Flexible convertible hotplate adapter for rounded vessels and objects
10701765 ยท 2020-06-30
Inventors
Cpc classification
B01L2300/1805
PERFORMING OPERATIONS; TRANSPORTING
B01F35/92
PERFORMING OPERATIONS; TRANSPORTING
H05B3/68
ELECTRICITY
B01L7/00
PERFORMING OPERATIONS; TRANSPORTING
B01L9/00
PERFORMING OPERATIONS; TRANSPORTING
B01F33/45
PERFORMING OPERATIONS; TRANSPORTING
International classification
B01L7/00
PERFORMING OPERATIONS; TRANSPORTING
B01L9/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
The present invention is an article or device to facilitate the heating of rounded vessels and other rounded objects comprising a flexible polymeric support having a plurality of folds so as to form the flexible polymeric support into a plurality of nested, concentric hollow cylindrical portions whose respective upper edges can be arranged and fixed into two or more configurations to accommodate at least two respective spherical section contours of respective different sizes. The present invention facilitates the heating of rounded, regularly-shaped or irregularly-shaped vessels or objects by presenting a flexible polymeric support surface. The flexible polymeric support surface is sufficiently malleable so as to be adapted for heating such objects or containers, and may be incorporated into an arrangement or system for heating such a container or object, and/or for stirring its contents, while being supported by the article or device of the present invention.
Claims
1. A device to facilitate the heating of rounded vessels and other rounded objects comprising: a flexible polymeric support comprising: a plurality of folds so as to form said flexible polymeric support into a plurality of nested, concentric hollow cylindrical portions each having respective upper edges and adapted to be arranged and fixed in at least two configurations such that said upper edges of said concentric hollow cylindrical portions accommodate at least two respective spherical section contours of at least two respective different sizes, and so as to be adapted to contact rounded vessels or other rounded objects of two respective different sizes.
2. The device according to claim 1 wherein said concentric hollow cylindrical portions comprise: a heat-conducting polymeric material selected from the group consisting of heat- conducting silicone rubbers.
3. The device according to claim 1 additionally comprising: a magnetic stirrer for creating a rotating magnetic field for purposes of stirring a vessel containing a magnet and disposed on said flexible polymeric support.
4. The device according to claim 1 additionally comprising: a temperature-sensing device selected from the group consisting of thermometers and thermocouples.
5. A device to facilitate the heating of rounded vessels and other rounded objects comprising: a flexible polymeric support comprising: a plurality of folds so as to form said flexible polymeric support into a plurality of nested, concentric hollow cylindrical portions each having respective upper edges and adapted to be reversibly moved from a collapsed configuration wherein said upper edges are coplanar to a fixed configuration such that said upper edges of said hollow cylindrical portions accommodate the shape of a spherical section contour.
6. The device to facilitate the heating of rounded vessels and other rounded objects comprising: a flexible polymeric support comprising: a plurality of folds so as to form said flexible polymeric support into a plurality of nested, concentric hollow cylindrical portions each having respective upper edges and adapted to be reversibly moved between two deployed configurations such that said upper edges of said hollow cylindrical portions accommodate respectively the shapes of at least two different spherical section contours.
7. The device according to claim 1 wherein said flexible polymeric support comprises: an upper side adapted to contact a container of one of said at least two spherical section contours and a lower side opposite said upper side, and additionally comprising a thermally conductive container disposed on said lower side of said flexible polymeric support, said thermally conductive container containing a thermally conductive filler material.
8. The device according to claim 5 wherein said flexible polymeric support comprises: an upper side adapted to contact a container having a spherical section contour and a lower side opposite said upper side, and additionally comprising: a container disposed on said lower side of said flexible polymeric support, said container containing a thermally conductive fluid.
9. The device according to claim 6 wherein said flexible polymeric support comprises: an upper side adapted to contact a container of one of said at least two spherical section contours and a lower side opposite said upper side, and additionally comprising: a container disposed on said lower side of said flexible polymeric support, said container containing a thermally conductive fluid.
10. A device according to claim 7. wherein said thermally conductive filler material is selected from the group consisting of liquids, pastes, putties, greases and gums.
11. A device according to claim 1 additionally comprising: a handle portion.
12. A device according to claim 1 wherein said a flexible polymeric support comprises: a flexible polymeric support surface comprising: thermal interface silicone rubber compositions selected from the group consisting of silicone rubber compositions and fluoro-silicone rubber compositions, said thermal interface silicone rubber compositions containing substantially uniform dispersions of filler particles selected from the group consisting of thermally-conducting metals, minerals and ceramics.
13. A device according to claim 10 wherein said malleable material is selected from the group consisting of (a) high-temperature-resistant thermal-transfer fluids, silicone oil thermal transfer fluids and silicone fluids, (b) silicone greases and (c) silicone materials containing a substantially-uniform dispersion of thermally-conducting filler particles selected from particles of heat-conducting metals, mineral particles and ceramic particles.
14. A device according to claim 1, said device adapted to be arranged and fixed in four configurations such that said upper edges of said concentric hollow cylindrical portions accommodate respective round-bottomed flasks of four different respective different sizes at their respective bottoms.
Description
BRIEF DESCRIPTION OF THE FIGURES
(1) While the specification concludes with claims particularly pointing out and distinctly claiming the present invention, it is believed that the present invention will be better understood from the following description in conjunction with the accompanying Drawing Figures, in which like reference numerals identify like elements, and wherein:
(2)
(3)
(4)
(5)
(6)
DETAILED DESCRIPTION OF VARIOUS EMBODIMENTS OF THE INVENTION
(7) In the following detailed description of the preferred embodiment, reference is made to the accompanying drawings that form a part hereof, and in which is shown by way of illustration, and not by way of limitation, a specific preferred embodiment in which the invention may be practiced. It is to be understood that other embodiments may be utilized and that changes may be made without departing from the spirit and scope of the present invention.
(8)
(9) The materials of construction of both the skin 5 and the filler substance 6 are chosen from materials which are resistant to substantial degradation when exposed to the range of temperatures the device is expected to experience in normal use; that is, comprising materials which substantially retain their mechanical properties up to temperatures of about 180 C. or greater for practical periods of time. The material of constructions for 5 is chosen from soft, malleable or flexible metals or metal alloys or chosen from high-temperature-resistant organic polymers such as polyimide films. One type of high-temperature-resistant polyimide film is known by the trade name: Kapton (DuPont Chemicals). Most preferentially, the material of construction of 5 is a silicone rubber or a fluorosilicone rubber and, further, 5 preferentially comprises a silicone rubber with superior thermal conductivity, in other words, a material with superior heat conductivity properties. Examples of high-temperature-resistant materials of this type are known in the art as thermal interface silicone rubbers and are materials chosen from various silicone rubber compositions containing substantially-uniform dispersions of filler particles chosen from thermally-conducting metals, minerals, ceramics or other inorganic or organic materials. The chosen thermal interface silicone rubber, preferentially, will have a thermal conductivity greater than 1 W m.sup.1 K.sup.1. In one embodiment the skin/shell, 5, thickness is in the range of about 0.1 mm to 15 mm but preferentially it is about 2 mm in thickness.
(10) The composition of the moldable/malleable/fluid filler material 6 is to be chosen from high-temperature-resistant thermal-transfer fluids, some examples of which are known by the trade names of Paratherm (Paratherm Corp.), Dowtherm (Dow Chemical Corporation), and Therminol (Eastman Chemical Co.). Still other high-temperature-resistant thermal transfer fluids and materials are known to persons skilled in the art. The preferred moldable/malleable filler substance is a silicone oil such as Syltherm XLT HTF, Syltherm 800 Stabilized HTF, Syltherm HF HTF, (all marketed by Dow Chemical Company) or a silicone fluid, silicone grease or silicone paste and, further, 6 is preferentially a silicone oil, a silicone fluid, a silicone grease or a silicone paste containing a substantially-uniform dispersion of substantially thermally-conducting filler particles such as are chosen from particles of various metals, mineral particles, ceramic particles or other inorganic materials. A silicone paste with continuous thermal stability to 200 C. and very high thermal conductivity is marketed under the trade name Omegatherm 201 by OMEGA Engineering, Inc. Heat-Away 6400 is a high-temperature thermally conductive, copper-filled silicone grease marketed by Aremco Product, Inc. and suitable for heat transfer applications from 51 C. to 288 C. Still other suitable high-temperature thermally conductive fluids, pastes or greases are known to persons skilled in the art.
(11) In one embodiment, the device is constructed to form an object or article which is substantially flat on one face (designated as the bottom) and is substantially shaped, on the opposite face, (designated as the top) to form a pocket, socket, cavity or basin such as may conform to the profile of a round-bottomed vessel or to the shape of some other rounded or regularly or irregularly shaped object to be situated or nested in the pocket.
(12) Another embodiment is also shown in
(13) Viewed as a cylinder, changing the device's diameter by compression of (squeezing) the side(s) of the device will cause the incompressible filler fluid to push the top face up and away from the bottom face. In other words, the height of the device will vary inversely with its diameter because the volume of the device will remain essentially constant even as the device is adjusted to accommodate flasks of different capacities.
(14) This embodiment of the present invention further comprises a lifting ring, 3, (
(15)
(16) In one embodiment, the lifting ring 3, is encapsulated by a coating, designated as the lifting ring shell, 2, (
(17) In one embodiment, the device or article comprises a partial covering of a second skin or shell, 4, (
(18)
(19)
(20) Another embodiment of the present invention may comprise a thermocouple integrated with the device or inserted in slots or holes in the device such that the thermocouple probe may be plugged by means of a thermocouple pair of wires into the external temperature control of a hotplate or similar device.
(21)
(22) While particular embodiments of the present invention have been illustrated and described, it would be obvious to those skilled in the art that various other changes and modifications can be made without departing from the spirit and scope of the invention. It is therefore intended to cover in the appended claims, which themselves constitute part of the disclosure, all such changes and modifications that are within the scope of this invention.
(23) The following references are hereby incorporated herein by reference:
US PATENT DOCUMENTS
(24) TABLE-US-00001 3,784,170 January 1974 Peterson et al. 4,054,270 October 1977 Gugger et al. 4,080,663 March 1978 Wik 4,090,263 May 1978 Hoffa 4,131,370 December 1978 Lawrence et al. 4,199,265 April 1980 Sanderson et al. 4,214,874 July 1980 White 4,227,815 October 1980 Hoffa 4,390,283 June 1983 Meyer 4,568,195 February 1986 Herz et al. 4,752,138 June 1988 Rufer 4,759,635 July 1988 MacMichael et al. 4,830,511 May 1989 Smazik 4,876,069 October 1989 Jochimsen 4,911,555 March 1990 Saffer et al. 4,991,973 February 1991 Maaz et al. 5,529,391 June 1996 Kindman et al. 5,899,567 May 1999 Morris, Jr. 5,911,503 June 1999 Braden et al. D426312 June 2000 Gomes 6,508,582 January 2003 Friedman 6,659,637 December 2003 Friedman 6,733,171 May 2004 Schob 6,905,656 June 2005 Ladlow et al. 6,962,433 November 2005 Nichols et al. 6,988,825 January 2006 Coville et al. 7,075,040 July 2006 McFadden et al. 7,153,021 December 2006 Goodwin et al. 7,364,350 April 2008 Coville et al. 7,494,267 February 2009 Ware 8,398,297 March 2013 Dettling et al. 2004/0151065 August 2004 Nichols et al. 2011/0038224 February 2011 Dettling et al.
FOREIGN PATENT DOCUMENTS
(25) TABLE-US-00002 2 201 204 May 1973 DE 81 06 555.8 December 1981 DE 30 43 335 June 1982 DE 1201297 May 2002 EP 156206 June 1969 GB WO 91/10503 July 1991 WO
OTHER REFERENCES
(26) Texas Instruments, Data Sheet for Single Schmitt-Trigger Inverter, SN74LVC1G14, SCE218CApril 1999Revised February 2000, pp. 1-8, Texas Instruments, Dallas, Tex. Allegro Microsystems, Inc., Data Sheet for Microstepping DMOS Driver with Translator, A3979, pp. 1-14, Allegro Microsystems, Inc., Worcester, Mass., www.allegromicro.com. National Semiconductor Corporation, Data Sheet for LM117/LM317A/LM317 3Terminal Adjustable Regulator, 9063, Oct. 20, 2008, pp. 1-28, National Semiconductor Americas Technical Support Center, www.national.com. Linear Technology Corporation, Data Sheet for LTC1440/LTC1441/LTC1442 Ultralow Power Single/Dual Comparator with Reference, 144012fd, pp. 1-16, Linear Technology Corporation, Milpitas, Calif., www.linear.com, 1996. Maxim Integrated Products, Data Sheet for MAX1615/MAX1616 High-Voltage, Low-Power Linear Regulators for Notebook Computers, 19/1225; Rev 3; September 2004, pp. 1-8, Maxim Integrated Products, Sunnyvale Calif., www.maxim-ic.com/packages. International Search Report and Written Opinion mailed Jan. 4, 2012 for PCT/US2010/039614 filed Jun. 23, 2010. International Preliminary Report on Patentability mailed Feb. 14, 2012 for PCT/US2010/039614 filed Jun. 23, 2010.