Optical module

Abstract

An optical module with optical fibers is intended to be able to be easily sucked and conveyed, and mounted on another substrate. An optical module of the present disclosure includes an optical device to which optical fibers are optically connected; and a carrier including a substrate and an adhesive layer formed at a surface of the substrate, and a part of the optical device and a part of the optical fibers are adhesively fixed on a surface of the adhesive layer. The optical device may include ball grid array shaped electrodes. The carrier may be provided with a plurality of holes.

Claims

1. An optical module comprising: an optical device to which N optical fibers are optically connected, N being a positive integer; and a carrier including a substrate and an adhesive layer formed at a surface of the substrate, wherein an adhesive fixing of a part of the optical device and a part of the N optical fibers are performed on a surface of the adhesive layer, wherein a peeling film is disposed between the adhesive layer and the optical device and between the adhesive layer and the N optical fibers, in order to peel off the optical device and the N optical fibers from the adhesive layer of the carrier.

2. The optical module according to claim 1, wherein the optical device includes ball grid array shaped electrodes.

3. The optical module according to claim 1, wherein the adhesive fixing is performed so that the carrier partially overlaps with the optical device when viewed from above the carrier.

4. The optical module according to claim 1, wherein the substrate of the carrier and the adhesive of the carrier are provided with a plurality of holes.

5. The optical module according to claim 1, wherein in the carrier, only the substrate is provided with a plurality of holes and the adhesive layer is provided with no hole.

6. The optical module according to claim 1, wherein a peeling prevention member is disposed on a non-adhered surface of the N optical fibers fixed to the carrier.

7. The optical module according to claim 6, wherein the peeling prevention member is a film, or is a strip-shaped member or a mesh-like member.

Description

BRIEF DESCRIPTION OF DRAWINGS

(1) FIG. 1(a) is a side view of a related-art optical device with optical fibers. FIG. 1(b) is a top view of the related-art optical device with optical fibers.

(2) FIG. 2(a) is a cross-sectional view of an optical module according to a first embodiment of the present disclosure. FIG. 2(b) is a top view of the optical module according to the first embodiment of the present disclosure.

(3) FIG. 3(a) is a cross-sectional view of an optical module according to a second embodiment of the present disclosure. FIG. 3(b) is a top view of the optical module according to the second embodiment of the present disclosure.

(4) FIG. 4(a) is a cross-sectional view of an optical module according to a third embodiment of the present disclosure. FIG. 4(b) is a top view of the optical module according to the third embodiment of the present disclosure.

(5) FIG. 5(a) is a cross-sectional view of an optical module according to a fourth embodiment of the present disclosure. FIG. 5(b) is a top view of the optical module according to the fourth embodiment of the present disclosure.

(6) FIG. 6(a) is a cross-sectional view of an optical module according to a fifth embodiment of the present disclosure. FIG. 6(b) is a top view of the optical module according to the fifth embodiment of the present disclosure.

(7) FIG. 7(a) is a cross-sectional view of an optical module according to a sixth embodiment of the present disclosure. FIG. 7(b) is a top view of the optical module according to the sixth embodiment of the present disclosure.

(8) FIG. 8(a) is a cross-sectional view of an optical module according to a seventh embodiment of the present disclosure. FIG. 8(b) is a top view of the optical module according to the seventh embodiment of the present disclosure.

DESCRIPTION OF EMBODIMENTS

(9) Embodiments of the present disclosure will be described below in detail with reference to the drawings. Note that, in the drawings, components with the same function are denoted with the same reference signs for the sake of clear description. However, it is obvious to those skilled in the art that the present disclosure is not limited to the description of the embodiments described below, and the mode and the detail thereof can be changed in various ways without departing from the spirit of the disclosure disclosed in this specification and the like. Furthermore, the configurations according to different embodiments can be combined as appropriate to be implemented.

First Embodiment

(10) FIGS. 2(a) and 2(b) are a cross-sectional view and a top view illustrating a configuration of an optical module according to a first embodiment of the present disclosure.

(11) As illustrated in FIGS. 2(a) and 2(b), an optical module 300 according to the present embodiment includes: an optical device 100 to which N (N is a positive integer) optical fibers are optically connected; and a carrier 400 including a carrier substrate 401 and an adhesive layer 402 formed at a surface of the carrier substrate. A part of the optical device 100 and a part of the N optical fibers 200 are adhesively fixed to a surface of the adhesive layer 402. Note that an optical fiber block 101 may be used to optically couple the optical device 100 and the optical fibers 200 to each other.

(12) In the present embodiment, an example is illustrated in which the optical device 100 and the optical fibers 200 are optically coupled using the optical fiber block 101. However, other optical coupling mode such as lens coupling may also be employed. In the configuration of the present embodiment, the optical device 100 and the optical fibers 200 are disposed on the same plane, but the adhesive layer may also be provided on top of the carrier to have a portion of the optical fibers fixed to a surface opposite to the optical device 100. In FIG. 2(a), three optical fibers 200 are illustrated, but the number N of optical fibers may be any positive integer.

(13) A high heat resistant special glass epoxy material, aluminum, or the like can be used as the carrier substrate 401 of the carrier 400, for example. Furthermore, the adhesive layer 402 may be formed by directly applying resin at the carrier substrate 401, or may be formed by attaching a sheet-like adhesive layer to the carrier substrate 401.

(14) In the configuration according to the present embodiment, the optical device 100 and the optical fibers 200 are adhesively fixed to the carrier 400. Thus, the optical module 300 of the present embodiment can be sucked, conveyed, and mounted on another substrate as in a case with related-art electronic devices without the optical fibers 200. It is clear from the top view of FIG. 2(b).

Second Embodiment

(15) FIGS. 3(a) and 3(b) are a cross-sectional view and a top view illustrating a configuration of an optical module according to a second embodiment of the present disclosure.

(16) As illustrated in FIGS. 3(a) and 3(b), the optical module 300 according to the embodiment of the present disclosure has a configuration obtained by providing ball grid array shaped electrodes (BGA electrodes) 102 on the optical device 100 in the configuration according to the first embodiment.

(17) The BGA electrodes 102 are supposed to be mounted on another substrate or the like by a reflow process. The amount of deformation of the optical fibers 200 due to thermal stress during the reflow heating is limited because the optical fibers 200 are adhesively fixed on the adhesive layer 402. Thus, with the configuration of the present embodiment, the amount of movement of the optical device 100 from a predetermined position during reflow heating can be reduced.

Third Embodiment

(18) FIGS. 4(a) and 4(b) are a cross-sectional view and a top view illustrating a configuration of an optical module according to a third embodiment of the present disclosure.

(19) As illustrated in FIGS. 4(a) and 4(b), the optical module 300 according to the third embodiment of the present disclosure has a design in which the carrier 400 and the optical device 100 are partially overlaps each other in the configuration according to the second embodiment, so that a part of the optical device 100 can be confirmed from above the carrier 400.

(20) The mounting positioning of the optical device 100 with the BGA electrodes 102 needs to be performed accurately using image recognition techniques. This is because, for example, the ball spacing of the BGA electrodes need to be set to a narrow pitch such as, for example, approximately 500 μm or less, to meet the demand for the downsizing and high-density integration of the optical device 100. However, with the configuration of the second embodiment, the accurate positioning of the optical device 100 is difficult because the position of the optical device cannot be confirmed from top view direction. With the present configuration, at least a part of the optical device 100 can be confirmed from top view direction, so that the optical device having the BGA electrodes formed at a narrow pitch can be mounted at a precise position.

(21) The configuration of the present embodiment enables the upper part of the optical device 100 to be confirmed. Alternatively, a configuration enabling a part of the optical device 100 to be confirmed through a hole opened in the carrier 400 may be employed for example.

Fourth Embodiment

(22) FIGS. 5(a) and 5(b) are a cross-sectional view and a top view illustrating a configuration of an optical module according to a fourth embodiment of the present disclosure.

(23) As illustrated in FIGS. 5(a) and 5(b), the optical module 300 according to the fourth embodiment of the present disclosure has a configuration obtained by providing, with a plurality of holes, the carrier substrate 401 and the adhesive layer 402 of the carrier 400 in the configuration of the third embodiment.

(24) With the configuration of the present embodiment, the weight of the carrier 400 can be reduced. Thus, in a suction conveyance process for mounting the optical module 300, the optical module 300 can be held with a stronger suction force to prevent the optical module 300 from falling off.

(25) Although FIGS. 5(a) and 5(b), illustrate a case of circular holes, the shape of the holes may be any shape. For example, mesh-like holes may be opened.

Fifth Embodiment

(26) FIGS. 6(a) and 6(b) are a cross-sectional view and a top view illustrating a configuration of an optical module according to a fifth embodiment of the present disclosure.

(27) As illustrated in FIGS. 6(a) and 6(b), the optical module 300 according to the fifth embodiment of the present disclosure has a configuration obtained by providing, with a plurality of holes, only the carrier substrate 401 of the carrier 400 in the configuration of the third embodiment.

(28) In the configuration of the present embodiment, a process of removing the carrier 400 from the optical device 100 and the optical fibers 200 after the reflow process can be simplified, while reducing the weight of the carrier 400. Specifically, the carrier 400 is removed while pressing the adhesive layer 402 in holes 404a formed above the optical device 100 among holes 404 formed in the carrier substrate 401, toward the optical device 100 side. As a result, the adhesive layer in the holes 404a is stretched, whereby the optical device is peeled off. Thereby, the carrier 400 can be held and the carrier 400 can be easily removed.

(29) Note that in the present embodiment, the adhesive layer 402 is formed by attaching an adhesive film to the substrate.

Sixth Embodiment

(30) FIGS. 7(a) and 7(b) are a cross-sectional view and a top view illustrating a configuration of an optical module according to a sixth embodiment of the present disclosure.

(31) As illustrated in FIGS. 7(a) and 7(b), the optical module 300 according to the sixth embodiment of the present disclosure is obtained with a carrier peeling film 500 provided between the carrier 400 and the optical device 100 and between the carrier 400 and the optical fibers 200, in the configuration of the third embodiment.

(32) This configuration can simplify a process for removing the carrier 400 after the optical module 300 is mounted, using a method different from that described in the fifth embodiment. Specifically, in removing the carrier 400, the carrier 400 can be easily peeled off by pulling up a portion 500a of the film that can be confirmed from top view direction.

(33) In the example of the present embodiment, the portion of the film that does not overlap with the carrier 400 (the portion 500a) can be confirmed from above the carrier. Furthermore, at a plurality of locations, the portion of the film may also be confirmed from above the carrier. Furthermore, the shape of the film 500 may not be rectangular, and may be designed to achieve a good balance between the removability and the adhesiveness.

Seventh Embodiment

(34) FIGS. 8(a) and 8(b) are a cross-sectional view and a top view illustrating a configuration of an optical module according to a seventh embodiment of the present disclosure.

(35) As illustrated in FIGS. 8(a) and 8(b), the optical module 300 according to the seventh embodiment of the present disclosure, a peeling prevention (falling prevention) member 501 is provided on a surface of the optical fibers 200 not in contact with the adhesive layer 402, in the configuration described in the sixth embodiment. This member can prevent the optical fibers from peeling off from the adhesive layer to disable suction conveyance during the mounting.

(36) In the present embodiment, a film is used as the peeling prevention member. However, the effect described above can be obtained with a plate-shaped or strip-shaped member similarly attached instead of the film. The plate-shaped or strip-shaped member may be a material that can withstand the heating process or the reflow process. Preferably, a member similar to the carrier substrate is used. Examples of such a member include high heat resistant special glass epoxy material, aluminum, and the like.

INDUSTRIAL APPLICABILITY

(37) The present disclosure can be applied to a component for optical communication, and more specifically, can be applied to an optical module that can be reflowed having a carrier on which an optical device and optical fibers are adhesively fixed, so that suction conveyance and mounting can be performed using a mounter and the like.

REFERENCE SIGNS LIST

(38) 100 Optical device 101 Optical fiber block 102 BGA electrodes 200 Optical fibers 300 Optical module 400 Carrier 401 Carrier substrate 402 Adhesive layer 403 Hole 404 Hole 404a Hole 500 Film 500a Portion of film 501 Peeling prevention (falling prevention) member