Contact Temperature Sensor

Abstract

A contact temperature sensor is disclosed. In an embodiment a contact temperature sensor includes a contact body including a bottom wall configured to apply the contact temperature sensor on a test body and a carrier ceramics configured to thermally directly couple the contact temperature sensor to the test body, wherein the carrier ceramics is arranged on a side of the bottom wall facing the test body, and wherein the carrier ceramics includes a metallization on a side facing the test body. The contact temperature sensor further includes a temperature sensor element thermally coupled to the carrier ceramics.

Claims

1-11. (canceled)

12. A contact temperature sensor comprising: a contact body comprising: a bottom wall configured to apply the contact temperature sensor on a test body; and a carrier ceramics configured to thermally directly couple the contact temperature sensor to the test body, wherein the carrier ceramics is arranged on a side of the bottom wall facing the test body, and wherein the carrier ceramics comprises a metallization on a side facing the test body; and a temperature sensor element thermally coupled to the carrier ceramics.

13. The contact temperature sensor according to claim 12, wherein the carrier ceramics comprises a metallization on a side facing away from the test body.

14. The contact temperature sensor according to claim 13, wherein the carrier ceramics comprises a structured metallization on the side facing away from the test body.

15. The contact temperature sensor according to claim 12, wherein the carrier ceramics comprises a metallization over the entire surface on the side facing the test body.

16. The contact temperature sensor according to claim 15, wherein the carrier ceramics comprises a structured metallization on a side facing away from the test body.

17. The contact temperature sensor according to claim 12, wherein the carrier ceramics comprises silicon nitride.

18. The contact temperature sensor according to claim 12, wherein the carrier ceramics consists essentially of silicon nitride.

19. The contact temperature sensor according to claim 12, wherein the temperature sensor element includes an NTC thermistor.

20. The contact temperature sensor according to claim 12, wherein the temperature sensor element is coupled to the carrier ceramics via a positive substance-to-substance bond.

21. The contact temperature sensor according to claim 12, wherein the contact temperature sensor comprises at least one contact for electrical coupling with an evaluation means, and wherein the temperature sensor element and/or the carrier ceramics comprises an electrically-conductive connection wire coupled to the at least one contact, the electrically-conductive connection wire comprising a plating.

22. The contact temperature sensor according to claim 21, wherein the electrically-conducting connection wire comprises a conductor comprising an iron-nickel-alloy, and a copper plating located on the conductor.

23. The contact temperature sensor according to claim 12, wherein the metallization on the side of the carrier ceramics facing away from the test body, and/or the temperature sensor element is connected to an electrically-conductive connection wire via a positive substance-to-substance bond.

24. The contact temperature sensor according to claim 12, wherein the carrier ceramics and the temperature sensor element comprise a common potting.

25. A contact temperature sensor comprising: a contact body comprising: a bottom wall configured to apply the contact temperature sensor on a test body; and a carrier ceramics configured to thermally directly couple the contact temperature sensor to the test body, wherein the contact temperature sensor is arranged on a side of the bottom wall facing the test body, and wherein the carrier ceramics comprises a metallization on a side facing the test body; and a temperature sensor element thermally coupled to the carrier ceramics.

26. The contact temperature sensor according to claim 25, wherein the carrier ceramics comprises a metallization over the entire surface on the side facing the test body.

27. The contact temperature sensor according to claim 26, wherein the carrier ceramics comprises a structured metallization on a side facing away from the test body.

28. The contact temperature sensor according to claim 27, wherein the metallization on the side of the carrier ceramics facing away from the test body, and/or the temperature sensor element is connected to an electrically-conductive connection wire via a positive substance-to-substance bond.

29. The contact temperature sensor according to claim 26, wherein the temperature sensor element is coupled to the carrier ceramics via a positive substance-to-substance bond.

30. The contact temperature sensor according to claim 26, wherein the contact temperature sensor comprises at least one contact for electrical coupling with an evaluation means, and wherein the temperature sensor element and/or the carrier ceramics comprises an electrically-conductive connection wire coupled to the at least one contact, the electrically-conductive connection wire comprising a plating.

31. The contact temperature sensor according to claim 30, wherein the electrically-conducting connection wire comprises a conductor comprising an iron-nickel-alloy, and a copper plating located on the conductor.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In the following, exemplary embodiments of the invention are explained with reference to the schematic drawings.

[0019] FIG. 1 shows a sectional view of an exemplary embodiment of a contact temperature sensor;

[0020] FIG. 2 shows a first sectional view of an exemplary embodiment of a contact body of the contact temperature sensor; and

[0021] FIG. 3 shows a second sectional view of the exemplary embodiment of the contact body.

[0022] Elements of identical construction or function are denoted by the same reference characters throughout the Figures.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

[0023] FIG. 1 shows a sectional view of an exemplary embodiment of a contact temperature sensor 1. The contact temperature sensor 1 comprises a contact body 3 and, for example, a tension clamp 5. One end of the tension clamp 5 is mechanically coupled with the contact body 3, for example. The tension clamp 5 is arranged and configured to press the contact body 3 on to a test body 7, and to fix the contact body 3 to the test body 7. Alternatively, the contact temperature sensor 1 can comprise a fastener strap which is attached to the contact body 3 with both ends, respectively. A length of the fastener strap advantageously is adjustable.

[0024] In the exemplary embodiment shown, the contact temperature sensor 1 is mounted on a test body 7 in the form of a pipe 9. Inside the pipe, 9, a fluid (not shown here), e.g., a coolant, can be present in a manner to be flowing or at rest. The fluid can comprise a gas and/or a liquid. The contact temperature sensor 1 includes a temperature sensor element 30, which is in thermal contact with the pipe 9. The contact body 3 comprises a plug housing 13. A contact pin 15 for the electric coupling with an evaluation means is arranged inside the plug housing 13, which pin is connected with the temperature sensor element 30 via conducting connections.

[0025] FIG. 2 shows a first sectional view of an exemplary embodiment of the contact body 3 in detail. The contact body 3 comprises a bottom wall 31 for applying the contact temperature sensor 1 on the test body 7.

[0026] The contact body 3 includes a carrier ceramics 33 for the direct thermal coupling of the test body 7 with the contact temperature sensor 1. The carrier ceramics 33 is arranged on a side of the bottom wall 31 facing the test body 7.

[0027] The contact body 3 comprises a hollow space 35 with an opening, for example. The opening is arranged in the bottom wall 31 of the contact body 3 and is at least in part covered or closed by the carrier ceramics 33.

[0028] For example, a holding element 36 is at least in part arranged in the hollow space 35. The holding element 36 is arranged and configured to hold the temperature sensor element 30 and the carrier ceramics 33.

[0029] The holding element 36 is forming as a holding bracket, for example. The holding element 36 is held in the hollow space 35 of the contact body 3 by means of a clamping connection, for example. An inner wall of the hollow space 35 comprises latch hooks 37, for example, on which bracket limbs 38 of the holding brackets are supported.

[0030] The carrier ceramics 33 is coupled with the holding element 36 in a mechanic manner, for example.

[0031] The carrier ceramics 33 preferably comprises silicon nitride, or consists of silicon nitride. Silicon nitride has a high breaking strength. It is alternatively possible that the carrier ceramics 33 includes an alternative or further ceramics material, for example alumina. In other words, the ceramics material can be selected dependent upon the requirements in terms of breaking strength, thermal conductivity and/or processability.

[0032] For the efficient take-up of the thermal energy of the test body 7, the carrier ceramics 33 preferably comprises a metallization over the entire surface, on the side facing the test body 7.

[0033] On a side of the carrier ceramics facing away from the test body 7, a temperature sensor element 30 is arranged, which is thermally coupled with the carrier ceramics 33.

[0034] The temperature sensor element 30 is preferably thermally and mechanically directly coupled with the carrier ceramics 33. The carrier ceramics 33 comprises a metallization of the side facing away from the test body 7, preferably a structured metallization. The metallization can include silver or copper, or consists of silver or copper.

[0035] The temperature sensor element 30 is coupled with the carrier ceramics 33 via a positive substance-to-substance bond. The positive substance-to-substance bond can include a soldered connection. Alternatively, the positive substance-to-substance bond can be produced by means of a common sintering of the carrier ceramics 33 with the temperature sensor element 30. The temperature sensor element 30 preferably also comprises a ceramic material in this case. Sintering can occur in non-pressurized or pressurized manner.

[0036] The temperature sensor element 30 preferably includes an NTC thermistor, also called NTC (Negative Temperature Coefficient) resistor.

[0037] The contact temperature sensor 1 includes at least one contact for the electric coupling with an evaluation means. The temperature sensor element 30 and/or the carrier ceramics 33 are respectively coupled and/or directly connected to the at least one electric contact via an electrically-conducting connection wire 39.

[0038] The connection wire 39 preferably comprises a plating. The respective electrically-conducting connection wire 39 comprises a conductor that includes an iron nickel alloy, for example. A copper plating is applied on to the conductor, for example.

[0039] The metallization on the side of the carrier ceramics 33 facing away from the test body, and/or the temperature sensor element 30 is preferably connected to the respective electrically-conducting connection wire 39 via a positive substance-to-substance bond.

[0040] The carrier ceramics 33 and the temperature sensor element 30 preferably comprise a common potting 41. The potting 41 is applied on to the carrier ceramics 33 essentially on the side facing away from the test body 7 in such a way that the temperature sensor element 30 and the carrier ceramics 33 are covered with the potting 31 on the side facing away from the test body 7 where they are not covered by a plastic material of the holding element 36 and/or of the contact body 3.

[0041] The potting 41 is preferably configured and arranged in such a way that no moisture can enter into the temperature sensor element 30, and the carrier ceramics 33 is supported substantially over the entire surface, or over the entire surface, on the side of the carrier ceramics 33 facing away from the test body. In this way, a bending or breaking of the carrier ceramics 33 and/or of the temperature sensor element 30 can be largely prevented, and a reliability of the contact temperature sensor 1 is increased.

[0042] The direct thermal or mechanical coupling of the carrier ceramics 33 with the test body 7 provides the advantage that a response time can be substantially shortened. Heat transfer locations can be reduced, and required or desired response periods of the contact temperature sensor 1 can be realized dependent upon respective dimensions, in particular in terms of a thickness of the carrier ceramics 33.

[0043] FIG. 3 shows a second sectional view of the exemplary embodiment of the contact body 3.

[0044] The invention is not limited to the exemplary embodiments due the description by means of the exemplary embodiments. The invention rather comprises any new feature as well as any combination of features, which in particular includes any combination of features in the claims, even though this feature or this combination of features is per se not explicitly indicated in the claims or in the exemplary embodiments.