Heat Shrink Component And Method Of Assembling A Heat Shrink Component

Abstract

A heat shrink component includes a heat shrink layer and a heating unit in thermal contact with at least a part of the heat shrink layer and heating the heat shrink layer to a heat shrink temperature. The heating unit includes an electrically conductive lead formed of copper and/or aluminum and having an electrical conductivity of more than 3.Math.10.sup.7 S/m. The heat shrink component has a first dimension in an expanded state and a second dimension in a shrunk state after heating. The first dimension is larger than the second dimension.

Claims

1. A heat shrink component, comprising: a heat shrink layer; and a heating unit in thermal contact with at least a part of the heat shrink layer and heating the heat shrink layer to a heat shrink temperature, the heating unit including an electrically conductive lead formed of copper and/or aluminum and having an electrical conductivity of more than 3.Math.10.sup.7 S/m, the heat shrink component having a first dimension in an expanded state and a second dimension in a shrunk state after heating, the first dimension is larger than the second dimension.

2. The heat shrink component of claim 1, wherein the heating unit includes a plurality of heating elements interconnected by the electrically conductive lead.

3. The heat shrink component of claim 2, wherein at least one of the heating elements is a semiconductor heating element.

4. The heat shrink component of claim 1, wherein the heat shrink layer is formed at least partly as a sleeve with a longitudinal axis, the sleeve covering at least a part of an electrical connection and/or a part of a termination.

5. The heat shrink component of claim 4, wherein the heating unit at least partially encompasses the sleeve.

6. The heat shrink component of claim 4, wherein the electrically conductive lead is a plurality of ring-shaped wires arranged around the longitudinal axis of the sleeve.

7. The heat shrink component of claim 4, wherein the electrically conductive lead is wound in a helical configuration around the heat shrink layer.

8. The heat shrink component of claim 4, wherein the electrically conductive lead has a plurality of interconnected elongated wire sections extending along the longitudinal axis and distributed around a circumference of the sleeve.

9. The heat shrink component of claim 1, wherein the electrically conductive lead is a metal wire having a cross-section with a round, an oval, or a polygonal shape.

10. The heat shrink component of claim 1, wherein the electrically conductive lead is an electrically conductive film.

11. The heat shrink component of claim 1, wherein the electrically conductive lead includes copper and has an electrical conductivity greater than 4.Math.10.sup.7 S/m.

12. The heat shrink component of claim 1, wherein the electrically conductive lead includes a plurality of sections that are electrically connected in series and/or in parallel.

13. A method of assembling a heat shrink component, comprising: providing a heat shrink component in an expanded state, the heat shrink component including a heat shrink layer and a heating unit in thermal contact with at least a part of the heat shrink layer, the heating unit including an electrically conductive lead formed of copper and/or aluminum and having an electrical conductivity of more than 3.Math.10.sup.7 S/m; connecting an electrical power source to the heating unit; and heating the heat shrink layer to a heat shrink temperature with the heating unit, the heat shrink component shrinking from a first dimension in the expanded state to a second dimension in a shrunk state, the first dimension is larger than the second dimension.

14. The method of claim 13, wherein the electrical power source provides a DC voltage that is below 60 V or an AC voltage of 25 V RMS.

15. The method of claim 13, wherein the heat shrink component is a low voltage, a medium voltage, or a high voltage cable accessory.

16. The method of claim 13, wherein, in the heating step, a part of the heat shrink component is heated to a temperature of at least 120 C. for a heating time of 20 minutes or less.

17. The method of claim 13, wherein the electrically conductive lead includes copper and has an electrical conductivity greater than 4.Math.10.sup.7 S/m.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The invention will now be described by way of example with reference to the accompanying Figures, of which:

[0014] FIG. 1 is a schematic diagram of a heat shrinking process of a heat shrinkable joint sleeve;

[0015] FIG. 2 is a schematic diagram of a heating unit according to an embodiment;

[0016] FIG. 3 is a schematic diagram of a heating unit according to another embodiment;

[0017] FIG. 4 is a schematic diagram of a heating unit according to another embodiment;

[0018] FIG. 5 is a schematic diagram of a heating unit according to another embodiment;

[0019] FIG. 6 is a sectional end view of a plurality of electrically conductive leads;

[0020] FIG. 7 is a sectional end view of a plurality of electrically conductive leads; and

[0021] FIG. 8 is a schematic diagram of a heating unit according to another embodiment.

DETAILED DESCRIPTION OF THE EMBODIMENT(S)

[0022] Exemplary embodiments of the present disclosure will be described hereinafter in detail with reference to the attached drawings, wherein like reference numerals refer to like elements. The present disclosure may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein; rather, these embodiments are provided so that the present disclosure will convey the concept of the disclosure to those skilled in the art. Furthermore, several aspects of the embodiments may formindividually or in different combinationssolutions according to the present invention. The following described embodiments thus can be considered either alone or in an arbitrary combination thereof.

[0023] The term high-voltage as used in the following is intended to relate to voltages above approximately 1 kV. In particular, the term high-voltage is intended to comprise the usual nominal voltage ranges of power transmission, namely medium voltage, MV, (about 3 kV to about 72 kV), high-voltage, HV, (about 72 kV to about 245 kV), and also extra high-voltage (up to presently about 500 kV). Of course also higher voltages may be considered in the future. These voltages may be direct current (DC) or alternating current (AC) voltages. In the following, the term high-voltage cable is intended to signify a cable that is suitable for carrying electric current of more than about 1 A at a voltage above approximately 1 kV. Accordingly, the term high-voltage accessory is intended to signify a device that is suitable for interconnecting high-voltage facilities and/or high-voltage cables. In particular, a high-voltage accessory may either be an end termination or a cable joint. The present invention is also applicable to the so-called low-voltage, LV, range that relates to voltages below 1 kV. The principles of the present invention may further be applied to heat shrink products used for electronic applications.

[0024] A heat shrinking process of heat shrinkable joint sleeve 100A, 100B is shown in FIG. 1. The heat shrink sleeve is in the expanded state 100A where it has first dimensions. The heat shrink sleeve in the expanded state 100A has an inner diameter 102A which is larger than the outer diameter of a component to be covered and a wall thickness 104A that is thinner than in the finally mounted state. By applying heat, the heat shrink sleeve is transformed from the expanded state 100A into a heat shrink sleeve in the shrunk state 100B (indicated by the arrow). In order to be shrunk under the influence of heat, the sleeve 100 has a heat shrink layer heat.

[0025] A heat-recoverable article (an independently dimensionally heat-unstable article) is used as the heat shrink layer 108. In various embodiments, the heat shrink layer 108 can be fabricated from any suitable material. In other embodiments, the multilayer arrangements additionally comprise elastic layers. Heat shrink layers 108 and/or elastic layers may comprise electrically insulating and/or electrically semi-conductive and/or conductive layers or components.

[0026] As shown in FIG. 1, the shrunk sleeve 100B has an inner diameter 102B that fits tightly over the covered component and a larger wall thickness 104B as compared to the expanded state 100A. The heat shrink process leads to a reduction of diameter 102B of up to 75% of the diameter 102A in the expanded state 100A. The principles according to the present invention can be applied to straight tube shaped sleeves 100 as well as to differently shaped covers for branch joints, elbows, bends, and the like. The component onto which the sleeve 100 is shrunk may be cylindrical or it may have regions with a cross-section that is polygonal and/or that is varying along the longitudinal axis of the component.

[0027] The heat shrinking step is performed by applying electrical energy via electrically conductive leads 106 with an electrical conductivity of more than 3.Math.10.sup.7 S/m which comprise copper and/or aluminum. In an embodiment, the electrically conductive lead 106 comprises copper and has an electrical conductivity greater than 4.Math.10.sup.7 S/m.

[0028] FIGS. 2-5 illustrate examples of how the electrically conductive leads 106 that form a heating unit 120 can be arranged on a heat shrink product. The leads 106 may be positioned with direct contact to a heat shrink layer or may be positioned on a layer of non-shrink material, such as an elastomeric layer or a thermoplastic layer. Terminals are led to the outside for connecting a power source, such as a battery supplying a DC voltage of, for example, 24 V. In an embodiment, the power source provides a DC voltage below 60 V or an AC voltage of 25 V root mean squared (RMS).

[0029] A length of the electrically conductive lead 106 is determined by a diameter and a resistance value that is to be reached and amounts to around 1 to 15 m when choosing a diameter in a range of 0.1 mm to 0.4 mm. The resulting overall resistance of such heating units 120 may for instance be in a range of 0.3 to 6.0 at 23 C.

[0030] In the embodiment shown in FIG. 2, a plurality of elongated wire sections 112 are arranged in parallel to a longitudinal axis 110 of the heat shrink sleeve 100. The individual wire sections 112 may be serially interconnected in the fashion of a meandering structure to form one continuous electrical lead 106. Additionally, some of the longitudinal sections 112 may be interconnected to form an elongated closed loop, a plurality of those loops being interconnected in parallel. The sections 112 may either be arranged on an outer surface or on an inner surface of the heat shrink sleeve 100. The sections 112 may also be covered by further layers. The sections 112 may also be arranged in different planes with respect to the center line 110.

[0031] Arranging the wire sections 112 in parallel to the longitudinal axis 110 of the heat shrink sleeve 100 is also advantageous from an electro-physical point of view because undesired coil structures can be avoided. If necessary, the loops of wire interconnecting the wire sections 112 for providing a closed path for the current may be arranged at the periphery of the sleeve 100 in a way that they can be cut off after the shrinking process is completed, leaving in place only the longitudinal wire sections.

[0032] The embodiment shown in FIG. 2 having the longitudinal wire sections 112 has the advantage that, upon shrinking of the heat shrink layer 108, the wire sections 112 become arranged closer to each other, but are not significantly deformed or dislocated. If the covered component has a polygonal cross-section and/or has dimensions that vary along the longitudinal axis, the wire sections 112 conform to this outer silhouette to some extent. Still, no sharp edges or disruptions during the heat shrinking process can occur. This means that separations or areas of increased resistance due to strong deformation of the wires are less likely.

[0033] In an embodiment shown in FIG. 3, a plurality of ring-shaped wires 114 are arranged on the sleeve 100 to form the electrically conductive lead 106. These ring-shaped wires 114 are arranged equidistantly along the longitudinal axis 110 and are essentially perpendicular to the longitudinal axis 110. In other embodiments, the ring-shaped wires 114 can also be arranged with varying distances between each other. Moreover, when using an elliptical shape instead of a circular geometry, the rings 114 can also be arranged to include an angle other than 90 with the longitudinal axis 110. The rings 114 may electrically be connected in series and/or in parallel. For a serial connection, the rings 114 may not be entirely closed around the circumference of the heat shrink sleeve 100.

[0034] In an embodiment shown in FIG. 4, one continuous electrically conductive lead 106 is wound in a helical configuration around the heat shrink layer 108. This configuration is particularly easy to assemble.

[0035] The above-described arrangements according to FIGS. 2-4 can also be combined with each other as is exemplarily depicted in FIG. 5. In the embodiment of FIG. 5, one layer of longitudinal sections 112 is combined with one layer of ring-shaped wires 114, wherein it is arbitrary which layer is the top layer and which one the bottom layer. In another embodiment, more than two layers can be combined to form a heating unit. Electrically, these layers may either be connected in parallel or serially. Advantageously, the wires 112, 114 in the different layers are to be electrically insulated against wires 112, 114 of another layer. This may be achieved by using wires 112, 114 that are individually covered with an electrical insulation and/or by arranging an insulating material between adjacent layers of wire 112, 114.

[0036] Several examples of electrically conductive leads 106 are shown in FIG. 6. An electrical resistance suitable for generating temperatures around 120 C. and up to 450 C. from safety voltages (e. g. 24 V DC) can also be realized with a highly conductive material when reducing the cross-sectional area and/or enhancing the length accordingly. The cross-section of the wires 106 may be circular (electrically conductive lead 106A), elliptic (electrically conductive lead 106B), or polygonal (electrically conductive lead 106C). Furthermore, the electrically conductive lead may also be formed by a thin film 116. It should be noted that the drawings are not exactly to scale throughout the Figures; in particular, the thickness of the electrically conductive film 116 is exaggerated.

[0037] The electrically conductive film 116 shown in FIG. 6 may, for instance, be formed from a metallization layer that is etched by a photolithography process. Alternatively, also screen printing or other printing techniques can be used for depositing the electrically conductive film 116 on the heat shrink layer, or on an additional layer, i. e. a thermoplastic film.

[0038] The electrical resistance of the electrically conductive lead 106 will now be described in greater detail with reference to FIG. 7. FIG. 7 shows arrangements that have the same electrical resistance, leading to the same heating effect when powered with the same voltage. In particular, the cross section of a standard resistance heating wire 118 is compared to a copper wire 106 or an electrically conductive copper film 116. When assuming that the copper wire 106A and the electrically conductive film 116 have only 1% of the specific resistance of the resistance wire 118, they need to have a cross sectional area of only 1% of the cross-sectional area of the resistance wire 118 in order to provide the same overall resistance for a piece of lead having the same length. Alternatively, a copper wire 106A having 20% of the cross-sectional area of the resistance wire 118 has the same resistance as the resistance wire 118, if the copper wire 106A has 5 times the length of the resistance wire 118.

[0039] Due to economic and reliability considerations, the number and diameter of the heating wires 106 needs to be within certain limits. If the wires 106 have very small diameters, their numbers and/or length need to be reduced. Otherwise, the resistance increases too much and voltages of 24 V or below cannot generate a sufficiently high current to heat up the wires 106 to temperatures of at least 110 C. On the other hand, if the wires 106 have too large cross-sections, their resistance may become too low. Then the length has to be increased, in order to increase the resistance. Otherwise, the wires 106 would not be heated up sufficiently. Thereby costs are increased. A further option is to use (at least in particular areas of the heat shrink component) two or more electrical circuits of heating wires which are connected in parallel. The electrical current then splits up according to the relative resistance of the circuits. This allows choosing wires 106 with smaller cross-sections, while achieving the same resulting resistance as with a larger size wire. In other words, two wires are connected in parallel and have each half of the cross-section compared to a benchmark wire. This principle, however, gets to some limits regarding economic considerations, such as the cost of fine wires relative to standard wires, and regarding reliability issues, because handling of extremely fine wires with diameters of less than 100 m is cumbersome.

[0040] In addition to only using the electrically conductive lead 106 as the heating unit 120, additional heating elements 122 can also be provided, as shown in FIG. 8. In an embodiment, the electrically conductive lead 106 generates only negligible amounts of heat. The main part of the heat is generated by the additional heating elements 122. The heating elements 122 may for instance be formed from semiconductor heating elements. The electrically conductive leads 106 that are interconnecting the heating elements 122 may either be formed as sections of wire, or by film-shaped electrically conductive leads. Any of the diameters explained with reference to FIG. 6 can be employed. In an embodiment, the semiconductor heating elements 122 may have a positive temperature coefficient (PTC) so that an inherent overheating protection is provided.

[0041] In an embodiment, sensors may be added to the heat shrink component. These sensors can be configured to monitor and/or drive the heating and shrinking process and give feedback for instance to the cable jointer and/or the electric drive system e. g. whether the installation has been finished successfully. In particular, when realizing the heating unit 120 as a thin film arrangement 116, the sensors and the heating unit 120 can be formed on a common flexible substrate that is attached to the sleeve.

[0042] The embodiments of the present invention are capable of shrinking widely used energy products, like LV, MV, and even HV joint bodies, terminations, sleeves (such as rejacketing sleeves), and molded parts (such as break out boots and caps) without using an open flame and instead using electrical energy. Because the application typically is a field installation, the power source beneficially uses batteries, either available in the van of the cable jointer staff or to be carried to the place of installation. Alternatively, a generator, either available in the van or transportable over limited distances, can be used. For safety reasons, the voltage can be limited to values in the magnitude of 20 V, at maximum 24 V. In order to be compatible with installation times that are reached using open flames, the shrink times of a typical MV joint body should not exceed a maximum of 10 minutes.

[0043] The present invention can be employed with the following exemplary specific dimensions and characteristics.

[0044] In contrast to conventional resistance wires, the conductivity of the wires 106 is at least 3.Math.10.sup.7 S/m. The power source provides a voltage that is a DC voltage below 60 V or an AC voltage of 25 V RMS.

[0045] A cross-sectional area of the heating conductor 106 is between 0.007 mm.sup.2 and 0.8 mm.sup.2, equaling to wires 106 of 0.1 to 1.0 mm diameter. Conductive films 116 must have according dimensions, typically these films have thicknesses in the range of 5 m to 25 m. The temperature of the conductor during the heating is at least 120 C., max. 450 C., for a heating time of 20 minutes or less. The value of 120 C. is a typical shrink temperature for heat shrink products. There are variants that shrink at 110 C. and a very special material which is not used on energy products starts to shrink at 65 C. Given temperature losses to the environment, the temperature of the conductors must be far above 120 C.

[0046] The above parameters define a broad working space. Depending on the geometry of the heat shrink product and the conductors 106, the heating system can be defined for instance according to the following examples.

[0047] A typical MV joint body has a wall thickness of 3.5 mm of the heat shrink layer (plus elastomeric layer), a length of 420 mm and an outer diameter of 68 mm (surface area is 9 dm.sup.2). In successful trials six heating units 120 with 3.3 meter of wire each (diameter 0.22 mm) were used. With a power source providing 24 V, these six heating units 120 were connected in parallel and heated up to 200 C. to 350 C. temperature of the wires 106. The shrink time was 10 min, using thermal insulation and heat spreading.

[0048] If the wire 106 diameters are chosen smaller, then each heating unit 120 must have less meters of wire 106. Accordingly, more than six heating units 120 are to be configured to allow a 24 V power source to heat up the heat shrink component to the required temperatures. In an embodiment, a circumferential distance between heating wires 106 may be below 50 mm, such as below 20 mm, in the non-recovered condition, reducing any issues with distributing the heating energy.

[0049] If another heat shrink product has less surface area, then a lower number of heating units 120 (thus less meters of wire) are needed.

[0050] If another heat shrink product has a lower wall thickness, then a comparably lower number of heating systems and less meters of wire are needed. The dependency on the wall thickness does not seem linear. It appears that even a stack of multiple heat shrink sleeves resulting in 10 mm total wall thickness can be heated with about the same settings as the typical MV joint body having a wall thickness of 3.5 mm. There is, of course, a dependency on the overall shrink behavior of the particular heat shrink material. By adapting the composition of the heat shrink material, the shrink temperature and the ease of shrinking can be varied.