Circuit module and method for manufacturing the same

Abstract

A circuit module includes a substrate on which a first electrode and a second electrode are provided, a first electronic component, and a first resin layer. The first electrode includes a first electrode base body and a first plating film. The second electrode and the first electronic component are covered with the first resin layer. The second electrode includes a second electrode base body, a metal column, whose one end is directly connected to the second electrode base body and another end is positioned in an inner side relative to an outer surface of the first resin layer, a second plating film with a cylindrical shape covering a side surface of a connection body of the second electrode base body and the metal column, and a covering portion connected to the other end of the metal column.

Claims

1. A circuit module comprising: a substrate on one main surface of which a first electrode and a second electrode are provided; a first electronic component; and a first resin layer, wherein the first resin layer is provided on the one main surface of the substrate, the first electronic component is connected to the first electrode, and arranged in the first resin layer such that a surface of the first electronic component positioned on an opposite side from a surface connected to the first electrode is at least partially exposed, the second electrode is arranged in the first resin layer such that one end of the second electrode is positioned in an outer side portion relative to an outer surface of the first resin layer, the first electrode includes a first electrode base body, and a first plating film at least partially covering an outer surface of the first electrode base body, the second electrode includes a second electrode base body, a metal column, whose one end is directly connected to the second electrode base body and another end is positioned in an inner side portion relative to the outer surface of the first resin layer, the metal column comprising sintered metal powder, a second plating film with a cylindrical shape, at least partially covering a side surface of a connection body of the second electrode base body and the metal column, and having one end flush with the other end of the metal column, and a covering portion whose one main surface is connected to the other end of the metal column and the one end of the second plating film and another main surface is positioned in the outer side portion relative to the outer surface of the first resin layer.

2. The circuit module according to claim 1, wherein the metal column has a region in which an area of a cross section orthogonal to a normal direction of the one main surface of the substrate and an area of a connection portion between the metal column and the second electrode base body are different from each other.

3. The circuit module according to claim 2, wherein the surface of the first electronic component positioned on the opposite side from the surface on the side of the first electrode is configured of a polished cross section, and the outer surface of the first resin layer parallel to the one main surface of the substrate and the polished cross section of the first electronic component are flush with each other.

4. The circuit module according to claim 2, the circuit module further comprising: a second electronic component mounted on the other main surface of the substrate, and a second resin layer provided on the other main surface of the substrate and covering the second electronic component.

5. The circuit module according to claim 2, wherein the second plating film is constituted of a metal material harder than a metal material constituting the metal column.

6. The circuit module according to claim 2, wherein an interface of the first resin layer positioned between the first resin layer and the metal column is covered with a metal material having higher corrosion resistance than corrosion resistance of the metal material constituting the metal column.

7. The circuit module according to claim 2, the circuit module further comprising: a covering film that at least partially covers a side surface of the second plating film, wherein the second plating film is constituted of a metal material having higher ductility than ductility of the metal material constituting the metal column, and the covering film is constituted of a metal material having higher ductility than the ductility of the metal material constituting the second plating film.

8. The circuit module according to claim 1, wherein the surface of the first electronic component positioned on the opposite side from the surface on the side of the first electrode is configured of a polished cross section, and the outer surface of the first resin layer parallel to the one main surface of the substrate and the polished cross section of the first electronic component are flush with each other.

9. The circuit module according to claim 8, the circuit module further comprising: a second electronic component mounted on the other main surface of the substrate, and a second resin layer provided on the other main surface of the substrate and covering the second electronic component.

10. The circuit module according to claim 8, wherein the second plating film is constituted of a metal material harder than a metal material constituting the metal column.

11. The circuit module according to claim 8, wherein an interface of the first resin layer positioned between the first resin layer and the metal column is covered with a metal material having higher corrosion resistance than corrosion resistance of the metal material constituting the metal column.

12. The circuit module according to claim 8, the circuit module further comprising: a covering film that at least partially covers a side surface of the second plating film, wherein the second plating film is constituted of a metal material having higher ductility than ductility of the metal material constituting the metal column, and the covering film is constituted of a metal material having higher ductility than the ductility of the metal material constituting the second plating film.

13. The circuit module according to claim 1, the circuit module further comprising: a second electronic component mounted on the other main surface of the substrate, and a second resin layer provided on the other main surface of the substrate and covering the second electronic component.

14. The circuit module according to claim 13, wherein the second plating film is constituted of a metal material harder than a metal material constituting the metal column.

15. The circuit module according to claim 13, wherein an interface of the first resin layer positioned between the first resin layer and the metal column is covered with a metal material having higher corrosion resistance than corrosion resistance of the metal material constituting the metal column.

16. The circuit module according to claim 13, the circuit module further comprising: a covering film that at least partially covers a side surface of the second plating film, wherein the second plating film is constituted of a metal material having higher ductility than ductility of the metal material constituting the metal column, and the covering film is constituted of a metal material having higher ductility than the ductility of the metal material constituting the second plating film.

17. The circuit module according to claim 1, wherein the second plating film is constituted of a metal material harder than a metal material constituting the metal column.

18. The circuit module according to claim 1, wherein an interface of the first resin layer positioned between the first resin layer and the metal column is covered with a metal material having higher corrosion resistance than corrosion resistance of the metal material constituting the metal column.

19. The circuit module according to claim 1, the circuit module further comprising: a covering film that at least partially covers a side surface of the second plating film, wherein the second plating film is constituted of a metal material having higher ductility than ductility of the metal material constituting the metal column, and the covering film is constituted of a metal material having higher ductility than the ductility of the metal material constituting the second plating film.

20. A method for manufacturing a circuit module including a substrate on one main surface of which a first electrode and a second electrode are provided, a first electronic component, and a first resin layer, the first electrode including a first electrode base body, and a first plating film, the second electrode including a second electrode base body, a metal column which is a sintered body of metal powder, a second plating film, and a covering portion, the method for manufacturing a circuit module, comprising: a first step of preparing or producing first constraining layer green sheets each including a through-hole filled with a conductor paste containing the metal powder which serves as part of the metal column after sintering, second constraining layer green sheets, a first insulator green sheet to which a conductor paste which serves as the first electrode base body after sintering, a conductor paste which serves as the second electrode base body after sintering, and a conductor paste which serves as a constituent element of an electronic circuit after sintering are applied, and second insulator green sheets to each of which a conductor paste which serves as a constituent element of the electronic circuit after sintering is applied; a second step of producing a multilayer body by stacking and pressure-bonding at least one of the first constraining layer green sheets, at least one of the second constraining layer green sheets, the first insulator green sheet, and at least one of the second insulator green sheets, in a state that positioning is performed such that a first constraining layer is present on the one main surface and a second constraining layer is present on another main surface of the substrate after sintering, and the metal column is directly connected onto the second electrode base body; a third step of producing a sintered body, by firing the multilayer body, in which the substrate, the first constraining layer present on the one main surface of the substrate, and the second constraining layer present on the other main surface of the substrate are included, and the metal column formed by the metal powder being sintered is directly connected onto the second electrode base body; a fourth step of removing the first constraining layer and the second constraining layer; a fifth step of simultaneously forming the first plating film at least partially covering an outer surface of the first electrode base body and the second plating film at least partially covering an outer surface of a connection body of the second electrode base body and the metal column; a sixth step of connecting the first electronic component to the first electrode; a seventh step of providing the first resin layer on the one main surface of the substrate such that the first electronic component and the connection body after plating are entirely covered; an eighth step of performing polishing process on the first electronic component and the first resin layer from a surface side positioned on an opposite side from a surface of the first electronic component on a side of the first electrode, such that a thickness of the first electronic component is reduced in comparison with a state before being connected to the first electrode, and an outer surface which is a polished cross section of the first resin layer parallel to the one main surface of the substrate, a polished cross section of the first electronic component, and a polished cross section of the connection body are flush with one another; a ninth step of etching the polished cross section of the connection body such that a cross section being exposed of the connection body is positioned in an inner side portion relative to the outer surface of the first resin layer parallel to the one main surface of the substrate; and a tenth step of forming the covering portion whose one main surface is connected onto the cross section of the connection body exposed after the etching and another main surface is positioned in an outer side portion relative to the outer surface of the first resin layer parallel to the one main surface of the substrate.

21. The method for manufacturing the circuit module according to claim 20, wherein, in the first step, the through-hole included in the first constraining layer green sheets has a tapered shape, and in the second step, the at least one of the first constraining layer green sheets is stacked and pressure-bonded such that an area of a cross section of the metal column orthogonal to a normal direction of the one main surface of the substrate after sintering is different from an area of a connection portion of the metal column and the second electrode base body.

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

(1) FIG. 1 is a bottom view of a circuit module 100 which is an embodiment of a circuit module according to the present disclosure.

(2) FIG. 2 is a cross-sectional view of the circuit module 100.

(3) FIG. 3 is a cross-sectional view of a main part of the circuit module 100.

(4) FIGS. 4A-4F include cross-sectional views for explaining various modifications of a second electrode 3 of the circuit module 100.

(5) FIGS. 5A-5D include diagrams for explaining an example of a method for manufacturing the circuit module 100, and includes cross-sectional views for partially schematically explaining steps.

(6) FIGS. 6A-6D include diagrams for explaining the example of the method for manufacturing the circuit module 100, and includes cross-sectional views for schematically explaining steps subsequent to those in FIGS. 5A-5D.

(7) FIGS. 7A-7D include diagrams for explaining the example of the method for manufacturing the circuit module 100, and includes cross-sectional views for schematically explaining steps subsequent to those in FIGS. 6A-6D.

(8) FIGS. 8A-8C include diagrams for explaining the example of the method for manufacturing the circuit module 100, and includes cross-sectional views for schematically explaining steps subsequent to those in FIGS. 7A-7D.

(9) FIG. 9 is a longitudinal cross-sectional view of the second electrode which further includes a covering film.

(10) FIG. 10 is a transverse cross-sectional view of the second electrode of FIG. 9 when viewed from a direction of arrows on a line X-X.

(11) FIG. 11 is a cross-sectional view of a main part of a circuit module 200 in the background art.

DETAILED DESCRIPTION

(12) Hereinafter, features of the present disclosure will be described in more detail through description of an embodiment of the present disclosure. The present disclosure can be applied to various circuit modules including a columnar external connection terminal for connection to a mother substrate of an electronic device. In particular, the present disclosure is effectively applied to a circuit module in which the external connection terminal is required to be thinly formed for miniaturization.

(13) Embodiment of Circuit Module

(14) <Structure of Circuit Module>

(15) A structure of a circuit module 100, which is an embodiment of a circuit module according to the present disclosure, will be described with reference to FIG. 1 to FIG. 3.

(16) Note that the drawings are respectively schematic diagrams, and dimensions of an actual product are not necessarily reflected. Additionally, variations in shapes of constituent elements or the like generated in manufacturing steps are not also necessarily reflected in the drawings. That is, hereinafter, the drawings used for description in this specification can be considered as representing the actual product in an essential aspect, even if there is a different part from that of the actual product.

(17) FIG. 1 is a bottom view of the circuit module 100 when viewed from a first resin layer 5 side in a normal direction of one main surface of a substrate 1. FIG. 2 is a cross-sectional view of the circuit module 100 when viewed in an arrow direction at a cut plane including a line A-A illustrated in FIG. 1. FIG. 3 is a cross-sectional view of a main part of the circuit module 100 obtained by enlarging an area surrounded by a dotted line in FIG. 2.

(18) The circuit module 100 according to the present disclosure includes the substrate 1, a first electronic component 4, the first resin layer 5, a second electronic component 7, and a second resin layer 8. Note that the second electronic component 7 and the second resin layer 8 are not necessarily essential constituent elements in the circuit module 100 of some embodiments of the present disclosure. For the substrate 1, a first electrode 2 and a second electrode 3 are provided on one main surface P1 thereof, and a third electrode 6 is provided on the other main surface P2 thereof. Here, the second electrode 3 corresponds to an external connection terminal. The substrate 1 includes an insulator layer 1a, and a pattern conductor 1b and a via conductor 1c which are conductors necessary for configuring an electronic circuit.

(19) That is, the substrate 1 is a ceramic multilayer substrate in which the insulator layer 1a is, for example, formed of a low temperature sintering ceramic material. However, the type of the insulator layer 1a is not limited thereto. The pattern conductor 1b and the via conductor 1c are formed using a metal material selected from Cu, a Cu alloy, and the like, for example. However, the material of the pattern conductor 1b and the via conductor 1c is not limited thereto.

(20) The first electronic component 4 is connected to the first electrode 2 with a connection member S, and is arranged in the first resin layer 5 such that a surface positioned on an opposite side from a surface on the first electrode 2 side is exposed. The second electronic component 7 is connected to the third electrode 6 with the connection member S, and is entirely covered with the second resin layer 8.

(21) The first electronic component 4 is, for example, an electronic component such as various types of ICs or a circuit module that is smaller than the circuit module 100. The second electronic component 7 is, for example, an electronic component such as a multilayer capacitor, a multilayer inductor, various types of filters, or various types of ICs. For the connection member S, for example, SnAgCu based Pb-free solder is used. However, the material of the connection member S is not limited thereto.

(22) The first electronic component 4 can be connected to the first electrode 2, and after being entirely covered with the first resin layer 5, subjected to polishing process from the surface side positioned on the opposite side from the surface on the first electrode 2 side. As a result, the first electronic component 4 is reduced in thickness in comparison with a state before being connected to the first electrode 2. In the first electronic component, the surface positioned on the opposite side from the surface on the first electrode side is configured of a polished cross section. Additionally, an outer surface P3 of the first resin layer 5 parallel to the one main surface of the substrate 1 and the polished cross section of the first electronic component 4 are flush with each other.

(23) By configuring as described above, for example, when the first electronic component 4 is an IC, the circuit module 100 is reduced in height without necessarily using a thin IC which is difficult to handle.

(24) The first resin layer 5 is provided on the one main surface P1 side of the substrate 1. The second resin layer 8 is provided on the other main surface P2 side of the substrate 1. Each of the first resin layer 5 and the second resin layer 8 is formed using a resin material in which a glass material, silica, or the like is dispersed as a filler. However, each of the first resin layer 5 and the second resin layer 8 may be formed of a single resin material. The first resin layer 5 and the second resin layer 8 may be formed by using any of the same resin material or different resin materials.

(25) The first electrode 2 has a plate shape and includes a first electrode base body 2a and a first plating film 2b covering an outer surface of the first electrode base body 2a. The second electrode 3 has a columnar shape and arranged in the first resin layer 5 such that one end thereof is positioned in an outer side portion relative to the outer surface P3 of the first resin layer 5. The second electrode 3 includes a second electrode base body 3a.sub.1, a metal column 3a.sub.2, a second plating film 3b, and a covering portion 3c. The third electrode 6 has a plate shape and includes a third electrode base body 6a and a third plating film 6b covering an outer surface of the third electrode base body 6a.

(26) The metal column 3a.sub.2 has a simple columnar shape in which one end thereof is directly connected to the second electrode base body 3a.sub.1 and the other end thereof is positioned in an inner side portion relative to the outer surface P3 of the first resin layer 5 (see FIG. 3). Here, the fact that the one end of the metal column 3a.sub.2 is directly connected to the second electrode base body 3a.sub.1 refers to being in a state of an integrated connection body, for example, by sintering or the like without necessarily using a connection member such as solder. That is, the metal column 3a.sub.2 is formed by metal powder being sintered.

(27) The second plating film 3b has a cylindrical shape, at least partially covers a side surface of a connection body of the second electrode base body 3a.sub.1 and the metal column 3a.sub.2, and has one end on an identical surface to the other end of the metal column 3a.sub.2. In the covering portion 3c, one main surface thereof is connected to the other end of the metal column 3a.sub.2 and the one end of the second plating film 3b, and the other main surface thereof is positioned in the outer side portion relative to the outer surface P3 of the first resin layer 5 (see FIG. 3). Note that a fourth plating film (not illustrated) may be further provided on an outer surface of the covering portion 3c.

(28) Each of the first electrode base body 2a, the second electrode base body 3a.sub.1, the metal column 3a.sub.2, and the third electrode base body 6a is formed using a metal material selected from Cu, a Cu alloy, and the like, for example. As the Cu alloy, for example, a Cu-10Ni alloy or the like may be used. However, the material of each of the first electrode base body 2a, the second electrode base body 3a.sub.1, the metal column 3a.sub.2, and the third electrode base body 6a is not limited thereto. Each of the first plating film 2b, the second plating film 3b, the third plating film 6b, and the covering portion 3c is formed using a metal material selected from Ni, a Ni alloy, and the like, for example.

(29) In a case where the fourth plating film is provided, the fourth plating film is formed using a metal material selected from Sn, an Sn alloy, and the like, for example.

(30) In the circuit module 100, the second electrode 3 which is the external connection terminal includes the second plating film 3b which at least partially covers the side surface of the connection body of the second electrode base body 3a.sub.1 and the metal column 3a.sub.2. In this case, the second plating film 3b and the first resin layer 5 have good compatibility with each other, and a close contact property between the second plating film 3b and the first resin layer 5 is high. Accordingly, for example, even when the circuit module 100 is heated, separation at an interface between the second electrode 3 and the first resin layer 5 is suppressed from occurring.

(31) <Modifications of Second Electrode>

(32) FIGS. 4A-4F include cross-sectional views for explaining various modifications of the second electrode 3 of the circuit module 100. FIG. 4A illustrates a case where the metal column 3a.sub.2 has a tapered shape in which a cross-sectional area continuously decreases from the one end (a connection portion with the second electrode base body 3a.sub.1) of the metal column 3a.sub.2 to the other end (a connection portion with the covering portion 3c) of the metal column 3a.sub.2. FIG. 4B illustrates a case where the metal column 3a.sub.2 has an inverted tree shape on the diagram.

(33) FIG. 4C illustrates a case where the metal column 3a.sub.2 has a shape in which the cross-sectional area continuously decreases from the one end to the middle portion of the metal column 3a.sub.2, and has a simple columnar shape from the middle portion to the other end of the metal column 3a.sub.2. FIG. 4D illustrates a case where the metal column 3a.sub.2 has a tree shape on the diagram.

(34) FIG. 4E illustrates a case where the metal column 3a.sub.2 has a barrel shape as a whole by the cross-sectional area continuously increasing from the one end to the middle portion of the metal column 3a.sub.2, and the cross-sectional area continuously decreasing from the middle portion to the other end of the metal column 3a.sub.2. FIG. 4F illustrates a case where the metal column 3a.sub.2 has a Japanese hand drum shape (a shape similar to an hourglass shape) as a whole by the cross-sectional area continuously decreasing from the one end to the middle portion of the metal column 3a.sub.2, and the cross-sectional area continuously increasing from the middle portion to the other end of the metal column 3a.sub.2.

(35) That is, the metal column 3a.sub.2 according to each of the modifications has a region in which an area of a cross section orthogonal to a normal direction of the one main surface of the substrate 1 is different from an area of the connection portion between the metal column 3a.sub.2 and the second electrode base body 3a.sub.1.

(36) In a case where the metal column 3a.sub.2 has such a shape, in comparison with a case of a mere columnar shape, a contact area between the second electrode 3 and the first resin layer 5 increases. Accordingly, the separation at the interface between the second electrode 3 and the first resin layer 5 is further suppressed from occurring. In addition, in a case where the shape of the metal column 3a.sub.2 is the tree shape, the inverted tree shape, the barrel shape, the Japanese hand drum shape (a shape similar to an hourglass shape), or the like, as described above, and the area of the cross section orthogonal to the normal direction of the one main surface of the substrate 1 does not simply change, the effect is particularly remarkably obtained.

(37) <Method for Manufacturing Circuit Module>

(38) FIGS. 5A to 8C are diagrams for explaining an example of a method for manufacturing the circuit module 100 which is the embodiment of the circuit module according to the present disclosure. FIGS. 5A to 5D, FIGS. 6A to 6D, FIGS. 7A to 7D, and FIGS. 8A to 8C are cross-sectional views respectively schematically illustrating steps sequentially performed in the example of the method for manufacturing the circuit module 100. Note that each of FIGS. 5A 8C corresponds to a cross-sectional view of the circuit module 100 when viewed in an arrow direction at the cut plane including the line A-A illustrated in FIG. 1 (see FIG. 2).

(39) Furthermore, in the following method for manufacturing, a case where the circuit module 100 is once produced in an aggregated state and then is divided into individual pieces is described. However, in the drawings used in the description, the reference numerals attached to constituent elements of the circuit module 100 in the state of being divided into individual pieces are used, and the aggregated state and the state of being divided into individual pieces are not particularly distinguished from each other.

(40) FIG. 5A is a cross-sectional view illustrating a step (first step) of preparing or producing a first constraining layer green sheet 9r, a second constraining layer green sheet 10r, a first insulator green sheet 1ar.sub.1, a second insulator green sheet 1ar.sub.2, and a third insulator green sheet 1ar.sub.3.

(41) The first constraining layer green sheet 9r includes a through-hole filled with a conductor paste 3ar.sub.2 containing the metal powder which serves as part of the metal column 3a.sub.2 after sintering. The second constraining layer green sheet 10r is not particularly limited.

(42) The first constraining layer green sheet 9r and the second constraining layer green sheet 10r include low temperature sintering ceramic material powder which is the same as low temperature sintering ceramic material powder constituting the insulator layer 1a, and sintering-resistant ceramic material powder which is not sintered at a sintering temperature of the low temperature sintering ceramic material powder. As the sintering-resistant ceramic material powder, Al.sub.2O.sub.3 powder is used, for example. The conductor paste 3ar.sub.2 is obtained by dispersing Cu powder, which is a conductive material, in a resin material which is a binder. The through-hole is filled with the conductor paste 3ar.sub.2 through a known technique such as screen printing.

(43) The first insulator green sheet 1ar.sub.1, the second insulator green sheet 1ar.sub.2, and the third insulator green sheet 1ar.sub.3, each includes the low temperature sintering ceramic material powder constituting the insulator layer 1a.

(44) To the first insulator green sheet 1ar.sub.1, a conductor paste 2ar, a conductor paste 3ar.sub.1, and a conductor paste 1cr are applied. The conductor paste 2ar serves as the first electrode base body 2a after sintering. The conductor paste 3ar.sub.1 serves as the second electrode base body 3a.sub.1 after sintering. The conductor paste 1cr serves as a constituent element of an electronic circuit after sintering. To the second insulator green sheet 1ar.sub.2, conductor pastes 1br and 1cr, each of which serves as a constituent element of the electronic circuit after sintering are applied.

(45) To the third insulator green sheet 1ar.sub.3, the conductor paste 1cr and a conductor paste 6ar are applied. The conductor paste 6ar serves as the third electrode base body 6a after sintering. Note that in a case where the second electronic component 7 is not included in the circuit module 100, preparation or production of the third insulator green sheet 1ar.sub.3 is omitted.

(46) The conductor pastes 1br, 1cr, 2ar, 3ar.sub.1, and 6ar are each obtained by dispersing Cu powder, which is a conductive material, in a resin material which is a binder. The conductor pastes 1br, 2ar, 3ar.sub.1, and 6ar are applied to the first insulator green sheet 1ar.sub.1, the second insulator green sheet 1ar.sub.2, and the third insulator green sheet 1ar.sub.3 through a known technique such as screen printing.

(47) FIG. 5B is a cross-sectional view illustrating a step (second step) of producing a multilayer body by stacking and pressure-bonding at least one first constraining layer green sheet 9r, at least one second constraining layer green sheet 10r, the first insulator green sheet 1ar.sub.1, at least one second insulator green sheet 1ar.sub.2, and the third insulator green sheet 1ar.sub.3. At this time, the stacking and pressure-bonding is performed in a state that positioning is performed such that a first constraining layer 9 is present on the one main surface P1 side and a second constraining layer 10 is present on the other main surface P2 side of the substrate 1 after sintering, and the metal column 3a.sub.2 is directly connected onto the second electrode base body 3a.sub.1.

(48) FIG. 5C is a cross-sectional view illustrating a step (third step) of producing a sintered body by firing the multilayer body described above. By this step, the sintered body is obtained in which the substrate 1, the first constraining layer 9 present on the one main surface P1 side of the substrate 1, and the second constraining layer 10 present on the other main surface P2 side of the substrate 1 are included, and the metal column 3a.sub.2 formed by the metal powder in the conductor paste 3ar.sub.2 being sintered is directly connected onto the second electrode base body 3a.sub.1.

(49) FIG. 5D is a cross-sectional view illustrating a step (fourth step) of removing the first constraining layer 9 from the one main surface P1 side of the substrate 1 and removing the second constraining layer 10 from the other main surface P2 side of the substrate 1. The removal of the first constraining layer 9 and the second constraining layer 10 can be carried out through a known technique such as sandblast, for example.

(50) FIG. 6A is a cross-sectional view illustrating a step (a fifth step) of simultaneously forming the first plating film 2b covering the outer surface of the first electrode base body 2a, the second plating film 3b covering the outer surface of the connection body of the second electrode base body 3a.sub.1 and the metal column 3a.sub.2, and the third plating film 6b covering the outer surface of the third electrode base body 6a. The first plating film 2b, the second plating film 3b, and the third plating film 6b can be formed through a known electroless plating method. By this step, the first electrode 2 and the third electrode 6 are produced.

(51) FIG. 6B is a cross-sectional view illustrating a step (sixth step) of connecting the first electronic component 4 to the first electrode 2 by using the connection member S. As the connection member S, for example, a solder bump having the above-described Pb-free solder composition can be used. The solder bump is applied to, for example, the first electronic component 4 side. Then, by applying ultrasonic vibration to the first electronic component 4, the solder bump is connected to the first electrode 2.

(52) FIG. 6C is a cross-sectional view illustrating a step (seventh step) of providing the first resin layer 5 on the one main surface P1 side of the substrate 1 such that the first electronic component 4 and the connection body of the second electrode base body 3a.sub.1 and the metal column 3a.sub.2 after plating are entirely covered. The step of covering the first electronic component 4 and the connection body after plating with the first resin layer 5 can be performed through a known technique such as coating or the like on the one main surface P1 side of the substrate 1 with the resin material forming the first resin layer 5, for example.

(53) FIG. 6D is a cross-sectional view illustrating a step (eighth step) of performing polishing process on the first electronic component 4 and the first resin layer 5 from the surface side positioned on the opposite side from the surface of the first electronic component 4 on the first electrode 2 side. At this time, polish-processing is performed such that a thickness of the first electronic component 4 is reduced in comparison with a state before being connected to the first electrode 2, and the outer surface P3 which is the polished cross section of the first resin layer 5 parallel to the one main surface P1 of the substrate 1, the polished cross section of the first electronic component 4, and the polished cross section of the connection body after plating described above are flush with one another. The polishing process can be performed through a known technique such as lap polishing.

(54) FIG. 7A is a cross-sectional view illustrating a step of applying a resist R onto the other main surface P2 of the substrate 1 so as to cover the third electrode 6. The resist R can be applied onto the other main surface P2 of the substrate 1 through a known technique such as a screen printing method, for example. This step is performed in order to prevent the third electrode 6 from being etched when a step (ninth step) of etching the polished cross section of the connection body after plating described later is performed. Accordingly, this step is not performed when the second electronic component 7 is not included in the circuit module 100 and there is no third electrode 6 for connecting the second electronic component 7.

(55) FIG. 7B is a cross-sectional view illustrating the step (ninth step) of etching the polished cross section of the connection body such that the exposed cross section of the connection body after plating described above is positioned in the inner side portion relative to the outer surface P3 of the first resin layer 5. By this step, the metal column 3a.sub.2 and the second plating film 3b are etched. Then, the exposed cross section of the connection body after plating moves to the inner side portion relative to the outer surface P3 of the first resin layer 5 by an amount equivalent to an etching region E.

(56) FIG. 7C is a cross-sectional view illustrating a step (tenth step) of forming the covering portion 3c (see FIG. 3) whose one main surface is connected onto the cross section of the connection body exposed after etching and whose other main surface is positioned in the outer side portion relative to the outer surface P3 of the first resin layer 5. The covering portion 3c can be formed through a known electroless plating method. By this step, the second electrode 3 having the aforementioned constituent elements is produced.

(57) FIG. 7D is a cross-sectional view illustrating a step of removing the resist R covering the third electrode 6 from the other main surface P2 of the substrate 1. The resist R can be removed through a known technique such as dissolution or the like with a solvent. This step is performed in order to remove the resist R applied for the purpose of protecting the third electrode 6 before the step (ninth step) of etching the polished cross section of the connection body after plating described above. Accordingly, this step is not performed when the second electronic component 7 is not included in the circuit module 100 and there is no third electrode 6 for connecting the second electronic component 7.

(58) FIG. 8A is a cross-sectional view illustrating a step of connecting the second electronic component 7 to the third electrode 6 by using the connection member S. As the connection member S, for example, a solder bump having the above-described Pb-free solder composition can be used. The solder bump is applied to, for example, the second electronic component 7 side. Then, by applying ultrasonic vibration to the second electronic component 7, the solder bump is connected to the third electrode 6. This step is not performed when the second electronic component 7 is not included in the circuit module 100.

(59) FIG. 8B is a cross-sectional view illustrating a step of providing the second resin layer 8 on the other main surface P2 side of the substrate 1 such that the second electronic component 7 is entirely covered. The step of covering the second electronic component 7 with the second resin layer 8 can be performed through a known technique such as coating or the like on the one main surface P1 side of the substrate 1 with the resin material forming the first resin layer 5, for example. By this step, the circuit module 100 in the aggregated state is produced. This step is not performed when the second electronic component 7 is not included in the circuit module 100 and there is no second resin layer 8 for covering the second electronic component 7.

(60) FIG. 8C is a cross-sectional view illustrating a step of cutting the aggregation of the circuit modules 100. By this step, the circuit module 100 according to the present disclosure is produced. Note that in a case where the circuit module 100 is manufactured in a state of being divided into the individual peace from the beginning, this step is not performed.

(61) In the above-described method for manufacturing the circuit module 100, after the first electronic component 4 and the connection body on the outer surface of which the second plating film 3b is formed are covered with the first resin layer 5, the first electronic component 4, the first resin layer 5, and the connection body are subjected to polishing process. Accordingly, it is possible to efficiently obtain the circuit module 100 capable of suppressing the separation at the interface between the second electrode 3 and the first resin layer 5 from occurring, and reduced in height.

(62) In the above-described method for manufacturing the circuit module 100, the following features can be included. In the first step, the first constraining layer green sheet 9r in which the through-hole having a tapered shape is filled with the conductor paste 3ar.sub.2 containing the metal powder which serves as part of the metal column 3a.sub.2 after sintering is prepared or produced. In the second step, at least one first constraining layer green sheet 9r described above is stacked and pressure-bonded such that the region in which the area of the cross section of the metal column 3a.sub.2 after sintering orthogonal to the normal direction of the one main surface P1 of the substrate 1 is different from the area of the connection portion of the metal column 3a.sub.2 and the second electrode base body 3a.sub.1 is included.

(63) That is, the first constraining layer green sheet 9r is stacked while adjusting an orientation of the conductor paste 3ar.sub.2 formed to have the tapered shape as described above such that the metal column 3a.sub.2 after sintering has a desired shape.

(64) In the method for manufacturing the circuit module 100 having the features described above, it is possible to efficiently manufacture the circuit module 100 in which the separation at the interface between the second electrode 3 and the first resin layer 5 is further suppressed from occurring. Furthermore, it is possible to easily produce the metal column 3a.sub.2 having the various shapes, such as the tree shape, the inverted tree shape, the barrel shape, the Japanese hand drum shape (a shape similar to an hourglass shape), or the like, as illustrated in FIG. 4, and having a shape in which the area of the cross section orthogonal to the normal direction of the one main surface of the substrate 1 does not simply change and with which the separation suppression effect is remarkably obtained.

(65) Note that the second electrode 3 may further include a covering film 3b.sub.2 for at least partially covering a side surface of a second plating film 3b.sub.1. FIG. 9 is a longitudinal cross-sectional view of the second electrode which further includes the covering film. FIG. 10 is a transverse cross-sectional view of the second electrode of FIG. 9 when viewed from a direction of arrows on a line X-X.

(66) As illustrated in FIG. 9 and FIG. 10, the second electrode 3 according to the present modification includes the second electrode base body 3a.sub.1, the metal column 3a.sub.2, the second plating film 3b.sub.1, the covering film 3b.sub.2, and the covering portion 3c. The covering film 3b.sub.2 has a cylindrical shape, at least partially covers an outer circumferential surface of the second plating film 3b.sub.1, and has one end on an identical surface to the other end of the metal column 3a.sub.2. The one main surface of the covering portion 3c is connected to the other end of the metal column 3a.sub.2, the one end of the second plating film 3b.sub.1, and one end of the covering film 3b.sub.2.

(67) In the present modification, the second plating film 3b.sub.1 covers the entire circumferential surface of the connection body of the second electrode base body 3a.sub.1 and the metal column 3a.sub.2. The covering film 3b.sub.2 covers the entire outer circumferential surface of the second plating film 3b.sub.1.

(68) The second plating film 3b.sub.1 is constituted of a metal material having higher ductility than that of the metal material constituting the metal column 3a.sub.2. The covering film 3b.sub.2 is constituted of a metal material having higher ductility than that of the metal material constituting the second plating film 3b.sub.1.

(69) For example, the metal column 3a.sub.2 is constituted of a metal material selected from Cu, a Cu alloy, and the like, the second plating film 3b.sub.1 is constituted of a metal material selected from Ni, an Ni alloy, and the like, and the covering film 3b.sub.2 is constituted of a metal material selected from Au, an Au alloy, and the like. Note that the metal materials respectively constituting the metal column 3a.sub.2, the second plating film 3b.sub.1, and the covering film 3b.sub.2 are not limited to those described above, and it is sufficient that the covering film 3b.sub.2, the second plating film 3b.sub.1, the metal column 3a.sub.2 are respectively constituted of metal materials having higher ductility in this order.

(70) According to the configuration described above, in the second electrode 3, since metal materials having higher ductility are arranged in order from the side close to the first resin layer 5, when a stress is generated between the first resin layer 5 and the second electrode 3, the stress can be alleviated by the metal material having high ductility positioned in the vicinity of the first resin layer 5, and thus, it is possible to suppress the second electrode 3 from breaking by the stress being applied to the second electrode 3.

(71) Note that the interface of the first resin layer 5 positioned between the first resin layer 5 and the metal column 3a.sub.2 may be covered with a metal material having higher corrosion resistance than that of the metal material constituting the metal column 3a.sub.2. In a case where the second electrode 3 includes the covering film 3b.sub.2, the covering film 3b.sub.2 is constituted of a metal material having higher corrosion resistance than that of the metal material constituting the metal column 3a.sub.2, and in a case where the second electrode 3 does not include the covering film 3b.sub.2, the second plating film 3b.sub.1 is constituted of a metal material having higher corrosion resistance than that of the metal material constituting the metal column 3a.sub.2. As the metal material having higher corrosion resistance than that of the metal material constituting the metal column 3a.sub.2, a noble metal such as Au, Ag, Pt, or the like, or an alloy thereof can be used.

(72) In a case where the interface of the first resin layer 5 positioned between the first resin layer 5 and the metal column 3a.sub.2 is covered with the metal material having higher corrosion resistance than that of the metal material constituting the metal column 3a.sub.2, it is possible to suppress moisture, gas, or the like from entering into the inside of the circuit module 100 from the interface between the second electrode 3 and the first resin layer 5. As a result, it is possible to suppress the circuit module 100 from deteriorating in characteristics.

(73) The second plating film 3b.sub.1 can be constituted of a metal material harder than the metal material constituting the metal column 3a.sub.2, from a viewpoint that the metal column 3a.sub.2 during polishing process in the eighth step can be suppressed from sagging. As a material constituting the second plating film 3b.sub.1, for example, a metal such as Ni, Ti, W, Co, or the like, or an alloy thereof can be used. Note that the hardness of the above-described metal material is the Vickers hardness.

(74) It should be noted that the embodiments described in this specification are exemplary, the present disclosure is not limited to the embodiments described above, and various applications and modifications can be added within the scope of the present disclosure.

REFERENCE SIGNS LIST

(75) 100 CIRCUIT MODULE

(76) 1 SUBSTRATE

(77) 1a INSULATOR LAYER

(78) 1b PATTERN CONDUCTOR

(79) 1c VIA CONDUCTOR

(80) 2 FIRST ELECTRODE

(81) 2a FIRST ELECTRODE BASE BODY

(82) 2b FIRST PLATING FILM

(83) 3 SECOND ELECTRODE (EXTERNAL CONNECTION TERMINAL)

(84) 3a.sub.1 SECOND ELECTRODE BASE BODY

(85) 3a.sub.2 METAL COLUMN

(86) 3b, 3b.sub.1 SECOND PLATING FILM

(87) 3b.sub.2 COVERING FILM

(88) 3c COVERING PORTION

(89) 4 FIRST ELECTRONIC COMPONENT

(90) 5 FIRST RESIN LAYER

(91) 6 THIRD ELECTRODE

(92) 6a THIRD ELECTRODE BASE BODY

(93) 6b THIRD PLATING FILM

(94) 7 SECOND ELECTRONIC COMPONENT

(95) 8 SECOND RESIN LAYER

(96) P1 ONE MAIN SURFACE

(97) P2 THE OTHER MAIN SURFACE

(98) P3 OUTER SURFACE OF FIRST RESIN LAYER PARALLEL TO ONE MAIN SURFACE OF SUBSTRATE

(99) S CONNECTION MEMBER