Contacting arrangement and method for forming the contacting arrangement

Abstract

A contacting arrangement between an electrical component and a circuit carrier, the component being connected to a connection element formed as a part separate from the component, and the connection element being electroconductively contacted directly with the circuit carrier via at least one press-fit connection.

Claims

1. A method for forming a contacting arrangement between an electrical component and a circuit carrier, the contacting arrangement including a connection element, the component being connected to the connection element, the connection element being formed as a part separate from the component, wherein the connection element is electroconductively contacted directly with the circuit carrier via at least one press-fit connection, the method comprising: integrally connecting the connection element to the component; and forming the press-fit connection between the connection element and at least one opening of the circuit carrier, wherein: the formation of the press-fit connection is assisted with the aid of ultrasonic oscillations, and the oscillation direction of the ultrasonic oscillations extends perpendicular to a joining direction of the component.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 shows a perspective view of a capacitor connected to a circuit carrier.

(2) FIG. 2 shows a detail of FIG. 1 in the area of a press-fit connection in an enlarged depiction, also in a perspective view.

(3) FIG. 3 shows the arrangement according to FIG. 1 in a side view.

(4) FIG. 4 shows the circuit carrier and the capacitor according to FIG. 1 in a perspective view for illustrating the joining process of the capacitor in the area of the circuit carrier.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

(5) Identical elements or elements having an identical function are provided with the same reference numerals in the figures.

(6) A contacting arrangement 100 between an electrical component 1 in the form of a plate shaped (ceramic) capacitor 2 and a circuit carrier 10 in the form of a circuit board 11, a substrate or the like is depicted in the FIGS. 1 through 3. Electrical component 1 or capacitor 2 is block-shaped, the two opposite (large) side surfaces 13, 14 of component 1 serving as contacts, and a contact surface 15 formed from an electrically conductive material being provided in the area of side surfaces 13, 14, as is apparent based on side surface 13 in FIG. 2. This contact surface 15 is connected at least in areas with an essentially flat, electrically conductive connection element 18 made of sheet metal via an integral connection 19, connection 19 being formed on the upper side and lower side of connection element 18, which acts as an electrically conductive contact surface.

(7) Integral connection 19, which may be formed as a flat connection, may, in particular, be a welded connection, a soft-soldered connection, a sintered connection or a hard-soldered connection.

(8) A main feature here is that integral connection 19 between electrical component 1 and connection element 18 in the exemplary embodiment described has also been produced in advance or separately prior to the formation of contacting arrangement 100. In the exemplary embodiment depicted, both connection element 18, as well as side surfaces 13, 14, and contact surfaces 15 of capacitor 2 each have a rectangular shape, connection element 18 having a smaller surface area, for example, than corresponding side surfaces 13, 14, and contact surfaces 15.

(9) As is shown, based on a synopsis of FIGS. 1 through 3, the connection element 18 includes a connection section 21 on the side facing circuit carrier 10, which is connected via an S-shaped intermediate section 22 to a section 23 that forms contact surface 15, in which integral connection 19 is formed. Connection section 21 situated in parallel to section 23 also exhibits a distance a from the plane of section 23 (FIG. 3).

(10) Connection section 21 also protrudes beyond front face 24 of electrical component 1 or of capacitor 2 facing circuit carrier 10. Connection section 21 includes a plurality of press-fit contacts 25 in the form of projections formed, in particular, by a punch process situated in parallel to one another, which include pointed or conically-shaped end areas 26 on the side facing circuit carrier 10. Press-fit contacts 25 interact with press-fit openings 28 formed in circuit carrier 10. A main feature here is that when fitting press-fit contacts 25 into press-fit openings 28, press-fit connections 30 are formed in each case which enable an electrical contacting between electrical component 1 and circuit carrier 10. For this purpose, it may be provided in a conventional manner that press-fit openings 30 are electrically conductive, for example, with the aid of corresponding coatings or through-contacts in the form of vias.

(11) As is also shown in FIG. 3, front face 24 of electrical component 1 rests flat on upper side 32 of circuit carrier 10. As is also shown in FIG. 3, electrically conductive areas 34, 35 are provided in the area of upper side 32 of circuit carrier 10, via which electrical component 1 is electrically contacted with press-fit contacts 25.

(12) In addition, it is depicted solely in FIG. 4, for example, that additional components 4, 5 may be situated relatively close to electrical component 1, or capacitor 2, on other electrically conductive areas 36, 37 on upper side 32 of circuit carrier 10. These components 4, 5 may be designed, for example, in the form of SMD parts or the like and, if necessary, may be thermally stressable only up to a relatively low temperature.

(13) The joining process or the connection of electrical component 1 to circuit carrier 10 is shown in a simplified manner in FIG. 4. It is apparent here that electrical component 1 is moved in the direction of circuit carrier 10 with the aid of a joining force F extending perpendicular to the surface of circuit carrier 10, press-fit contacts 25 of connection element 18 being aligned with press-fit openings 32 in circuit carrier 10. Thus, the press-fit connections 30 are formed via a correspondingly high joining force F. In addition, it may be provided for facilitating the joining process that ultrasonic oscillations are introduced into component 1 in the direction of double arrow 40 extending, in particular, in a direction perpendicular to joining force F or in parallel to the surface of circuit carrier 10, in order to facilitate the joining process.

(14) It is also mentioned that the direction of the ultrasonic oscillations introduced into component 1 may alternatively also extend in parallel to the surface of circuit carrier 10, in order to facilitate the joining process.

(15) Contacting arrangement 100 described thus far may be adapted or modified in a variety of ways, without departing from the inventive concept. This concept involves connecting electrical component 1 to a circuit carrier 10 exclusively via one connection element 18 and with the aid of press-fit connections 30. The present invention is, in particular, not intended to be limited to capacitors 2 as electrical components 1. Thus, it may be provided, for example, to first establish press-fit connections 30 between connection element 18 and circuit carrier 10, and only subsequently establish the connection between connection element 18 and component 1.