Systems and Methods of Automated Film Removal
20200148491 ยท 2020-05-14
Inventors
- Wendy Wenling Lin (Montgomery, OH, US)
- Alexander Joseph Vallee (Loveland, OH, US)
- Derek Black (Austin, TX, US)
- Stephen Grupinski (Austin, TX, US)
- Damain Hendrix (Austin, TX, US)
- Nathan Woodward (Austin, TX, US)
Cpc classification
B25J15/0666
PERFORMING OPERATIONS; TRANSPORTING
Y10T156/1944
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
B65H3/0816
PERFORMING OPERATIONS; TRANSPORTING
B65H3/14
PERFORMING OPERATIONS; TRANSPORTING
B65H3/0883
PERFORMING OPERATIONS; TRANSPORTING
B25J15/0071
PERFORMING OPERATIONS; TRANSPORTING
B32B38/10
PERFORMING OPERATIONS; TRANSPORTING
B29C70/54
PERFORMING OPERATIONS; TRANSPORTING
Y10T156/1132
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10T156/1983
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10T156/1184
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
B65H3/22
PERFORMING OPERATIONS; TRANSPORTING
International classification
Abstract
A system and method for separating a layer from a layer assembly when the layer assembly includes a backing layer and a material layer. The system includes an automated machine having a controller and an end effector. A separating tool is attached to the end effector of the automated machine. The separating tool includes a displacing member, with an outer face, configured to establish a void between the backing layer and the material layer by displacing a portion of the backing layer. The separating layer also includes a securing member configured to establish a mechanical connection with a displaced portion of the backing layer.
Claims
1. An automated system for separating a layer from a layer assembly, the layer assembly comprising a backing layer and a material layer, the system comprising: an automated machine having a controller and an end effector; and a separating tool attached to the end effector of the automated machine, the separating tool including, a displacing member configured to establish a void between the backing layer and the material layer by displacing a portion of the backing layer, the displacing member further comprising a displacing member outer face, and a securing member configured to establish a mechanical connection with a displaced portion of the backing layer.
2. The automated system of claim 1, wherein the separating tool further comprises an actuator coupled to the displacing member outer face and wherein the securing member is a plurality of needles, and wherein the actuator is configured to drive and retract the plurality of needles through a sealing member, penetrating the displaced portion of the backing layer.
3. The automated system of claim 1, wherein the separating tool further comprises an actuator coupled to the displacing member outer face and wherein the securing member is a lancet, and wherein the actuator is configured to drive and retract the lancet through a sealing member, penetrating the displaced portion of the backing layer.
4. The automated system of claim 1, wherein the separating tool further comprises: an actuator coupled to the displacing member outer face; a sealing member; a receiver port coupled to the displacing member outer face; and wherein the securing member is a needle having a first end portion and a second end portion opposite thereof, and wherein the actuator configured to drive and retract the needle so as to drive the first end portion needle through the sealing member, passing through the displaced portion of the backing layer, and entering the receiver port, while retaining the second end portion.
5. The automated system of claim 1, wherein the separating tool further comprises a plurality of actuators coupled to the displacing member outer face and the securing member is a plurality of gripping elements, and wherein the plurality of actuators are configured to drive and retract the plurality of gripping elements so as to grip a displaced portion of the backing layer between opposing gripping elements.
6. The automated system of claim 5, wherein the separating tool further comprises: a piercing member coupled to at least one of the plurality of gripping elements.
7. The automated system of claim 1, wherein the automated system of claim 1, wherein the separating tool further comprises a vacuum coupling coupled to the displacing member, and wherein the vacuum coupling is operably coupled to a vacuum line.
8. The automated system of claim 1, wherein the separating tool further comprises: an actuator coupled to the displacing member outer face; a hollow needle; and a gas line communicably coupled to the hollow needle, and wherein the actuator is configured to insert a portion of the hollow needle between the backing layer and the material layer.
9. The automated system of claim 1 further comprising an assembly surface configured with a securing substrate.
10. The automated system of claim 9, wherein the securing member is a barbed protrusion.
11. The automated system of claim 1, wherein the displacing member further comprises an inner face and wherein the securing member is fixedly coupled to the inner face.
12. The automated system of claim 1, wherein the displacing member further comprises an inner face, wherein the displacing member is deformable in response to a vacuum, and wherein the securing member is fixedly coupled to the inner face.
13. A method for separating a layer from a layer assembly, the layer assembly comprising a backing layer and a material layer, the method comprising: placing a portion of the layer assembly on an assembly surface that holds the portion in place; bringing a separating tool into contact with a surface portion of the backing layer, the separating tool attached to a machine; activating the separating tool so as to create a void between the backing layer and material layer, resulting in a displaced portion of the backing layer; establishing a mechanical connection with the displaced portion of the backing layer; and moving the separating tool in a selected direction so as to remove the secured backing layer and expose an entirety of the material layer.
14. The method of claim 13, wherein a portion of resin is spread on the assembly surface to hold the portion of the material layer in place.
15. The method of claim 13, wherein the assembly surface holds the portion of the material layer in place through the establishment of a vacuum between the assembly surface and a surface of the material layer.
16. The method of claim 13, wherein the assembly surface holds the portion of the material layer in place through the establishment of a magnetic coupling between the assembly surface and the material layer.
17. The method of claim 13, wherein establishing a mechanical connection further comprises: activating an actuator to apply motive force to a plurality of needles to extend the plurality of needles; penetrating the displaced portion of the backing layer; maintaining the plurality of needles in an extended position until the backing layer is removed from the material layer; and retracting the plurality of needles to release the mechanical connection.
18. The method of claim 13, wherein establishing a mechanical connection further comprises: activating an actuator to apply motive force to a plurality of gripping elements to extend the plurality of gripping elements; pinching the displaced portion of the backing layer between opposing gripping elements; maintaining the plurality of gripping elements in an extended position until the backing layer is removed from the material layer; and retracting the plurality of gripping elements to release the mechanical connection.
19. A method for enabling the automated layup of a composite laminate assembly comprising: applying a portion of a resin on an assembly surface, the resin compatible with the resin that is pre-impregnated into a first composite ply; positioning a first uncovered surface defined by a face of the first composite ply in contact with the portion of resin on the assembly surface and with a backing layer facing away from the assembly surface; utilizing an automated system employing a separating tool to separate the backing layer from the first composite ply; removing the backing layer exposing a second uncovered surface of the first composite ply; disposing of the backing layer; placing a second composite ply upon the first composite ply orientated so that an uncovered surface of the second composite ply is in contact with the second uncovered surface of the first composite ply; and utilizing the automated system to separate the backing layer from the second composite ply.
20. The method of claim 19, further comprising repeating, until a desired number of composite plies have been achieved, the steps of: pre-heating the surface upon which the composite layer will be placed; placing a second composite ply upon the first composite ply orientated so that an uncovered surface of the second composite ply is in contact with the second uncovered surface of the first composite ply; and utilizing the automated system to separate the backing layer from the second composite ply.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] A full and enabling disclosure of the present invention, including the best mode thereof, directed to one of ordinary skill in the art, is set forth in the specification, which makes reference to the appended Figs., in which:
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[0030] Repeat use of reference characters in the present specification and drawings is intended to represent the same or analogous features or elements of the present invention.
DETAILED DESCRIPTION OF PARTICULAR EMBODIMENTS
[0031] Reference now will be made in detail to embodiments of the invention, one or more examples of which are illustrated in the drawings. Each example is provided by way of explanation of the invention, not limitation of the invention. In fact, it will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the scope or spirit of the invention. For instance, features illustrated or described as part of one embodiment can be used with another embodiment to yield a still further embodiment. Thus, it is intended that the present invention covers such modifications and variations as come within the scope of the appended claims and their equivalents.
[0032] As used herein, the terms first, second, and third may be used interchangeably to distinguish one component from another and are not intended to signify location or importance of the individual components.
[0033] In the present disclosure, when a layer is being described as on or over another layer or substrate, it is to be understood that the layers can either be directly contacting each other or have another layer or feature between the layers, unless expressly stated to the contrary. Thus, these terms are simply describing the relative position of the layers to each other and do not necessarily mean on top of since the relative position above or below depends upon the orientation of the device to the viewer.
[0034] As used herein, the term polyfilm generally includes a film made from, but not limited to, homopolymers; copolymers, such as, for example, block, graft, random and alternating copolymers; and terpolymers; and blends and modifications thereof. Furthermore, unless otherwise specifically limited, the term polyfilm shall include all possible geometrical polymer configurations. These configurations include, but are not limited to isotactic, syndiotactic, and random symmetries.
[0035] In one aspect, a layup system for use in forming a composite layup structure from a plurality of plies of composite material, including an outermost ply of composite material with a backing layer adhered thereto, is provided. The system includes a robotic device and an end effector coupled to the robotic device. The end effector includes a separating tool designed to remove the backing layer by developing a void between the composite layer and the backing layer and a means to mechanically secure the backing layer. The robotic device is configured to translate the effector relative to the composite layup structure such that the backing layer is peeled from the outermost ply of composite material.
[0036] Referring now to the drawings,
[0037] Referring again to
[0038] Referring still to the end effector 104 of
[0039] The layer stack 200 of
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[0041] In the present instance, the assembly surface 112 depicts, but is not limited to, a male mold designed to shape the material layer 204 into the desired shape of the component being produced. In addition to the male mold depicted, the assembly surface 112 may also be a planar surface or a female mold. In some embodiments, the assembly surface 112 is treated with a compatible resin so as to create a securing substrate for holding a first ply of the material layer 204. For instances in which the material layer 204 is pre-impregnated composite material, the compatible resin may be the same as the resin pre-impregnating the composite fibers so as to eliminate the introduction of additional adhesive elements. In some instances, the assembly surface may be externally or internally heated. In still other instances, the material layer 204 may be held by the assembly surface 112 through the creation of a vacuum or magnetic field at the assembly surface 112.
[0042] In
[0043] Referring now to
[0044] Referring still to
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[0057] Moreover, the robotic arm 116 of the exemplary automated machine 100 depicted is generally formed of a plurality of links 126 and a plurality of joints 128, with the plurality of links 126 sequentially arranged and movably coupled to one another with the plurality of joints 128. At least certain of the plurality of links 126 are operable with the actuator pack 118, such that one or more actuators or motors (not shown) of the actuator pack 118 may control operation (such as a position and/or orientation) of the robotic arm 116. However, in other embodiments, any other suitable configuration may be provided for manipulating or otherwise controlling the plurality of links 126 of the robotic arm 116 of the exemplary automated machine 100.
[0058] Further, as is depicted, the base 114 includes one or more support structures 130 operable with the end effector 104 for assisting the end effector 104 and performing certain operations. For example, when the end effector 104 is configured as a welder, the one or more support structures 130 may include, e.g., a gas supply, a wire supply, an electric power supply, etc. When the end effector 104 is configured as an astrictive gripper employing vacuum, the one or more support structures 130 may include, a vacuum pump coupled to vacuum lines 132.
[0059] In further embodiments, the automated machine 100 may be any other suitable form of automated machine. For example, the automated machine 100 may be a cartesian robot, a scara robot, a cylindrical robot, a polar robot, or a delta robot.
[0060] In some instances, the material layer 204 may be a ceramic matrix composite (CMC) material. CMC materials are more frequently being used for various high temperature applications. For example, because CMC materials can withstand relatively extreme temperatures, there is particular interest in replacing components within a combustion gas flow path of a gas turbine engine with components made from CMC materials. Typically, CMC materials comprise ceramic fibers embedded in a matrix material such as silicon carbide (SiC), silicon, silica, alumina, or combinations thereof. Plies of the CMC material may be laid up to form a preform component that may then undergo thermal processing, such as a cure or burn-out to yield a high char residue in the preform, and subsequent chemical processing, such as melt-infiltration with silicon, to arrive at a component formed of a CMC material having a desired chemical composition.
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[0062] The one or more memory device(s) 406 may store information accessible by the one or more processor(s) 404, including computer-readable instructions 408 that may be executed by the one or more processor(s) 404. The instructions 408 may be any set of instructions that when executed by the one or more processor(s) 404, cause the one or more processor(s) 404 to perform operations. The instructions 408 may be software written in any suitable programming language or may be implemented in hardware. In some embodiments, the instructions 408 may be executed by the one or more processor(s) 404 to cause the one or more processor(s) 404 to perform operations, such as implementing one or more of the processes mentioned above.
[0063] The memory device(s) 404 may further store data 410 that may be accessed by the processor(s) 404. For example, the data 410 may include a third instance of shared data for a gas turbine engine, as described herein. The data 410 may include one or more table(s), function(s), algorithm(s), model(s), equation(s), etc. according to example embodiments of the present disclosure.
[0064] The one or more computing device(s) 402 may also include a communication interface 412 used to communicate, for example, with the other components of system. The communication interface 412 may include any suitable components for interfacing with one or more network(s), including for example, transmitters, receivers, ports, controllers, antennas, or other suitable components.
[0065] The technology discussed herein makes reference to computer-based systems and actions taken by and information sent to and from computer-based systems. One of ordinary skill in the art will recognize that the inherent flexibility of computer-based systems allows for a great variety of possible configurations, combinations, and divisions of tasks and functionality between and among components. For instance, processes discussed herein may be implemented using a single computing device or multiple computing devices working in combination. Databases, memory, instructions, and applications may be implemented on a single system or distributed across multiple systems. Distributed components may operate sequentially or in parallel.
[0066] This written description uses exemplary embodiments to disclose the invention, including the best mode, and also to enable any person skilled in the art to practice the invention, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the invention is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they include structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal languages of the claims.