Blister packages

Abstract

The present invention pertains to a process for packaging one or more products, said process comprising the following steps: (i) providing a package having an opening, said package comprising at least one sheet, said sheet comprising the following layers: a layer [layer (L1)] consisting of a composition [composition (C1)] comprising, preferably consisting of, at least one thermoplastic polymer [polymer (T1)], said layer (L1) having two opposite surfaces, wherein one surface comprises one or more grafted functional groups [surface (L1-S1-f)], directly adhered to the surface (L1-S1-f), a layer [layer (L2)] consisting of at least one metal compound [compound (M1)], and optionally, directly adhered to the layer (L2), a layer (L3) consisting of a composition [composition (C3)] comprising, preferably consisting of at least one thermoplastic polymer [polymer (T2)], said polymer (T2) being equal to or different from the polymer (T1); (ii) feeding the package provided in step (i) with one or more products; and (iii) sealing the package provided in step (ii). The present invention also pertains to said package, to a process for the manufacture of said package and to uses of said package in various applications.

Claims

1. A process for manufacturing a package, said process comprising: treating one surface of a layer (L1) with a radio-frequency glow discharge process in the presence of an etching gas medium, wherein layer (L1) is part of a sheet, wherein layer (L1) consists of a composition (C1) comprising at least one thermoplastic polymer (T1), and wherein layer (L1) has two opposite surfaces; applying by electroless deposition a layer (L2) onto the surface of the layer (L1), said layer (L2) consisting of at least one metal compound (M1); optionally, directly adhering to layer (L2), a layer (L3) consisting of a composition (C3) comprising at least one thermoplastic polymer (T2), said polymer (T2) being equal to or different from polymer (T1); and shaping the sheet, thereby providing a package having an opening.

2. The process according to claim 1, wherein polymer (T1) and polymer (T2), equal to or different from each other, are selected from the group consisting of: vinyl chloride-based polymers selected from the group consisting of polyvinyl chloride, copolymers of vinyl chloride with one or more other comonomers and mixtures thereof, vinylidene chloride-based polymers selected from the group consisting of polyvinylidene chloride, copolymers of vinylidene chloride with one or more other comonomers such as 1,1-dichloroethane and mixtures thereof, chlorotrifluoroethylene-based polymers selected from the group consisting of polychlorotrifluoroethylene, copolymers of chlorotrifluoroethylene with one or more other comonomers and mixtures thereof, polyolefins, copolymers of ethylene, substituted polyolefins, polyesters, polycarbonates, polyamides, polyacrylonitriles, cellulose, and polylactic acid.

3. The process according to claim 1, wherein the radio-frequency glow discharge process is carried out at a radio-frequency between 1 kHz and 100 kHz.

4. The process according to claim 1, wherein the radio-frequency glow discharge process is carried out at a voltage between 1 kV and 50 kV.

5. The process according to claim 1, wherein the etching gas medium is selected from the group consisting of air, N.sub.2, NH.sub.3, CH.sub.4, CO.sub.2, He, O.sub.2, H.sub.2 and mixtures thereof.

6. The process according to claim 5, wherein the etching gas medium comprises N.sub.2 and/or NH.sub.3 and, optionally, H.sub.2.

7. The process according to claim 1, said process further comprising applying by electro-deposition a layer (L4) consisting of at least one metal compound (M2) onto layer (L2), said compound (M2) being equal to or different from compound (M1).

8. The process according to claim 1, wherein composition (C1) consists of at least one thermoplastic polymer (T1).

9. The process according to claim 1, wherein composition (C3) consists of at least one thermoplastic polymer (T2).

Description

EXAMPLE 1MANUFACTURE OF A FLUOROPOLYMER LAYER

(1) For manufacturing thin films, pellets of ECTFE were processed in a cast extrusion film line equipped with a 2.5 single stage extruder. Extruder is connected to the die via an adapter equipped with breaker plate. The die was a 1370 mm wide auto-gauge die. Upon exit from the die, molten tape was casted on three subsequent chill rolls, whose speed was adapted so as to obtain a film. Total thickness and thickness variation along the width are controlled by a Beta-ray gauge control system with retrofit to the die. The final width of the film, after edge cutting, was about 1050 mm.

(2) The following processing conditions were used for a 50 m thick film (see Tables 1 and 2 here below):

(3) TABLE-US-00001 TABLE 1 Temperature Zone [ C.] Main Barrel Zone 1 275 Main Barrel Zone 2 280 Main Barrel Zone 3 280 Main Barrel Zone 4 280 Clamp 280 Adapter 1 280 Adapter 2 280

(4) TABLE-US-00002 TABLE 2 Temperature Zone [ C.] Adapter 280 Die Zone 1 285 Die Zone 2 285 Die Zone 3 285 Die Zone 4 285 Die Zone 5 285 Top Roll 90 Centre Roll 170 Bottom Roll 170

EXAMPLE 2SURFACE MODIFICATION OF A FLUOROPOLYMER LAYER

(5) The fluoropolymer film so obtained was treated by a radio-frequency plasma discharge process. The etching gas used was N.sub.2. Working radio-frequency and voltage had values of 40 kHz and 20 kV, respectively.

EXAMPLE 3METALLIZATION PROCESS OF A FLUOROPOLYMER LAYER

(6) The fluoropolymer film treated by plasma as detailed hereinabove was coated with metallic copper by electroless plating. Prior to the copper deposition, the fluoropolymer layer was catalyzed by the wet process of Pd activation. This activation process was carried out by the immersion of the fluoropolymer layer in an aqueous solution containing 0.03 g/L of PdCl.sub.2 for 1 min, resulting in the substrate being entirely covered with Pd particles at a high density.

(7) The activated fluoropolymer film was then immersed in an aqueous plating bath containing 6 g/L of CuSO.sub.4, 27 g/l of EDTA disodium salt hydrate, formaldehyde 7.4 ml/l and 5.6 g/l of sodium hydroxide. The plating temperature was 60 C. and its pH value was 10.

COMPARATIVE EXAMPLE 1METALLIZATION PROCESS OF A FLUOROPOLYMER LAYER

(8) A fluoropolymer film was prepared following the same procedure as detailed above under Example 3, but without surface modification by plasma of the fluoropolymer film.

COMPARATIVE EXAMPLE 2METALLIZATION PROCESS OF A FLUOROPOLYMER LAYER

(9) The fluoropolymer film treated by plasma as detailed in Example 2 was coated with metallic nickel by sputtering according to usual techniques.

(10) Evaluation of Adhesion of the Metallized Fluoropolymer Assembly

(11) Adhesion of the metallic layer on the fluoropolymer substrates has been characterized by means of ASTM D3359 cross cut test standard procedure. Using a cutting tool, two series of perpendicular cuts were applied on the metallic layer in order to create a lattice pattern on it. A piece of tape was then applied and smoothened over the lattice and removed with an angle of 180 with respect to the metallic layer. The adhesion of metallic layer on the fluoropolymer was then assessed by comparing the lattice of cuts with the ASTM D3359 standard procedure. The classification of test results ranged from 5B to 0B, whose descriptions are depicted in Table 3.

(12) TABLE-US-00003 TABLE 3 ASTM D3359 Classification Description 5B The edges of the cuts are Completely smooth; none of the squares of the lattice is detached. 4B Detachment of flakes of the coating at the intersections of the cuts. A cross cut area not significantly greater than 5% is affected. 3B The coating has flaked along the edges and/or at the intersection of the cuts. A cross cut area significantly greater than 5%, but not significantly greater than 15% is affected. 2B The coating has flaked along the edges of the cuts partly or wholly in large ribbons, and/or it has flaked partly of wholly on different parts of the squares. A cross cut area significantly greater than 15%, but not significantly greater than 65%, is affected. 1B The coating has flaked along the edges of the cuts in large ribbons and/or some squares have detached partly or wholly. A cross cut area significantly greater than 35%, but not significantly greater than 65%, is affected. 0B Any degree of flaking that cannot be classified even by classification 1B.

(13) The adhesion values for metallized fluoropolymer assemblies obtained according to Example 1 and comparative Examples 1 and 2 are set forth in Table 4 here below.

(14) TABLE-US-00004 TABLE 4 Adhesion strength ASTM Run D3359 Example 3 5B C. Example 1 0B C. Example 2 1B

(15) It has been thus found that the multilayer assembly according to the present invention advantageously provided for outstanding interlayer adhesion properties as compared to multilayer assemblies according to Comparative Examples 1 and 2. No interlayer adhesion was observed for the multilayer assembly obtained according to Comparative Example 1, wherein the surface of the fluoropolymer film was not modified by plasma treatment.

(16) Evaluation of Surface Functionalization by XPS after Plasma Treatment

(17) The fluoropolymer film obtained according to Example 1 as described above was provided as such. It has been found by XPS analysis that the surface modified fluoropolymer layer obtained according to Example 2 comprises functional groups containing nitrogen atoms (2.87 At %) as compared to the bare fluoropolymer film obtained according to Example 1, wherein its surface, as confirmed by XPS analysis, does not comprise functional groups containing nitrogen atoms.

(18) Evaluation of Water Vapour Permeation Properties of the Metallized Fluoropolymer Assembly

(19) The fluoropolymer film obtained according to Example 1 as described above was provided as such.

(20) Water vapour permeability was measured according to ASTM F1249 standard test procedure by means of the Water Vapor Transmission Rate (WVTR).

(21) It has been found that the metallized fluoropolymer layer of the invention as notably obtained according to Example 3 advantageously provided for lower water vapour permeability as compared to the bare fluoropolymer film obtained according to Example 1 (see Table 5 below).

(22) TABLE-US-00005 TABLE 5 WVTR Run [g/m2day] Ex. 1 26 Ex. 3 0.7

(23) Deposition of 0.2 m of copper, resulting in a total thickness of the multilayer assembly of 50.2 m, was advantageously sufficient to highly reduce water vapour permeation with respect to the bare fluoropolymer film having a thickness of 50 m obtained according to Example 1.

(24) In view of the above, it has been found that the multilayer assembly according to the present invention is particularly suitable for use in packaging applications.