device 1 comprises a plurality of individually addressable resistive heater elements 131, 132, 133, 134, 135 that are in thermal contact with a respective zone 121, 122, 123, 124, 125 of the cavity 12. The resistive heating elements are accommodated electrically insulated from each other in the encapsulation layer 17 between the carrier layer 15 and the cover layer 16, For illustration purposes the size of the heating elements as indicated in the drawings is exaggerated, so that they seem to protrude the carrier layer 15. FIG. 1 further shows that the surface 11 inside the cavity 12 is coated with a high thermally conductive heat spreader 18 to evenly distribute the heat flux around the functional material, for a more uniform ink release and reducing shear forces. The range within which the heat is spread can be controlled by a proper selection of the thickness of the heat spreader, so that on the one hand a good uniformity is achieved while still being capable to control the distribution of the heat flux at the granularity of the resistive heating elements.

In the example shown in FIG. 1 the cavity 12 has an elongate form, and the zones 121, 122, 123, 124, 125 are subsequent length zones therein.

[0041] The individually addressable resistive heater elements 131, 132, 133, 134, 135 are coupled to a control circuitry 14. The control circuitry 14 is configured to supply an electric power C131, C132, C133, C134, C135 having a respective time dependent magnitude to respective ones 131, 132, 133, 134, 135 of the plurality of individually addressable resistive heater elements.

[0042] Some elements are shown in more detail in FIG. 1A, which shows a portion of a plate 10 comprising an individually addressable heating element 13 which is in thermal contact with a first and a second cavity 12A, 12B, each provided to transfer a respective portion 50A, 50B of functional material.

[0043] In some embodiments the device may have a predetermined configuration to operate in a predetermined manner.

[0044] In the embodiment shown, the control circuitry 14 is configured to read a record carrier 60 that comprises instructions that specify the time dependent magnitude according to which it is to supply power to the respective resistive heater elements 131-135. Mutually different record carriers may specify mutually different embodiments of methods to be performed with the device 1. Examples thereof are provided below. Also it may be conceived that the device has a proper record carrier, that can be loaded with instructions for each case, for example instructions received from the internet 61, or provided by an operator via a user interface 62.

[0045] The substrate 20 may be of a rigid or of a flexible nature. The term “flexible substrate” used in this text refers in particular to a substrate that is bendable enough to be used in a reel to reel process. In other words a flexible substrate as used in this text is a substrate that is flexible enough to allow bending over a certain curvature, e.g. with a radius of 1-100 centimeters (depending on the reel diameter), without the substrate losing essential functionality. Supply of chip bonding material matter 50 can e.g. be placed on a pad structure or on chip pads.

[0046] The functional material to be transferred is for example, a thermosettable isotropic conductive adhesive material with a volume resistivity of typically 400-1000 microOhm.Math.cm. To illustrate the general applicability of the method, an experimental conductive adhesive is transferred consisting of a highly viscous conductive adhesive with a viscosity of 160-180 Pa.Math.s. The conductive adhesive can be provided as homogenous layer of 20-30 micron, in particular, 25 micron thick. The thickness is controlled to be around 25 um or 50 um but could be theoretically be of any thickness. For example, a cavity 12 may be in the order of 5-10 micron deep and may have a smallest diameter of less than 50 micron.

[0047] FIG. 2 schematically shows a method of operating the transfer device 1. The lower part of FIG. 2 shows a plate 10 that is substantially similar to the one described with reference to FIG. 1 apart from the fact that in this case the cavity 12 comprises three length zones 121, 122, 123. As in the example of FIG. 5, the length zones 121, 122, 123 are in thermal contact with a proper individually addressable resistive heater element 131, 132, 133. A viscous functional material 50 to be deposited on the substrate 20 was provided in the cavity 12, for example using a doctors blade.

[0048] The upper part of FIG. 2 shows how the individually addressable heater elements 131, 132, 133 each are provided with an electric power C131, C132, C133 having a respective time dependent magnitude. In the example shown, heating is performed in a plurality of heating cycles, in this case three heating cycles C1, C2, C3. During mutually different phases within each heating cycle each time one of the individually addressable heater elements 131, 132, 133 is provided with an electric power. As indicated by the thick dashed curves, the electric energy (fluence) provided within a single phase is below a threshold value (Release) at which a transfer of the functional material would occur. However, the total amount of electric energy provided in the three heating cycles exceeds the required threshold value. In the example shown, in each cycle electric energy is provided to the heater element 131 in the first phase, to the heater element 132 in the second phase and to the heater element 133 in the third phase. In the third heating cycle C3, the accumulated electric energy exceeds the release threshold in the first length zone 121 during the first phase, in the second length zone 122 during the second phase and in the third length zone during the third phase. Because the accumulated energy at the start of the third cycle C3 is already close to the release threshold, each zone of the cavity 12 only needs to be heated for a short time. Therewith the mutual differences in the release time of the portions of the functional material is small as compared to the case wherein the portions are heated in a single heating cycle. By reducing the differences in release time deformations of the functional material during the process of transfer are minimized.

[0049] As shown in FIG. 3 and FIG. 4A-4H, the improved deposition apparatus further renders it possible to deliberately deform the functional material 50 during its deposition in a controlled manner in order adapt the shape of the functional material to the shape of the surface of the substrate 20 where it is to be deposited. In this example the substrate surface comprises an upper surface 21, a side surface 22 and a lower surface 23, and the functional material 50 to be deposited is to be wrapped around an end of the substrate 20, so that it extends over an end portion of the upper surface 21 over the side surface 22 and over an end portion of the lower surface 23, for example to electrically connect an elements on the upper surface 21 with an element on the lower surface 23.

[0050] As shown in FIG. 3 and FIG. 4A-4G this is achieved in that the plurality of individually addressable heater elements 131, 132, 133, 134, 135 are arranged in successive length zones of the elongate cavity 12 filled with the viscous functional material 50 to be deposited at time TO (See FIG. 4A). Heating is performed by subsequently supplying electric power to a respective one of the heater elements, wherein a non-linear relationship exists between a rank of the individually addressable heater elements in succession and a point in time at which a supply of electric power is initiated thereto. In the upper part of FIG. 3 this is illustrated in that during a first time interval T1, power C131 is supplied to a first heater element 131 to heat a first length zone of the cavity 12 (See FIG. 4B). As shown in FIGS. 4C, 4D and 4E, during subsequent time intervals T2-T4 that succeed each other without a significant interruption, power C132-C134 is supplied to the subsequent heater elements 132-134 to heat subsequent length zones of the cavity 12. Then, as shown in FIG. 4F, further supply of power is postponed during a time interval T45 before power C135 is supplied to the fifth heater element 135 during a fifth time interval T5, as shown in FIG. 4G. As schematically shown in the lower part of FIG. 3 and in FIG. 4F, subsequent to the heating step in T4, the strip of functional material 50 is adhered at one end to the upper surface of the receiving substrate 20 and at the other end it is still adhered to the surface 11 of the plate inside the cavity 12. The time interval T45, serves as a relaxation time wherein vibrations of the strip of functional material 50 are allowed to dampen out. If these vibrations are sufficiently dampened, the last length zone is heated to eject the strip of functional material at that location. As a result, at time T6, shown in FIG. 411, the strip of functional material 50 folds around the side target surface 22 of the receiving substrate 20 and the portion originating from the last length zone adheres to the lower target surface 23. The postponement of heating during the time interval T45 avoids that the strip of functional material 50 hits the side target surface 23 with an excessive velocity, and therewith mitigates the risk that the strip is broken into pieces.

[0051] FIG. 5 and FIG. 6A-6F show a further embodiment of the method, wherein different heating modes are combined to fold a strip of functional material 50 during its deposition on the receiving substrate 20, so that it forms an element 51 of the functional material that has a height exceeding that of the depth of the cavity from which it was transferred. The upper part of FIG. 5 shows the power signal C131, . . . , C135 for each of the heater elements 131, . . . , 135, i.e. the power as a function of time supplied thereto.

[0052] As shown in FIG. 6A, at TO, the plate 10 is provided having its cavity filled with the strip of viscous functional material 50. During the subsequent time intervals T1, T2 (See FIG. 6B, 6C respectively) the heater elements 131, 135 at the mutually opposite ends of the cavity are powered with C131, C135 respectively. The amount of energy supplied therewith is sufficient to generate a gas pressure at an interface between the cavity surface in the cavity and the functional material, to force the functional material from the corresponding end-portions of the cavity. Because the functional material 50 has a center portion 52, 53, 54 that is still adhered to the cavity surface, the end portions 51, 55 of the viscous functional material 50 respectively fold over the centrally arranged portions 52, 54 respectively.

[0053] As further shown in FIG. 6D, during the next time interval T3, heating of the heater elements 132 and 134 is performed in three heating cycles C1, C2, C3. During a first phase and a second phase within each heating cycle heater element 132, 134 is provided with an electric power C132, C134. The electric energy provided within a single phase is below the threshold value at which the functional material portions 52, 54 are driven out of the cavity, so that these functional material portions are heated in a substantially symmetric manner. During the last heating cycle the amount of energy supplied to these portions exceeds the threshold value so that they are forced to fold inwards. Because only a modest amount of energy needs to be supplied in this last heating cycle, the duration of each phase therein can be short, so that the ejection of the portion 54 can rapidly follow the ejection of portion 52, therewith providing for a substantially symmetric fold. Finally, as shown in FIG. 6E, during time interval T5, the most central portion 53 is heated with heater element 133, so that the folded strip 56 of functional material is transferred towards the receiving substrate 20, and adheres thereto at T6 as sown in FIG. 6F. It is noted that during a time interval T4, heating is interrupted, to allow a completion of the folding of the material portions 52, 54.

[0054] FIG. 7 shows an example how even more complex constructions can be formed on a substrate surface. The upper part of FIG. 7 shows the surface 11 of the plate 10 that is provided with mutually separate functional material sections 50A, 50B, 50C in respective cavities. The plate 10 has subsequent resistive heater elements 131, 132, 133, 134, 135, 136, 137 having a length in the direction X. Each heater element is configured to heat a region in a proper range in the direction Y. FIG. 7 further shows on the lower left a series of cross-sections A according to A-A as indicated in the upper part, and in the lower-middle and the lower right respectively a series of cross-sections B, C according to B-B and C-C as indicated in the cross-section A. These series of cross-sections are also indicated as A and B in the upper part of FIG. 7.

[0055] The upper one of each series of cross-sections A,B,C indicates the plate 10 as it is initially provided at TO.

[0056] During a time interval T1, the resistive heater element 131 is heated. As a result, the portions of the material section 50A present in this range, denoted as AL1 on the left and AR2 on the right are heated to an extent that they are forced out by the vapor pressure locally created in the cavity. As a result, these portions fold inward (Fold 1) similarly as the portion 51 in FIG. 6B. Similarly, during a time interval T2, the resistive heater element 137 is heated. As a result, also the portions AL7, AR7 of the material section 50A present in this range are heated to an extent that they are forced out by the vapor pressure locally created in the cavity and fold inwards (Fold 2).

[0057] Analogously to what was described with reference to FIG. 6D, during the next time interval T3, heating of the heater elements 132 and 136 is performed in three heating cycles. During a first phase and a second phase within each heating cycle heater element 132, 136 is provided with an electric power. Therewith the portions AL2, AL6, AR2, AR 6 of the material section 50A present in the areas that in thermal contact with these heater elements are heated. Also the portions B2, C6 of the material sections 50B and 50C in these areas are heated. The electric energy provided within a single phase is below the threshold value at which locally present functional material portions are driven out of the cavity, so that these functional material portions are heated in a substantially symmetric manner. During the last heating cycle the amount of energy supplied to these portions exceeds the threshold value. Therewith the portion AL2 carrying the earlier folded portion AL1 thereon is folded inwards (Fold 3). Likewise portion AL6 carrying AL7 folds inwards (fold 6). And similarly this applies to AR2 carrying AM and to AR6 carrying AR7. Also the portions B2 and C6 fold inwards and therewith fuse at the ends with which they contact each other.

[0058] During T4, heating of the heater elements 133 and 135 is performed in three heating cycles. This has as a result that in the last cycle of T4, the material of section 50B present in the range of resistive heater element 133, as well as the material of section 50C present in the range of resistive heater element 135 is ejected. Therewith the fused functional material originating from sections 50B and 50C is deposited as a single conducting strip 57 on the substrate. Also the portions, e.g. AL3, AL6 of material section 50 within the range of heater elements 133 and 135 are forced outwards, but because material section 50A is still adhered to the plate surface in the region of heater element 134, this has as the effect that the structure of material section is folded further, so that the original portions AL1 AL7 fuse with each other. Likewise portions AR1, AR7 fuse with each other. Therewith a bridge 58 is formed that has a first leg 58L formed by portions AL1 AL2, AL3, AL5, AL6 and AL7 at one side, a second leg 58R formed by portions AR1, AR2, AR3, AR5, AR6 and AR7 at the opposite side and a bridge body 58B formed by a portion A4 of the material section in the range of heater element 134. Because this heater element 134 was not yet activated, the bridge 58 is still suspended with the bridge body to the surface 11 of the plate 10.

[0059] Finally during T5 heater element 134 is heated so that the bridge 58 which was folded in the previous steps is now transferred towards the substrate 20, where it lands at its first and second leg 58L, 58R and with the bridge body 58B traverses the conducting strip 57 at distance.

A further exemplary application is shown in FIG. 8A-8E. In this example the improved method is applied to provide an electric connection to an electric terminal 26 of a component 25 on the receiving substrate 20. FIG. 8A shows the initial situation at TO. In FIG. 8B it is shown how during a time-interval T1 a central portion of the functional material 50 is released from the cavity by activating resistive heater element 133. As shown in FIG. 8C, during a subsequent time-interval T2 portions of the functional material 50 neighboring this central portion are released by pulse-wise activating the resistive heater elements 132, 134. Therewith the elements 132, 134 the electric energy provided within a single pulse is below a threshold value at which a transfer of the functional material occurs, but the total amount of electric energy provided in the sequence of pulse provided during the time-interval T2 exceeds the threshold value. Likewise, as shown in FIG. 8D, during the time-interval T3, end portions of the functional material 50 are released by pulse-wise activating the resistive heater elements 131, 135. FIG. 8E shows that as a result at T4, a strip of deposited functional material 50 forms an electric connection with the electric terminal 26 of the component 25.

[0060] In the previous examples it was presumed that the resistive heater elements were provided each with separate contacts. FIG. 9A shows another example, wherein the resistive heater elements of the plate 10 are arranged in a heater matrix. For clarity other details of the plate 10 are not sown in this figure. The heater matrix comprises a first set of powerlines, denoted as column lines CL1, CL2, CL3 arranged in a first planar direction of the plate 10 and a second set of power lines, denoted as row lines RL1, RL2, RL3 that are arranged transverse to the column lines. In this example the lines are directed in mutually orthogonal direction, but in other examples another angle may be used, e.g. 60 degrees. By way of example, only 3 column lines and 3 row lines are shown. However, in practice a larger number of lines may be present, for example a few hundreds or thousands of lines. Each of the heater elements is electrically connected to a specific pair of a rowline and a column line. For example heater element H22 has one terminal connected to rowline RL2 and another terminal connected to column line CL2. Neighboring heater element H23 has one terminal connected to rowline RL3 and another terminal connected to column line CL2.

[0061] Heater elements in the matrix can be individually addressed by connecting their corresponding pair of power lines to a power source. In the example shown element H22 is addressed in that rowline RL2 and column line CL2 are connected to the power source. Nevertheless, when connecting the powerlines RL2, CL2, also a current may flow via other heater elements, for example following the path via heater element H32, line CL3, heater element H33, line RL3 and heater element H23. Although the current flowing via the neighboring heater elements is substantially slower than that via the addressed element, it may be desired to suppress these leakage currents.

[0062] To that end, in one example the resistive heater elements are of a material with a negative temperature coefficient (NTC). The effect of this measure is shown in FIG. 9B. Therein the continuous curves and the dashed curves respectively indicate the resistance and the temperature of a heater as a function of time. For the addressed pixel the curves are black, and for the neighboring pixels the color gray is used. Due to the fact that initially the resistance of the path through the addressed heater element is lower than the resistance of the path through a sequence of serially arranged neighboring elements the temperature rises more rapidly in the addressed heater element than in the neighboring heater elements. As a result of the negative temperature coefficient therewith the resistance of the addressed heater element is reduced more than the resistance of the neighboring heater elements, so that the current path through the addressed heater element is favored more. Hence current through neighboring heater elements is suppressed.

[0063] In another example, illustrated with reference to FIG. 9C, varistor heater elements are used. As in FIG. 9B, the black dashed curve indicates the temperature development as a function of time for the addressed heater element and the gray dashed curve indicates the corresponding information for neighboring heater elements. Due to the fact that the current path through the neighboring elements comprises serially arranged varistors, the supply voltage is not sufficient to render these elements conductive, so that a leakage current through these neighboring elements is suppressed.

[0064] FIG. 10 shows a further embodiment of the improved transfer method. Therein the plate 10 and the receiving substrate 20 are moved relative to each other during the process of transferring functional material 50 from the cavity 12. In the example shown a first portion 50a of the functional material 50 already adheres to the receiving substrate 20 while another portion 50b of the functional material still adheres to the plate surface in the cavity 12. As a result, the material 50 is stretched so that the form of the resulting deposited feature is longer and thinner than the form of the functional material in the cavity. The extent to which the material is stretched is determined by the ratio of the speed v with which the plate 10 moves relative to the substrate 20 and the speed with which the functional material 50 is expelled from the cavity in the direction of movement. The plate 10 may for example have respective individually addressable resistive heaters each extending over a range with length L in the cavity, that are subsequently heated with a mutual time delay τ, corresponding to a speed of expelling the v.sub.e the functional material 50 equal to L/τ. In that case the functional material is stretched with a factor v.Math.τ/L.

[0065] A record carrier 60, as shown in FIG. 1 may also comprise instructions that specify the controller 14 how to control the speed v with which the plate 10 moves relative to the substrate 20 and the speed with which the functional material 50 is expelled from the cavity in the direction of movement.

[0066] As shown further in FIG. 10 this embodiment of the transfer method also enables a way of deposition wherein the deposited functional material bridges recessed features 20r.

[0067] Other variations to the disclosed embodiments can be understood and by those skilled in the art in practicing the claimed invention, from a study of the drawings, the disclosure, and the appended claims. In the claims, the word “comprising” does not exclude other elements or steps, and the indefinite article “a” or “an” does not exclude a plurality. A single unit may fulfill the functions of several items recited in the claims. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measured cannot be used to advantage. Any reference signs in the claims should not be construed as limiting the scope. In addition, the functional material may have a wide-range of viscosity, possible to transfer (from 50 Pa.Math.s to 1000 Pa.Math.s (non-exhaustive)). Contrary to stencil printing and screen printing it is a non-contact direct write method wherein the distance to the substrate surface is preferably kept higher than 1 micron. The transfer accuracy of the functional ink is dependent on the printing gap. Typically the printing gap needs to be in the same order as the feature size to obtain a good printing accuracy. When a small printing gaps are required, it becomes technically more difficult to align the print head with the sample holder. Therefore it is preferred to control the gap by using spacer pins and press the print head and sample holder together. It is preferred to have at least three degrees (heave, roll, pitch) of freedom between the print head and sample holder. In an example pastes can be formed as follows:

TABLE-US-00001 Solids content 90 ± 5 wt % Material Solids content Purpose Metal (Ag, Cu, Au): 86.5 ± 5 wt % Conductivity Polymer binder 2.5 ± 2 wt % Adhesion and cohesion Fumed silica 1 ± 1 wt % Anti-slump, rheology control Solvent: 10 ± 5 wt % Printability

[0068] with viscosities ranging between 100 en 1000 Pa*s. In contrast to conventional screen print paste and inks shear thinning may be minimized e.g. by adding fumed silica to prevent flow of the past on the acceptor substrate. This can also be prevented by curing/drying the ink e.g. by laser irradiation, which can be conveniently realized by a high solids content and low solvent content.

[0069] The power required to induce a gas pressure is dependent on the functional material used with the method. As a rule of thumb it may be required that the control circuitry connected to the resistive heating elements configured to heat the a heating element in less than 100 microseconds at an average power of more than 10 kW/cm2. Alternatively, it may be required that the control circuitry allows the resistive heater elements to heat the functional material at a heating rate of at least 5K/microsecond in order to generate gas at the interface to provide for the gas pressure that forces the functional material out of the cavity. In case a direct ejection is not required the heating power is provided in a sequence of cycles as shown for example in FIG. 2.

[0070] In addition to controlling the transferring process by supplying individually addressable heater elements with an electric power having a respective time dependent magnitude it is possible to control a heat flux distribution associated with an individual heat by means of its shape, as is illustrated in the following examples in FIGS. 11A, 11B and 11C.

[0071] In each of these figures, the lower part shows a cross-section through the plate 10 while functional material is being deposited. The middle part shows in a view in a direction towards the surface 11 of the plate 10, a cross-section of the individual addressable resistive heating element 13. The upper part schematically shows the local heat flux (solid line) as a function of the position along the cavity 12 and the associated release time (dashed line).

[0072] In the example of FIG. 11A the cross-section of the resistive element 13 increases in a direction from left to right along the cavity 12. As a result, the resistive element has a resistance and therewith a heat flux that decreases in that direction, Consequently the release time for the material 50 in the cavity 12 is larger for positions more to the right end of the cavity. In the lower part of FIG. 11A this is illustrated in that the unit of functional material is tilted with its left end towards the substrate (not shown) where it will be deposited.

[0073] In the second example, shown in FIG. 11B, the cross-section the cross-section of the resistive element 13 is narrows at the ends of the cavity 12, and is relatively wide in a center portion. As a result, the resistive element has a relatively high resistance at the ends of the cavity as compared to in the center portion of the cavity. Therewith the resistive element provides for a relatively high heat flux at the ends of the cavity 12 as compared to the heat flux generated in between the ends, Consequently the release time for the material 50 at the ends of the cavity 12 is relatively short as compared for that of the remainder of the material 50. In the lower part of FIG. 11B this is illustrated in that the unit of functional material 50 is curved with its ends towards the substrate (not shown) where it will be deposited.

[0074] FIG. 11C shows a third example, wherein the cross-section of the resistive element 13 widens at the ends of the cavity 12, and has a relatively constant small width in a center portion. As a result, the restive element has a relatively low resistance at the ends of the cavity as compared to in the center portion of the cavity. Therewith the resistive element provides for a relatively low heat flux at the ends of the cavity 12 as compared to the heat flux generated in between the ends, Consequently the release time for the material 50 at the ends of the cavity 12 is relatively long as compared for that of the remainder of the material 50. In the lower part of FIG. 11B this is illustrated in that the unit of functional material 50 is curved with its ends towards the plate 10.

[0075] While the present invention has been described with respect to a limited number of embodiments, those skilled in the art will appreciate numerous modifications and variations therefrom within the scope of this present invention as determined by the appended claims. For example, as noted above, a donor area may be at level with the surrounding surface or may be formed as a cavity in the donor surface. Also in some embodiments a plate is provided with one or more donor areas at level with the surrounding surface and other donor areas formed as a cavity. For example, according to a modification within the scope of the claims a plate having a donor area formed as a cavity in the donor surface may be replaced with a plate having a donor area at level with the surrounding donor surface.