Waterproof MEMS chip package structure

Abstract

A waterproof MEMS chip package structure includes a substrate having aa through hole cut through opposing top and bottom surface thereof, a waterproof membrane disposed in the through hole, an along chip bonded to the top surface of the substrate, a MEMS chip stacked on the analog chip and electrically connected to the substrate and the analog chip by wire bonding, and a top cover mounted on the substrate to form an accommodation chamber that accommodates the analog chip and the MEMS chip and communicates with the outside through the through hole. Therefore, the MEMS chip package structure of the present invention utilizes the waterproof membrane to block water vapor from entering the accommodation chamber through the through hole, thereby achieving the effect of protecting the chips.

Claims

1. A MEMS chip package structure, comprising: a substrate comprising a top surface, a bottom surface and a through hole cut through said top surface and said bottom surface; a waterproof membrane disposed in said through hole of said substrate; an analog chip bonded to said top surface of said substrate; a MEMS chip stacked on said analog chip and electrically connected to said substrate and said analog chip; and a top cover mounted on said top surface of said substrate and defining with said top surface of said substrate an accommodation chamber therebetween for accommodating said analog chip and said MEMS chip, said accommodation chamber communicating with the outside through said through hole.

2. The MEMS chip package structure as claimed in claim 1, wherein said substrate is a multilayer board formed by a plurality of sheets; said waterproof membrane is clamped between two adjacent said sheets.

3. The MEMS chip package structure as claimed in claim 1, wherein the material of said waterproof membrane is a polymer.

4. The MEMS chip package structure as claimed in claim 3, wherein said polymer is polytetrafluoroethene (PTFE).

5. The MEMS chip package structure as claimed in claim 1, wherein said top cover is selectively made of plastic or metal.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a schematic drawing illustrating the structural arrangement of a waterproof MEMS chip package structure in accordance with the present invention.

(2) FIG. 2 is a top view of a part of the substrate for waterproof MEMS chip package structure in accordance with the present invention.

DETAILED DESCRIPTION OF THE INVENTION

(3) The applicant first describes here, throughout the specification, including the preferred embodiment described below and the claims of the scope of the present patent application, the nouns relating to directionality are based on the direction in the drawings. In the following preferred embodiment, the same reference numerals are given to the same or similar elements or structural features thereof, and the dimensions and proportions of the various elements in the drawings are used to facilitate the display and description of the structural features of the present invention but not drawn according to the actual configuration.

(4) Referring to FIG. 1, a waterproof MEMS chip package structure 10 in accordance with the present invention is shown. The waterproof MEMS chip package structure 10 comprises a substrate 20, a waterproof membrane 25, an analog chip 30, a MEMS chip 32 and a top cover 40.

(5) The substrate 20 has a top surface 21, a bottom surface 22 and a through hole 23 cut through the top surface 21 and the bottom surface 22. In this embodiment, the substrate 20 is a multi-layer board formed by a plurality of sheets 24 subjected to a pressing process.

(6) The material of the waterproof membrane 25 in this embodiment is a polymer such as polytetrafluoroethene (PTFE).

(7) The waterproof membrane 25 is disposed in the through hole 23 and is simultaneously clamped between the upper and lower adjacent sheets 24 in the pressing process of the substrate 20 to block water vapor from passing through the through hole 23.

(8) The analog chip 30 is fixed on the top surface 21 of the substrate 20 by an adhesive. The MEMS chip 32 is fixed on a top surface of the analog chip 30 by an adhesive and electrically connected to the substrate 20 and the analog chip 30 by wire bonding. Thereby, the continuity analog signal (such as light, pressure or sound, etc.) transmitted by the MEMS chip 32 is processed by the analog chip 30 for output.

(9) The material of the top cover 40 can be plastic or metal, which is not limited here. The top cover 40 is fixed on the top surface 21 of the substrate 20 by an adhesive and forms an accommodation chamber 42 for accommodating the analog chip 30 and the MEMS chip 32, and the accommodation chamber 42 communicates with the outside through the through hole 23.

(10) It can be seen from the above that the MEMS chip package structure 10 of the present invention can effectively prevent moisture and dust from entering the accommodation chamber 42 through the through hole 23 by using the waterproof membrane 24, thus, a waterproof and dustproof effect is provided to protect the chips located in the accommodation chamber 42 to prolongs the service life of the package structure.