HEAT ASSISTED MAGNETIC RECORDING MEDIA WITH OPTIMIZED HEAT SINK LAYER

Abstract

A heat assisted magnetic recording disk drive comprises a magnetic recording media with a heat sink layer including at least a material being defined by the general structure M.sub.n+1AX.sub.n, wherein M is a transition metal, A is an A-group element, X is C or N or a mixture of C and N, and n is a positive integer, or a material defined by the general structure M.sub.n+1AX.sub.n, wherein M is a transition metal, X is one or both of C and N, and n is a positive integer, or a mixture of the materials being defined by the general structure M.sub.n+1AX.sub.n and the material defined by the general structure M.sub.n+1X.sub.n, wherein the crystal structure of the materials is hexagonal with repeated M-X-M (quasi 2D) atomic layers. The atomic layers are stacked along the {right arrow over (c)}-axis that is oriented substantially parallel to the surface normal of the heat sink layer.

Claims

1. A heat assisted magnetic recording disk drive comprising a magnetic recording media with a heat sink layer, wherein the heat sink layer comprises at least a material being defined by the general structure M.sub.n+1AX.sub.n, wherein M is a transition metal, A is an A-group element, X is C or N or a mixture of C and N, and n is a positive integer, or a material defined by the general structure M.sub.n+1X.sub.n, wherein M is a transition metal, X is one or both of C and N, and n is a positive integer, or a mixture of the materials being defined by the general structure M.sub.n+1AX.sub.n and the material defined by the general structure M.sub.n+1X.sub.n, wherein the crystal structure of the materials is hexagonal with repeated M-X-M (quasi 2D) atomic layers, the atomic layers are stacked along the {right arrow over (c)}-axis and the {right arrow over (c)}-axis is oriented substantially parallel to the surface normal of the heat sink layer.

2. The heat assisted magnetic recording disk drive of claim 1, wherein the transition metal is selected from the group consisting of Sc, Ti, V, Cr, Mn, Zr, Nb, Mo, Tc, Lu, Hf, Ta, W or a combination of these elements.

3. The heat assisted magnetic recording disk drive of claim 1, wherein the A-group element is selected from the group consisting of Al, Si, P, S, Ga, Ge As, Cd, In, Sn, Sb, Tl, Pb, Bi or a combination of these elements.

4. The heat assisted magnetic recording disk drive of claim 1, wherein the atomic layers are repeated along the {right arrow over (c)}-axis.

5. The heat assisted magnetic recording disk drive of claim 1, wherein M.sub.n1AX.sub.n is Ti.sub.2AlC, Ti.sub.3SiC.sub.2, etc.

6. The heat assisted magnetic recording disk drive of claim 1, wherein the thickness of the heat sink layer is between 10 nm and 50 nm, preferably between 10 nm and 20 nm.

7. The heat assisted magnetic recording disk drive of claim 1, wherein the thermal conductivity of heat sink layer is between 30 W/m/K and 200 W/m/K, preferably between 30 W/m/K and 50 W/m/K.

Description

DRAWINGS

[0023] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.

[0024] In the drawings:

[0025] FIG. 1 is a cross sectional diagram of a heat assisted magnetic recording media.

[0026] FIG. 2 is a cross sectional diagram of a heat sink layer comprising a material being defined by the general structure M.sub.n1AX.sub.n.

[0027] FIG. 3 is a cross sectional diagram of a heat sink layer comprising a material being defined by the general structure M.sub.n1X.sub.n.

[0028] Corresponding reference numerals indicate corresponding parts throughout the several views of the drawings.

DETAILED DESCRIPTION

[0029] Example embodiments will now be described more fully with reference to the accompanying drawings.

[0030] FIG. 1 is a cross sectional diagram of a heat assisted magnetic recording media 1 including a heat sink layer 4. The magnetic recording media 1 comprises a substrate 5, the heat sink layer 4 disposed over the substrate 5, a seed layer 3 disposed between the heat sink layer 4 and a magnetic recording layer 2. The substrate 5 may be made of any suitable material, such as ceramic glass, amorphous glass, or NiP coated AlMg alloy. The seed layer 3 utilizes e.g. MgO underlayers to induce the proper growth mode of the magnetic recording layer 2. The magnetic recording layer 2 may include crystalline grains of magnetic material, such as L1.sub.0-chemically-ordered iron-platinum alloy film segregated by a non-magnetic material, such as an oxide, a carbide or a nitride. The heat sink layer 4 may be a single layer or a multi-layer structure, wherein the heat sink layer 4 comprises at least a material being defined by the general structure M.sub.n+1AX.sub.n or by the general structure M.sub.n+1X.sub.n.

[0031] FIG. 2 shows a cross section of a heat sink layer 6 and illustrates the layer structures of the MAX phases being defined by the general structure M.sub.n+1AX.sub.n in which the transitional metal carbide and/or nitride layers are interleaved with layers of pure A-group element and each X atom 9 is positioned within an octahedral array of M atoms 7. The MAX phases are oriented substantially with their c-axis parallel to the surface normal of the heat sink layer.

[0032] FIG. 3 shows a cross section of a heat sink layer 10 and illustrates the layer structures of the MXenes being defined by the general structure M.sub.n1X.sub.n. Because MXenes adopt the structures inherited from the parent MAX phases the M atoms 11 are arranged within the M.sub.n+1X.sub.n framework, wherein each X atom 12 is positioned within an octahedral array of M atoms 11. The MXenes are oriented substantially with their c-axis parallel to the surface normal of the heat sink layer.

[0033] The foregoing description of the embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but, where applicable, are interchangeable and can be used in a selected embodiment, even if not specifically shown or described. The same may also be varied in many ways. Such variations are to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.