CARRIER BASE MODULE FOR A LIGHTING MODULE

Abstract

Methods, apparatus and systems are described. An apparatus includes a module body made of a polymer material. The module body includes a mounting surface adjacent a potting area. At least two lead frame elements are embedded in the polymer material of the module body. Each of the at least two lead frame elements has a first terminal side and a second terminal side in the component potting area. An LED element is on the mounting surface of the module body and electrically coupled to the first terminal side of the at least two lead frame elements.

Claims

1. A carrier base module comprising: a module body made of a polymer material and comprising a mounting surface adjacent a potting area; at least two lead frame elements embedded in the polymer material of the module body, each of the at least two lead frame elements comprising a first terminal side and a second terminal side in a component potting area; an LED element on the mounting surface of the module body and electrically coupled to the first terminal side of the at least two lead frame elements.

2. The carrier base module according to claim 1, further comprising a heat sink element at least partially embedded in the polymer material of the module body in an area of the mounting surface in contact with the LED element.

3. The carrier base module according to claim 1, further comprising at least two additional lead frame elements embedded in the polymer material of the module body and not electrically coupled to the LED element.

4. The carrier base module according to claim 1, wherein the module body further comprises a recess surrounding at least one of the mounting surface and the component potting area, and at least one of the first and second terminal sides is in the recess.

5. The carrier base module according to claim 1, further comprising at least one of an electrical connector electrically coupled between the first terminal sides of the at least two lead frame elements and the LED element and another electrical connector electrically coupled between the second terminal sides and at least one electronic component.

6. The carrier base module according to claim 5, wherein the at least one of the electrical connector and the other electrical connector is one of a ribbon bond and a wire bond.

7. An automotive lighting system comprising: a carrier base module comprising: a module body made of a polymer material and comprising a mounting surface adjacent a potting area, at least two lead frame elements embedded in the polymer material of the module body, each of the at least two lead frame elements comprising a first terminal side and a second terminal side in a component potting area, and an LED element on the mounting surface of the module body and electrically coupled to the first terminal side of the at least two lead frame elements; and at least one electronic component on the mounting surface or in the component potting area.

8. The system according to claim 7, further comprising at least two additional lead frame elements embedded in the polymer material of the module body, the at least one electronic component comprising one of a bin code resistor and a thermal resistor electrically coupled to the at least two additional lead frame elements.

9. The system according to claim 7, wherein the at least one electronic component is a TVS diode electrically coupled in parallel with the LED element.

10. The system according to claim 9, wherein the TVS diode is on the second terminal side of the at least two lead frame elements.

11. The system according to claim 7, further comprising a potting material covering at least the component potting area.

12. The system according to claim 11, further comprising at least one of an electrical connector electrically coupled between the first terminal sides of the at least two lead frame elements and the LED element and another electrical connector electrically coupled between the second terminal sides and at least one electronic component, the potting material covering the at least one electronic component, the at least one electrical connector, and the at least one other electrical connector without covering at least a top surface of the LED element.

13. The system according to claim 12, wherein the at least one of the electrical connector and the other electrical connector is one of a ribbon bond and a wire bond.

14. The system according to claim 11, wherein the module body further comprises a recess surrounding at least one of the mounting surface and the component potting area, and the potting material is in the recess.

15. The system according to claim 7, wherein the at least one electronic component is another LED element.

16. The system according to claim 7, further comprising at least one capacitor in parallel at least one of the at least one electronic component and the LED element.

17. The system according to claim 7, further comprising a heat sink element at least partially embedded in the polymer material of the module body in an area of the mounting surface in contact with the LED element.

18. A method for producing a customizable lighting module comprising: building a module body from a polymer material with a component potting area and a mounting area; embedding at least two lead frame elements having at least one first terminal side and at least one second terminal side in the polymer material; producing a universal and standardized carrier base module by mounting an LED element on a mounting surface of the module body; electrically connecting the first terminal side of each of the at least two lead frame elements to the LED element; mounting at least one electronic component to the component potting area; and electrically connecting the at least one electronic component to at least one of the at least two lead frame elements and two further lead frame elements.

19. The method according to claim 18, further comprising potting the component potting area after mounting the at least one electronic component using a potting material.

20. The method according to claim 18, further comprising, during the building of the module body, embedding at least one heat sink element in the module body in the area of a mounting surface.

Description

BRIEF DESCRIPTION OF THE DRAWING(S)

[0038] FIG. 1 shows a perspective view of a section of an embodiment of a carrier base module with parts of the outer surface removed;

[0039] FIG. 2 shows another perspective view of the carrier base module of FIG. 1 with the closed outer surface;

[0040] FIG. 3 shows a detailed perspective view of a mounting surface of a carrier base module with a TVS diode mounted two lead frame elements in a component potting area;

[0041] FIG. 4 shows a detailed perspective view of a mounting surface of a carrier base module with a thermistor mounted to additional lead frame elements in a component potting area;

[0042] FIG. 5 shows another perspective view of a carrier base module with a bin code resistor mounted to additional lead frame elements in a component potting area; and

[0043] FIG. 6 shows another detailed perspective view of a mounting surface of a carrier base module with a thermistor mounted to additional lead frame elements by ribbon bonding.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT(S)

[0044] An embodiment of a carrier base module 1 for a lighting module is shown in FIGS. 1 and 2. The module body 2 of the carrier base module 1 is made of a polymer material and comprises a component potting area 6 formed as a recess 11 in the module body 2. In the component potting area 6 one or several electronic components 7 such as controller circuit boards can be arranged and electrically connected to each of two lead frame elements 3a, b.

[0045] The lead frame elements 3a, b are arranged with one terminal side 9 in the component potting area 6 and with another terminal side 8 in direct proximity to a mounting surface 5 in the recess 11 of the carrier base module 1. The mounting surface 5 is a flat surface on the front face of the carrier base module 1 and accordingly of a lighting module, where an LED element 4 as well as further components 7 can be arranged.

[0046] The LED element 4 comprises three single rectangular LEDs with a flat surface connected to a single substrate which is directly mounted on the mounting surface 5 of the carrier base module 1. Below the LED element 4, a metallic heat sink element 10 is embedded in the surface of the module body 2 for conducting heat away from the LED element 4 during operation. The LED element 4 is electrically connected to the first terminal side 8 of each of the lead frames 3a, b via a metallic connector 12 for ribbon bonding.

[0047] In a completed lighting module built from the carrier base module 1 as well as at least one electronic component 7, the recess 11 comprising the component potting area 6 as well as the mounting surface 5 is closed by a layer of silicone inserted into the recess 11 on the outer surface of the module body 2 potting the component potting area 6.

[0048] To produce a lighting module, first a carrier base module 1 is build from polymer material with a component potting area 6 as well as at least two lead frame elements 3a, b embedded in the polymer material. The carrier base module 1 has at least two terminal sides 8, 9 of each of the lead frame elements 3a, b arranged on the module body 2 with at least one surface accessible for electrically connecting at least one electronic component 7. Then an LED element 4 is mounted directly on a heat sink element 10 embedded in the module body 2 in the area of a mounting surface 5 of the module body 2, wherein the LED element 4 is electrically connected to the first terminal side 8 of the at least two lead frame elements 3a, b.

[0049] Afterwards, at least one electronic component 7 is mounted to the mounting surface 5 and/or in the component potting area 6 of the standardized carrier base module 1 and electrically connected to the lead frame elements 3a, b and or further lead frame elements 3c, d for building a finished lighting module.

[0050] An electronic component 7, such as a TVS diode, might be arranged in parallel to the LED element 4 and electrically connected to the second terminal side 9 of each of the two lead frame elements 3a, b (see FIG. 3). Alternatively or additionally, an electronic component 7, such as a thermistor or a bin code resistor, might be mounted to two additional lead frame elements 3c, d, which are not electrically connected to the first two lead frame elements 3a, b (see FIG. 4), The electronic component 7 might be directly mounted on the terminal sides 9 of the second pair of lead frame elements 3c, d (see FIG. 4) or might be mounted to the mounting surface 5 connected via ribbon bonds (see FIG. 6).

[0051] Finally, on the mounting surface 5 and in the component potting area 6 there might be further second terminal sides 9, which might be isolated or electrically connected to the first two lead frame elements 3a, b or to further lead frame elements 3c, d (see FIG. 5).

[0052] While the invention has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive; the invention is not limited to the disclosed embodiments.

[0053] In particular, the LED element 4 including the number and specific shape of the LEDs should be considered exemplary; different shapes, numbers and sizes are possible. Further, in alternative embodiments the shape and size of the module body 2 may be chosen differently. Finally, also the position of the recess 11 of the component potting area 6 as well as surrounding the mounting surface 5 may be arranged at a different position on the module body 2.

[0054] These and other variations of the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed invention, from a study of the drawings, the disclosure, and the appended claims.

[0055] In the claims, the word comprising does not exclude other elements or steps, and the indefinite article a or an does not exclude a plurality.

[0056] The mere fact that certain measures or features are recited in mutually different dependent claims or disclosed in separate embodiments does not indicate that a combination of these measures and features cannot be used to advantage. Any reference signs in the claims should not be construed as limiting the scope.