CABLE STRUCTURE AND MANUFACTURING METHOD THEREOF

Abstract

A cable structure and a manufacturing method thereof are provided. The cable structure includes a transmission component and a protection component. The transmission component includes at least one first intermedium unit, and the least one first intermedium unit includes at least one first transmission cable and a first barrier layer covering the at least one first transmission cable. The protection component includes at least one shielding layer covering the at least one first intermedium unit and an insulating layer covering the at least one shielding layer. The at least one shielding layer includes a metal foil layer covering the at least one first intermedium unit and at least one conducting layer formed on a surface of the metal foil layer.

Claims

1. A cable structure, without a metal braid, comprising: a transmission component including at least one first intermedium unit, the at least one first intermedium unit including at least one first transmission cable and a first barrier layer that covers the at least one first transmission cable; and a protection component including at least one shielding layer that covers the at least one first intermedium unit and an insulating layer that covers the at least one shielding layer; wherein the at least one shielding layer includes a metal foil layer covering the at least one first intermedium unit and at least one conducting layer formed on a surface of the metal foil layer; wherein the at least one conducting layer includes a combination of at least two of a first conducting material, a second conducting material, and a third conducting material; wherein the first conducting material is graphene, the second conducting material is graphite, a graphite carbon pipe, or a combination thereof, and the third conducting material is at least one of gold, silver, copper, iron, aluminum and nickel.

2. (canceled)

3. (canceled)

4. The cable structure according to claim 1, wherein the transmission component further includes at least one second intermedium unit, the at least one second intermedium unit including at least one second transmission cable and a second barrier layer, and the at least one shielding layer covers the at least one second intermedium unit.

5. A manufacturing method of a cable structure without a metal braid, comprising: providing a transmission component that includes at least one first intermedium unit, the at least one first intermedium unit including at least one first transmission cable and a first barrier layer that covers the at least one first transmission cable; covering the transmission component by at least one shielding layer; and covering the at least one shielding layer by an insulating layer; wherein the at least one shielding layer includes a metal foil layer that covers the transmission component and at least one conducting layer formed on a surface of the metal foil layer; wherein the at least one conducting layer includes a combination of at least two of a first conducting material, a second conducting material, and a third conducting material; wherein the first conducting material is graphene, the second conducting material is graphite, a graphite carbon pipe, or a combination thereof, and the third conducting material is at least one of gold, silver, copper, iron, aluminum and nickel.

6. (canceled)

7. (canceled)

8. The manufacturing method of the cable structure according to claim 5, wherein the transmission component further includes at least one second intermedium unit, the at least one second intermedium unit including at least one second transmission cable and a second barrier layer, and the at least one shielding layer covers the at least one second intermedium unit.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The present disclosure will become more fully understood from the following detailed description and accompanying drawings.

[0013] FIG. 1 is a first cross-sectional view of a cable structure according to a first embodiment of the present disclosure.

[0014] FIG. 2 is an enlarged schematic view of portion II of FIG. 1.

[0015] FIG. 3 is a second cross-sectional view of the cable structure according to the first embodiment of the present disclosure.

[0016] FIG. 4 is a cross-sectional view of the cable structure according to a second embodiment of the present disclosure.

[0017] FIG. 5 is a cross-sectional view of the cable structure according to a third embodiment of the present disclosure.

[0018] FIG. 6 is a cross-sectional view of the cable structure according to a fourth embodiment of the present disclosure.

[0019] FIG. 7 is a flow chart of a manufacturing method of the cable structure according to the present disclosure.

[0020] FIG. 8 is a flow chart of a manufacturing method of a conducting layer according to the present disclosure.

[0021] FIG. 9 is a flow chart of a processing method of the conducting layer according to the present disclosure.

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

[0022] The present disclosure is more particularly described in the following examples that are intended as illustrative only since numerous modifications and variations therein will be apparent to those skilled in the art. Like numbers in the drawings indicate like components throughout the views. As used in the description herein and throughout the claims that follow, unless the context clearly dictates otherwise, the meaning of a, an, and the includes plural reference, and the meaning of in includes in and on. Titles or subtitles can be used herein for the convenience of a reader, which shall have no influence on the scope of the present disclosure.

[0023] The terms used herein generally have their ordinary meanings in the art. In the case of conflict, the present document, including any definitions given herein, will prevail. The same thing can be expressed in more than one way. Alternative language and synonyms can be used for any term(s) discussed herein, and no special significance is to be placed upon whether a term is elaborated or discussed herein. A recital of one or more synonyms does not exclude the use of other synonyms. The use of examples anywhere in this specification including examples of any terms is illustrative only, and in no way limits the scope and meaning of the present disclosure or of any exemplified term. Likewise, the present disclosure is not limited to various embodiments given herein. Numbering terms such as first, second or third can be used to describe various components, signals or the like, which are for distinguishing one component/signal from another one only, and are not intended to, nor should be construed to impose any substantive limitations on the components, signals or the like.

First Embodiment

[0024] Referring to FIG. 1 to FIG. 3, a first cross-sectional view of a cable structure according to a first embodiment of the present disclosure, an enlarged schematic view of portion II of FIG. 1, and a second cross-sectional view of the cable structure according to the first embodiment of the present disclosure are shown, respectively. As shown in the drawings, the first embodiment of the present disclosure provides a cable structure C. The cable structure C includes a transmission component 1 and a protection component 2. The transmission component 1 includes at least one first intermedium unit 10. The at least one first intermedium unit 10 includes at least one first transmission cable 100 and a first barrier layer 101 that covers the at least one first transmission cable 100. The protection component 2 includes at least one shielding layer 21 that covers the at least one first intermedium unit 10 and an insulating layer 22 that covers the at least one shielding layer 21. The at least one shielding layer 21 includes a metal foil layer 210 covering the at least one first intermedium unit 10 and at least one conducting layer 211 formed on a surface of the metal foil layer 210.

[0025] Specifically, the first embodiment of the present disclosure provides the cable structure C that includes the transmission component 1 and the protection component 2. The transmission component 1 further includes at least one first intermedium unit 10. The at least one first intermedium unit 10 includes at least one first transmission cable 100 and the first barrier layer 101. The first transmission cable 100 can be regarded as a signal transmission cable. The first barrier layer 101 can be formed of insulating materials, but not limited thereto. The first barrier layer 101 covers the first transmission cable 100.

[0026] The protection component 2 further includes at least one shielding layer 21 and the insulating layer 22. The insulating layer 22 can be formed of insulating materials, but not limited thereto. The at least one shielding layer 21 can include the metal foil layer 210 and at least one conducting layer 211. The metal foil layer 210 can be made of copper foil materials, aluminum foil material or other conducting materials, but not limited thereto. The at least one conducting layer 211 can be made of conducting materials, and can be formed by coating on a surface of the metal foil layer 210 opposite to the first intermedium unit 10, but not limited thereto. The at least one shielding layer 21 covers the at least one first intermedium unit 10, and the insulating layer 22 covers the at least one shielding layer 21.

[0027] Therefore, when the at least one first intermedium unit 10 transmits high frequency signals, the at least one conducting layer 211 between the metal foil layer 210 and the insulating layer 22 can shield and absorb EMI transmitted from outside, so as to stabilize signal transmission quality of the cable structure C.

[0028] By virtue of the at least one conducting layer 211 that is disposed between the metal foil layer 210 and the insulating layer 22 for shielding and absorbing

[0029] EMI transmitted from outside, a configuration of a conventional metal braid can be omitted. As a result, the weight of the electronic cable is reduced and flexibility of the electronic cable is increased. Moreover, since the at least one conducting layer 211 is formed by coating on the surface of the metal foil layer 210, there is no gap formed on a range of shielding EMI. Therefore, the electronic cable of the present disclosure possesses better masking capability than the conventional electronic cable.

[0030] Moreover, the at least one conducting layer 211 can include one of the following: a first conducting material 2110, a second conducting material 2111, a third conducting material 2112, and the combination of at least two of the first, second, and third conducting materials 2110, 2111, 2112. Furthermore, the first conducting material 2110 can be graphene, the second conducting material 2111 can be graphite, graphite carbon pipe, or a combination thereof, and the third conducting material 2112 is at least one of gold, silver, copper, iron, aluminum and nickel, but not limited thereto.

[0031] Referring to FIG. 3, in one of the embodiments, the protection component 2 can further include an isolating layer 20 that is made of insulating materials, but not limited thereto. The isolating layer 20 covers the at least one first intermedium unit 10; the at least one shielding layer 21 covers the isolating layer 20; the insulating layer 22 covers the at least one shielding layer 21.

Second Embodiment

[0032] Referring to FIG. 4, a cross-sectional view of the cable structure according to a second embodiment of the present disclosure is shown. Further referring to FIG. 1 to FIG. 3, the cable structure of this embodiment is similar to the first embodiment, and the detailed descriptions of the same components in these embodiments are thus be omitted hereinafter for sake of brevity. It should be noted that, the protection component 2 in this embodiment further includes a plurality of shielding layers 21A, 21B, which can be stacked layer-upon-layer between the at least one first intermedium unit 10 and the insulating layer 22.

[0033] For example, in order to improve the effect of shielding and/or absorbing EMI from outside of the cable structure of the present disclosure, the plurality of shielding layers 21A, 21B can be configured. For instance, two shielding layers are configured in this embodiment, but not limited thereto. In other words, the protection component 2 can further include multiple shielding layers 21A, 21B which are stacked layer-upon-layer between the at least one first intermedium unit 10 and the insulating layer 22. Moreover, the material of the conducting layer 211 of the shielding layer 21A can be exactly the same or partially the same as that of the conducting layer 211 of the shielding layer 21B. Consequently, by configuration of the layer-upon-layer stacking of the shielding layer 21A and the shielding layer 21B, the effect of shielding EMI from outside can be substantially increased.

[0034] The shielding layer 21A can also be formed, by coating, on a surface of the shielding layer 21B, but not limited thereto.

Third Embodiment

[0035] Referring to FIG. 5, a cross-sectional view of the cable structure according to the third embodiment of the present disclosure is shown. Further referring to FIG. 1 to FIG. 4, the cable structure of this embodiment is similar to the aforesaid embodiments, and the detailed descriptions of the same components in these embodiments are thus be omitted hereinafter for sake of brevity. It should be noted that, the transmission component 1 in this embodiment further includes at least one third intermedium units 13. The at least one third intermedium units 13 includes a plurality of conducting cables 130, a third transmission cable 131, and a third barrier layer 132 that covers the plurality of conducting cables 130 and the fourth transmission cable 131. Each of the conducting cables 130 includes a cable core 1300 and an insulating layer 1301.

[0036] For example, the transmission component 1 of the cable structure C of the present disclosure can further include the plurality of first intermedium units 10 and the plurality of third intermedium units 13. Each of the cable core 1300, the third transmission cable 131 and the first intermedium units 10 can be signal transmission cables. Each of the third barrier layer 132, the insulating layer 1301 and the first barrier layer 101 can be made of insulating materials. Therefore, the at least one shielding layer 21 of the cable structure C of the present disclosure covers the plurality of first intermedium units 10 and the plurality of third intermedium units 13. The insulating layer 22 covers the shielding layer 21.

Fourth Embodiment

[0037] Referring to FIG. 6, a cross-sectional view of the cable structure according to a fourth embodiment of the present disclosure is shown. Further referring to FIG. 1 to FIG. 5, the cable structure of this embodiment is similar to the aforesaid embodiments, and the detailed descriptions of the same components in these embodiments are thus be omitted hereinafter for sake of brevity. It should be noted that the cable structure in this embodiment is similar to that in the third embodiment, and the only difference resides in that the third barrier layer 132 and the first barrier layer 101 are replaced by the shielding layer 21 and the insulating layer 22 in this embodiment so as to improve the effect of shielding EMI.

[0038] In addition to demonstrating the cable structure C of the present disclosure in abovementioned embodiments, a manufacturing method of the cable structure C will be further illustrated as follows for better understanding.

[Manufacturing Method of Cable Structure]

[0039] Referring to FIG. 7 to FIG. 9, a flow chart of a manufacturing method of the cable structure according to the present disclosure, a flow chart of a manufacturing method of a conducting layer according to the present disclosure, a flow chart of a processing method of the conducting layer according to the present disclosure are shown, respectively. Further referring to FIG. 1 to FIG. 6, the manufacturing method of the cable structure C includes the following steps.

[0040] The first step is to provide a transmission component. The transmission component can include at least one first intermedium unit. The at least one first intermedium unit includes at least one first transmission cable and a first barrier layer that covers the at least one first transmission cable (Step S30).

[0041] The next step is to cover the transmission component by at least one shielding layer (Step S31).

[0042] And then, the next step is to cover the at least one shielding layer by an insulating layer (Step S32).

[0043] Further, referring to FIG. 9, the present disclosure provides a manufacturing method of the conducting layer. The manufacturing method includes the following steps.

[0044] The first step is to proportionately mix first conducting materials 2110, second conducting materials 2111, third conducting materials 2112, or a combination thereof (Step S40).

[0045] Then, the next step is to stir the mixed materials (Step S41).

[0046] Further, the next step is to mill the stirred materials (Step S42) so as to homogenize and minimize compositions of the materials.

[0047] After that, steps of grinding, extending, rolling, and stretching on the materials are repeatedly applied until the materials are fully mixed and compatible (Step S43). In process of mixing the materials, particular solvent and/or auxiliaries can be added while stirring the materials such that the materials can be completely mixed and compatible. The aforesaid particular solvent and auxiliaries are conventional materials thus the detailed descriptions thereof are omitted herein.

[0048] Finally, the last step is to seal or pack the compatible materials (Step S44).

[0049] Furthermore, referring to FIG. 10, the present disclosure provides a processing method of the conducting layer. The processing method includes the following steps.

[0050] The first step is to dilute, by particular diluent, the sealed or packed materials for obtaining material liquid (Step S50).

[0051] Then, the next step is to stir the dilute material liquid for adjusting stickiness of the material liquid (Step S51).

[0052] Further, the next step is to evenly coating the adjusted material liquid on the metal foil layer 210 (Step S52).

[0053] After that, the next step is to solidify the material liquid on the metal foil layer 210 so as to form the conducting layer 211 (Step S53), wherein a degree of solidification is smaller or equal to 90 degree.

[0054] Finally, the last step is to obtain the shielding layer 21 and apply the winding process (Step S54).

[0055] As mentioned above, a workable thickness of the conducting layer 211 ranges between 10 um to 12 um and a material resistivity thereof ranges from 10.sup.2 to 10.sup.5.

[0056] In conclusion, by virtue of the protection component 2 includes at least one shielding layer 21 that covers the at least one first intermedium unit 10 and an insulating layer 22 that covers the at least one shielding layer 21 and the at least one shielding layer 21 includes the metal foil layer 210 covering the at least one first intermedium unit 10 and at least one conducting layer 211 formed on the surface of the metal foil layer 210 of the cable structure C and the manufacturing method of the cable structure provided by the present disclosure, the effect of shielding EMI can be substantially increased.

[0057] Moreover, conventional methods for absorbing radiation wave is to weave (i.e., forming a cable mesh structure) a metal braid by aluminum foils, copper cables, aluminum cables or combination of other metal alloy so as to achieve effect of shielding EMI. While the weaving number of the metal braid is increased, a weight of the electronic cable is increased, and a flexibility of the electronic cable is reduced so that it is difficult to complete the metal braid. Furthermore, even though the weaving number of the metal braid is high, there are still gaps formed between the cable mesh structure of the metal braid, which diminishes effect of shielding the EMI and thereby lowering quality of signal transmission.

[0058] Therefore, by virtue of the conducting layer 211 that is disposed between the transmission component 1 and the insulating layer 22 for shielding and absorbing EMI transmitted from outside, a configuration of a conventional metal braid can be omitted. Moreover, since the at least one conducting layer 211 is formed by coating on the surface of the metal foil layer 210, there is no gap formed on a range of shielding EMI. Therefore, the electronic cable of the present disclosure possesses better masking capability than the conventional electronic cable. Furthermore, the weight of the electronic cable is reduced and flexibility of the electronic cable is increased.

[0059] The foregoing description of the exemplary embodiments of the disclosure has been presented only for the purposes of illustration and description and is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching.

[0060] The embodiments were chosen and described in order to explain the principles of the disclosure and their practical application so as to enable others skilled in the art to utilize the disclosure and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will become apparent to those skilled in the art to which the present disclosure pertains without departing from its spirit and scope.