Illumination apparatus having thermally isolated heat sinks and dual light sources

Abstract

An apparatus includes a light emitting diode (LED) chip; a laser light source; a front heat sink including first and second holes; a lens arranged to extend over the first hole; a back heat sink; and an insulating circuit board including a third hole, the circuit board sandwiched between the heat sinks such that the second hole and the third holes are aligned. The LED chip is mounted in a surface of the circuit board facing the front heat sink, and arranged such that it aligns with the first hole and the lens. The laser light source is provided in the back heat sink and arranged such that it extends at least partially through the second and third holes.

Claims

1. An apparatus comprising: at least one insulating plate including a first hole; a front heat sink having a second hole; a first electronic component mounted on the front heat sink; a back heat sink; a second electronic component mounted on the back heat sink; wherein the insulating plate is sandwiched between the front and back heat sinks, the first and second holes aligned such that the second electronic component can be seen through the first and second holes.

2. An Illumination apparatus comprising: at least one circuit board including a first hole; a first light source provided on the circuit board; a front heat sink having a second hole; a back heat sink; a second light source provided on the back heat sink; wherein the circuit board is sandwiched between the front and back heat sinks, the first and second holes aligned such that the second light source can be seen through the first and second holes.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is an assembled view of the embodiment for two co-located light sources

(2) FIG. 2 is an exploded view and assembly of the method and apparatus for the compound heat sink.

(3) FIG. 3 is pictured the mounting of each light source to their respective component heat sinks.

DETAIL DESCRIPTIONS OF THE INVENTION

(4) All illustrations of the drawings are for the purpose of describing selected versions of the present invention and are not intended to limit the scope of the present invention.

(5) Referring to FIG. 1 an assembled view of the embodiment shows a laser light source 104, an LED light source with lens 100, and an insulating circuit board 103. The lens 100 is mounted onto a first hole 106 formed on front heat sink 101. A back heat sink 102 supports the laser light source 104. The circuit board 103 is sandwiched between the front heat sink 101 and the back heat sink 102, thereby thermally isolating the heat sinks 101 and 102 from each other. A second hole 107 formed on the front heat sink 101 aligns with the circuits board hole 108, such that the laser light source 104 extends at least through the second hole 107 and circuit board hole 108.

(6) Referring to FIG. 2 an exploded view of the apparatus an LED chip 204 is mounted on a surface 205 of the circuit board 103 to align with the first hole 106, such that light from the LED chip 204 reaches the LED lens 100. The front heat sink 101 mounts to the surface 205 of the circuit board 103. The circuit board 103 acts as an insulator between the back heat sink 102 and the LED chip 204 on the surface. The front heat sink 101 and back heat sink 102 with the circuit board 103 sandwiched between them form the assembly 210.

(7) Referring to FIG. 3 the front heat sink 101 and the back heat sink 102 are shown. The laser light source 104 is mounted in the heat sink 102 to form a component 350. The circuit board 103 is attached to the front heat sink 101 to form a component 360.

(8) Although the invention has been explained in relation to its preferred embodiment, it is to be understood that many other possible modifications and variations can be made without departing from the spirit and scope of the invention.