Organic semiconductor transistor

Abstract

An organic semiconductor transistor is provided. The organic semiconductor transistor includes a gate electrode, a gate insulating layer positioned on the gate electrode, a source electrode and a drain electrode which are positioned on the gate insulating layer and spaced apart from each other, a channel layer formed of an organic semiconductor on the gate insulating layer on which the source electrode and the drain electrode are formed, and a dopant layer formed by injecting dopant molecules downward from an upper portion of the channel layer, wherein the dopant layer is formed to be spaced above a position at which each of the source electrode and the drain electrode is in contact with the channel layer, and the dopant molecules and the organic semiconductor form a material combination in which the dopant molecules diffuse in the organic semiconductor in a solid-state diffusion manner.

Claims

1. An organic semiconductor transistor comprising: a gate electrode; a gate insulating layer positioned on the gate electrode; a source electrode and a drain electrode which are positioned on the gate insulating layer and spaced apart from each other; a channel layer formed of an organic semiconductor on the gate insulating layer on which the source electrode and the drain electrode are formed; and a dopant layer formed by injecting dopant molecules downward from an upper portion of the channel layer, wherein the dopant layer is formed to be spaced above a position at which each of the source electrode and the drain electrode is in contact with the channel layer, and the dopant molecules and the organic semiconductor form a material combination in which the dopant molecules diffuse in the organic semiconductor in a solid-state diffusion manner.

2. The organic semiconductor transistor of claim 1, wherein: the organic semiconductor includes poly(2,5-bis(3-hexadecylthiophen-2-yl)thieno[3,2-b]thiophene) (PBTTT); and the dopant molecules include 2,3,5,6-tetrafluoro-7,7,8,8-tetracyanoquinodimethane (F4-TCNQ).

3. The organic semiconductor transistor of claim 1, further comprising a self-assembled monolayer (SAM) between the gate insulating layer and the channel layer.

4. The organic semiconductor transistor of claim 1, wherein an upper surface of the channel layer is plasma-etched.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a cross-sectional view illustrating an organic semiconductor transistor according to one embodiment of the present invention.

(2) FIG. 2 is a cross-sectional view illustrating an organic semiconductor transistor according to another embodiment of the present invention.

(3) FIG. 3A is a graph showing an lds-Vgs transfer curve of the organic semiconductor transistor manufactured according to the present invention.

(4) FIG. 3B is a graph showing an Ids-Vds output curve of the organic semiconductor transistor manufactured according to the present invention.

(5) FIGS. 4A to 4C are graphs showing data of an organic semiconductor transistor, which is a comparison target, on the basis of a Y-function method.

(6) FIGS. 5A to 5C are graphs showing data of the organic semiconductor transistor according to the present invention on the basis of the Y-function method.

(7) FIG. 6 is a graph showing a variation of an ON/OFF ratio of a transistor according to whether etching is performed after doping during manufacturing of the organic semiconductor transistor according to the present invention.

(8) FIG. 7A is a graph showing lds-Vgs transfer curves of a comparison target element and the organic semiconductor transistor according to the present invention in transistors including a high-k material as a gate insulating layer.

(9) FIG. 7B is a graph showing Ids-Vds transfer curves of the transistor of the comparison target element and the organic semiconductor transistor according to the present invention in the transistors including the high-k material as a gate insulating layer.

(10) Throughout the drawings and the detailed description, unless otherwise described, the same drawing reference numerals will be understood to refer to the same elements, features, and structures. The relative size and depiction of these elements may be exaggerated for clarity, illustration, and convenience.

DETAILED DESCRIPTION

(11) Details of embodiments are included in detailed descriptions and drawings. Advantages and features of the present invention and methods of achieving the same will be clearly understood with reference to the accompanying drawings and the following detailed embodiments. Like reference numerals denote like elements throughout the description.

(12) While such terms as first, second, etc. may be used to describe various components, such components must not be limited to the above terms. The above terms are used only to distinguish one component from another. As used herein, the singular forms a, an, and the are intended to include the plural forms as well, unless the context clearly indicates otherwise. When a portion includes an element, another element may be further included, rather than excluding the existence of another element, unless otherwise described. Moreover, terms described in the description, such as part and module, refer to a unit of processing at least one function or operation and may be implemented by hardware or software or a combination thereof.

(13) FIG. 1 is a cross-sectional view illustrating an organic semiconductor transistor according to one embodiment of the present invention.

(14) Referring to FIG. 1, the organic semiconductor transistor according to one embodiment of the present invention may include a gate electrode 10, a gate insulating layer 20 positioned on the gate electrode 10, a source electrode 30a and a drain electrode 30b which are positioned on the gate insulating layer 20 and spaced apart from each other, a channel layer 50 formed on the gate insulating layer, on which the source electrode 30a and the drain electrode 30b are formed, and formed of an organic semiconductor, and dopant layers 60a, 60b, 61a, and 61b formed by injecting dopant molecules downward from an upper portion of the channel layer 50.

(15) Specifically, as the gate electrode 10 is for controlling electrical properties of the channel layer 50, the gate electrode 10 may include a conductive material such as silicon (Si) or a metal. For example, the metal may include at least one among aluminum (Al), gold (Au), beryllium (Be), bismuth (Bi), cobalt (Co), copper (Cu), hafnium (Hf), indium (In), manganese (Mn), molybdenum (Mo), nickel (Ni), lead (Pb), palladium (Pd), platinum (Pt), rhodium (Rh), rhenium (Re) ruthenium (Ru), tantalum (Ta), tellurium (Te), titanium (Ti), tungsten (W), zinc (Zn), and zirconium (Zr).

(16) The gate insulating layer 20 may include an insulating material such as silicon oxide, silicon nitride, or the like.

(17) From a viewpoint of ease of manufacturing, the gate electrode 10 may include silicon (Si), and the gate insulating layer 20 may include silicon oxide (for example, SiO.sub.2).

(18) The source electrode 30a and the drain electrode 30b may be formed of a metal such as Pt, Ru, Au, Ag, Mo, Ti, Al, W, or Cu, a conductive oxide such as InZnO (IZO), AlZnO (AZO), or the like. In addition, according to one embodiment, thicknesses of the electrodes may be changed according to a metal. For example, in the case of titanium (Ti), the thickness may be 2 nm, and in the case of gold (Au), the thickness may be 30 nm. Such a source electrode 30a and a drain electrode 30b may be deposited on a substrate with a shadow mask using a vacuum electron beam evaporator or the like. Here, a pressure of the vacuum electron beam evaporator may be 10.sup.7 Torr, and a deposition speed thereof may be 0.5 /s.

(19) Referring to FIG. 1, the organic semiconductor transistor may further include a self-assembled monolayer (SAM) 40 formed of at least one of octadecyltrichlorosilane (ODTS) or octyltrichlorosilane (OTS) between the gate insulating layer 20 and the channel layer 50. The SAM 40 is for improving crystallinity of an organic semiconductor layer, which will be formed later, so as to improve electrical properties of an organic semiconductor thin film.

(20) In addition, according to the present invention, the organic semiconductor has to be formed of a material in which dopant molecules diffuse in the organic semiconductor in a solid-state diffusion manner. According to one embodiment, poly(2,5-bis(3-hexadecylthiophen-2-yl) thieno[3,2-b]thiophene) (PBTTT) may be used as the material of the organic semiconductor.

(21) According to the present invention, the dopant molecules 60a and 60b have to be formed of a material which diffuses in the organic semiconductor channel layer 50 in a solid-state diffusion manner. According to one embodiment, 2,3,5,6-tetrafluoro-7,7,8,8-tetracyanoquinodimethane (F4-TCNQ) may be used as a dopant material. Then, the dopant molecules 60a and 60b diffuse in the channel layer 50, and thus the diffusion injection portions 61a and 61b are formed to extend to regions in contact with the source electrode 30a and the drain electrode 30b. Accordingly, charge injection from the electrodes into contact portions between the source electrode 30a, the drain electrode 30b, and the channel layer 50 formed of the organic semiconductor is improved, and thus a contact resistance can be reduced.

(22) As described above, in a case in which a combination of the organic semiconductor capable of solid-state diffusion and the dopant molecules is used, even when a dopant is deposited on an upper surface of the organic semiconductor channel layer 50, the dopant diffuses to a lower surface of the channel layer 50, and thus there is an advantage in that the present invention can be applied when a structure of the transistor is a bottom-gate structure. Accordingly, there is an advantage in that a dielectric layer of the transistor may be freely selected without degrading properties of the organic semiconductor channel layer 50 unlike a conventional top-gate transistor.

(23) FIG. 2 is a cross-sectional view illustrating an organic semiconductor transistor according to another embodiment of the present invention.

(24) As illustrated in FIG. 2, a channel layer 50 may be in a state in which an upper surface thereof is plasma-etched. This is to prevent stability degradation of a transistor element due to diffusion of dopant molecules.

(25) Properties of the organic semiconductor transistor manufactured according to the above-described present invention will be described with reference to FIGS. 3A to 7B.

(26) FIG. 3A is a graph showing an Ids-Vgs transfer curve of the organic semiconductor transistor manufactured according to the present invention, and FIG. 3B is a graph showing an Ids-Vds output curve of the organic semiconductor transistor manufactured according to the present invention.

(27) FIGS. 4A to 4C are graphs showing data of an organic semiconductor transistor, which is a comparison target, on the basis of a Y-function method, and FIGS. 5A to 5C are graphs showing data of the organic semiconductor transistor according to the present invention on the basis of the Y-function method.

(28) When FIGS. 4A to 4C are compared to FIGS. 5A to 5C, the contact resistance of the organic semiconductor transistor on which doping is performed according to the present invention is clearly reduced when compared to a comparison target element. That is, a contact resistance of the element extracted using the Y-function method is 24.5 kcm in the case of the comparison target on which the doping is not performed and the contact resistance of the organic semiconductor transistor on which the doping is performed is 5.1 kcm.

(29) FIG. 6 is a graph showing a variation of an ON/OFF ratio of a transistor according to whether etching is performed after doping during manufacturing of the organic semiconductor transistor according to the present invention.

(30) Referring to FIG. 6, in the case of an element on which etching is not performed, it may be confirmed that the ON/OFF ratio of the transistor is sharply decreased. That is, it may be seen that plasma etching affects stability of the element during a manufacturing process.

(31) Meanwhile, the contact resistance of the element, which is reduced using the doping, is more clearly effective on a low power element. To this end, the effect was checked using a transistor manufactured to include an insulator formed of A1.sub.2O.sub.3, which is a kind of a high-k material using atomic layer deposition (ALD).

(32) FIG. 7A is a graph showing Ids-Vgs transfer curves of a comparison target element and the organic semiconductor transistor according to the present invention in transistors including a high-k material, and FIG. 7B is a graph showing Ids-Vds transfer curves of the comparison target element and the organic semiconductor transistor according to the present invention in the transistors including the high-k material.

(33) Referring to FIGS. 7A and 7B, in a case in which an element having a low operating voltage is formed, while a mobility of the comparison target element is 0.019 cm.sup.2/Vs, a mobility of the doped element is 0.037 cm.sup.2/Vs. It may be confirmed that the doped element shows a high performance at a low voltage operation due to the reduction in the contact resistance.

(34) According to one embodiment, the present invention maintains a degree of structural freedom of the organic transistor element and is used to improve performance of a conventional element by applying a doping technology based on solid-state diffusion of an organic semiconductor for reducing a contact resistance. Accordingly, a lower power organic electronic element can be realized.

(35) Meanwhile, the present embodiments may be realized with computer readable codes in a computer readable recording medium. The computer readable recording medium includes any kind of a recording device in which computer readable data are stored.

(36) Examples of the computer readable recording medium are a read only memory (ROM), a random-access memory (RAM), a compact disc (CD)-ROM, a magnetic tape, a floppy disk, and an optical data storage device, and the computer readable recording medium may be implemented in a carrier wave type (for example, recorded by transmission through Internet). In addition, the computer readable recording media may be dispersed on computer systems connected through networks, and the computer readable codes may be stored and executed therein in a distributed manner. In addition, functional programs, codes, and segments for realizing the present embodiments may be easily inferred by programmers skilled in the art of the present invention.

(37) It will be understood by those skilled in the art that the invention may be performed in other concrete forms without changing the technological scope and essential features. Therefore, the above-described examples should be considered in a descriptive sense only and not for purposes of limitation.