Heat exchange device for artificial satellite, wall and assembly of walls comprising such a heat exchange device
10677533 ยท 2020-06-09
Assignee
Inventors
Cpc classification
F28F7/02
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28D2021/0021
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28D15/04
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F13/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28D15/0275
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
F28D15/02
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F7/02
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F13/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28D15/04
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Abstract
Disclosed is a heat exchange device for effecting a heat exchange between a heat transfer fluid of a first network of capillary heat pipes and a heat transfer fluid of a second network of capillary heat pipes. The heat exchange device includes a solid block provided with a first channel and a second channel which are independent of one another, the first channel having at least one opening intended to be connected to a capillary heat pipe of the first network, the second channel having at least one opening intended to be connected to a capillary heat pipe of the second network, the first channel having a portion which lies near a portion of the second channel such that the heat transfer fluid of the first network is able to exchange heat with the heat transfer fluid of the second network via the heat exchanging portions.
Claims
1. A wall configured to be mounted in an artificial satellite, the wall comprising: a support panel; and at least one heat exchange device supported by the support panel, the at least one heat exchange device comprising: first capillary heat pipes containing a first heat transfer fluid, the first capillary heat pipes forming a first network, second capillary heat pipes containing a second heat transfer fluid, the second capillary heat pipes forming a second network, and a solid block provided with a first channel and a second channel independent of the first channel, each of the first channel and the second channel having a capillary internal structure, the capillary internal structure being formed directly on the first channel and the second channel of the solid block, the first channel having at least one first opening connected to one of the first capillary heat pipes of the first network, and at least one first side channel having a longitudinal length extending perpendicularly in a direction through the solid block toward the second channel, and the second channel having at least one second opening connected to one of the second capillary heat pipes of the second network, and at least one second side channel having a longitudinal length extending perpendicularly in a direction through the solid block toward the first channel, the at least one first side channel of the first channel lying near the at least one second side channel of the second channel such that the first heat transfer fluid is able to exchange heat with the second heat transfer fluid via said at least one first side channel and the at least one second side channel, wherein the solid block is void of space, except for the first and second channels.
2. The wall according to claim 1, wherein the at least one first side channel has a closed terminal end, the at least one second side channel has a closed terminal end, said at least one first side channel extending parallel and adjacent to said at least one second side channel.
3. The wall according to claim 1, wherein the first channel comprises an additional first opening connected to another one of the first capillary heat pipes of the first network and the second channel comprises an additional second opening connected to another one of the second capillary heat pipes of the second network.
4. The wall according to claim 3, wherein said at least one first opening is located on a first face of said solid block, and said additional first opening is located on a second face of said solid block, said first face being perpendicular to said second face.
5. The wall according to claim 3, wherein said at least one first opening is located on a first face of said solid block, and said additional first opening is located on a second face of said solid block, said first face being parallel to said second face.
6. The wall according to claim 1, wherein the at least one first side channel is located at a distance of between 1 millimeter and 3 millimeters from the at least one second side channel.
7. The wall according to claim 1, wherein said solid block comprises a bearing face configured to be fixed to a panel of the artificial satellite, and the first channel and second channel are arranged in one and the same plane, said plane being parallel to said bearing face.
8. The wall according to claim 1, wherein said solid block comprises a bearing face configured to be fixed to a panel of the artificial satellite, and the first channel and second channel are arranged in two separate planes, said planes being parallel to said bearing face.
9. The wall according to claim 1, wherein said solid block comprises a bearing face configured to be fixed to a panel of the artificial satellite, the first channel and second channel respectively comprising the at least one first side channel and the at least one second side channel as a first cavity and a second cavity which each extend in a plane parallel to said bearing face.
10. A wall configured for mounting in an artificial satellite, said wall comprising: a support panel; at least one heat exchange device supported by said support panel, the at least one heat exchange device comprising first capillary heat pipes containing a first heat transfer fluid, the first capillary heat pipes forming a first network, second capillary heat pipes containing a second heat transfer fluid, the second capillary heat pipes forming a second network, and a solid block provided with a first channel and a second channel independent of the first channel, each of the first channel and the second channel having a capillary internal structure, the capillary internal structure being formed directly on the first channel and the second channel of the solid block, the first channel having at least one first opening connected to one of the first capillary heat pipes of the first network, and a first side channel having a longitudinal length extending perpendicularly in a direction through the solid block toward the second channel, and the second channel having at least one second opening connected to one of the second capillary heat pipes of the second network, and a second side channel having a longitudinal length extending perpendicularly in a direction through the solid block toward the first channel, the first side channel of the first channel lying near the second side channel of the second channel such that the first heat transfer fluid is able to exchange heat with the second heat transfer fluid via the first side channel and the second side channel, wherein the solid block is void of space, except for the first and second channels, and the first channel having two openings to the exterior including the at least one first opening, the second channel having two openings to the exterior including the at least one second opening, the first channel of the at least one heat exchange device being connected to the first capillary heat pipes, the second channel of the at least one heat exchange device being connected to the second capillary heat pipes.
11. The wall according to claim 10, further comprising at least one electronic device fixed to said support panel, in direct or indirect thermal contact with said at least one heat exchange device.
12. The wall according to claim 10, further comprising angles, wherein the first capillary heat pipes are fixed to said angles to form a comb-shaped configuration.
13. The wall according to claim 10, further comprising angles, wherein the first capillary heat pipes are fixed to said angles to form an S-shaped configuration.
14. The wall according to claim 10, further comprising angles, wherein the first capillary heat pipes are fixed to said angles to form a matrix-shaped configuration.
15. The wall according to claim 1, wherein the solid block is made in one piece.
Description
(1) The invention will be better understood from reading the following description, provided as an example only and with reference to the figures in which:
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12) In the following description, the terms top, bottom, lower, and upper are defined relative to when the heat exchange device of the invention is arranged as shown in
(13) Referring to
(14) The solid block 4 comprises an upper main face 6, a lower main face 8, a front face 10, a rear face 12, and two side faces 14, 16.
(15) The upper main face 6 of the heat exchange device 2 and/or its lower main face 8 are bearing faces intended to be fixed to a panel of an artificial satellite or to the interior of a panel, for example inside a honeycomb panel. These faces are intended to be in direct or indirect contact with one or more electronic devices or with another heat exchange device 2. These faces constitute the base plate of the heat exchange device 2.
(16) The solid block 4 is traversed by a first rectilinear channel 20 and a second rectilinear channel 30, each leading to an opening 22, 32 formed in the front face 10 and an additional opening 24, 34 formed in the rear face 12.
(17) The opening 22 of the first channel is intended to be connected to a capillary heat pipe 25 of a first network 26 of capillary heat pipes, represented by dotted lines in
(18) Similarly, the opening 32 of the second channel is intended to be connected to a capillary heat pipe 35 of a second network 36 of capillary heat pipes, represented by dotted lines in
(19) The first channel 20 and the second channel 30 each have an inner wall 17 provided with a capillary structure 18 schematically represented by broken lines. This capillary structure 18 is, for example, a lattice formed by heating a metal powder using a laser.
(20) Alternatively, the capillary structure 18 may be implemented as a mesh, a porous structure, or axial grooves.
(21) The first channel 20 has a longitudinal axis A-A. The second channel 30 has a longitudinal axis B-B that is parallel to axis A-A.
(22) The first channel 20 has side channels 28 having a closed end 29. The side channels 28 extend perpendicularly to the axis A-A of the first channel 20, towards the second channel 30.
(23) Similarly, the second channel 30 also has side channels 38 having a closed end 39. The side channels 38 extend perpendicularly to the axis B-B of the second channel 30 and towards the first channel 20.
(24) The side channels 28 of the first channel and the side channels 38 of the second channel alternate with one another. Thus, aside from the side channels 28, 38 at the ends (closest to the front face 10 and rear face 12), each side channel 28 of the first channel lies between two side channels 38 of the second channel and vice versa. Each side channel 28 of the first channel is near a side channel 38 of the second channel. More specifically, each side channel 28 of the first channel lies at an approximate distance of between 1 mm and 3 mm from a side channel 38 of the second channel. In this embodiment, each side channel 28 of the first channel extends parallel to a side channel 38 of the second channel. When the heat exchange device 2 is connected to the first network 26 of heat pipes and to the second network of heat pipes 36, these side channels arranged close to one another allow the transfer of heat from the heat transfer fluid contained in the first network 26, to the heat transfer fluid contained in the second network 36. These side channels 28, 38 constitute channel portions of one network that can exchange heat with channel portions of another network. These heat exchanges even out the temperature of the two networks and guarantee redundancy in the heat transport and elimination function. In case of malfunction of a heat pipe network, for example due to a hole being pierced in a heat pipe, the other network of heat pipes can provide this function.
(25) The length and number of the side channels 28, 38 are variable, to enable providing the best response to the requirements of the satellite mission.
(26) The heat exchange device 2 is preferably made of a homogeneous material in order to ensure uniform thermal conduction, this material having high thermal conductivity. It is for example made of an aluminum alloy, for example such as AlSi10 mg. In this case, it can be made by a process of additive layer manufacturing.
(27) Alternatively, the heat exchange device 2 may be made of multiple materials in order to impart different properties to different areas of the device. For example, the heat exchange device 2 may comprise a first material for its internal portion and another material for the face which will constitute its base plate, namely its upper main face 6 or its lower main face 8.
(28)
(29) The first heat exchange device 2 transports heat between the first network 26 and second network 36. The second heat exchange device 40 transports heat between the second network 36 and the third network 46. The heat exchange devices 2, 40 according to the invention provide excellent thermal uniformity throughout the three networks of heat pipes 26, 36, 46.
(30)
(31) Referring to
(32) Referring to
(33) Advantageously, this embodiment allows implementing two redundant networks arranged in the same plane. The height of this heat exchange device is small. The distance between the dissipative equipment and the heat transfer fluid of the two networks is reduced. As a result, there is less heat loss in the exchanges between the two networks. This results in better heat dissipation from the panel.
(34) According to this embodiment, the first and second networks have a grid shape. Alternatively, a star configuration can also be considered.
(35) Referring to
(36) The third channel 62 has side channels 63, 64 which alternately extend to one side and to the other side of its axis C-C. Some side channels 63 of the third channel extend parallel and close to the side channels 28 of the first channel. Other side channels 64 of the third channel extend parallel and close to the side channels 38 of the second channel.
(37) The third channel has an opening 65 and an additional opening 66 provided for connection to the heat pipes 42, 48 of a third network 46. Advantageously, this third embodiment provides a heat exchange between three networks of capillary heat pipes which are not in fluid communication.
(38) Referring to
(39) This fifth embodiment provides the same advantages as the third embodiment.
(40) Referring to
(41) In the heat exchange device 70 according to the seventh embodiment illustrated in
(42) In the heat exchange device 76 according to the eighth embodiment illustrated in
(43) Referring to
(44) Advantageously, the heat exchange device 77 according to the ninth embodiment allows heat exchange between two networks of heat pipes located in different planes.
(45) Referring to
(46) Referring to
The first cavity 80 lies above the second cavity 82. The heat exchange between the heat transfer fluid of the first network 26 and the heat transfer fluid of the second network 36 occurs by means of the first cavity 80 and second cavity 82.
(47) Referring to
(48) Depending on the location of the electronic devices, the spacing between them, and their dissipation surface area, it is possible to combine multiple heat exchange devices as described above so as to couple the heat pipes differently.
(49) Referring to
(50) The heat transfer fluid of the first network 26 of heat pipes is not in fluid communication with the heat transfer fluid of the second network 36 of heat pipes.
(51) The heat transfer fluid contained in each network is typically ammonia. Alternatively, it consists for example of ethanol or methanol.
(52) According to the embodiment shown, the capillary heat pipes of the first network 26 are attached to one another and to capillary nodes 96 so as to form a general S-shape. Similarly, the capillary heat pipes of the second network 36 are attached to one another and to capillary nodes 96 so as to form a general S-shape.
(53) The capillary nodes 96 are, for example, made of an aluminum alloy such as AlSi10 mg by an additive manufacturing process.
(54) In this embodiment, the capillary nodes 96 have an L-shape. Alternatively, these L-shaped capillary nodes may be replaced by a heat exchange device containing an L-shaped channel. The capillary nodes 96 and the heat transfer devices, which allow forming an angle between the two heat pipes attached thereto, are referred to as angles within the meaning of the invention.
(55) Only the heat exchange device 98 shown at the bottom right of the figure will be described in detail. This heat exchange device 98 comprises a first channel, a second channel, and a third channel.
(56) The first channel leads to an opening 22 and to an additional opening 24. A capillary heat pipe 25 of the first network 26 is fixed to opening 22, by an assembly method such as gluing or welding. A capillary heat pipe 27 of the first network 26 is fixed to additional opening 24.
(57) The second channel leads to an opening 32 and to an additional opening 34. A capillary heat pipe 35 of the second network 36 is fixed to opening 32. A capillary heat pipe 37 of the second network 36 is fixed to additional opening 34.
(58) The third channel leads to two openings connected to capillary heat pipes of the first network 26.
(59) According to a variant embodiment illustrated in
(60) The wall 92 further comprises electronic devices 103. For example, in
(61) According to a variant (not shown), the capillary heat pipes of the first network and/or the second network are fixed to each other and to capillary nodes 96 so as to form a general grid shape. To implement this embodiment, capillary nodes having a star shape or heat exchange devices according to the third embodiment or fifth embodiment may be employed (see
(62) Alternatively, the capillary heat pipes and the heat exchange devices 98 are mounted within the support panel. In this case, the electronic devices are mounted on the panel with indirect contact with the heat exchange device 98.
(63) Alternatively, two heat exchange devices may be mounted one on the other.
(64) Referring to
(65) The first wall 108 comprises a first panel 112 which carries a first network 26 of capillary heat pipes. The second wall 110 comprises a second panel 114 which carries a second network 36 of capillary heat pipes. The assembly 106 further comprises a heat exchange device 90 according to the twelfth embodiment of the invention.
(66) This heat exchange device 90 is carried by the first panel 112 or the second panel 114. It is installed at the corner formed between the two panels.
(67) Two heat pipes 116, 118 are fixed in openings 22, 32 of the heat exchange device 90. These heat pipes 116, 118 are in thermal contact with the heat pipes of the second network 36.
(68) Two heat pipes 120, 122 are fixed in openings 24, 34 of the heat exchange device 90. These heat pipes 120, 122 are in thermal contact with the heat pipes of the first network 26.
(69) Alternatively, heat pipes 116 and 118 may be connected to a heat exchange device 98 shown in
(70) Alternatively, heat pipes 120 and 122 may be connected to a heat exchange device 98 shown in
(71) This assembly advantageously allows the conveyance of heat from one wall of the satellite to another.
(72) Alternatively, the heat exchange devices according to the third embodiment and fifth embodiment are used to form angles.