Abstract
The present invention has an object of providing a stepped wafer that can prevent a resist from remaining after development, and a method for manufacturing the stepped wafer. The stepped wafer according to the present invention is a stepped wafer having a step and whose main surface is thinner in a center portion and is thicker in an outer periphery. The step includes a curved surface with a radius of curvature ranging from 300 m to 1800 m.
Claims
1. A stepped wafer having a step and a main surface, wherein the stepped wafer is thinner in a center portion and is thicker in an outer periphery, wherein said step includes a curved surface with a radius of curvature in cross-section ranging from 300 m to 1800 m.
2. The stepped wafer according to claim 1, wherein said step includes a plurality of steps, and each of said steps includes a curved surface with a radius of curvature ranging from 300 m to 1800 m.
3. The stepped wafer according to claim 1, wherein said step includes a sloped portion and a flat portion, and said curved surface is formed at least at a boundary between said sloped portion and said flat portion.
4. A method for manufacturing a stepped wafer having a step and a main surface, wherein the stepped wafer is thinner in a center portion and is thicker in an outer periphery, said method comprising (a) forming said step including a curved surface with a radius of curvature in cross-section ranging from 300 m to 1800 m.
5. The method according to claim 4, wherein in said step (a), a plurality of steps including said step are formed, and each of said steps includes a curved surface with a radius of curvature ranging from 300 m to 1800 m.
6. The method according to claim 4, wherein in said step (a), said step includes a sloped portion and a flat portion, and said curved surface is formed at least at a boundary between said sloped portion and said flat portion.
7. The method according to claim 5, wherein in said step (a), said step closer to said center portion is formed by a grinding wheel less coarse than a grinding wheel used for forming said step closer to said outer periphery.
Description
BRIEF DESCRIPTION OF DRAWINGS
(1) FIG. 1 illustrates an example structure of a semiconductor wafer according to Embodiment 1 of the present invention.
(2) FIG. 2 illustrates an example manufacturing process of the semiconductor wafer according to Embodiment 1 of the present invention.
(3) FIG. 3 illustrates an example manufacturing process of the semiconductor wafer according to Embodiment 1 of the present invention.
(4) FIG. 4 illustrates an example state of the semiconductor wafer to which a positive resist is applied according to Embodiment 1 of the present invention.
(5) FIG. 5 illustrates an example state of the semiconductor wafer to which the positive resist is applied according to Embodiment 1 of the present invention.
(6) FIG. 6 illustrates an example state of the semiconductor wafer to which the positive resist is applied according to Embodiment 1 of the present invention.
(7) FIG. 7 is a graph illustrating an example relationship between a radius of curvature and a residual resist according to Embodiment 1 of the present invention.
(8) FIG. 8 illustrates a relationship between the radius of curvature and an outer periphery of the semiconductor wafer according to Embodiment 1 of the present invention.
(9) FIG. 9 illustrates a relationship between the radius of curvature and the outer periphery of the semiconductor wafer according to Embodiment 1 of the present invention.
(10) FIG. 10 is a graph illustrating an example relationship between the radius of curvature and the outer periphery of the semiconductor wafer according to Embodiment 1 of the present invention.
(11) FIG. 11 illustrates an example shape of a semiconductor wafer according to Embodiment 2 of the present invention.
(12) FIG. 12 illustrates an example shape of the semiconductor wafer according to Embodiment 2 of the present invention.
(13) FIG. 13 illustrates an example state of a semiconductor wafer to which a positive resist is applied according to a premise technique.
(14) FIG. 14 illustrates an example state of the semiconductor wafer to which the positive resist is applied according to the premise technique.
(15) FIG. 15 illustrates an example state of the semiconductor wafer to which the positive resist is applied according to the premise technique.
(16) FIG. 16 illustrates an example state of the semiconductor wafer to which the positive resist is applied according to the premise technique.
DESCRIPTION OF EMBODIMENTS
(17) Embodiments according to the present invention will be hereafter described based on the drawings.
(18) [Premise Technique]
(19) First, the technique on which the present invention is predicated (premise technique) will be described.
(20) FIGS. 13 to 16 illustrate example states of a semiconductor wafer 15 to which a positive resist is applied according to the premise technique. In FIGS. 13 to 16, the top surface of the semiconductor wafer 15 in the paper indicates a rear surface of the semiconductor wafer 15.
(21) As illustrated in FIG. 13, the semiconductor wafer 15 according to the premise technique is a stepped wafer including a first linear sloped surface 16, a first grinded surface 17, a second linear sloped surface 18, and a second grinded surface 19. Each of a connecting portion between the first linear sloped surface 16 and the first grinded surface 17 and a connecting portion between the second linear sloped surface 18 and the second grinded surface 19 is a straight-line connecting portion 20.
(22) As illustrated in FIG. 14, when a positive resist 10 is applied to the rear surface of the semiconductor wafer 15 in spin coating, the positive resist 10 becomes less prone to flow through the straight-line connecting portions 20 with angles. Consequently, the positive resist 10 is applied thicker to the straight-line connecting portions 20 than to the other portions.
(23) Then, illuminating (exposing light to) the positive resist 10 using an exposure light source 11 in a state of FIG. 14 does not allow a lower portion of the positive resist 10 applied to the straight-line connecting portions 20 to be sensitized as illustrated in FIG. 15. In other words, the entire positive resist 10 does not become an exposed resist 12. Thus, a residual resist 21 remains after development as illustrated in FIG. 16.
(24) As described above, the residual resist 21 remaining after development causes a problem of contaminating the semiconductor wafer 15 or devices to be used in the subsequent processes and reducing yields of final products manufactured using the semiconductor wafer 15.
(25) The present invention has been conceived to solve such a problem, and will be hereinafter described in detail.
Embodiment 1
(26) First, a structure of a stepped wafer according to Embodiment 1 of the present invention will be described.
(27) FIG. 1 illustrates an example of a semiconductor wafer 1 that is a stepped wafer according to Embodiment 1. In FIG. 1, the top surface of the semiconductor wafer 1 in the paper indicates a rear surface of the semiconductor wafer 1.
(28) As illustrated in FIG. 1, the semiconductor wafer 1 is a stepped wafer including a first linear sloped surface 3 (sloped portion), a first curved-surface connecting portion 4 (curved surface), a first grinded surface 5 (flat portion), a second linear sloped surface 7 (sloped portion), a second curved-surface connecting portion 8 (curved surface), and a second grinded surface 9 (flat portion). In other words, the semiconductor wafer 1 is a stepped wafer having steps and whose a main surface (rear surface) is thinner in center portion and is thicker in outer periphery. A connecting portion (boundary) between the first linear sloped surface 3 and the first grinded surface 5 is the first curved-surface connecting portion 4, whereas a connecting portion between the second linear sloped surface 7 and the second grinded surface 9 is the second curved-surface connecting portion 8.
(29) Next, a method for manufacturing the semiconductor wafer 1 that is the stepped wafer will be described.
(30) FIGS. 2 and 3 illustrate example manufacturing processes of the semiconductor wafer 1.
(31) First, the semiconductor wafer 1 is fixed on a grinding stage (not illustrated).
(32) Next, the first linear sloped surface 3 is formed 1 mm to 3 mm inside of the outermost periphery of the semiconductor wafer 1 using a first grinding wheel 2 as illustrated in FIG. 2. Here, the first grinding wheel 2 moves from the outside (closer to the outer periphery) to the inside (closer to the center portion) in a diagonal direction in a cross-sectional view while grinding the rear surface of the semiconductor wafer 1.
(33) Next, the first curved-surface connecting portion 4 for connecting the first linear sloped surface 3 to the first grinded surface 5 to be formed later is formed using the first grinding wheel 2 as illustrated in FIG. 2. Here, the first grinding wheel 2 forms the first curved-surface connecting portion 4 with a radius of curvature ranging from 300 m to 1800 m. After forming the first curved-surface connecting portion 4, the first grinded surface 5 is formed using the first grinding wheel 2.
(34) Next, the second linear sloped surface 7 and the second curved-surface connecting portion 8 are formed using a second grinding wheel 6 as illustrated in FIG. 3, similarly as the first linear sloped surface 3 and the first curved-surface connecting portion 4. Here, the second grinding wheel 6 forms the second curved-surface connecting portion 8 with a radius of curvature ranging from 300 m to 1800 m so as not to be in contact with the first linear sloped surface 3 or the first curved-surface connecting portion 4. The second grinding wheel 6 is a grinding wheel whose surface (grinding surface) is less coarse than that of the first grinding wheel 2, and is used for finish grinding. After forming the second curved-surface connecting portion 8, the second grinded surface 9 is formed using the second grinding wheel 6. For example, an electrode pattern is formed on the surface of the semiconductor wafer 1 facing the second grinded surface 9.
(35) Next, application of a positive resist to the semiconductor wafer 1 (i.e., the semiconductor wafer 1 illustrated in FIG. 1) fabricated through the manufacturing processes illustrated in FIGS. 2 and 3 will be described.
(36) FIGS. 4 to 6 illustrate example states of the semiconductor wafer 1 to which the positive resist 10 is applied.
(37) As illustrated in FIG. 4, the positive resist 10 is applied on the rear surface of the semiconductor wafer 1 in spin coating with a uniform thickness over the first linear sloped surface 3, the first curved-surface connecting portion 4, the first grinded surface 5, the second linear sloped surface 7, the second curved-surface connecting portion 8, and the second grinded surface 9.
(38) Next, as illustrated in FIG. 5, when the positive resist 10 is exposed to light using the exposure light source 11, the entire positive resist 10 is sensitized (i.e., the entire positive resist 10 becomes the exposed resist 12). Then, the entire positive resist 10 (the exposed resist 12) can be removed after development as illustrated in FIG. 6.
(39) FIG. 7 is a graph illustrating an example relationship between the radius of curvature and the residual resist of the semiconductor wafer 1.
(40) As illustrated in FIG. 7, the semiconductor wafer 1 having a curved surface whose radius of curvature is larger than or equal to 300 m is found to have no resist after application of the positive resist 10, exposure to light, and development. In contrast, the resist remains in the semiconductor wafer 1 having a curved surface whose radius of curvature is smaller than 300 m.
(41) Since radiuses of curvature of the first curved-surface connecting portion 4 and the second curved-surface connecting portion 8 that are curved surfaces of the semiconductor wafer 1 according to Embodiment 1 are larger than or equal to 300 m, the resist does not remain after development even with application of the positive resist 10. In other words, the radius of curvature of the first curved-surface connecting portion 4 is set larger than or equal to 300 m, a rising angle at which the first linear sloped surface 3 is connected to the first grinded surface 5 is relaxed to improve the flow of the positive resist 10, thus enabling prevention of the resist from remaining in the first curved-surface connecting portion 4.
(42) FIGS. 8 and 9 illustrate a relationship between the radius of curvature and the outer periphery of the semiconductor wafer 1. In FIGS. 8 and 9, the solid line indicates the semiconductor wafer 1 whose radius of curvature is 300 m, and the dotted line indicates the semiconductor wafer 1 whose radius of curvature is larger than 300 m. Here, the number of steps of the semiconductor wafer 1 is one.
(43) As illustrated in FIG. 8, when the outer periphery of the semiconductor wafer 1 whose radius of curvature is 300 m is made as wide as the outer periphery of the semiconductor wafer 1 whose radius of curvature is larger than 300 m, the semiconductor wafer 1 whose radius of curvature is larger than 300 m has a smaller area of the second grinded surface 9 and fewer chips including an electrode pattern.
(44) As illustrated in FIG. 9, when the second grinded surface 9 in the semiconductor wafer 1 whose radius of curvature is 300 m has the same area as that in the semiconductor wafer 1 whose radius of curvature is larger than 300 m, the semiconductor wafer 1 whose radius of curvature is larger than 300 m has a smaller width of the outer periphery and reduced strength in the outer periphery (see FIG. 10). The reduced strength in the outer periphery of the semiconductor wafer 1 becomes a factor of increasing the frequency of fractures in the semiconductor wafer 1. As illustrated in FIG. 10, the radius of curvature of the semiconductor wafer 1 is preferably smaller than or equal to 1800 m to have the same area of the second grinded surface 9 as that of the semiconductor wafer 1 whose radius of curvature is 300 m and maintain the strength in the outer periphery.
(45) Consequently, Embodiment 1 enables prevention of a resist applied to the semiconductor wafer 1 from remaining after development. Furthermore, the strength in the outer periphery of the semiconductor water 1 can be maintained.
Embodiment 2
(46) Embodiment 1, which describes formation of the first curved-surface connecting portion 4 in the connecting portion between the first linear sloped surface 3 and the first grinded surface 5 and formation of the second curved-surface connecting portion 8 in the connecting portion between the second linear sloped surface 7 and the second grinded surface 9, is not limited to such.
(47) For example, a first curved sloped surface 13 that is a curved surface replacing the first linear sloped surface 3 and the first curved-surface connecting portion 4 in FIG. 1 may be formed as illustrated in FIG. 11. In other words, the semiconductor wafer 1 may be a stepped wafer including the first curved sloped surface 13 and the first grinded surface 5. Here, the first curved sloped surface 13 has a radius of curvature ranging from 300 m to 1800 m.
(48) In addition to FIG. 11, a second curved sloped surface 14 that is a curved surface replacing the second linear sloped surface 7 and the second curved-surface connecting portion 8 in FIG. 1 may be formed as illustrated in FIG. 12. In other words, the semiconductor wafer 1 may be a stepped wafer including the first curved sloped surface 13, the second curved sloped surface 14, and the second grinded surface 9. Here, each of the first curved sloped surface 13 and the second curved sloped surface 14 has a radius of curvature ranging from 300 m to 1800 m.
(49) Consequently, forming the first curved sloped surface 13 and the second curved sloped surface 14 according to Embodiment 2 enables, when a resist is applied to the semiconductor wafer 1, uniform application of the resist on the first curved sloped surface 13 and the second curved sloped surface 14 and prevention of the resist applied to the semiconductor wafer 1 from remaining in the semiconductor wafer 1 after development. Grinding the semiconductor wafer 1 using the first grinding wheel 2 and the second grinding wheel 6 also improves the flow of an etching solution (the etching solution does not stay) in an etching process for a removing fractured layer formed on the rear surface of the semiconductor wafer 1, and in-plane uniformity in the thickness of the semiconductor wafer 1 on the second grinded surface 9.
(50) Embodiments can be freely combined, and appropriately modified or omitted within the scope of the invention.
(51) Although this invention has been described in detail, the description is in all aspects illustrative and does not restrict the invention. Numerous modifications that have yet been exemplified will be devised without departing from the scope of the invention.
EXPLANATION OF REFERENCE SIGNS
(52) 1 semiconductor wafer, 2 first grinding wheel, 3 first linear sloped surface, 4 first curved-surface connecting portion. 5 first grinded surface, 6 second grinding wheel, 7 second linear sloped surface, 8 second curved-surface connecting portion, 9 second grinded surface, 10 positive resist, 11 exposure light source, 12 exposed resist, 13 first curved sloped surface, 14 second curved sloped surface, 15 semiconductor wafer, 16 first linear sloped surface, 17 first grinded surface, 18 second linear sloped surface, 19 second grinded surface, 20 straight-line connecting portion, 21 residual resist.
