Germanium-on-silicon laser in CMOS technology

Abstract

A germanium waveguide is formed from a P-type silicon substrate that is coated with a heavily-doped N-type germanium layer and a first N-type doped silicon layer. Trenches are etched into the silicon substrate to form a stack of a substrate strip, a germanium strip, and a first silicon strip. This structure is then coated with a silicon nitride layer.

Claims

1. A method of forming a germanium waveguide comprising the steps of: forming trenches penetrating into a P-type silicon substrate that is coated with a doped N-type germanium layer and a first N-type doped silicon layer to form a stack of a substrate strip, a germanium strip, and a first silicon strip; and coating a top surface of the first silicon strip and side edges of both the germanium strip and the first silicon strip in the trenches with a silicon nitride layer; and further comprising, after forming trenches and before coating the stack, a step of widening the trenches to form openings in the P-type silicon substrate so that the germanium strip rests on a silicon base of the silicon substrate, said openings exposing an underside surface of the doped N-type germanium layer.

2. The method of claim 1, further comprising the step of defining contact openings in the silicon nitride layer to expose the top surface of the first silicon strip covering the germanium strip.

3. The method of claim 2, further comprising the step of forming conductive contacts in said contact openings.

4. A germanium waveguide comprising: a P-type silicon substrate including a central region delimited by lateral trenches penetrating into the silicon substrate; a doped N-type germanium strip coating the central region and delimited by the lateral trenches; a first N-type doped silicon strip coating the germanium strip and delimited by the lateral trenches; and a silicon nitride layer coating a top surface of the silicon strip and side edges of both the germanium strip and the silicon strip in the lateral trenches; wherein the lateral trenches widen in a portion penetrating into the silicon substrate to expose an underside surface of the doped N-type germanium strip, the doped N-type germanium strip further resting on the central region of the silicon substrate, wherein the central region has a width smaller than a width of the germanium strip.

5. A method of forming a germanium waveguide, comprising the steps of: coating a top surface of a P-type silicon substrate with a doped N-type germanium layer; coating a top surface of the doped N-type germanium layer with an N-type doped silicon layer; forming a pair of trenches which delimit the germanium waveguide and extend completely through the N-type doped silicon layer and the doped N-type germanium layer and partially through the P-type silicon substrate; widening each trench of said pair of trenches to extend underneath portions of and expose an underside surface of the doped N-type germanium layer; depositing a silicon nitride layer on a top surface of the N-type doped silicon layer and on sidewalls of the pair of trenches in contact with the N-type doped silicon layer and the doped N-type germanium layer; forming at least one opening extending completely through the silicon nitride layer to reach the N-type doped silicon layer; and depositing a metal in the at least one opening to contact the N-type doped silicon layer.

6. A germanium waveguide, comprising: a P-type silicon substrate; a doped N-type germanium layer on a top surface of the P-type silicon substrate; an N-type doped silicon layer on a top surface of the doped N-type germanium layer; a pair of trenches which delimit the germanium waveguide and extend completely through the N-type doped silicon layer and the doped N-type germanium layer and partially through the P-type silicon substrate, wherein each trench of said pair of trenches widens to extend underneath portions of and expose an underside surface of the doped N-type germanium layer; a silicon nitride layer on a top surface of the N-type doped silicon layer and on sidewalls of the pair of trenches in contact with the N-type doped silicon layer and the doped N-type germanium layer; at least one opening extending completely through the silicon nitride layer to reach the N-type doped silicon layer; and a metal in the at least one opening to contact the N-type doped silicon layer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The foregoing and other features and advantages will be discussed in detail in the following non-limiting description of specific embodiments in connection with the accompanying drawings, among which:

(2) FIGS. 1A to 1D are simplified transverse cross-section views illustrating successive steps of the manufacturing of a first embodiment of a germanium laser;

(3) FIGS. 2A to 2E are simplified transverse cross-section views illustrating successive steps of the manufacturing of a variation of the first embodiment of a germanium laser;

(4) FIGS. 3A to 3G are simplified transverse cross-section views illustrating successive steps of the manufacturing of a second embodiment of a germanium laser;

(5) FIGS. 4A to 4F are simplified transverse cross-section views illustrating successive steps of the manufacturing of a first variation of a third embodiment of a germanium laser; and

(6) FIGS. 5A to 5E are simplified transverse cross-section views illustrating successive steps of the manufacturing of a second variation of a third embodiment of a germanium laser.

DETAILED DESCRIPTION

(7) The same elements have been designated with the same reference numerals in the different drawings and, further, the various drawings are not to scale. For clarity, only those elements which are useful to the understanding of the described embodiments have been shown and are detailed.

(8) In the following description, when reference is made to terms qualifying the position and orientation such as above, under, upper, lower, etc., reference is made to the representation of the concerned elements in the drawings.

(9) 1. Planar Injection Laser

(10) FIGS. 1A to 1D are simplified transverse cross-section views illustrating successive steps of the manufacturing of a first embodiment of a planar injection germanium laser.

(11) As illustrated in FIG. 1A, the manufacturing method starts from a P-type silicon substrate 1, which may be a thin silicon-on-insulator layer (SOI). On this substrate 1, a thin N-type germanium layer 3 is deposited and then covered with a thin N-type silicon layer 5. It should be noted that layer 5 may be a polysilicon layer, the materials of layers 1 and 3 being monocrystalline. The waveguide is formed in the central portion of FIG. 1A delimited by trenches 7 which penetrate into substrate 1, and extend orthogonally to the plane of the drawing.

(12) At a next step illustrated in FIG. 1B, a silicon nitride layer 9 is deposited. Conventionally, the silicon nitride layer 9 is deposited by plasma-enhanced chemical vapor deposition (PECVD) at a temperature in the range from 300 to 700 C. The tensioning of the germanium is ensured by the fact that the silicon nitride layer (SiN) is placed under compressive strain on deposition thereof. This strain will relax and the nitride layer returns to a more stable state and stretches. As a result of this deformation, the layers located under the silicon nitride layer are under tensile strain. Preferably, the waveguide is oriented in the <100> crystallographic direction of the germanium. Silicon nitride layer 9 covers the structure and, preferably, penetrates into trenches 7. Before the deposition of the silicon nitride layer, it is possible to deposit a silicon oxide layer having a thickness of some ten nanometers to improve the bonding and to passivate the free surfaces of the semiconductors.

(13) At a next step illustrated in FIG. 1C, openings 11 are formed in the silicon nitride layer to enable to form a contact on underlying silicon layer 5. As shown, openings 11 are preferably arranged on either side of the guide width to avoid relaxing the strain caused by silicon nitride layer 9 in the underlying layers.

(14) After this, as illustrated in FIG. 1D, a layer of a conductive material 13 is deposited to form contacts on N-type silicon layer 5. Further, an electrical contact, not shown, is conventionally created on P-type silicon substrate 1. This contact may be laterally transferred to an area close to the waveguide. A metal strip may, for example, be deposited parallel to the guide in an area etched down to a depth close to some ten micrometers to form the contact on substrate 1.

(15) According to the choice of materials used and to the geometry of the structure (guide width, thickness of the layers, depth of the trenches, position of the openings) and to the characteristics of the silicon nitride layer deposited by PECVD, the uniaxial deformation in the germanium induced by the silicon nitride layer may reach a level in the range from 0.55 to 0.87%. The disclosed structure is adaptable to different type of stackings of materials.

(16) The strain is homogeneously applied along the entire width of the guide, even for significant thicknesses of the germanium layer. This provides an active medium having a length of several micrometers, and accordingly a significant gain per unit length for the laser.

(17) The waveguide may have a width in the range from 4 to 6 according to the desired optical properties, while ensuring a good transfer of the strain.

(18) The thickness of N-type doped germanium layer 3 is in the range from 250 to 300 nm (close to /2n, where is the emission wavelength of the laser and n is the refraction index of germanium). Such a thickness provides a good guiding of the light in near infrared. Layer 5, which is used as an electric injector, should be selected with a thickness sufficient to obtain an electric contact of good quality, but not too thick, to avoid for this layer to absorb the strain transmitted by the SiN layer.

(19) Based on the above-discussed imperatives, digital finite element simulations of the mechanical behavior of the structure may be performed to optimize the different parameters of the topology of the waveguide (trench depth, guide width, positioning of the openings). The transfer of the strain in the structure may be simulated from the value of the initial strain of the silicon nitride layer deposited across a 300-nm thickness. The value of the initial hydrostatic strain of the SiN film in compressive mode is 4.5 GPa (in practice, 1.8 GPa is obtained in the plane of the layer at equilibrium). The strain level may be modified by modifying the silicon nitride layer deposition parameters. The uniaxial deformation values only take into account the effect of the SiN layer. According to the conditions of deposition of the germanium on silicon layer, it is possible to obtain an initial residual strain associated with the thermal expansion coefficient difference. This deformation, which is in the range from 0.15 to 0.25%, may add to the total deformation that can be transferred by the silicon nitride layer.

(20) The silicon nitride layer deposited in the bottom of the trenches forms a compressive strain pocket. Such a pocket adversely affects the obtaining of the laser effect in the germanium. An etching of the trenches down to a 1.5-m depth provides an optimal result to limit this effect, and this, for different guide widths which may range up to 5 m.

(21) Tests and simulations have shown that the dimensions of the elements of the waveguide should preferably be within the following ranges: guide width: from 4 to 6 m, thickness of germanium layer 3: from 200 to 500 nm, thickness of injector layer 5: from 100 to 250 nm, thickness of nitride layer 9: from 300 to 500 nm, trench width: from 0.5 to 1 trench depth: from 1 to 1.5 width of the openings: from 200 to 500 nm, distance from the openings to the edges: from 200 to 500 nm.

(22) FIGS. 2A to 2E are transverse cross-section views illustrating successive steps of the manufacturing of a variation of the structure of FIG. 1D.

(23) FIG. 2A shows the structure already described in relation with FIG. 1A.

(24) At a step illustrated in FIG. 2B, a selective anisotropic etching of P-type silicon 1 is carried out so that trenches 7 widen under germanium layer 3 to form bowl-shaped openings 20. Thus, under germanium 3, only a narrowed portion or base 22 of silicon substrate 1 remains in place. Of course, base 22 extends in a strip orthogonal to the plane of the drawings.

(25) The next steps illustrated in FIGS. 2C to 2E are respectively identical to the steps described in relation with FIGS. 1B to 1D.

(26) Thus, in the structure of FIG. 1D, silicon substrate 1 extends under the entire portion of germanium layer 3; while in the structure of FIG. 2E, the germanium layer portion only partly rests on a silicon base 22. The disengaging of the germanium layer allows a deformation of greater amplitude and enables to obtain a more efficient strain transfer.

(27) The variation of FIGS. 2A to 2E, where the germanium is suspended on a base, enables to obtain the following advantages over the case of FIGS. 1A to 1D: greater strain in the structure, confinement of the optical mode at the center of the structure, and confinement of the carriers at the center of the structure during the electric injection.

(28) For a guide having a 5 m thickness without the base, a uniaxial tensile deformation of 0.5% can be obtained in the germanium. The underetching enables to amplify this value up to 0.75%. The thinner the base, the more significant the deformation that can be achieved in the structure, but the maximum is located at the interface between the SiN layer and the semiconductor for the electric injection. This effect is due to the bend of the structure. A good tradeoff is given for a ratio from 0.5 to 0.7, for example, 0.6, between the width of the waveguide and the size of the base.

(29) Tests and simulations have shown that the dimensions of the elements of the waveguide could preferably be within the following ranges: guide width: from 3 to 5 m, base height: from 1 to 1.5 m, base width: from 0.55 to 0.65 times the width of the germanium strip, width of the openings: from 200 to 500 nm, distance from the openings to the edges: from 200 to 500 nm.

(30) 2. First Example of Lateral Injection Laser

(31) FIGS. 3A to 3G are simplified transverse cross-section views illustrating successive steps of the manufacturing of a second embodiment of a lateral injection germanium laser.

(32) As illustrated in FIG. 3A, the method of manufacturing starts from a silicon substrate 1, possibly of SOI type. This substrate is preferably lightly doped, and practically insulating, or P-type doped.

(33) At the step illustrated in FIG. 3B, a groove 30 has been formed in the substrate.

(34) At the step illustrated in FIG. 3C, the groove has been filled by local epitaxy of a heavily-doped N-type germanium strip 32.

(35) At the step illustrated in FIG. 3D, one has formed in substrate 1, on either side of germanium strip 32, parallel strips 34 and 36 doped by implantation, respectively of type P and of type N.

(36) At the step illustrated in FIG. 3E, the upper surface of germanium strip 32 and a neighboring portion of parallel doped silicon strips 34 and 36 has been masked. After this, an etching has been carried out to form a raised area comprising an upper portion 35 of strip 34 and an upper portion 37 of strip 36 which surround germanium strip 32.

(37) At the step illustrated in FIG. 3F, the entire structure is coated with a silicon nitride layer 40 which generates the desired strain effect as previously described. It should be noted that, in this embodiment, the nitride is directly deposited on the germanium and thus that the strain is directly applied thereto and is thus even more efficient than in the previously-described embodiments of planar injection guides. Before the deposition of the silicon nitride layer, it is possible to deposit a silicon oxide layer having a thickness of some ten nanometers to improve the bonding and to passivate the free surfaces of the semiconductors.

(38) At the step illustrated in FIG. 3G, the nitride layer has been only maintained on the upper surface of the guide and outside of the structure. After this, metallizations 42 and 44 in contact, respectively, with silicon strips 34 and 36 have been formed. Metallization 42 is intended to be connected, in operation, to a positive potential and metallization 44 is intended to be connected, in operation, to a negative or zero potential.

(39) The lateral doped silicon layers enable to transfer the contacting area laterally with respect to the waveguide. The metal contacts have no influence upon the transfer of the strain into the germanium via the silicon nitride layer. This also enables to avoid for the optical mode to be disturbed by the metal, and to avoid for a possible heating of the current supply metal conductors to affect the active area of the waveguide.

(40) For a waveguide having a 5-m width with an active area having a 4.6-m width, the deformation reaches a 0.5% level. The results are close to a planar injection guide. However, when the guide width is decreased to 2 m, the ratio between the width of the guide and that of the SiN layer is modified, and the uniaxial deformation may reach a level of 1.3%.

(41) Tests and simulations have shown that the dimensions of the waveguide elements could preferably be within the following ranges: guide width: from 1.6 to 3 m, width of the Ge layer: from 1.5 to 2.5 m, width of the Si layers: 2200 nm, guide height: from 300 nm to 1 m, width of the SiN layer: from 300 to 500 nm.

(42) 3. Second Example of Lateral Injection Laser

(43) FIGS. 4A to 4F are simplified transverse cross-section views illustrating successive steps of the manufacturing of a first variation of a third embodiment of a lateral injection germanium laser.

(44) As illustrated in FIG. 4A, the manufacturing method starts from a silicon substrate 1, possibly of SOI type, coated with a germanium layer 50. Germanium layer 50 comprises a heavily-doped N-type central area 51. This is obtained by successive epitaxies or by implantation.

(45) At the step illustrated in FIG. 4B, an etching is performed to delimit a strip 52 of the heavily-doped germanium resting on a more lightly doped germanium layer 54. The upper heavily-doped germanium portion is removed.

(46) At the step illustrated in FIG. 4C, a local epitaxy of strained Si.sub.xGe.sub.1-x (x being a number smaller than 1) on germanium 54, is carried out on either side of strip 52. Si.sub.xGe.sub.1-x strips extending on either side of heavily-doped N-type central germanium strip 52 are thus obtained. These Si.sub.xGe.sub.1-x strips are doped, for example, by implantation, to form respectively P-type and N-type doped silicon/germanium strips 56 and 58.

(47) At the step illustrated in FIG. 4D, portions of each of silicon/germanium strips 56 and 58 which are not adjacent to germanium strip 52 are etched to decrease their thickness. The etching depth is approximately of the thickness of SiGe layers 56 and 58 (that is, from 20 to 100 nm, for SiGe layers from 50 to 300 nm). The lateral dimension of the SiGe layers is from 1 to 2 m. Thus, the total width of the guide is from 1.05-1.3 m to 2.05-2.3 m, according to the width of the central germanium layer.

(48) At the step illustrated in FIG. 4E, one has formed on the central portion of the guide, that is, on germanium strip 52 and on the raised portions of strips 56, 58, a strained SiN layer 60 to enhance the deformation at the center of the structure. The SiN layer is directly in contact with the germanium, which provides an optimized strain transfer.

(49) After this, as illustrated in FIG. 4F, electric contacts 62, 64 are formed on SiGe strips 56, 58.

(50) FIGS. 5A to 5E are simplified transverse cross-section views illustrating successive steps of the manufacturing of a second variation of a third embodiment of a lateral injection germanium laser.

(51) FIG. 5A is identical to FIG. 4A.

(52) At the step illustrated in FIG. 5B, an etching is performed to delimit a strip 72 of the heavily-doped germanium resting on a more lightly doped germanium layer 54. The upper lightly-doped germanium portion is maintained in place and forms a strip 74 on strip 72.

(53) At the step illustrated in FIG. 5C, a local epitaxy of strained Si.sub.xGe.sub.1-x (x being a number smaller than 1) on germanium 54, is carried out on either side of strip 72. The epitaxy is interrupted at the level of the limit between strips 72 and 74. Si.sub.xGe.sub.1-x strips extending on either side of heavily-doped N-type central germanium strip 72 are thus obtained. These Si.sub.xGe.sub.1-x strips are doped, for example, by implantation, to form respectively P-type and N-type doped silicon/germanium strips 56 and 58.

(54) At the step illustrated in FIG. 5D, one has formed on the central portion of the guide, that is, on germanium strip 74, a strained SiN layer 80 to enhance the deformation at the center of the structure. The SiN layer is directly in contact with the germanium, which provides an optimized strain transfer.

(55) After this, as illustrated in FIG. 5E, electric contacts 62, 64 are formed on SiGe strips 56, 58.

(56) The structures of FIGS. 4F and 5E use lateral epitaxial Si.sub.xGe.sub.1-x strips 56 and 58 strained and doped around the central guide or band. Such epitaxial strips enable to:

(57) 1) create a local tensile strain against the germanium band in the N-type doped area,

(58) 2) perform the electric injection of the carriers into the N doped germanium, by taking advantage of the discontinuities of the energy bands between the Ge and the SiGe for the confinement of the carriers.

(59) The tensile strain in the SiGe layer will transfer by laterally pulling the germanium layer. The strain depends on the silicon concentration in the Si.sub.xGe.sub.1-x layer. It is due to the mesh parameter difference between the silicon and the germanium.

(60) Regarding the strain transfer, the critical parameter is the thickness of the Si.sub.xGe.sub.1-x layer which can be grown by epitaxy according to its composition. The strain obtained in Si.sub.xGe.sub.1-x layer is proportional to the product of the composition by the relative mesh parameter difference between the silicon and the germanium. The larger the silicon concentration, the more the Si.sub.xGe.sub.1-x layer will be strained. As a counterpart, however, the maximum thickness which can be obtained decreases. Typically, the critical thicknesses, emax, and the biaxial strains, //, of the Si.sub.xGe.sub.1-x layers are: Si.sub.0.4Ge.sub.0.6: emax=50-70 nm, //=1.6% Si.sub.0.3Ge.sub.0.7: emax=100-150 nm, //=1.2% Si.sub.0.2Ge.sub.0.8: emax=250-300 nm, //=0.8%

(61) The thickness of the active germanium layer should be identical to that of the Si.sub.xGe.sub.1-x layer for an optimal strain transfer. The applicants have studied the strain transfer for these three cases and have also considered the effect of the addition of a strained SiN layer to amplify the transferred strain.

(62) Si.sub.0.2Ge.sub.0.8

(63) An active germanium layer of 250250 nm is considered. The initial strain in the Si.sub.0.2Ge.sub.0.8 layer is //=0.8%. The average uniaxial deformation in the active germanium area is 0.5%, the addition of a SiN layer enables to amplify the average uniaxial deformation in germanium up to a value of 0.6%.

(64) Si.sub.0.3 Ge.sub.0.7

(65) An active germanium layer of 125125 nm is considered. The initial strain in the Si.sub.0.3Ge.sub.0.7 layer is //=1.2%. The average uniaxial deformation in the active germanium area is 0.9%, by using Si.sub.0.3Ge.sub.0.7 layers. The addition of a SiN layer enables to increase the average uniaxial deformation up to 0.98%.

(66) Si.sub.0.4Ge.sub.0.6

(67) An active germanium layer of 5050 nm is considered. The average uniaxial strain in the active germanium area in the Si.sub.0.4Ge.sub.0.6 layer is //=1.6%. The average uniaxial deformation in the active germanium area is 1.13%, by using Si.sub.0.4Ge.sub.0.6 layers. The addition of a SiN layer enables to obtain an average uniaxial deformation of 1.42%.

(68) Various embodiments with different variations have been described hereabove. It should be noted that those skilled in the art may combine various elements of these various embodiments and variations without showing any inventive step. It should be understood that, for the sake of brevity, certain explanations and numerical indications given for certain embodiments have not been repeated for other embodiments.

(69) Further, each of the materials described as an example may be replaced with a material having the same properties and the same function in the devices and methods described hereabove as an example only.