METHOD FOR FURTHER IMPROVING LASER PULSED DEPOSITION EFFICIENCY
20230235446 · 2023-07-27
Inventors
Cpc classification
C23C14/54
CHEMISTRY; METALLURGY
H01L21/02266
ELECTRICITY
H01L21/02115
ELECTRICITY
International classification
Abstract
A thin film deposition apparatus comprising: a laser pulse generator to generate a laser pulse; optical elements to optionally P-polarize and optionally rotate the laser pulse polarization with a polarization angle φ based on the cavity chamber and deposition material; focusing optics to focus the laser pulse; a source of deposition material having refractive index n.sub.2; said deposition material mounted within an evacuated chamber having a refractive index n.sub.1; a rotation and / or translation device to alter and / or direct said laser pulse onto said source of deposition material at an incidence angle θ to produce a plasma to be deposited on a substrate; wherein the polarization angle φ and incidence angle θ are defined by the area under the graphical representation of the ellipse of equation
where θ.sub.0=0.8× arctan (n.sub.2/n.sub.1), φ.sub.0=0, a=0.4× arctan (n.sub.2/n.sub.1) and b=0.5× arctan (n.sub.2/n.sub.1).
Claims
1-42. (canceled)
43. A thin film deposition apparatus comprising: a laser pulse generator to generate a laser pulse; optical elements to P-polarize and rotate the laser pulse polarization with a polarization angle φ based on the cavity chamber and deposition material; focusing optics to focus the laser pulse; a source of deposition material having refractive index n.sub.2; said deposition material mounted within an evacuated chamber having a refractive index n.sub.1 a rotation and / or translation device to alter and / or direct said laser pulse onto said source of deposition material at an incidence angle θ to produce a plasma to be deposited on a substrate; wherein the polarization angle φ and incidence angle θ are defined by the area under the graphical representation of the ellipse of equation
44. The thin film deposition apparatus according to claim 43 wherein the laser pulse generator comprises an excimer laser pulse generator.
45. The thin film deposition apparatus according to claim 44 wherein the excimer laser pulse generator comprises KrF as gain medium.
46. The thin film deposition apparatus according to claim 43 wherein the laser pulse generator comprises ArF as gain medium.
47. The thin film deposition apparatus according to claim 43 wherein the laser pulse wavelength is less than 1064 nm.
48. The thin film deposition apparatus according to claim 43 wherein the laser pulse wavelength is less than 600 nm.
49. The thin film deposition apparatus according to claim 43 wherein the laser pulse wavelength is about 532 nm.
50. The thin film deposition apparatus according to claim 43 wherein the laser pulse wavelength is in the range 213 to 355 nm.
51. The thin film deposition apparatus according to claim 43 wherein the laser pulse wavelength is in the range 126 to 348 nm.
52. The thin film deposition apparatus according to claim 43 wherein the laser pulse wavelength is 248 nm or about 248 nm.
53. The thin film deposition apparatus according to claim 43 wherein the laser pulse wavelength is 198 nm or about 198 nm.
54. The thin film deposition apparatus according to claim 43 wherein the laser pulse wavelength is 193 nm or about 193 nm.
55. The thin film deposition apparatus according to claim 43 wherein the pulse duration is in the range 1 femtosecond to 50 nanoseconds.
56. The thin film deposition apparatus according to claim 43 wherein the pulse duration is in the range 5-30 nanoseconds.
57. The thin film deposition apparatus according to claim 43 wherein the optical elements to P-polarize and rotate the laser pulse polarization comprises one or more of a film polarizer, a crystal polarizing cube, a wire grid polarizer, a Brewster window, a λ/4 plate, a λ/2 plate, and a faraday rotator.
58. The thin film deposition apparatus according to claim 43 wherein the deposition material comprises one or more of: a carbon source, a graphite, highly oriented pyrolytic graphite, a complex metal oxide, Lithium Niobate (LiNbO.sub.3), a high temperature superconductor, LiTi.sub.2O.sub.4, Li.sub.4Ti.sub.5O.sub.12, YBa.sub.2Cu.sub.3O.sub.7, a ferroelectric material, Ba.sub.xSr.sub.1-xTiO.sub.3, a piezoelectric, Ta.sub.2O.sub.5, a fast ion conductor, Y.sub.2(Sn.sub.yTi.sub.1-y).sub.2O.sub.7, a liquid petroleum gas sensor, and Pd-doped SnO.sub.2.
59. The thin film deposition apparatus according to claim 43 wherein the pressure within the evacuated chamber is in the range 10.sup.-4 to 10.sup.-8 Torr.
60. The thin film deposition apparatus according to claim 43 wherein the pressure within the evacuated chamber is in the range 10.sup.-6 to 10.sup.-8 Torr.
61. The thin film deposition apparatus according to claim 43 wherein the polarization angle φ and incidence angle θ are defined by the area under the graphical representation of the ellipse of equation
62. A thin film deposition apparatus comprising: an excimer laser pulse generator with KrF as gain medium to generate a laser pulse with wavelength of 248 nm and pulse duration of 5 to 30 nanoseconds; a set of optical elements, comprising a sequence of λ/4 plate, then λ/2 plate then λ/4 plate to linearly P-polarize the laser pulse and rotate the laser pulse polarization with a polarization angle φ based on the cavity chamber and deposition material; focusing optics to focus the laser pulse; a source of deposition material comprising highly oriented pyrolytic graphite and having refractive index n.sub.2; said deposition material mounted on a rotation and / or translation device within an evacuated chamber having a refractive index n.sub.1 and pressure within the evacuated chamber in the range 10-.sup.6 to 10.sup.-8 Torr; a rotation and / or translation device comprising a dielectric mirror, for readily altering and directing said laser pulse onto said source of deposition material at an incidence angle θ to produce a plasma; a substrate; means for positioning said substrate to be in the path of said plasma so that said plasma is directed towards said substrate; wherein the polarization angle φ and incidence angle θ are defined by the area under the graphical representation of the ellipse of equation
Description
DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION OF THE INVENTION
[0061] Referencing
[0062] A circularly polarized or elliptically polarized pulsed laser source would require more complex polarization optics with a polarizer such as a film polarizer, crystal polarizing cube, wire grid polarizer, Brewster window or any other light polarizing device known to someone skilled in the art, to linearly polarize the pulsed laser beam, in addition to the aforementioned polarization rotation apparatus.
[0063] The ablation of the source of deposition material occurs in a high vacuum chamber 5, under a pressure ranging from 10.sup.-4 to 10.sup.-12 Torr or in some preferred embodiments, 10.sup.-4 to 10.sup.-8 Torr or 10.sup.-6 to 10.sup.-8 Torr, allowing the creation of a plasma plume of ejected atom and ionized species 6 from the source of deposition material, each time a single pulse from the P-polarized pulsed laser source hits the source of deposition material. The plasma plume 6, propagating inside the vacuum chamber 5, reaches the substrate 7, where it condenses to form a thin film 8.
[0064] The source of deposition material can be mounted on a rotation/translation device 9, allowing for the incoming laser beam to hit a different spot on the source of deposition material surface and to maintain the source of deposition material surface at the focal point of the focussing optics 2.
[0065] For clarity, we define the pulsed laser beam as an electromagnetic wave as shown in
[0066] To demonstrate the advantages related to the present invention we have investigated the deposition of a diamond like carbon film with graphite as the source of deposition material.
[0067] The reflectance of a graphite source of deposition material was calculated at 3 different wavelengths for S-polarized (φ= π/2), P-polarized (φ= 0) and circularly polarized (φ= π/4) laser beams as previously defined. The results of these calculations are shown in
[0068] The temperature at the surface of the graphite source of deposition material was also calculated, following the formalism of equation (1), and the results shown in
F is the laser fluence (J/cm.sup.2), R, α (5.68×10.sup.4 cm.sup.-1), ρ (1.4 g/cm.sup.3) and C.sub.F (710 J kg.sup.-1 K.sup.-1) are the target reflectance, absorption coefficient, density and heat capacitance respectively.
[0069] It can be clearly seen, in
[0070] Similarly, the kinetic energy of the ejected carbon atom can be calculated from their velocity (E=0.5mv.sup.2) where the total velocity (v) is the sum of three different contributions, the thermal velocity v.sub.T, the plasma expansion velocity v.sub.k and the Coulomb acceleration v.sub.c for the charge species.
[0071] Where T.sub.s is the surface temperature, m the mass of the considered species, and k the Boltzmann constant (1.38×10.sup.-23 m.sup.2 kg s.sup.-2 K.sup.-1).
[0072] Where y is the adiabatic coefficient (y=1.67 for monoatomic species).
[0073] Where e is the electron charge (1.602×10.sup.-19 C), z the charge state (i.e. 1+, 2+, 3+ or 4+) and V.sub.0 the equivalent plasma acceleration voltage (~70 V measured experimentally from the electron velocity).
[0074] It can be seen in
[0075] The increase of the kinetic energy is not the same for all generated species. The kinetic energy of highly charged ions is dominated by the Coulomb acceleration which is independent of the plasma temperature in the formalism used here. The increase of kinetic energy for neutral species, which are not influenced by the Coulomb acceleration follows the increase of the plasma temperature as a function of the incidence angle and polarization.
[0076] The benefit of this approach is even greater at shorter wavelengths, as it can be seen in
[0077] In relation to optimal wavelengths to be used, preferably they are in the UV region of the optical spectrum, ranging from 126 to 355 nm and typically 193 or about 193 nm, or 198 or about 198 nm or 248 nm or about 248 nm.
[0078] In some embodiments, shorter wavelengths are used, for example with an excimer laser, for example Ar.sub.2 at 126 nm, Kr.sub.2 at 146 nm, F.sub.2 at 157 nm, Xe.sub.2 at 172 nm. Such shorter wavelengths are generally less efficient and more difficult to handle.
[0079] However, any wavelength may work under the right conditions, provided that the pulse energy is sufficient. The longer the wavelength the higher the energy requirement. In some embodiments, greater wavelengths such as within the visible or Near Infra-Red parts of the spectrum may be used. For example, the wavelengths may be 532 nm (visible), 1064 nm (NIR) or 10.6 .Math.m (IR). However, these are generally not as suitable as they result in higher surface roughness in the deposited thin films which may be detrimental for the envisioned application of the deposited thin film such as for example anti-reflection coatings.
[0080] For diamond like coatings, it is widely believed that C.sup.+ are responsible for generating the Sp3 hybridization which gives these films their unique physical properties. It is also believed that the highest Sp3 fraction is achieved when C.sup.+ kinetic energy reaches 60 eV. Using a frequency double YAG laser (λ=532 nm), circularly polarized at 45 deg incidence angle and following the same formalism for the calculation of the kinetic energy described above, a fluence of ~85 J/cm.sup.2 is required. This fluence requirement falls to ~77 J/cm.sup.2 for a P-polarized beam at the Brewster incidence angle. This value can be further reduced by using shorter wavelengths such as 248 nm produced by an Excimer laser with Krypton Fluoride (KrF) as the gain medium. In this case, only a pulsed laser fluence of 60 J/cm.sup.2 is required to achieve the required C.sup.+ kinetic energy of 60 eV, provided that the pulsed laser beam is P-polarized and the incidence angle on the source of deposition equal the Brewster angle (i.e. θ.sub.B = 69 deg).
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[0082] The isolines of the contour plot, which are delimitating the percentage increase of the kinetic energy of the ablated atom from 0% to the maximum increase (i.e. 40%) with a 5% increment are shown in
[0083] The table 1 shows the parameters used for defining the different ellipses fitting the isolines as function of θ.sub.B. Examining the table 1, someone skilled in the art will appreciate that the higher the isoline threshold, the closer the fitting parameter to the ideal values of θ.sub.0=θ.sub.B and φ.sub.0=0 describing the ideal condition of a P-polarized pulsed laser with an incidence angle equal to the Brewster angle. However, some improvement can be seen even when deviating from the ideal conditions. For example, a linearly polarized pulsed laser beam with a polarization angle φ=20 deg and an incidence angle θ=52 deg will still produce a 15% increase of the ablated atoms kinetic energy. Generally, any combination of incidence and polarization angles, θ and φ defined by the area under the graphical representation of the ellipse of equation (5) with θ.sub.0=0.8 × θ.sub.B, φ.sub.0=0, a=0.4 × θ.sub.B and b=0.5 × θ.sub.B will result in an increase of the kinetic energy as shown in
TABLE-US-00001 Fitting Parameters for the Ellipses Describing the Isolines Isoline threshold - % increase in kinetic energy Fitting parameters 5% 10% 15% 20% 25% 30% 35% 40% θ.sub.0 (deg) 0.83 × θ.sub.B 0.88 × θ.sub.B 0.91 × θ.sub.B 0.93 × θ.sub.B 0.95 × θ.sub.B 0.96 × θ.sub.B 0.98 × θ.sub.B 0.99 × θ.sub.B φ.sub.0 (deg) 0 0 0 0 0 0 0 0 a (deg) 0.36 × θ.sub.B 0.29 × θ.sub.B 0.25 × θ.sub.B 0.21 × θ.sub.B 0.17 × θ.sub.B 0.14 × θ.sub.B 0.10 × θ.sub.B 0.03 × θ.sub.B b (deg) 0.52 × θ.sub.B 0.44 × θ.sub.B 0.36 × θ.sub.B 0.29 × θ.sub.B 0.22 × θ.sub.B 0.14 × θ.sub.B 0.07 × θ.sub.B 0.01 × θ.sub.B
[0084] This reduction of the required fluence obtained with this invention allows for increased deposition speed. For example, with the same laser power output, a larger spot size on the target can be used with a P-polarized beam at the Brewster angle, yielding the same fluence, enabling larger quantities of material being removed from the target, thereby increasing the deposition speed.
[0085] Another benefit of a large incidence angle relates to surface contamination on the optics, especially the window 10 in
[0086] Furthermore, the larger than standard incidence angle allows for reducing the distance between the source of deposition material and the substrate due to the lower encumbrance. This smaller gap also enables larger deposition rates as it has been shown that the deposition rate is inversely proportional to the distance between the target and the substrate. This is due to the increase of hemispherical expansion of the pulsed laser induced plasma plume with the increase of the source of deposition material to substrate distance. In other words, while positioning the substrate closer to the source of deposition material allows only a smaller surface to be coated, the conservation of the ion flux implies that a thicker coating can be achieved for a given deposition time. This is particularly relevant for the coating of substrates with a small surface area, such as lenses for example.
[0087] When applying PLD to the deposition of complex metal oxides, changing the distance between the target and the substrate can influence the stoichiometry for the deposited material. Using the apparatus and method described allows for an alternative way to achieve better control.
[0088] While for most applications a vacuum chamber will be ideally dedicated to the deposition of a single material to avoid cross contamination and therefore costly down time in an industrial setting, it is easy to envision a simple mechanical device for readily adjusting the incidence angle. Such adjustment may preferably occur within the vacuum chamber to access a wider range of incidence angle as steering the pulsed laser beam outside the chamber would only allow for few degrees variation of the incidence angle. An example of such device is depicted in
[0089] The mirror can be provided in any suitable shape or form. Typically, they are either circular or square. Preferably, when used with an excimer laser, the mirror is a dielectric mirror, which reflects only the desired wavelength or wavelength range they are designed to reflect and are otherwise transparent (or semitransparent). Metallic mirrors, such as Aluminium can also be used for UV applications (down to 250 nm) but are not as resilient as dielectric ones as they can not sustain high energy density. In practice, mirrors can be glued on a plate, or mounted on a ring, or clamp.
[0090] Another option is to change the position of the target, through similar rotation and translation mechanical devices, to modify the incidence angle without having to adjust the pulsed laser optical pathway. However, this option would only work for flat targets and not cylindrical ones. Furthermore, tilting the source of deposition material will also tilt the generated plasma plume created upon impact of the pulsed laser beam onto the target, as it is always perpendicular to the target surface, therefore requiring the substrate to be repositioned with respect to the target accordingly. Consequently, while technically feasible, this approach is more complex than steering the pulsed laser beam. Any variation of the aforementioned pulsed laser beam steering architecture or any other means of steering the incident laser beam onto the target material 4 would be adequate for matching the incidence angle with the Brewster angle, or moving towards the Brewster angle from the standard 45 deg.
[0091] The reader will appreciate that this is only one of many potential applications for this invention which relates to the optimum polarization and incidence angle for pulsed laser beams in PLD. Changing from one source of deposition material to another will require adjustment of the pulsed laser beam incidence angle to the Brewster angle according to the refractive index of the source of deposition material as shown in
[0092] The same calculations, as previously shown for graphite ablation and the resulting carbon atom increase of kinetic energy, have been reproduced with other materials commonly used in physical deposition methods such as silver, gold, titanium dioxide (TiO.sub.2) and tantalum pentoxide (Ta.sub.2O.sub.5). These materials have been selected to demonstrate the viability of this invention over a wide range of refractive index n.sub.2 from 1.3 to 2.6 at 248 nm for the source of deposition material.
[0093] It is convenient to describe the invention herein in relation to particularly preferred embodiments. However, the invention is applicable to a wide range of embodiments and it is to be appreciated that other constructions and arrangements are also considered as falling within the scope of the invention. Various modifications, alterations, variations and or additions to the construction and arrangements described herein are also considered as falling within the ambit and scope of the present invention.